KR20200063638A - Producing device of mask integrated frame - Google Patents

Abstract

The present invention relates to a frame-integrated apparatus for producing a mask. According to the present invention, a frame-integrated apparatus (10) for producing a mask having an integral-type frame includes: a stage part (20) onto which a frame (200) is seated and supported; a grip part (30) to grip a template (50) to which a mask (100) is attached and supported; a grip moving part (40) to move the grip part (30) in any one direction of X, Y, Z, and θ axes; a head part (60) to irradiate light to a welding part of the mask (100) to sense an alignment state of the mask (100); and a head moving part (70) to move the head part (60) in any one of the X, Y, Z, and θ axes. The stage part (20) includes a heating unit (29) to increase the temperature of a process area having the frame (200) to a first temperature (ET).

Description

Frame-integrated mask manufacturing equipment {PRODUCING DEVICE OF MASK INTEGRATED FRAME}

The present invention relates to an apparatus for manufacturing a frame-integrated mask. More specifically, it can be stably supported and moved without deformation of the mask, the mask can be integrated with the frame, the alignment between each mask can be clarified, and the mask is separated from the frame. It relates to an apparatus for manufacturing a frame-integrated mask capable of preventing deformation of a frame in the process of replacement.

As a technique for forming a pixel in an OLED manufacturing process, a FMM (Fine Metal Mask) method is mainly used in which a thin metal mask is closely adhered to a substrate to deposit an organic material at a desired location.

In the conventional OLED manufacturing process, the mask is manufactured in a stick form, a plate form, etc., and then the mask is welded and fixed to the OLED pixel deposition frame. In one mask, a plurality of cells corresponding to one display may be provided. In addition, for manufacturing a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is tensioned to be flat. Adjusting the tensile force so that the entire part of the mask is flat is a very difficult task. In particular, in order to align the mask patterns having a size of only a few to several tens of µm while flattening all the cells, a high-level operation to check the alignment state in real time while finely adjusting the tensile force applied to each side of the mask is required. do.

Nevertheless, in the process of fixing several masks to one frame, there was a problem in that alignment between the masks and between the mask cells was not well. In addition, because the thickness of the mask film is too thin and large area in the process of welding and fixing the mask to the frame, the mask cell may be scratched or warped by a load, or wrinkles or burrs generated in the welded part in the welding process. There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD image quality is 500 to 600 pixel per inch (PPI), and the pixel size reaches about 30 to 50㎛, and 4K UHD, 8K UHD high image quality is higher than ~860 PPI, ~1600 PPI, etc. It has the resolution of. As described above, the alignment error between each cell should be reduced to a few μm in consideration of the pixel size of the ultra-high quality OLED, and an error out of this may lead to product failure, so the yield may be very low. Therefore, there is a need to develop a technique that prevents deformation such as a mask being crushed or distorted, a technique for making alignment clear, and a technique for fixing a mask to a frame.

On the other hand, if the alignment of some of the masks is not clearly fixed, or if the mask is defective, the masks must be separated, but there is a problem of misalignment of other masks in the process of separating and replacing the welded mask.

Accordingly, the present invention has been made to solve the problems of the prior art as described above, and an object thereof is to provide an apparatus for manufacturing a frame-integrated mask capable of forming an integral structure between a mask and a frame.

In addition, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask capable of preventing deformation such as a mask being crushed or distorted and making alignment clear.

In addition, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask having significantly reduced manufacturing time and significantly increased yield.

In addition, an object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask capable of stably supporting and moving a mask without deformation.

In addition, the present invention provides an apparatus for manufacturing a frame-integrated mask capable of separating and replacing a mask so as to prevent deformation such as distortion of a frame and to clearly align a mask in a frame-integrated mask in which the mask and the frame form an integral structure. That's the purpose.

The above object of the present invention is an apparatus for manufacturing a frame-integrated mask, comprising: a stage portion on which a frame is mounted and supported; A grip portion for gripping the template on which the mask is adhesively supported; A grip moving part that moves the grip part in at least one of X, Y, Z, and θ axes; A head portion irradiating a laser to a welding portion of the mask and sensing an alignment state of the mask; And a head moving part moving the head part in at least one of X, Y, and Z axes, and the stage part includes a heating unit that raises the temperature of the process region including the frame to a first temperature. It is achieved by the manufacturing equipment.

Before the grip portion grips the template, the mask may further include a preheat portion providing a space in which the template on which the adhesive is supported is preheated.

The grip portion can be gripped by adsorbing at least a portion of the upper surface of the template.

The stage portion may further include a stage moving portion moving in at least one of X, Y, Z, and θ axes.

The stage unit may include a frame alignment unit that aligns the position of the frame.

The grip unit includes a grip unit gripping the template; A grip moving unit that moves the grip unit in at least one of X, Y, Z, and θ axes; And a connecting unit connecting the grip moving unit to the grip moving unit.

The grip unit may further include a grip heating unit that applies heat to the gripped template.

The grip unit may be formed with a plurality of adsorption units applying pressure to the template at mutual intervals.

The plurality of adsorption units may be arranged so as not to overlap in the region on the Z axis with the weld portion of the mask.

The grip moving unit includes a base unit; A grip support unit disposed on the base unit to support the grip portion; And a grip rail unit that moves the base unit, and the base unit can move within an area spaced apart from the stage unit in the Z-axis direction so that the grip unit enters the upper portion of the stage unit.

A base rail unit is formed along the Y-axis direction on the base unit, and a grip support unit is connected to the base rail unit to move along the Y-axis direction.

The head unit may include a laser unit that irradiates the mask with a laser to weld the frame, or irradiates the mask with a laser to trim the laser.

The pair of laser units are arranged to be spaced apart from each other, and each laser unit may irradiate a laser to a welding portion of one side and the other side of the mask.

The head unit may include a camera unit that photographs an alignment state of the mask and the mask pattern in the process of attaching the mask to the frame.

The frame includes a border frame portion including a hollow region; It may include a plurality of mask cell regions, and may include a mask cell sheet portion connected to an edge frame portion.

The frame may include a plurality of mask cell regions along at least one of the first direction and the second direction perpendicular to the first direction.

Each mask may be connected to each mask cell region.

A plurality of adsorption holes may be formed in a portion spaced apart a predetermined distance from the edge of the mask cell sheet portion where the mask cell region is present.

The stage unit may further include a lower support unit that generates suction pressure in the lower portion of the frame.

At least one vacuum flow path of the lower support unit is formed, and the vacuum flow path can transmit the pressure generated by the external pressure absorption means to the adsorption hole.

A heating unit may be disposed under the lower support unit.

A mask pattern is formed on the mask, and the mask can be adhered to the template through a temporary adhesive portion.

The first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature, and after the mask is adhered to the frame, the temperature of the process region including the frame may be lowered to a second temperature lower than the first temperature.

The first temperature is any one of 25°C to 60°C, the second temperature is any one of 20°C to 30°C lower than the first temperature, and the OLED pixel deposition process temperature is any of 25°C to 45°C It can be one temperature.

When the temperature of the process region is the first temperature, the mask on the template may correspond to the mask cell region only by controlling the position of the grip portion gripping the template without applying tension to the mask.

According to the present invention configured as described above, there is an effect that the mask and the frame can achieve an integral structure.

In addition, according to the present invention, there is an effect that can prevent deformation such as the mask is struck or twisted and the alignment can be clarified.

In addition, according to the present invention, there is an effect that can significantly reduce the manufacturing time, and significantly increase the yield.

In addition, according to the present invention, there is an effect capable of stably supporting and moving the mask without deformation.

In addition, according to the present invention, in the frame-integrated mask in which the mask and the frame form an integral structure, there is an effect of preventing deformation such as distortion of the frame and separating and replacing the mask so that the alignment of the mask is clear.

1 and 2 are schematic diagrams showing a process of bonding a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic view showing a mask for forming a conventional high-resolution OLED.
9 is a schematic diagram showing a mask according to an embodiment of the present invention.
10 and 11 are plan schematic and front schematic views showing an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
12 is a partially enlarged schematic diagram of an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.
13 to 14 are schematic diagrams showing a process of manufacturing a mask supporting template by adhering a mask metal film on a template according to an embodiment of the present invention and forming a mask.
15 is an enlarged cross-sectional schematic diagram showing a temporary adhesive part according to an embodiment of the present invention.
16 is a schematic diagram showing a process of loading a mask support template on a frame according to an embodiment of the present invention.
17 is a schematic diagram showing a state in which a template is loaded on a frame after raising the temperature of a process region according to an embodiment of the present invention, thereby matching a mask to a cell region of the frame.
18 is a schematic view showing a process of adhering a mask to a frame according to an embodiment of the present invention.
19 is a schematic view showing a state in which an adsorption force is applied to a mask through an adsorption hole according to an embodiment of the present invention.
20 is a schematic diagram showing a process of separating a mask and a template after adhering a mask according to an embodiment of the present invention to a frame.
21 is a schematic diagram illustrating a state in which a mask according to an embodiment of the present invention is associated with a cell region of a neighboring frame.
22 is a schematic diagram illustrating a process of separating a mask and a template after adhering a mask according to an embodiment of the present invention to a cell region of a neighboring frame.
23 is a schematic diagram showing a state in which a mask according to an embodiment of the present invention is attached to a frame.
24 is a schematic view showing a process of lowering the temperature of a process region after adhering a mask according to an embodiment of the present invention to a cell region of a frame.
25 is a schematic diagram showing an OLED pixel deposition apparatus using an integrated frame mask according to an embodiment of the present invention.

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention, if appropriately described, is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions across various aspects, and length, area, thickness, and the like may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 and 2 are schematic diagrams showing a process of adhering the conventional mask 1 to the frame 2. 3 is a schematic diagram showing that alignment errors between cells C1 to C3 occur in the process of tensioning F1 to F2 of the conventional mask 1.

Referring to FIG. 1, the conventional mask 1 may be manufactured in a stick-type or plate-type. The mask 1 shown in FIG. 1 is a stick-type mask and can be used by welding and fixing both sides of the stick to the OLED pixel deposition frame 2.

The body (or mask film 1a) of the mask 1 is provided with a plurality of display cells C. One cell C corresponds to one display such as a smartphone. The pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P form a cluster to form one cell C, and a plurality of cells C may be formed on the mask 1. Hereinafter, the stick mask 1 having six cells C: C1 to C6 will be described as an example.

1(a), 2(a), and 2(b), first, the stick mask 1 should be flattened. The pair of clampers 3 facing each other with the frame 2 interposed therebetween clamps both sides of the mask 1, and pulls by applying tensile force F1 to F2 in the long axis direction of the mask 1 Accordingly, the mask 1 is stretched. Then, the clamper 3 is moved to a position corresponding to the frame 2 along the y-axis moving rail 4 that occupies the outside of the frame 2. The cells C1 to C6 of the mask 1 are positioned in an empty area inside the frame of the frame 2. The frame 2 may be sized such that the cells C1 to C6 of one stick mask 1 are positioned in an empty area inside the frame, and the cells C1 to C6 of the plurality of stick masks 1 are framed. It may be large enough to be located in the interior empty area.

Next, referring to (c) of FIG. 2, a pair of clampers 3 descends along the Z-axis moving rail 5 to stretch the mask 1 on the square frame 2. The mask 1 is loaded. The cells C1 to C6 of the mask 1 are positioned in an empty area inside the frame of the frame 2. The frame 2 may be sized such that cells C1 to C6 of one mask 1 are positioned in an empty area inside the frame, and cells C1 to C6 of the plurality of masks 1 are empty inside the frame. It may be large enough to be located in an area.

Next, referring to (b) of FIG. 1 and (d) of FIG. 2, after aligning finely adjusting the tensile forces F1 to F2 applied to each side of the mask 1, the mask 1 side As part of the welding (W) with a laser (L) or the like, the mask 1 and the frame 2 are interconnected. Then, the clamper 3 releases the clamping of the mask 1. 1(c) shows the cross-sections of the mask 1 and the frame 2, which are interconnected.

Referring to Figure 3, despite the fine adjustment of the tensile force (F1 ~ F2) applied to each side of the stick mask (1), there is a problem that the alignment between the mask cells (C1 ~ C3) does not work well. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stick mask 1 is a large area including a plurality of (eg, six) cells C1 to C6, and has a very thin thickness of several tens of μm, so it is easily struck or distorted by a load. In addition, it is very difficult to check in real time the alignment between each cell (C1 to C6) while adjusting the tensile force (F1 to F2) to flatten all the cells (C1 to C6).

Therefore, the fine error of the tensile force (F1 ~ F2) may cause an error in the degree to which the stick mask (1) each cell (C1 ~ C3) is stretched or stretched, and accordingly the distance (D1) between the mask pattern (P) ~D1", D2~D2") cause a problem in that they are different. Of course, it is difficult to completely align the error to 0, but in order to prevent the mask pattern P having a size of several to several tens of µm from adversely affecting the pixel process of the ultra-high-definition OLED, the alignment error does not exceed 3 µm. It is desirable not to. The alignment error between adjacent cells is referred to as pixel position accuracy (PPA).

In addition, while connecting a plurality of stick masks 1 of about 6 to 20 to each of the frame 2, a plurality of cells C of the stick mask 1, and between the plurality of stick masks 1 It is also very difficult to clarify the alignment between ~C6), and it is a significant reason to reduce productivity because the process time due to the alignment is forced to increase.

On the other hand, after the stick mask 1 is connected and fixed to the frame 2, the tensile forces F1 to F2 applied to the stick mask 1 may act on the frame 2 in reverse. That is, after the stick mask 1, which has been stretched tightly by the tensile forces F1 to F2, is connected to the frame 2, tension can be applied to the frame 2. Usually this tension is not large, so it may not have a significant effect on the frame 2, but if the size of the frame 2 is small and the rigidity is low, this tension can deform the frame 2 finely. This may cause a problem that the alignment state is wrong between the plurality of cells C to C6.

Accordingly, the present invention proposes a frame-integrated mask and an apparatus for manufacturing the same, which enable the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being deformed, such as being struck or twisted, and can be clearly aligned with the frame 200. When the mask 100 is connected to the frame 200, since no tension is applied to the mask 100, the tension of the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 is significantly reduced, and has the advantage of significantly increasing the yield.

4 is a front view showing a frame-integrated mask according to an embodiment of the present invention [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)], Figure 5 according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) showing the frame.

4 and 5, the frame-integrated mask may include a plurality of masks 100 and a frame 200. In other words, the plurality of masks 100 are each bonded to the frame 200 one by one. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being adhered to the frame 200, and the frame 200 ), the protrusions can be removed.

A plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100. One mask cell C may correspond to one display such as a smartphone.

The mask 100 may be made of an invar having a coefficient of thermal expansion of about 1.0 X 10 ^-6 /°C, and a super invar having a temperature of about 1.0 X 10 ^-7 /°C. Since the mask 100 made of this material has a very low thermal expansion coefficient, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a fine metal mask (FMM) or shadow mask in manufacturing a high-resolution OLED. In addition, considering that technologies for performing a pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 has nickel (Ni), nickel-cobalt (Ni-Co) having a slightly higher thermal expansion coefficient than this. ). The mask 100 may use a metal sheet produced by a rolling process or electroforming.

The frame 200 is formed to allow the plurality of masks 100 to adhere. The frame 200 may include various edges formed in a first direction (for example, a horizontal direction) and a second direction (for example, a vertical direction) including the outermost border. These various corners may partition the region to which the mask 100 is to be adhered on the frame 200.

The frame 200 may include a frame frame 210 having a substantially square shape or a square frame shape. The inside of the frame portion 210 may be hollow. That is, the border frame unit 210 may include a hollow region R. The frame 200 may be made of a metal material such as invar, superinvar, aluminum, titanium, etc., and is composed of invar, super invar, nickel, nickel-cobalt, etc. having the same thermal expansion coefficient as the mask in consideration of thermal deformation. Preferably, these materials can be applied to both the frame portion 210 of the frame 200, the mask cell sheet portion 220.

In addition to this, the frame 200 includes a plurality of mask cell regions CR, and may include a mask cell sheet portion 220 connected to the edge frame portion 210. The mask cell sheet portion 220 may be formed by rolling like the mask 100 or may be formed using other film forming processes such as electroforming. In addition, the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR through laser scribing, etching, or the like on a flat sheet. Alternatively, the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a planar sheet to the edge frame unit 210. In the present specification, a description will be mainly given of forming a plurality of mask cell regions CR in the mask cell sheet portion 220 and then connecting them to the frame frame portion 210.

The mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225. The border sheet portions 221 and the first and second grid sheet portions 223 and 225 refer to portions divided in the same sheet, and they are integrally formed with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Accordingly, the edge sheet portion 221 may have a substantially square shape or a square frame shape corresponding to the edge frame portion 210.

In addition, the first grid sheet portion 223 may be formed to extend in the first direction (horizontal direction). The first grid sheet portion 223 may be formed in a straight line so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 has equal intervals.

In addition, in addition to this, the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction). The second grid sheet portion 225 may be formed in a straight line so that both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, it is preferable that each second grid sheet portion 225 has an equal interval.

Meanwhile, an interval between the first grid sheet parts 223 and an interval between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction may be a rectangular shape, a rectangular shape such as a parallelogram, a triangular shape, or the like. , The sides and corners may be rounded. The cross-sectional shape can be adjusted in processes such as laser scribing and etching.

The thickness of the frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220. The border frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.

In the case of the mask cell sheet part 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 25) passes through the mask 100 in the OLED pixel deposition process. This can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be formed about 0.1 mm to 1 mm. In addition, the widths of the first and second grid sheet portions 223 and 225 may be formed to about 1 to 5 mm.

A plurality of mask cell regions CR: CR11 to CR56 may be provided, except for regions occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the planar sheet. In another aspect, the mask cell region CR is an area occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the border frame portion 210. Except for, it may mean an empty area.

As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 may be performed. For this, it is necessary to avoid the large-area mask 100, and the small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of 2-3.

The frame 200 includes a plurality of mask cell areas CR, and each of the masks 100 may be adhered so that one mask cell C corresponds to the mask cell area CR. Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy around the mask cell C (corresponding to a portion of the mask film 110 excluding the cell C). have. The dummy may include only the mask film 110 or may include the mask film 110 on which a predetermined dummy pattern having a shape similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell region CR of the frame 200, and a part or all of the dummy may be adhered to the frame 200 (mask cell sheet portion 220 ). Accordingly, the mask 100 and the frame 200 can achieve an integral structure.

On the other hand, according to another embodiment, the frame is not manufactured by adhering the mask cell sheet portion 220 to the border frame portion 210, the border frame portion 210 in the hollow region (R) portion of the border frame portion 210 ) And a frame in which an integral grid frame (corresponding to the grid sheet portions 223 and 225) is directly formed may be used. This type of frame also includes at least one mask cell region CR, and it is possible to manufacture a frame-integrated mask by matching the mask 100 to the mask cell region CR.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described above with reference to FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to (a) of FIG. 6, a border frame unit 210 is provided. The border frame portion 210 may have a rectangular frame shape including the hollow region R.

Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet portion 220 is manufactured by manufacturing a flat sheet using a rolling, electroplating, or other film forming process, and then removing the mask cell region CR through laser scribing, etching, or the like. can do. In this specification, a description will be given of an example in which 6 x 5 mask cell regions CR: CR11 to CR56 are formed. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.

Next, the mask cell sheet portion 220 may correspond to the border frame portion 210. In the process of matching, by stretching (F1 to F4) all sides of the mask cell sheet portion 220 to flatten the mask cell sheet portion 220, the border sheet portion 221 to the border frame portion 210 You can respond. One side can hold and hold the mask cell sheet portion 220 with several points (for example, 1 to 3 points in FIG. 6(b)). On the other hand, the mask cell sheet portion 220 may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220 corresponds to the edge frame portion 210, the edge sheet portion 221 of the mask cell sheet portion 220 may be welded (W) and adhered. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly adhered to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase adhesion. The welding (W) portion may be generated in the form of a line or a spot and has the same material as the mask cell sheet portion 220 and integrally forms the border frame portion 210 and the mask cell sheet portion 220. It can be a medium that connects to.

7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet portion 220 having the mask cell region CR is first manufactured and adhered to the edge frame portion 210. However, in the embodiment of FIG. 7, the flat sheet of the edge frame portion ( After adhesion to 210), a portion of the mask cell region CR is formed.

First, as illustrated in (a) of FIG. 6, a border frame portion 210 including a hollow region R is provided.

Next, referring to (a) of FIG. 7, a flat sheet (the flat mask cell sheet part 220 ′) may correspond to the border frame part 210. The mask cell sheet portion 220 ′ is in a plane state in which the mask cell region CR is not yet formed. In the process of matching, all sides of the mask cell sheet portion 220' are tensioned (F1 to F4), so that the mask cell sheet portion 220' can be flattened to correspond to the border frame portion 210. One side can hold and hold the mask cell sheet portion 220' with several points (for example, 1 to 3 points in FIG. 7(a)). On the other hand, the mask cell sheet portion 220' may be tensioned (F1, F2) along some side directions rather than all sides.

Next, when the mask cell sheet portion 220' corresponds to the frame portion 210, the edge portion of the mask cell sheet portion 220' may be welded (W) to be adhered. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly adhered to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220' as much as possible to increase adhesion. The welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220', and the frame portion 210 and the mask cell sheet portion 220'. It can be a medium to integrally connect.

Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (planar mask cell sheet portion 220'). The mask cell region CR may be formed by removing the sheet of the mask cell region CR portion through laser scribing, etching, or the like. In this specification, a description will be given of an example in which 6 x 5 mask cell regions CR: CR11 to CR56 are formed. When the mask cell region CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and four second grids The mask cell sheet portion 220 having the sheet portion 225 may be configured.

8 is a schematic view showing a mask for forming a conventional high-resolution OLED.

In order to realize a high resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this needs to be reduced. 8(a), in order to implement a high-resolution OLED pixel 6, the pixel spacing and pixel size in the mask 10' must be reduced (PD -> PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited by the shadow effect, it is necessary to form the pattern of the mask 10' at an angle (14). However, in the process of forming the pattern inclined (14) on the thick mask 10' having a thickness T1 of about 30 to 50 µm, patterning 13 suitable for the fine pixel spacing PD' and the pixel size is performed. Since it is difficult to do this, it may cause the yield to deteriorate in the processing step. In other words, in order to form the pattern 14 in an inclined manner with a fine pixel spacing PD', a thin mask 10' must be used.

In particular, for high resolution of UHD level, as shown in FIG. 8(b), it is possible to perform fine patterning only by using a thin mask 10' having a thickness T2 of about 20 µm or less. In addition, for ultra-high resolution of UHD or higher, the use of a thin mask 10' having a thickness T2 of about 10 mu m may be considered.

9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM around the mask cell C. It has been described above that the mask 100 may be manufactured from a metal sheet produced by a rolling process, electroplating, or the like, and that one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask film 110 (the mask metal film 110) excluding the cell C, and includes only the mask film 110 or a predetermined dummy having a shape similar to the mask pattern P The patterned mask layer 110 may be included. In the dummy DM, a part or all of the dummy DM may be adhered to the frame 200 (the mask cell sheet unit 220) corresponding to the edge of the mask 100.

The width of the mask pattern P may be smaller than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural.

Since the one surface 101 of the mask 100 is a surface to be adhered to the frame 200, it is preferable that it is flat. In a planarization process, which will be described later, one surface 101 may be flattened and mirrored. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.

Hereinafter, a mask metal film 110 ′ is prepared, and the mask 100 is supported by supporting the template 50, and the template 50 supported by the mask 100 is loaded onto the frame 200. An apparatus for manufacturing a frame-integrated mask and a series of manufacturing processes will be described as the mask 100 is adhered to the frame 200.

10 and 11 are plan schematic and front schematic views of the apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. 12 is a partially enlarged schematic diagram of an apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. According to one embodiment, in FIGS. 10 to 12, it will be described as an example that the frame 200 has 2 X 5 mask cell regions (CR: CR11 to CR52).

10 to 12, the frame-integrated mask manufacturing apparatus 10 includes a table 15, a stage portion 20, a grip portion 30, a grip moving portion 40, a head portion 60, and a head moving It includes a portion 70, a vibration damping table (80).

First, the table 15, also called a gantry, is installed on a structure that is firmly installed against the ground to prevent external vibration or shock. The upper surface of the table 15 is made to be a precisely horizontal surface for a more reliable process.

On the table 15, a stage portion 20 on which the frame 200 is seated is installed. The stage unit 20 may include a loading unit 21, a frame alignment unit 23 and a frame support unit 25. Also, a heating unit (not shown) and a backlight unit (not shown) may be further included.

The loading unit 21 may correspond to the body of the stage unit 20, and may have a wide plate shape to provide an area in which the frame 200 is loaded. On the table 15, a stage moving part 27 may be further included, and the stage moving part 27 may set the stage part 20 (or the loading part 21) at least among X, Y, Z, and θ axes. It can move in either direction. The θ-axis direction may mean an angle rotating on the XY plane, the YZ plane, and the XZ plane. 10 and 11, the stage moving portion 27 is shown in the form of a rail so as to move the loading portion 21 in the Y-axis direction. However, the present invention is not limited thereto, and known moving/rotating means such as a rail shape, a belt shape, a chain shape, a motor, and a gear may be used to move/rotate in various directions.

The frame alignment unit 23 is disposed on each side and each corner of the frame support 25 or the frame 200 to align the position of the frame 200.

The frame support unit 25 may have a rectangular frame shape similar to that of the frame 200 so that the frame 200 may be seated, and may be disposed on the loading unit 21 or the frame alignment unit 23. The frame support unit 25 may prevent the edge frame portion 210 and the mask cell sheet portion 220 from being deformed by tension during the process in which the mask 100 is adhered to the frame 200. The frame support unit 25 may be disposed to be in close contact with the frame 200 at the bottom of the frame 200. Grooves may be formed on the upper surface of the frame support unit 25 so that the rim frame portion 210 and the grid frame portion 220 fit snugly, and the frame 200 may be fitted and seated in the grooves. Thus, the deformation of the frame 200 can be prevented even when the mask 100 is adhered to the frame 200 and a tension is applied. The frame support unit 25 may be configured integrally with the lower support unit 90 to be described later in FIG. 19.

After one mask 100 is adhered to the cell C, if the mask 100 is adhered to the neighboring cell C again, the mutually adjacent masks 100 are interposed between the frames 200. Since the opposite force can act, the tension applied to the frame 200 can be offset. Thus, before the tension is canceled, that is, when only one mask 100 is adhered, the frame 200 is deformed during the adhesive process of the mask 100 as the frame support unit 25 receives and accommodates the frame 200. It can be prevented. Of course, it is possible to prevent the tension from being applied to the frame 200 through the process of adhering the mask 100 to the frame 200 after raising the temperature of the process region to be described later to the first temperature.

The heating unit 29 may control the temperature of the process region in the process of adhering the mask 100 to the frame 200 or apply heat to the frame 200. The heating unit 29 may be disposed under the frame support unit 25 or the lower support unit 90 to be described later in FIG. 19. However, the present invention is not limited thereto, and it is possible to control the temperature of the process region and adjust the placement position within a range of applying heat to the frame.

The heating unit 29 may increase the temperature of the process region to the first temperature, and control the temperature of the process region to be maintained after lowering the second temperature, which is a temperature lower than the first temperature.

The backlight unit (not shown) may help the camera unit 65 of the head unit 60 to check the alignment of the mask pattern P as light is emitted in the vertical upper (Z-axis) direction. For the emission of light in the vertical upward direction, a form in which light is emitted directly as a transmissive type, and a form in which light irradiated in a vertical lower direction is reflected as a reflection type and emits light in an upward direction may be used.

The grip unit 30 may include a grip unit 31, a grip moving unit 35, and a connecting unit 37. In addition, the grip heating unit 34 may be further included. The grip unit 30 may grip the template 50 to which the mask 100 is adhesively supported. At this time, gripping may be performed by adsorbing at least a portion of the upper surface of the template 50. Alternatively, the gripping may include holding a part of the template 50 within a range where the mask 100 is not affected.

The grip unit 31 may adsorb and grip the upper surface of the template 50. The grip unit 31 may be formed in a horizontal shape on the XY plane, and a plurality of adsorption units 32 may be formed on the lower surface.

The adsorption unit 32 may be separately connected to the lower portion of the grip unit 31 or may be a portion formed in the shape of an adsorption hole in the grip unit 31. The template 50 may be adsorbed to the lower surface of the grip unit 31 by applying suction pressure to the upper surface of the template 50 through the adsorption unit 32. There is no limitation in the arrangement form of the adsorption unit 32, but not overlapping in the region on the Z axis with the weld portion (WP; region where laser welding is to be performed) (see FIG. 9) of the mask 100, so as not to block the laser's entry path. It is desirable not to.

The grip heating unit 34 may apply heat to the template 50 (and the mask 100) gripped by the grip unit 30. The grip heating unit 34 may preheat the template 50 and the mask 100 before the template 50 and the mask 100 move to a process area near the frame 200. The grip heating unit 34 may preheat the template 50 and the mask 100 to a level of a first temperature similar to the heating unit 29. Accordingly, when the grip portion 30 moves onto the frame 200 by gripping the template 50 (and the mask 100), the bonding process is performed in the process region at the first temperature level immediately without waiting. Therefore, it can contribute to the speed of the process.

The grip heating unit 34 may be included as a heating coil in the grip unit 31, but is not limited thereto, and a form in which a heating element is disposed on the surface of the grip unit 31 is also possible, and the template 50 (and mask ( 100)] may be disposed at any position of the grip portion 30 within a range of applying heat to preheat.

Meanwhile, in addition to the grip heating unit 34, the apparatus 10 for manufacturing a frame-integrated mask of the present invention may further include a preheating unit 5. 10 and 12, the preheating section 5 is shown as being disposed outside the table 15, but within a range that does not affect the process region in which the process in which the mask 100 and the frame 200 are bonded is performed. (15) It may be arranged inside. However, it is preferable that the preheating part 5 is disposed at a position where the grip part 30 is accessible.

The preheating unit 5 may provide a space in which the template 50 supported by the mask 100 is loaded and preheated before the grip unit 30 grips the template 50 (and the mask 100). . A heating element is disposed inside or outside the preheater 5 to apply heat to the template 50 on which the mask 100 is supported. The preheater 5 may preheat the template 50 and the mask 100 to a level of a first temperature similar to the heating unit 29. Accordingly, the template 50 and the mask 100 maintain the first temperature level before being gripped by the grip unit 30, and the grip unit 30 grips the template 50 (and the mask 100), When moving on the frame 200, there is an advantage that the waiting time can be further reduced so that the bonding process can be performed in the process region at the first temperature level.

The grip moving unit 35 may move the grip unit 31 in at least one of X, Y, Z, and θ axes. In the present invention, the movement of the grip unit 31 in the X-axis and Y-axis directions is assumed by the grip moving unit 40, and the grip moving unit 35 is assumed to move in the Z and θ axes. . The grip moving unit 35 can use any known moving/rotating means capable of moving/rotating in various directions without limitation. Meanwhile, an auxiliary unit 33 for mediating the connection between the grip unit 31 and the grip moving unit 35 may be further included.

The connecting unit 37 may mediate the connection between the grip moving unit 35 on the grip moving unit 40 (or the grip supporting unit 43 ). In addition, the connecting unit 37 can use any known moving/rotating means that the grip moving unit 35 can move/rotate in the direction of the θ axis without limitation. Thus, the grip unit 31 can be rotated to make the template 50 on the preheater 5 accessible.

The grip moving part 40 may move the grip part 30 in at least one of X, Y, Z, and θ axes. Here, the movement of the grip portion 30 is fixed to the grip portion 40, and the grip portion 40 moves at least one of the X, Y, Z, and θ axes to move the grip portion 30 together. In addition to the concept, the grip moving part 40 may be understood to include a concept of moving only the grip part 30 in a state in which it does not move. In the present invention, the grip moving portion 40 performs movement in the X and Y axis directions of the grip portion 30, and the grip moving unit 35 or the grip support unit 45 is the Z and θ axis of the grip portion 30 It is assumed and described that the movement in the direction is performed.

The grip moving part 40 may include a base unit 41, a grip support unit 43, and a grip rail unit 45.

The base unit 41 has a wide plate shape, and may provide a space in which the grip support unit 43 is disposed. Then, both sides are connected to the grip rail unit 45 to move along the formation direction of the grip rail unit 45.

The grip support unit 43 is disposed on the base unit 41 to support the grip portion 30. The grip support unit 43 can move along the formation direction of the base rail unit 44 formed on the base unit 41.

The grip rail unit 45 is formed on both sides of the stage unit 20 along the formation direction of the stage unit 20 (or the loading unit 21), and the base unit 41 is mounted on the grip rail unit 45. This can move.

According to an embodiment, the stage portion 20 is formed to be substantially elongated along the X-axis direction, and a pair of grip rail units 45 may be formed along the X-axis direction at the long edge portions of the stage portion 20. have. In addition, the base unit 41 is formed to extend in the Y-axis direction, and both ends are respectively connected to the pair of grip rail units 45 to move in the X-axis direction. Further, the base rail unit 44 is formed on the base unit 41 along the Y-axis direction, and the grip support unit 43 is connected to the base rail unit 44 and can move in the Y-axis direction.

The frame 200 may be disposed on the left portion of the stage portion 20, and the grip portion 30 and the grip moving portion 40 may be disposed on the right portion. The base unit 41 and the stage portion 20 are spaced apart from each other on the Z axis. Thus, even if the base unit 41 moves to the area where the left frame 200 is disposed along the X-axis direction by the grip rail unit 45, the frame 200 and the base unit 41 do not interfere with each other. It may not. Accordingly, the tray 50 gripped by the grip unit 30 supported on the base unit 41 can be matched to a specific cell area CR on the frame 200.

The head part 60 is disposed above the stage part 20 and the grip part 30. A laser unit 61 (61a, 61b), a camera unit 65, a gap sensor, a defect analysis unit 67, and the like may be installed in the head unit 60.

The laser unit 61 may generate a laser L welding the mask 100 and the frame 200. Alternatively, the laser unit 61 may irradiate the mask 100 to generate a cutting laser that trims the laser. The pair of laser units 61 (61a, 61b) are arranged to be spaced apart from each other, and may be installed to adjust the positions of the X and Y axes. The spaced distance may correspond to the distance between the left welding part WP and the right welding part WP of the mask 100. When irradiating the laser L to attach the mask 100 to the frame 200, the laser L at a time is not necessary to irradiate the laser L to the left/right welds WP of the mask 100, respectively. ) It is possible to perform welding by irradiation. Accordingly, since both sides of the mask 100 are simultaneously adhered to the frame 200, the process time is shorter than the process of adhering side by side, and the mask 100 can be stably adhered to the frame 200 without deformation. There is this.

The camera unit 65 may photograph and sense the alignment of the mask 100 and the mask pattern P. The gap sensor unit may measure the Z-axis displacement of the mask 100 or sense the distance between the head portion 60 and the mask 100, the frame 200, and the like. The defective analysis unit may inspect the defective state of the mask 100.

The head moving parts 70: 71 and 75 may move the head part 60 in at least one of X, Y, and Z axes. In the present invention, the head moving unit 70 will be described assuming that the head portion 60 is moved only in the X axis. The first head moving portion 71 is connected to the upper portion of the head portion 60 is supplied with the moving power, the head portion to the second head moving portion 75 installed spaced below the first head moving portion 71 ( The main components of 60) are connected, and the movement in the X-axis direction can be guided according to the X-axis guide 76.

The vibration isolation table 80 may be installed to prevent vibration of the table 15. When the mask 100 is adhered to the frame 200, the alignment error PPA of the mask pattern P is influenced even in an environment where very small vibration occurs. Therefore, the vibration isolator 80 may preferably be provided with a passive isolator at the bottom of the table 15 to prevent vibration.

13 to 14 are schematic diagrams showing a process of manufacturing a mask support template by adhering a mask metal layer 110 on a template 50 and forming a mask 100 on the template 50 according to an embodiment of the present invention.

Referring to (a) of FIG. 13, a template 50 may be provided. The template 50 is a medium through which the mask 100 is attached on one surface and can be moved in a supported state. One surface of the template 50 is preferably flat so that it can be moved by supporting the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to the dummy of the mask metal film 110. The size of the template 50 may be a flat plate having an area larger than that of the mask metal layer 110 so that the mask metal layer 110 may be entirely supported.

The template 50 is preferably a transparent material so that it is easy to observe vision and the like in the process of aligning and adhering the mask 100 to the frame 200. In addition, in the case of a transparent material, the laser may penetrate. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia can be used. As an example, the template 50 may be a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. Also, BOROFLOAT ^® 33 has the advantage of ease of the control of the thermal expansion coefficient is less by about 3.3 Invar mask, the metal film 110 and the thermal expansion coefficient difference between the metal mask film 110.

On the other hand, in the template 50, one surface in contact with the mask metal film 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal film 110 (or the mask 100). Can be. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness (Ra) of 100 nm or less, the template 50 may use a wafer. The wafer has a surface roughness (Ra) of about 10 nm, and there are many commercial products and many surface treatment processes, so it can be used as a template 50. Since the surface roughness (Ra) of the template (50) is nm-scale, there is no or little air gap, and it is easy to generate the welding beads (WB) by laser welding, thereby affecting the alignment error of the mask pattern (P). May not give.

The template 50 is provided in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding portion (WP; the area to perform welding) of the mask 100 (see FIG. 9). The laser through hole 51 may be formed. The laser through hole 51 may be formed in the template 50 to correspond to the position and number of the welding part WP. Since a plurality of welding parts WP are arranged along a predetermined distance in the rim or dummy DM portion of the mask 100, a plurality of laser passing holes 51 may also be formed along a predetermined distance to correspond to this. As an example, since a plurality of welding parts WP are disposed on both sides (left/right) dummy DM portions of the mask 100 at predetermined intervals, the laser through holes 51 are also located on both sides of the template 50 (left/ A plurality of may be formed along a predetermined interval on the right side).

The laser through-hole 51 does not necessarily correspond to the position and number of the welding parts WP. For example, welding may be performed by irradiating the laser L only on a part of the laser through holes 51. In addition, some of the laser through holes 51 that do not correspond to the welding part WP may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.

A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary adhesive portion 55, the mask 100 (or mask metal film 110) is temporarily adhered to one surface of the template 50 until the mask 100 is adhered to the frame 200 on the template 50 It can be supported by.

The temporary adhesive 55 may use an adhesive or adhesive sheet (thermal release type) that can be separated by applying heat, or an adhesive or adhesive sheet (UV release type) that can be separated by UV irradiation.

As an example, the temporary adhesive 55 may use liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer or the like, and the type is not particularly limited. Liquid wax is a resin component for controlling adhesion, impact resistance, etc., mainly related to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive portion 55 may be SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary adhesive portion 55 using spin coating.

The temporary adhesive portion 55, which is a liquid wax, has a low viscosity at a temperature higher than 85° C. to 100° C., a viscosity at a temperature lower than 85° C., and can be partially hardened like a solid, thereby mask metal film 110' and template 50 ) Can be fixedly adhered.

Before or after the preparation of the template 50, the mask metal film 110 may be prepared.

As an embodiment, the mask metal film 110 may be prepared by a rolling method. The metal sheet produced by the rolling process may have a thickness of tens to hundreds of μm in the manufacturing process. For high resolution of UHD level, a thin mask metal film 110 having a thickness of about 20 μm or less can be used for fine patterning, and for ultra high resolution of UHD or higher, a thin mask metal film 110 having a thickness of about 10 μm ) Should be used. However, since the mask metal film 110 ′ generated by the rolling process has a thickness of about 25 to 500 μm, it is necessary to make the thickness thinner.

Therefore, a process of planarizing (PS) (see FIG. 13(b)) of one surface of the mask metal layer 110 ′ may be further performed. Here, the planarization (PS) means that one surface (upper surface) of the mask metal film 110' is mirrored, and at the same time, the upper portion of the mask metal film 110' is partially removed to reduce the thickness. Planarization (PS) may be performed by a chemical mechanical polishing (CMP) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by chemical wet etching or dry etching. In addition to this, a process capable of flattening the thickness of the mask metal film 110 ′ can be used without limitation.

In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring may be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a planarization (PS) by performing a chemical wet etching or dry etching process, a surface roughness (R _a ) may be reduced by adding a polishing process such as a separate CMP process.

As such, the thickness of the mask metal film 110 ′ can be made thin to about 50 μm or less. Accordingly, the thickness of the mask metal film 110 is preferably formed to about 2 μm to 50 μm, and more preferably, the thickness can be formed to about 5 μm to 20 μm. However, it is not necessarily limited thereto.

As another embodiment, the mask metal film 110 may be prepared by electroplating.

In order to perform electroforming, the base material of the mother plate may be a conductive material. The base plate can be used as a cathode electrode in electroplating.

As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced in a metal manufacturing process, and in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and a conductive polymer In the case of a substrate, there is a high possibility that impurities are contained, and strength. Acid resistance may be vulnerable. Elements that prevent the electric field from being uniformly formed on the surface of the mother plate (or cathode body), such as metal oxides, impurities, inclusions, and grain boundaries, are referred to as "defects". Due to the defect, a uniform electric field is not applied to the cathode body of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be formed non-uniformly.

In implementing ultra-high-definition pixels having a UHD level or higher, non-uniformity of the plating film and the plating film pattern (mask pattern P) may adversely affect the formation of pixels. For example, the current QHD image quality is 500 to 600 PPI (pixel per inch), and the pixel size reaches about 30 to 50㎛, and for 4K UHD and 8K UHD high image quality, higher than ~860 PPI and ~1600 PPI It has the same resolution. A micro display applied directly to a VR device, or a micro display used to be inserted into a VR device, aims to achieve an ultra-high quality of about 2,000 PPI or higher, and the pixel size reaches about 5 to 10 μm. Since the pattern width of the FMM and shadow mask applied thereto may be formed in a size of several to several tens of µm, preferably less than 30 µm, even a defect of several µm in size takes a large portion of the pattern size of the mask. to be. In addition, in order to remove defects in the cathode material of the above-described material, an additional process for removing metal oxide, impurities, etc. may be performed, and in this process, other defects such as etching of the cathode material may be caused. have.

Therefore, the present invention can use a single crystal base plate (or a cathode body). In particular, it is preferably a single crystal silicon material. To have conductivity, a high concentration doping of 10 ¹⁹ /cm ³ or more may be performed on the single crystal silicon base plate. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

On the other hand, as a single crystal material, metals such as Ti, Cu, Ag, GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge and other semiconductors, graphite (graphite), graphene (graphene), etc. _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, doping with a high concentration of 10 ¹⁹ /cm ³ or more may be performed to have conductivity. For other materials, conductivity may be formed by performing doping or by forming oxygen vacancy. Doping may be performed on the entire base plate, or may be performed only on the surface portion of the base plate.

In the case of a single crystal material, since there are no defects, there is an advantage that a uniform plating film 110 can be generated due to uniform electric field formation on all surfaces during electroforming. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of the OLED pixels. In addition, since there is no need to perform an additional process to remove and eliminate defects, the process cost is reduced and productivity is improved.

A conductive substrate is used as a base plate (Cathode Body), and a positive electrode (not shown) is arranged to be spaced apart to form a plating film 110 (or a mask metal film 110) by electroplating on the conductive substrate. Can form.

Next, the plating film 110 may be separated from the conductive substrate.

Meanwhile, before separating the plating film 110 from the conductive substrate, heat treatment may be performed. In order to lower the thermal expansion coefficient of the mask 100 and at the same time to prevent deformation by the heat of the mask 100 and the mask pattern P, the heat treatment is performed before separating the plated film 110 from the conductive substrate (or mother plate, cathode body). You can do The heat treatment may be performed at a temperature of 300°C to 800°C.

Generally, the thermal expansion coefficient of the invar thin plate produced by electroforming is higher than that of the inba thin plate produced by rolling. Thus, the thermal expansion coefficient can be lowered by performing heat treatment on the thin film of Invar, and deformation or the like may occur on the thin film of Invar during this heat treatment. Therefore, in the state of being adhered to the conductive substrate, if the plating film 110 is formed not only on the upper surface but also on the side and the lower surface of the conductive substrate, peeling, deformation, etc. do not occur even after heat treatment, and heat treatment can be stably performed. have.

The thickness of the mask metal film 110 generated by the electroplating process may be thinner than the rolling process. Accordingly, the planarization (PS) process of reducing the thickness may be omitted, but the etching characteristics may vary depending on the composition and crystal structure/fine structure of the surface layer of the plating mask metal film 110 ′. It is necessary to control the surface properties and thickness through.

Next, referring to (b) of FIG. 13, a mask metal film 110 ′ may be adhered to the template 50. After the liquid wax is heated to 85°C or higher and the mask metal film 110' is brought into contact with the template 50, adhesion can be performed by passing the mask metal film 110' and the template 50 between rollers. .

According to an embodiment, the solvent of the temporary adhesive portion 55 is vaporized by performing baking on the template 50 for about 120° C. for 60 seconds, and immediately, a mask metal film lamination process may be performed. . The lamination is performed by loading the mask metal film 110' on the template 50 on which the temporary adhesive portion 55 is formed on one surface, and passing it between the upper roll at about 100°C and the lower roll at about 0°C. Can be. As a result, the mask metal film 110 ′ may be contacted on the template 50 through the temporary adhesive portion 55.

15 is an enlarged cross-sectional schematic view showing a temporary adhesive portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive 55 may use a thermal release tape. The core film 56, such as a PET film, is disposed in the center of the heat release tape, and a heat release adhesive (thermal release adhesive) 57a, 57b is disposed on both sides of the core film 56, and the adhesion layer 57a , 57b) may be in the form of a release film / release film (58a, 58b) is disposed on the outside. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures from each other.

According to one embodiment, in a state in which the release film/release film 58a, 58b is removed, the lower surface of the heat release tape (second adhesive layer 57b) is adhered to the template 50, and the top of the heat release tape The surface (first adhesive layer 57a) may be adhered to the mask metal film 110'. Since the temperature at which the first adhesive layer 57a and the second adhesive layer 57b peel off each other is different, when separating the template 50 from the mask 100 in FIG. 20 to be described later, the first adhesive layer 57a The mask 100 may be separated from the template 50 and the temporary adhesive part 55 by applying the heat to be peeled off.

Subsequently, referring to FIG. 13B, a surface of the mask metal layer 110 ′ may be planarized (PS). As described above, the mask metal film 110' manufactured by the rolling process may reduce the thickness (110' -> 110) by a planarization (PS) process. In addition, the mask metal film 110 manufactured by the electroplating process may also be subjected to a planarization (PS) process to control surface characteristics and thickness.

Accordingly, as shown in (c) of FIG. 13, as the thickness of the mask metal film 110' is reduced (110' -> 110), the mask metal film 110 may have a thickness of about 5 μm to 20 μm. Can be.

Next, referring to (d) of FIG. 14, a patterned insulation portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material using a printing method or the like.

Subsequently, the mask metal layer 110 may be etched. Methods such as dry etching and wet etching may be used without limitation, and as a result of etching, a portion of the mask metal layer 110 exposed as an empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes a mask pattern P, and the mask 100 on which a plurality of mask patterns P are formed may be manufactured.

Next, referring to (e) of FIG. 14, the insulation portion 25 may be removed to complete the manufacture of the template 50 supporting the mask 100.

Since the frame 200 includes a plurality of mask cell regions CR, a plurality of masks 100 having a mask cell C corresponding to each mask cell region CR may also be provided. In addition, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

16 is a schematic diagram illustrating a process of loading a mask support template 50 on a frame 200 according to an embodiment of the present invention.

Referring to FIG. 16, the template 50 may be transferred by the grip part 30. The adsorption unit 32 of the grip portion 30 may adsorb and transfer the opposite side of the template 50 surface to which the mask 100 is adhered. The grip portion 30 adsorbs and transfers the template 50, and the mask 100 is adhesively supported to the template 50 via the temporary adhesive portion 55, so that the template 50 is transferred onto the frame 200. Even in the process, there is no effect on the adhesive state and alignment state of the mask 100.

17, the temperature of the process region according to an embodiment of the present invention is increased, and then the template 50 is loaded onto the frame 200 to load the mask 100 into the cell region of the frame 200 (CR: CR11 to CR52). It is a schematic diagram showing the state corresponding to ). Hereinafter, it will be described as an example that the frame 200 has 2 X 5 mask cell regions (CR: CR11 to CR52). In FIG. 17, it is exemplified to correspond/adher one mask 100 to the cell region CR, but the mask 100 is framed 200 by simultaneously correlating the plurality of masks 100 to all the cell regions CR. ) May be performed. In this case, a plurality of templates 50 supporting each of the plurality of masks 100 may be provided.

Next, referring to FIG. 17, after raising (ET) the temperature of the process region, the mask 100 may correspond to one mask cell region CR of the frame 200. The present invention is characterized in that no tension is applied to the mask 100 in the process of corresponding the mask 100 to the mask cell region CR of the frame 200.

Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when the mask cell sheet portion 220 is adhered with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked. The cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, it is necessary to perform adhesion of the mask 100 to the mask cell sheet portion 220 without applying a tensile force to the mask 100. Thus, it is possible to prevent the frame 200 (or the mask cell sheet portion 220) from being deformed by the tension applied to the mask 100 acting as a tension on the frame 200.

However, without applying a tensile force to the mask 100, the frame 200 is adhered to the frame 200 (or the mask cell sheet portion 220) to manufacture a frame-integrated mask, and one problem occurs when the frame-integrated mask is used in a pixel deposition process. Can occur. In the pixel deposition process performed at about 25 to 45° C., the mask 100 thermally expands by a predetermined length. Even in the mask 100 made of an invar material, a length of about 1 to 3 ppm may change according to a temperature rise of about 10° C. to form a pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, a length of about 5 to 15 μm may be increased. Then, the mask 100 is struck by its own weight, or it is stretched in a fixed state in the frame 200, causing deformation such as warping, thereby increasing the alignment error of the patterns P.

Accordingly, the present invention is characterized in that, at a temperature higher than this at room temperature, without applying a tensile force to the mask 100, it corresponds to and adheres to the mask cell region CR of the frame 200. In this specification, it is expressed that the mask 100 corresponds to and adheres to the frame 200 after raising (ET) the temperature of the process region to the first temperature.

The term “process region” may mean a space in which components such as the mask 100 and the frame 200 are located, and an adhesive process of the mask 100 is performed. The process area may be a space in a closed chamber or an open space. Also, the term “first temperature” may mean a temperature that is higher than or equal to a pixel deposition process temperature when a frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25°C to 60°C. The temperature rise of the process region can be performed by driving the heating unit 29, installing heating means in the chamber, or installing heating means around the process region.

Referring again to FIG. 17, after raising (ET) the temperature of the process region including the frame 200 to the first temperature, the mask 100 may correspond to the mask cell region CR. Alternatively, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased (ET) to the first temperature.

By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the grip portion 30, it can be seen whether the mask 100 corresponds to the mask cell region CR through the camera unit 65 of the head portion 60. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact. Since the mask 100 can be associated with the mask cell region CR only by controlling the position of the template 50, any tensile force may not be directly applied to the mask 100.

Meanwhile, the lower support unit 90 (see FIG. 19) may be further disposed under the frame 200. The lower support unit 90 may be configured integrally with the frame support unit 26. The lower support unit 90 may have a size sufficient to fit within the hollow region of the frame edge portion 210 and may be flat. In addition, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support unit 90. In this case, the edge sheet portions 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 can be more secured.

The lower support unit 90 may compress the opposite surface of the mask cell region CR in contact with the mask 100. That is, the lower support unit 90 supports the mask cell sheet portion 220 in an upward direction to prevent the mask cell sheet portion 220 from sagging in the downward direction during the bonding process of the mask 100. At the same time, since the lower support unit 90 and the template 50 compress the frame and the frame 200 (or the mask cell sheet portion 220) of the mask 100 in opposite directions, the mask 100 ) Can be maintained without being disturbed.

As described above, the mask 100 is attached to the mask cell region CR of the frame 200 by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200. Since the process is complete, no tension may be applied to the mask 100 in this process.

18 is a schematic diagram showing a process of adhering a mask 100 to a frame 200 according to an embodiment of the present invention.

Next, by irradiating a laser (L) to the mask 100, the mask 100 may be adhered to the frame 200 by laser welding. A welding bead WB is generated in the welding part WP of the laser-welded mask, and the welding bead WB may be integrally connected with the same material as the mask 100/frame 200. The pair of laser units 61a and 61b spaced apart from each other may perform welding by simultaneously irradiating the laser L to the left welding portion WP and the right welding portion WP of the mask 100.

19 is a schematic view showing a state in which an adsorption force is applied to the mask 100 through an adsorption hole 229 according to an embodiment of the present invention.

Meanwhile, according to another embodiment, a plurality of adsorption holes 229 may be formed near the edge of the frame 200 in which the mask cell region CR is present. Specifically, a plurality of adsorption holes 229 may be formed in a portion spaced apart from the edge of the mask cell sheet portion 220 by a predetermined distance, and more specifically, spaced apart from the inner edge of the edge sheet portion 221 by a predetermined distance. It may be formed on a portion and a portion spaced apart from a corner of the first and second grid sheet portions 223 and 225 by a predetermined distance.

The shape, size, and the like of the plurality of adsorption holes 229 are not limited in the scope of the purpose for which vacuum suction can be applied. However, it is preferable that the positions of the plurality of adsorption holes 229 do not overlap with the welding portion WP of the mask 100. When the welding part WP and the adsorption hole 229 overlap, the mask 100 and the frame 200 (or the mask cell sheet part 220) are not in close contact, so that the welding bead WB by laser welding is properly performed. It may not be created. Preferably, a plurality of adsorption holes 229 are formed in a portion adjacent to the welding portion WP to further weld the portion WP of the mask 100 to the frame 200 (or the mask cell sheet portion 220). Can be in close contact.

19, when the template 50 is loaded on the frame 200 (or the mask cell sheet portion 220), a part of the lower surface of the mask 100 is partially frame 200 (or the mask cell sheet portion ( 220)] It comes into contact with the upper part. The upper portion of the adsorption hole 229 formed in the frame 200 (or the mask cell sheet portion 220) corresponds to the lower surface of the mask 100 and the adsorption force (pressure absorption) corresponding to the lower portion of the adsorption hole 229. The applying means may apply the adsorption force VS (or suction pressure VS) to the mask 100 through the adsorption hole 229 to attract the portion of the mask 100 corresponding to the adsorption hole 229. Accordingly, the mask 100 is in close contact with the frame 200, and when performing laser welding, the welding beads WB may be more stably generated.

An adsorption unit 95 may be formed on the lower support unit 90. The adsorption section 95 is preferably disposed to correspond to the position of the adsorption hole 229 formed in the frame 200 (or the mask cell sheet section 220). In other words, the adsorption unit 95 may be disposed on the lower support unit 90 at a position where intensive suction force VS (or suction pressure VS) can be applied to the suction hole 229. The adsorption unit 95 may use a device capable of known vacuum suction, and may be connected to external suction pressure generating means. For example, a vacuum flow path 96 is formed inside the lower support unit 90 so that the other end is connected to an external suction generating means (not shown) such as a pump, and one end can be connected to the adsorption unit 95. A plurality of holes, slits, and the like are formed on the upper surface of the adsorption portion 95 connected to the vacuum flow path 96, and thus can be utilized as a passage through which suction pressure is applied. The external suction pressure generating means is connected to various vacuum flow passages 96 of the lower support unit 90, so that it is possible to individually control the suction pressure for each vacuum flow passage 96, and the suction pressure for all the vacuum flow passages 96 Can also be controlled simultaneously.

As the suction unit 95 of the lower support unit 90 provides an adsorption force VS (or suction pressure VS), as the adsorption force VS is applied to the mask 100 through the adsorption hole 229 , The mask 100 may be pulled to the adsorption portion 95 side (lower side). Then, the interface between the mask 100 and the frame 200 (or the mast cell sheet portion 220) may be in close contact.

Since the adsorption portion 95 strongly pulls the mask 100, there is no fine air gap between the mask 100 and the interface of the frame 200. As a result, the mask 100 and the frame 200 (in the enlarged view of FIG. 19, the first grid sheet portion 223) are in close contact, so even if the laser L is irradiated anywhere in the welding portion WP, the mask 100 and A weld bead WB may be well generated between the frames 200. The welding bead WB has an advantage that the mask 100 and the frame 200 are integrally connected, and as a result, welding can be stably performed well.

As described above with reference to FIG. 10, the lower support unit 90 may be configured integrally with the frame support unit 25. Referring again to FIG. 19, as the heating unit 29 is disposed under the lower support unit 90 (frame support unit 25) to generate heat, the temperature of the process region is adjusted to the first temperature and the second temperature. And the like.

20 is a schematic diagram showing a process of separating the mask 100 and the template 50 after adhering the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to FIG. 20, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat (EP) of a temperature higher than 85°C to 100°C is applied (EP), the viscosity of the temporary adhesive portion 55 is lowered, and the adhesive force between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving and removing the temporary adhesive portion 55 by immersing (CM) the temporary adhesive portion 55 in chemical substances such as IPA, acetone, and ethanol. have. As another example, when ultrasonic waves are applied (US) or UV is applied (UV), the adhesive force between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.

In more detail, since the temporary adhesive portion 55 that mediates the adhesion of the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding & debonding adhesive), various debonding methods can be used.

As an example, a solvent debonding method according to chemical treatment (CM) may be used. Debonding may be performed as the temporary adhesive portion 55 is dissolved by the penetration of a solvent. At this time, since the pattern P is formed on the mask 100, a solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has the advantage of being relatively economical compared to other debonding methods because it can be debonded at room temperature and does not require a separate and complicated debonding facility.

As another example, a heat debonding method according to heat application (EP) may be used. Decomposition of the temporary adhesive portion 55 is induced using high-temperature heat, and when the adhesive force between the mask 100 and the template 50 is reduced, debonding may be performed in the vertical direction or the horizontal direction.

As another example, a peelable adhesive debonding method according to heat application (EP) or UV application (UV) may be used. When the temporary adhesive portion 55 is a heat-peeling tape, debonding may be performed by a peeling adhesive debonding method, and this method does not require a high temperature heat treatment and expensive heat treatment equipment as the heat debonding method and the process of the process. Has a relatively simple advantage.

As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), or UV application (UV) may be used. If a non-sticky treatment is performed on a part (center portion) of the mask 100 or the template 50, only the border portion may be adhered by the temporary adhesive portion 55. In addition, when debonding, the solvent penetrates into the rim portion and debonding is performed by dissolving the entrance/adhesion portion 55. This method has the advantage that during the bonding and debonding process, the rest of the mask 100 and the template 50 except for the border areas are not directly lost or defects caused by adhesive material residues during debonding. There is this. In addition, unlike the thermal debonding method, there is an advantage in that the process cost can be relatively reduced because a high temperature heat treatment process is not required during debonding.

21 is a schematic diagram illustrating a state in which the mask 100 according to an embodiment of the present invention corresponds to the cell area CR of the neighboring frame 200.

Referring to FIG. 21, the mask 100 may correspond to the mask cell region CR12 adjacent to the mask cell region CR11 to which the mask 100 is adhered. The temperature of the process region may be maintained in a state where the temperature was increased (ET) to the first temperature in FIG. 17. Thus, the mask 100 may maintain a volume with respect to the first temperature in a state in which tensile force is not applied.

By loading the template 50 on the frame 200 (or the mask cell sheet portion 220), the mask 100 may correspond to the mask cell area CR12. The method of controlling the position of the template 50 and corresponding the mask 100 to the mask cell area CR12 is the same as that of FIG. 17. Meanwhile, the mask 100 may first correspond to a mask cell region CR other than the mask cell region CR12 adjacent to the mask cell region CR11.

Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. A welding bead WB is generated in the welding part of the laser-welded mask, and the welding bead WB may be integrally connected with the same material as the mask 100/frame 200.

22 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after adhering the mask 100 to the cell region CR of the neighboring frame 200 according to an embodiment of the present invention.

Referring to FIG. 22, after the mask 100 is adhered to the frame 200, the mask 100 and the template 50 may be debonded. Separation of the mask 100 and the template 50 may be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary adhesive portion 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. This is the same as described above in FIG. 20.

23 is a schematic diagram showing a state in which the mask 100 according to an embodiment of the present invention is adhered to the frame 200.

Next, referring to FIG. 23, a process of matching and adhering the mask 100 to the remaining mask cell area CR may be performed. All masks 100 may be adhered to the mask cell area CR of the frame 200.

The conventional mask 10 of FIG. 1 includes 6 cells (C1 to C6), and thus has a long length, whereas the mask 100 of the present invention includes a cell (C) and thus has a short length. The degree to which the pixel position accuracy (PPA) is distorted may be reduced. For example, assuming that the length of the mask 10 including a plurality of cells C1 to C6, ... is 1 m, and a PPA error of 10 μm is generated in 1 m as a whole, the mask 100 of the present invention Can be 1/n of the above error range according to the relative length reduction (corresponding to the reduction in the number of cells (C)). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm is generated in the entire length of 100 mm. , It has the effect that the alignment error is significantly reduced.

On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within the range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell areas CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Also in this case, considering the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells C as possible.

In the case of the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state is checked, it is necessary to simultaneously correspond to a plurality of cells C: C1 to C6 and check all of the alignment state. Compared to the conventional method (see Fig. 2), manufacturing time can be significantly reduced.

That is, in the method for manufacturing a frame-integrated mask of the present invention, each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and the alignment state is checked. Through the process, time can be significantly shorter than a conventional method in which six cells C1 to C6 are simultaneously mapped and all six cells C1 to C6 are aligned at the same time.

In addition, in the method of manufacturing the frame-integrated mask of the present invention, the product yield in 30 steps of matching and aligning the 30 masks 100 to 30 cell regions (CR: CR11 to CR56) is 6 cells (C1). ~C6), each of the five masks 10 (see FIG. 1(a)), which correspond to and align the frame 20, may appear to be much higher than the conventional product yield in five steps. Since the conventional method of arranging six cells C1 to C6 in a region corresponding to six cells C at a time is a much cumbersome and difficult operation, the product yield is low.

24 is a schematic diagram showing a process of lowering (LT) the temperature of the process region after adhering the mask 100 according to an embodiment of the present invention to the cell region CR of the frame 200.

Next, referring to FIG. 24, the temperature of the process region is lowered (LT) to the second temperature. The term "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25°C to 60°C, the second temperature may be about 20°C to 30°C on the premise that it is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop of the process region may be performed by controlling the heating unit 29, installing a cooling means in the chamber, installing a cooling means around the process region, or naturally cooling to room temperature.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may heat shrink by a predetermined length. The mask 100 may be isotropically heat-shrinked along all lateral directions. However, since the mask 100 is fixedly connected by welding to the frame 200 (or the mask cell sheet portion 220), the heat shrinkage of the mask 100 tensions itself to the surrounding mask cell sheet portion 220. (TS) will be applied. The mask 100 may be more tightly adhered to the frame 200 by applying its own tension (TS) of the mask 100.

In addition, since all of the masks 100 are adhered to the corresponding mask cell region CR, the temperature of the process region is lowered to the second temperature (LT), so that all the masks 100 simultaneously cause heat shrink, thereby framing the frame. The problem in which the alignment errors of the 200 or the patterns P are increased may be prevented. In more detail, even if the tension TS is applied to the mask cell sheet portion 220, since the plurality of masks 100 apply the tension TS in opposite directions to each other, the force is canceled and the mask cell sheet portion is canceled. No deformation occurs at 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area. The acting tension TS and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) by the tension TS is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.

25 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.

Referring to FIG. 25, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a coolant line 350 is disposed, and an organic material source 600 from the bottom of the magnet plate 300. It includes a deposition source supply unit 500 for supplying.

Between the magnet plate 300 and the source deposition unit 500, a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed. The target substrate 900 may be disposed such that the frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited for each pixel are closely or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.

The evaporation source supply unit 500 may supply the organic material source 600 by reciprocating the left and right paths, and the organic material sources 600 supplied from the evaporation source supply unit 500 may be provided with patterns P formed in the frame-integrated masks 100 and 200. ) To be deposited on one side of the target substrate 900. The deposited organic material source 600 that has passed the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.

In order to prevent uneven deposition of the pixels 700 by the shadow effect, the patterns of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited with a thickness as a whole.

Since the mask 100 is adhesively fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and its neighboring mask 100 may be maintained so as not to exceed 3 μm.

On the other hand, when a defect such as a foreign material is interposed in the mask 100 adhered to the frame 200 or a damage occurs in the mask pattern P, the mask 100 needs to be replaced. Alternatively, even when the mask 100 is adhered to the frame 200 so that some alignment of the mask pattern P is not clear, it is necessary to replace the mask 100 only to clarify the alignment.

In this case, if the mask 100 is immediately separated from the frame 200 without changing the temperature of the process region, the mask 100 adhered to the remaining cell regions CR12, CR13, CR21, ... except the cell region CR11 ), a slight deformation may occur in the frame 200 by the tension TS. Such deformation may cause sequential alignment errors of the mask pattern P and the mask cell C. That is, a plurality of masks (100) by applying a tension (TS) in the opposite direction to each other, the offset force, any one of the mask 100 (the mask (100) of the cell region (CR11)) to the frame 200 As it is separated, it acts on the frame 200 again, and alignment errors occur.

Therefore, the present invention, after the tension (TS) is re-made in a state that does not act on the frame 200, a defect occurs, the target mask 100 that needs to be separated/replaced (for example, comprising a mask cell (C11)) Mask 100] is characterized in that the separation / replacement.

First, the temperature of the process region may be increased (ET) to the first temperature. When the frame-integrated mask is used in the OLED pixel deposition process, the first temperature may mean a temperature higher than or equal to the pixel deposition process temperature. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25°C to 60°C. This is the same as rising (ET) to the first temperature in FIG. 17.

When the temperature of the process region rises (ET) to the first temperature, the masks 100 that have been thermally contracted simultaneously cause a predetermined thermal expansion. The degree of thermal expansion may correspond to the degree to which the application of the tension TS is released. In other words, when the temperature of the process region increases (ET) the first temperature, the tension TS applied to the mask 100 adhered to the frame 200 may be released. Accordingly, the mask 100 and the frame 200 may be in a stress-free state.

Next, the target mask 100 requiring separation/replacement may be separated from the frame 200. Separation may be performed from the frame 200 by applying a physical force to the target mask 100. However, in order to prevent deformation due to a force acting on the frame 200, it is necessary to squeeze the other edges when peeling off one edge.

After removing one edge (right edge) of the mask 100 including the mask cell C11 from the frame 200, the other edge (left edge) may be removed from the frame 200. Specifically, one side edge of the mask 100 may be in a state adhered to the first grid sheet portion 223 which is the right edge of the mask cell area CR11. Thus, if an external force is applied to one edge of the mask 100 to remove the mask, the adhesive force between the mask 100 and the frame 200 (first grid sheet portion 223) is applied to the portion of the first grid sheet portion 223. There is a problem that the transformation issues. Therefore, it is necessary to remove the mask 100 after the frame 200 (first grid sheet portion 223) is securely fixed.

In order to securely fix the frame 200 against external force, an outer portion of one edge (right edge) of the mask 100 to which the external force acts directly may be compressed. That is, the mask 100 may be adhered to compress the frame 200 (first grid sheet portion 223) that is outside the one edge. Crimping is preferably performed on the upper surface, the lower surface, and both sides of the frame 200 (first grid sheet portion 223) that is outside the one edge. The upper surface may be compressed using a compression bar (not shown), and the lower surface may be compressed using a lower support unit 90 (see FIG. 19) supporting the frame 200. When removing the other edge (left edge) from the frame 200, the outer part of the other edge (left edge) can be compressed in the same manner.

Next, the new mask 100 to be replaced may correspond to the mask cell area CR11. By loading the template 50 on the frame 200 (or the mask cell sheet unit 220), the mask 100 may correspond to the mask cell area CR11. Subsequently, the laser 100 may be irradiated to the mask 100 to bond the mask 100 to the frame 200 by laser welding. This is the same as the process of FIG. 18.

Next, the temperature of the process region may be lowered (LT) to the second temperature. Considering that the first temperature is about 25°C to 60°C, the second temperature may be about 20°C to 30°C on the premise that it is lower than the first temperature, and preferably, the second temperature may be room temperature. This is the same as lowering (LT) to the second temperature in FIG. 24.

When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may heat shrink by a predetermined length. The mask 100 may be heat-shrinked along the lateral direction. Then, since the plurality of masks 100 apply the tension TS in opposite directions to each other, the force is canceled so that the mask cell sheet portion 220 does not undergo deformation.

As described above, when separating/replacing the mask 100 having a defect, the temperature of the process region is raised to the first temperature to perform separation/replacement in a stress-free state, thereby preventing deformation of the frame 200, There is an advantage that the separation/replacement of the mask 100 can be stably performed without generating an alignment error between the mask pattern P and the mask cell C.

The present invention has been illustrated and described with reference to preferred embodiments, as described above, but is not limited to the above embodiments and is varied by those skilled in the art to which the present invention pertains without departing from the spirit of the present invention. Modifications and modifications are possible. Such modifications and variations are to be regarded as falling within the scope of the invention and appended claims.

5: preheating part
10: apparatus for manufacturing a frame-integrated mask
20: stage part
29: heating unit
30: grip
34: grip heating unit
40: grip moving part
50: template
51: laser through hole
55: temporary adhesive
60: head
70: head moving part
90: lower support unit
100: mask
110: mask film
200: frame
210: border frame
220: mask cell sheet portion
221: border sheet portion
223: first grid sheet portion
225: second grid sheet portion
1000: OLED pixel deposition device
C: cell, mask cell
CR: mask cell area
DM: Dummy, mask dummy
ET: the temperature of the process zone is raised to the first temperature
L: laser
LT: the temperature of the process region is lowered to the second temperature
P: mask pattern
WB: welding bead
WP: Weld

Claims (25)

An apparatus for manufacturing a frame-integrated mask,
A stage portion on which the frame is seated and supported;
A grip portion for gripping the template on which the mask is adhesively supported;
A grip moving part that moves the grip part in at least one of X, Y, Z, and θ axes;
A head portion irradiating a laser to a welding portion of the mask and sensing an alignment state of the mask; And
A head moving part moving the head part in at least one of X, Y, and Z axes
Including,
The stage unit comprises a heating unit for raising the temperature of the process region including the frame to a first temperature, the apparatus for manufacturing a frame-integrated mask. According to claim 1,
Before the grip portion grips the template, the preheat portion provides a space for the template to which the mask is adhered and supported to preheat.
The apparatus for manufacturing a frame-integrated mask further comprising a. According to claim 1,
The grip unit absorbs and grips at least a portion of the upper surface of the template. According to claim 1,
And a stage moving part moving the stage part in at least one of X, Y, Z, and θ axes. According to claim 1,
The stage unit includes a frame alignment unit that aligns the position of the frame, and the apparatus for manufacturing a frame-integrated mask. According to claim 1,
The grip part,
A grip unit gripping the template;
A grip moving unit that moves the grip unit in at least one of X, Y, Z, and θ axes; And
A connecting unit connecting the grip moving unit to the grip moving unit;
The apparatus for manufacturing a frame-integrated mask comprising a. The method of claim 6,
The grip unit further comprises a grip heating unit that applies heat to the gripped template, the apparatus for manufacturing a frame-integrated mask. The method of claim 6,
The grip unit is a device for manufacturing a frame-integrated mask, in which a plurality of adsorption units that apply pressure to the template are formed at mutual intervals. The method of claim 8,
The plurality of adsorption units are arranged so as not to overlap in a region on the Z-axis with the welding portion of the mask, the apparatus for manufacturing a frame-integrated mask. According to claim 1,
The grip moving part,
Base unit;
A grip support unit disposed on the base unit to support the grip portion; And
Includes a grip rail unit for moving the base unit,
The base unit moves in a region spaced apart from the stage portion in the Z-axis direction so that the grip portion enters the upper portion of the stage portion, and the apparatus for manufacturing a frame-integrated mask. The method of claim 10,
On the base unit, a base rail unit is formed along the Y-axis direction, and a grip support unit is connected to the base rail unit to move along the Y-axis direction, and the apparatus for manufacturing a frame-integrated mask is formed. According to claim 1,
Head part,
An apparatus for manufacturing a frame-integrated mask, comprising a laser unit that irradiates a mask with a laser to weld a frame or a laser to a mask to irradiate a laser. The method of claim 12,
The pair of laser units are arranged to be spaced apart from each other,
Each laser unit irradiates a laser to a welding part on one side and the other side of the mask, respectively. According to claim 1,
Head part,
An apparatus for manufacturing a frame-integrated mask, comprising a camera unit that photographs an alignment state of a mask and a mask pattern in a process in which the mask is adhered to the frame. According to claim 1,
The frame,
A border frame portion including a hollow region;
A mask cell sheet portion having a plurality of mask cell regions and connected to the edge frame portion
The apparatus for manufacturing a frame-integrated mask comprising a. The method of claim 15,
The frame includes a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction. The apparatus for manufacturing a frame-integrated mask. The method of claim 15,
A device for manufacturing a frame-integrated mask, wherein each mask is connected to each mask cell region. The method of claim 15,
A method of manufacturing a frame-integrated mask in which a plurality of adsorption holes are formed in a portion spaced apart a predetermined distance from the edge of the mask cell sheet portion where the mask cell region is present. The method of claim 18,
The stage unit further includes a lower support unit that generates suction pressure in the lower portion of the frame, and the apparatus for manufacturing a frame-integrated mask. The method of claim 19,
At least one vacuum flow path of the lower support unit is formed, and the vacuum flow path transmits the pressure generated by the external pressure generating means to the suction hole, the apparatus for manufacturing a frame-integrated mask. The method of claim 19,
An apparatus for manufacturing a frame-integrated mask, wherein a heating unit is disposed under the lower support unit. According to claim 1,
A mask pattern is formed on the mask, and the mask is adhered onto the template via a temporary adhesive portion, thereby manufacturing a frame-integrated mask. According to claim 1,
The first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature,
After the mask is adhered to the frame, the apparatus for manufacturing a frame-integrated mask, the temperature of the process region including the frame is lowered to a second temperature lower than the first temperature. The method of claim 23,
The first temperature is any one of 25 ℃ to 60 ℃,
The second temperature is any one of 20°C to 30°C lower than the first temperature,
OLED pixel deposition process temperature is any one of 25 ℃ to 45 ℃, the apparatus for manufacturing a frame-integrated mask. According to claim 1,
When the temperature of the process region is the first temperature, the apparatus for manufacturing the frame-integrated mask, which corresponds to the mask cell region of the mask on the template only by controlling the position of the grip portion gripping the template without applying tension to the mask.

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