CN111230295A - Apparatus for manufacturing frame-integrated mask - Google Patents

Abstract

The present invention relates to a frame-integrated mask manufacturing apparatus. The frame-integrated mask manufacturing apparatus (10) according to the present invention includes: a table part (20) for placing and supporting a frame (200); a clamp unit (30) for clamping a template (50) to which a mask (100) is bonded and supported; a clamp moving part (40) which moves the clamp part (30) towards at least one of X, Y, Z and theta axis; a head (60) for irradiating a welding portion of the mask (100) with laser light and for sensing an alignment state of the mask (100); and a head moving section (70) that moves the head (60) to at least one direction of the X, Y, Z axes, the table section (20) including a heating unit (29), the heating unit (29) being for raising a temperature of a process area including the frame (200) to a first temperature (ET).

Description

Apparatus for manufacturing frame-integrated mask

Technical Field

The present invention relates to a frame-integrated mask manufacturing apparatus. More particularly, the present invention relates to a frame-integrated mask manufacturing apparatus which can stably support and move a mask without deforming the mask, can accurately align (align) the mask with each other by integrally forming the mask and a frame, and can prevent deformation of the frame in a process of separating a replacement mask from the frame.

Background

As a technique for forming pixels in an OLED (organic light emitting diode) manufacturing process, an FMM (fine metal Mask) method is mainly used, which attaches a metal Mask (Shadow Mask) in the form of a thin film to a substrate and deposits an organic substance at a desired position.

In the existing OLED manufacturing process, after a mask is manufactured in a bar shape, a plate shape, or the like, the mask is solder-fixed to an OLED pixel deposition frame and used. One mask may have a plurality of cells corresponding to one display. In addition, in order to manufacture a large-area OLED, a plurality of masks may be fixed to an OLED pixel deposition frame, and each mask is stretched to be flat in the process of being fixed to the frame. Adjusting the tensile force to flatten the entire portion of the mask is a very difficult task. In particular, in order to align a mask pattern having a size of only several μm to several tens μm while flattening all the cells, it is necessary to finely adjust the tensile force applied to each side of the mask and to confirm the height operation requirement of the alignment state in real time.

However, in the process of fixing a plurality of masks to one frame, there is a problem that alignment between the masks and between the mask units is not good. In addition, in the process of welding and fixing the mask to the frame, the mask film has a problem that the mask is sagged or distorted due to a load because the thickness of the mask film is too thin and the area of the mask film is large; a problem of misalignment of the mask unit due to wrinkles, burrs (burr), etc. generated at the welded portion during the welding process, etc.

In the ultra-high definition OLED, the conventional QHD image quality is 500-600PPI (pixel per inch), the size of the pixel reaches about 30-50 μm, and the 4KUHD and 8KUHD have higher resolution of 860PPI, 1600PPI and the like. In this way, in consideration of the pixel size of the ultra-high-definition OLED, it is necessary to reduce the alignment error between the units to about several μm, and exceeding this error causes product defects, so the yield may be extremely low. Therefore, it is necessary to develop a technique capable of preventing the sagging or distortion or the like of the mask and making the alignment accurate, a technique of fixing the mask to the frame, and the like.

In addition, when some masks are not accurately aligned and fixed or a defect occurs in a mask, the mask needs to be separated, but there is a problem that alignment of other masks is disturbed in the process of separating and replacing a soldered mask.

Disclosure of Invention

Technical problem

The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a frame-integrated mask manufacturing apparatus capable of forming a mask and a frame into an integrated structure.

Another object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask, which can prevent deformation such as sagging or warping of the mask and can accurately align the mask.

Another object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask, which can significantly reduce the manufacturing time and significantly improve the yield.

Another object of the present invention is to provide an apparatus for manufacturing a frame-integrated mask, which can stably support and move a mask without deforming the mask.

Another object of the present invention is to provide a frame-integrated mask manufacturing apparatus capable of preventing distortion such as twisting of a frame by separating and replacing a mask in a frame-integrated mask having an integrated structure of a mask and a frame, and accurately aligning the mask.

Technical scheme

The object of the present invention is achieved by an apparatus for manufacturing a frame-integrated mask, the apparatus comprising: a table part for seating and supporting the frame; a clamp portion for clamping the template to which the mask is bonded and supported; a clamp moving part which moves the clamp part towards at least one of X, Y, Z and theta axis; a head part for irradiating laser to a welding part of the mask and sensing an alignment state of the mask; and a head moving part moving the head to at least one direction of the X, Y, Z axes, the work table part including a heating unit for raising a temperature of a process area including the frame to a first temperature.

A preheating part may be further included, which provides a space for preheating the template bonded and supported with the mask before the clamping part clamps the template.

The clamp portion can clamp by adsorbing at least a part of the upper surface of the template.

The table part may include a frame alignment unit for aligning a position of the frame.

The clamp part includes: a clamp unit for clamping the template; a clamp moving unit which moves the clamp unit towards at least one direction of X, Y, Z and theta axis; and a connection unit for connecting the jig moving unit to the jig moving part.

The clamp portion may further include a clamp heating unit for applying heat to the clamped template.

A plurality of suction units for applying suction pressure to the template may be formed at intervals on the jig unit.

The plurality of suction units may be arranged on the welding portion of the mask and the region on the Z-axis without overlapping.

The head may include a laser unit that welds the mask to the frame by irradiating laser light to the mask, or performs laser trimming (trimming) by irradiating laser light to the mask.

A pair of laser units may be arranged at intervals, each of the laser units irradiating laser to a welding portion of one side and the other side of the mask, respectively.

The frame may include: an edge frame portion including a hollow region; and a mask unit sheet portion having a plurality of mask unit regions and connected to the edge frame portion.

A plurality of suction holes may be formed at a portion spaced apart from a corner of the mask unit sheet part where the mask unit region exists by a predetermined distance, and the table part further includes a lower support unit generating a suction pressure to a lower portion of the frame.

A heating unit may be disposed at a lower portion of the lower supporting unit.

The first temperature is greater than or equal to an OLED pixel deposition process temperature, and after attaching the mask to the frame, the temperature of the process area including the frame is lowered to a second temperature that is less than the first temperature, the first temperature being any one of 25 ℃ to 60 ℃, the second temperature being any one of 20 ℃ to 30 ℃ that is less than the first temperature, and the OLED pixel deposition process temperature may be any one of 25 ℃ to 45 ℃.

Effects of the invention

The present invention having the structure as described above has an effect that the mask and the frame can form an integrated structure.

In addition, the present invention has an effect of preventing deformation such as sagging or warping of the mask and making alignment accurate.

In addition, the invention has the effects of remarkably shortening the manufacturing time and remarkably improving the yield.

In addition, the present invention has an effect that the mask can be stably supported and moved without being deformed.

In addition, the present invention has an effect of preventing deformation such as distortion of a frame and accurately aligning a mask by separating and replacing the mask in the frame-integrated mask in which the mask and the frame are integrally formed.

Drawings

Fig. 1 and 2 are schematic views of a conventional process of attaching a mask to a frame.

Fig. 3 is a schematic diagram of alignment errors between cells occurring in a conventional process of stretching a mask.

Fig. 4 is a front view and a side sectional view of a frame-integrated mask according to an embodiment of the present invention.

Fig. 5 is a front view and a side sectional view of a frame according to an embodiment of the present invention.

Fig. 6 is a schematic view of a manufacturing process of a frame according to an embodiment of the present invention.

Fig. 7 is a schematic view of a manufacturing process of a frame according to another embodiment of the present invention.

Fig. 8 is a schematic view of a conventional mask for forming a high-resolution OLED.

Fig. 9 is a schematic diagram of a mask according to an embodiment of the present invention.

Fig. 10 and 11 are a schematic plan view and a schematic front view of an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.

Fig. 12 is a partially enlarged schematic view of an apparatus for manufacturing a frame-integrated mask according to an embodiment of the present invention.

Fig. 13 to 14 are schematic views of a process of manufacturing a mask supporting template by bonding a mask metal film on a template and forming a mask according to an embodiment of the present invention.

Fig. 15 is an enlarged cross-sectional view of the temporary bonding portion according to an embodiment of the present invention.

Fig. 16 is a schematic view of a process of loading a mask support stencil onto a frame according to an embodiment of the present invention.

Fig. 17 is a schematic view of a state in which a template is loaded on a frame and a mask is corresponded to a unit region of the frame after a temperature of a process region is raised according to an embodiment of the present invention.

Fig. 18 is a schematic diagram of a process of attaching a mask to a frame according to an embodiment of the present invention.

Fig. 19 is a schematic view of a state in which an adsorption force is applied to a mask through an adsorption hole according to an embodiment of the present invention.

Fig. 20 is a schematic diagram of a process of separating a mask from a template after attaching the mask to a frame according to an embodiment of the present invention.

Fig. 21 is a schematic view of a state in which a mask is associated with a cell region of an adjacent frame according to an embodiment of the present invention.

Fig. 22 is a schematic view illustrating a process of separating the mask from the stencil after attaching the mask to the cell region of the adjacent frame according to an embodiment of the present invention.

Fig. 23 is a schematic view of a state in which a mask is attached to a frame according to an embodiment of the present invention.

Fig. 24 is a schematic view illustrating a process of decreasing the temperature of the process field after attaching the mask to the cell field of the frame according to an embodiment of the present invention.

Fig. 25 is a schematic view of an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.

Reference numerals:

5: preheating section 10: apparatus for manufacturing frame-integrated mask

20: the table portion 29: heating unit

30: the clamp portion 34: clamp heating unit

40: jig moving section 50: stencil (template)

51: laser through hole 55: temporary bonding part

60: head 70: head moving part

90: lower support unit 100: mask and method for manufacturing the same

110: mask film 200: frame structure

210: the edge frame portion 220: mask unit sheet part

221: edge sheet portion 223: first grid sheet part

225: second grid sheet portion 1000: OLED pixel deposition device

C: cell, mask cell CR: mask unit region

DM: dummy section, mask dummy section ET: raising the temperature of the process zone to a first temperature

L: laser LT: reducing the temperature of the process zone to a second temperature

P: mask pattern WB: welding bead

WP: weld part

Detailed Description

The present invention is described in detail below with reference to the attached drawing figures, which show by way of example specific embodiments capable of carrying out the invention. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. The various embodiments of the invention, although different from one another, are not mutually exclusive. For example, particular shapes, structures and characteristics described herein may be associated with one embodiment and may be implemented in other embodiments without departing from the spirit and scope of the present invention. The position and arrangement of the individual components in the respective disclosed embodiments can be changed without departing from the spirit and scope of the present invention. The following detailed description is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims and all equivalents thereto. Like reference numerals in the drawings denote the same or similar functions in many respects, and the length, area, thickness, and shape thereof may be exaggerated for convenience.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the invention.

Fig. 1 and 2 are schematic views of a conventional process of attaching a mask 1 to a frame 2. Fig. 3 is a schematic view of alignment errors between the cells C1 to C3 occurring during the conventional process of stretching the F1 to F2 mask 1.

Referring to fig. 1, the conventional mask 1 may be formed in a stripe Type (Stick-Type) or a Plate Type (Plate-Type). The mask 1 illustrated in fig. 1 is used as a stripe type mask, and both sides of the stripe may be solder-fixed to an OLED pixel deposition frame 2 and used.

The mask 1 includes a plurality of display cells C in its main Body (Body, or mask film 1 a). One cell C corresponds to one display (display) of a smartphone or the like. The cell C has a pixel pattern P formed therein so as to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, B are displayed. As an example, a pixel pattern P is formed in the cell C so as to have 70 × 140 resolution. That is, a large number of pixel patterns P are grouped to constitute one cell C, and a plurality of cells C may be formed on the mask 10. The strip mask 1 having 6 cells C (C1 to C6) will be described below as an example.

Referring to fig. 1 (a), 2 (a) and 2 (b), first, the strip mask 1 is developed flatly. The frame 2 is placed between two clamps 3 facing each other, and the mask 1 is stretched by clamping (clamping) both sides of the mask 1 and applying tensile forces F1 to F2 in the longitudinal direction of the mask 1. Then, the clamper 3 is moved to a position corresponding to the frame 2 along the y-axis moving rail 4 occupying the outside of the frame 2. The cells C1-C6 of mask 1 will be located in the blank area portion inside the frame 2. The frame 2 may have a size such that the cells C1 to C6 of one bar mask 1 are located in a blank area inside the frame, or may have a size such that the cells C1 to C6 of a plurality of bar masks 1 are located in a blank area inside the frame.

Then, referring to fig. 2 (c), the double clamper 3 is lowered along the Z-axis moving rail 5, and the mask 1 is loaded on the frame 2 having a quadrangular frame shape in a state where the mask 1 is stretched. The cells C1-C6 of mask 1 will be located in the blank area portion inside the frame 2. The frame 2 may have a size such that the cells C1 to C6 of one mask 1 are located in a blank region inside the frame, or may have a size such that the cells C1 to C6 of a plurality of masks 1 are located in a blank region inside the frame.

Then, referring to fig. 1 (b) and 2 (d), after aligning while finely adjusting the tensile forces F1 to F2 applied to the respective sides of the mask 1, a part of the side surface of the W mask 1 is welded by a laser L or the like, thereby connecting the mask 1 and the frame 2 to each other. Then, the clamper 3 releases the clamping of the mask 1. Fig. 1 (c) shows a side cross section of the mask 1 and the frame 2 connected to each other.

Referring to fig. 3, although the tensile forces F1 to F2 applied to the sides of the strip mask 1 are finely adjusted, a problem of poor alignment of the mask units C1 to C3 with respect to each other is shown. For example, the distances D1 to D1 'and D2 to D2' between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. The stripe mask 1 has a large area including a plurality of (for example, 6) cells C1 to C6 and a very thin thickness of several tens of μm, and therefore is liable to sag or twist due to a load. It is very difficult to adjust the tensile forces F1 to F2 so that all of the cells C1 to C6 are flattened and to confirm the alignment state of the cells C1 to C6 in real time by a microscope.

Therefore, slight errors in the tensile forces F1 to F2 may cause errors in the degree of stretching or spreading of the cells C1 to C3 of the strip mask 1, thereby causing differences in the distances D1 to D1 ″ and D2 to D2 ″ between the mask patterns P. Although it is very difficult to perfectly align to make the error 0, it is preferable that the alignment error is not more than 3 μm in order to avoid bad influence of the mask pattern P having a size of several μm to several tens μm on the pixel process of the ultra high definition OLED. The alignment error between such adjacent cells is referred to as Pixel Position Accuracy (PPA).

In addition, it is very difficult to precisely align the plurality of bar masks 1 and the plurality of cells C-C6 of the bar masks 1 while respectively connecting about 6 to 20 bar masks 1 to one frame 2, and it is only possible to increase the process time based on the alignment, which is an important reason for the reduction of productivity.

On the other hand, after the bar masks 1 are fixedly attached to the frame 2, the tensile forces F1 to F2 applied to the bar masks 1 act in the opposite direction to the frame 2. That is, the strip mask 1 stretched by the tensile forces F1 to F2 can be connected to the frame 2 and then a tension (tension) can be applied to the frame 2. Normally, the tension is not so large as to exert a large influence on the frame 2, but in the case where the frame 2 is downsized and becomes low in strength, the frame 2 may be slightly deformed by such tension. Thus, a problem may occur in that the alignment state between the plurality of cells C to C6 is broken.

In view of the above, the present invention provides a frame-integrated mask and a manufacturing apparatus thereof, which can integrate the mask 100 and the frame 200. The mask 100 integrated with the frame 200 can prevent deformation such as sagging or twisting, and be accurately aligned with the frame 200. When the mask 100 is attached to the frame 200, no tensile force is applied to the mask 100, and thus no tensile force causing deformation is applied to the mask 200 after the mask 100 is attached to the frame 200. Also, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly shortened, and the yield can be significantly improved.

Fig. 4 is a front view (fig. 4 (a)) and a side sectional view (fig. 4 (b)) of a frame-integrated mask according to an embodiment of the present invention, and fig. 5 is a front view (fig. 5 (a)) and a side sectional view (fig. 5 (b)) of a frame according to an embodiment of the present invention.

Referring to fig. 4 and 5, the frame integrated mask may include a plurality of masks 100 and one frame 200. In other words, the plurality of masks 100 are attached to the frames 200, respectively. Hereinafter, for convenience of explanation, the mask 100 having a square shape will be described as an example, but the mask 100 may have a bar mask shape having protrusions for clamping on both sides before being attached to the frame 200, and the protrusions may be removed after being attached to the frame 200.

A plurality of mask patterns P are formed on each mask 100, and one cell C may be formed on one mask 100. One mask unit C may correspond to one display of a smartphone or the like.

The mask 100 may have a coefficient of thermal expansion of about 1.0X10^-6Invar (invar) at/° C, coefficient of expansion of about 1.0X10^-7Super invar (super invar) material at/° c. The Mask 100 made of the material has a very low thermal expansion coefficient, so that the Mask has little concern of pattern deformation caused by thermal energy, and thus can be used as an fmm (fine Metal Mask) or a Shadow Mask (Shadow Mask) in the manufacture of a high-resolution OLED. In addition to this, in consideration of recently developed techniques for performing the pixel deposition process in a range where the temperature variation value is not large, the mask 100 may also be a material such as nickel (Ni), nickel-cobalt (Ni-Co), or the like, having a thermal expansion coefficient slightly larger than that. The mask 100 may use a sheet metal (sheet) generated by a rolling process or electroforming.

The frame 200 may be formed in a form of attaching a plurality of masks 100. Including the outermost peripheral edges, the frame 200 may include a plurality of corners formed along a first direction (e.g., lateral), a second direction (e.g., vertical). Such a plurality of corners may divide an area for attaching the mask 100 on the frame 200.

The frame 200 may include an edge frame portion 210 that is generally square, box-shaped. The interior of the edge frame portion 210 may be hollow in shape. That is, the edge frame portion 210 may include a hollow region R. The frame 200 may be formed of a metal material such as invar, super invar, aluminum, titanium, etc., and is preferably formed of a material such as invar, super invar, nickel-cobalt, etc., which has the same thermal expansion coefficient as the mask, in consideration of thermal deformation, and these materials are all applicable to the edge frame portion 210 and the mask unit sheet portion 220, which are all constituent elements of the frame 200.

In addition, the frame 200 is provided with a plurality of mask unit regions CR, and may include a mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet part 220 may be formed by rolling as in the mask 100, or may be formed by using another film forming process such as electroforming. The mask unit sheet portion 220 may be connected to the edge frame portion 210 by forming a plurality of mask unit regions CR on a planar sheet (sheet) by laser scribing, etching, or the like. Alternatively, the mask unit sheet portion 220 may be formed by laser scribing, etching, or the like after a planar sheet is connected to the edge frame portion 210. In this specification, a case where the mask unit sheet portion 220 is first formed with a plurality of mask unit regions CR and then connected to the edge frame portion 210 will be mainly described.

The mask unit sheet portion 220 may include an edge sheet portion 221 and at least one of a first grid sheet portion 223 and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 are portions divided on the same sheet, and are integrated with each other.

The edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have a substantially rectangular, square box shape corresponding to the edge frame portion 210.

In addition, the first grid sheet part 223 may be formed to extend along the first direction (lateral direction). The first grid sheet portion 223 is formed in a straight line shape, and both ends thereof may be connected to the edge sheet portion 221. When the mask unit sheet portion 220 includes a plurality of first grid sheet portions 223, each of the first grid sheet portions 223 preferably has the same pitch.

Further, the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction), and the second grid sheet portion 225 is formed in a straight line state, and both ends thereof may be connected to the edge sheet portion 221. The first and second grid sheet portions 223, 225 may cross each other perpendicularly. When the mask unit sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 preferably has the same pitch.

On the other hand, the pitch between the first grid sheet portions 223 and the pitch between the second grid sheet portions 225 may be the same or different depending on the size of the mask unit C.

The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross section perpendicular to the longitudinal direction may be, for example, a rectangle, a quadrangle such as a trapezoid, a triangle, or the like, and a part of the sides and corners may be formed in a circle. The cross-sectional shape may be adjusted during laser scribing, etching, etc.

The thickness of the edge frame portion 210 may be greater than the thickness of the mask die sheet portion 220. Since the edge frame portion 210 takes charge of the overall rigidity of the frame 200, it may be formed in a thickness of several mm to several tens cm.

The mask unit sheet part 220 has difficulty in a process of manufacturing a thick sheet in practice, and if it is too thick, an organic substance source 600 (refer to fig. 25) may block a path through the mask 100 in an OLED pixel deposition process. On the contrary, too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Thus, the mask die section 220 is preferably thinner than the thickness of the edge frame section 210, but thicker than the mask 100. The thickness of the mask die portion 220 may be about 0.1mm to 1 mm. The first and second grid sheet portions 223, 225 may have a width of about 1 to 5 mm.

In the planar sheet, a plurality of mask unit regions CR (CR11 to CR56) may be provided in addition to the regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225. From another perspective, the mask unit region CR may refer to a blank region except for regions occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 in the hollow region R of the edge frame portion 210.

As the cells C of the mask 100 correspond to the mask cell regions CR, they may be actually used as channels for depositing pixels of the OLED through the mask pattern P. As described above, one mask unit C corresponds to one display of a smartphone or the like. A mask pattern P for constituting one cell C may be formed in one mask 100. Alternatively, one mask 100 is provided with a plurality of cells C and each cell C may correspond to each cell region CR of the frame 200, but in order to precisely align the mask 100, it is necessary to avoid a large area mask 100, and preferably a small area mask 100 having one cell C is provided. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell region CR of the mask 200. At this time, in order to precisely align, it may be considered that the mask 100 having 2-3 cells C corresponds to one cell region CR of the mask 200.

The mask 200 includes a plurality of mask cell regions CR, and each mask 100 may be attached so that each mask cell C corresponds to each mask cell region CR. Each mask 100 may include a mask cell C in which a plurality of mask patterns P are formed, and a dummy portion (corresponding to a portion of the mask film 110 other than the cell C) around the mask cell C. The dummy portion may include only the mask film 110, or may include the mask film 110 on which a predetermined dummy pattern having a similar form to the mask pattern P is formed. The mask unit C corresponds to the mask unit region CR of the frame 200, and a part or all of the dummy portion may be attached to the frame 200 (the mask unit sheet portion 220). Thus, the mask 100 and the frame 200 may form an integrated structure.

On the other hand, according to another embodiment, the frame is not manufactured in such a manner that the mask unit sheet portions 220 are attached to the edge frame portion 210, but a frame in which a grid frame (corresponding to the grid sheet portions 223, 225) integrated with the edge frame portion 210 is directly formed at the hollow region R portion of the edge frame portion 210 may be used. The frame of this form also includes at least one mask cell region CR, and the mask 100 may be made to correspond to the mask cell region CR to manufacture a frame-integrated mask.

Hereinafter, a process of manufacturing the frame-integrated mask will be described.

First, the frame 200 described in fig. 4 and 5 may be provided. Fig. 6 is a schematic view of a manufacturing process of the frame 200 according to an embodiment of the present invention.

Referring to fig. 6 (a), an edge frame portion 210 is provided. The edge frame portion 210 may be a box shape including a hollow region R.

Next, referring to fig. 6 (b), the mask unit sheet portion 220 is manufactured. The mask unit sheet portion 220 can be manufactured by manufacturing a planar sheet by rolling, electroforming, or another film forming process, and then removing the mask unit region CR by laser scribing, etching, or the like. In this specification, the formation of 6 × 5 mask cell regions CR (CR11 to CR56) will be described as an example. There may be 5 first grid sheet portions 223 and 4 second grid sheet portions 225.

Then, the mask die section 220 may correspond to the edge frame section 210. In the corresponding process, the edge sheet part 221 may be corresponded to the edge frame part 210 in a state where all side portions of the mask cell sheet part 220 are stretched from F1 to F4 to make the mask cell sheet part 220 spread flat. The mask sheet portion 220 can be stretched by sandwiching it at a plurality of points (1 to 3 points as an example of fig. 6 (b)) on one side. On the other hand, the F1 and F2 mask cell sheet portions 220 may be stretched in a part of the side direction, not all of the side portions.

Then, when the mask die portions 220 are made to correspond to the edge frame portions 210, the edge die portions 221 of the mask die portions 220 may be attached by welding W. Preferably, all sides of W are welded so that the mask die sheet portion 220 is firmly attached to the edge frame portion 210, but is not limited thereto. The welding W should be performed close to the corner side of the frame part 210 to the maximum extent in order to minimize the tilting space between the edge frame part 210 and the mask unit sheet part 220 and to improve the adhesion. The welding W portion may be generated in a line (line) or spot (spot) shape, have the same material as the mask unit sheet portion 220, and may become a medium for integrally connecting the edge frame portion 210 and the mask unit sheet portion 220.

Fig. 7 is a schematic view of a manufacturing process of a frame according to another embodiment of the present invention. The embodiment of fig. 6 first manufactures the mask unit sheet portions 220 having the mask unit regions CR and then attaches to the edge frame portions 210, while the embodiment of fig. 7 attaches a planar sheet to the edge frame portions 210 and then forms the mask unit region CR portions.

First, the edge frame portion 210 including the hollow region R is provided as in fig. 6 (a).

Then, referring to fig. 7 (a), a planar sheet (a planar mask unit sheet portion 220') may be made to correspond to the edge frame portion 210. The mask unit sheet portion 220' is in a planar state in which the mask unit region CR is not yet formed. In the corresponding process, the mask unit sheet portions 220 'may be made to correspond to the edge frame portions 210 in a state where all side portions of the mask unit sheet portions 220' are stretched in a flat state from F1 to F4. The unit sheet portion 220' can be sandwiched and stretched at a plurality of points (1 to 3 points as an example of fig. 7 (a)) on one side. On the other hand, the F1 and F2 mask unit sheet portions 220' may be stretched in a part of the side direction, not all of the side portions.

Then, when the mask unit sheet portion 220 'is made to correspond to the edge frame portion 210, the edge portion of the mask unit sheet portion 220' may be attached by welding W. Preferably, all sides of W are welded so that the mask unit sheet portion 220' is firmly attached to the edge frame portion 220, but is not limited thereto. The welding W should be performed close to the corner side of the edge frame portion 210 to the maximum extent so as to minimize the turn-up space between the edge frame portion 210 and the mask unit sheet portion 220' and improve the adhesion. The welding W portion may be generated in a line (line) or spot (spot) shape, have the same material as the mask unit sheet portion 220 ', and may become a medium for integrally connecting the edge frame portion 210 and the mask unit sheet portion 220'.

Then, referring to fig. 7 (b), a mask unit region CR is formed in the planar sheet (the planar mask unit sheet portion 220'). The sheet of the mask unit region CR portion is removed by laser scribing, etching, or the like, so that the mask unit region CR can be formed. In this specification, the formation of 6 × 5 mask cell regions CR (CR11 to CR56) will be described as an example. When the mask unit region CR is formed, the mask unit sheet portion 220 may be configured such that a portion to which the edge frame portion 210 is welded W becomes an edge sheet portion 221, and 5 first grid sheet portions 223 and 4 second grid sheet portions 225 may be provided.

Fig. 8 is a schematic view of a mask used to form a conventional high-resolution OLED.

In order to realize a high-resolution OLED, the size of the pattern is gradually reduced, and the thickness of the mask metal film used therefor is also required to be thin. As shown in fig. 8 (a), if it is desired to realize the OLED pixel 6 of high resolution, it is necessary to reduce the pixel interval and the pixel size and the like (PD- > PD ') in the mask 10'. Furthermore, in order to prevent the OLED pixels 6 from being deposited unevenly due to the shadow effect, it is necessary to form 14 the pattern of the mask 10' obliquely. However, in the process of forming 14 the pattern obliquely in the thick mask 10 'having the thickness T1 of about 30 to 50 μm, since it is difficult to form the pattern 13 matching thereto in the fine pixel interval PD' and the pixel size, it becomes a factor of causing a reduction in yield in the process. In other words, in order to form the pattern 14 obliquely with a fine pixel pitch PD ', it is necessary to use a mask 10' having a small thickness.

In particular, in order to realize a high resolution of UHD level, as shown in (b) of fig. 8, only a thin mask 10' having a thickness T2 of 20 μm or less is used to perform fine patterning. Furthermore, to achieve ultra high resolution above UHD, it is contemplated to use a thin mask 10' having a thickness T2 of 10 μm.

Fig. 9 is a schematic diagram of a mask 100 according to an embodiment of the present invention.

The mask 100 may include a mask cell C formed with a plurality of mask patterns P and a dummy portion DM around the mask cell C. As described above, the mask 100 may be manufactured using a metal sheet produced by a rolling process, electroforming, or the like, and one cell C may be formed in the mask 100. The dummy portion DM corresponds to a portion of the mask film 110[ mask metal film 110] other than the cell C, and may include only the mask film 110, or include the mask film 110 formed with a predetermined dummy portion pattern similar to the shape of the mask pattern P. The dummy portion DM corresponds to an edge of the mask 100 and a portion or the whole of the dummy portion DM may be attached to the frame 200[ the mask die section 220 ].

The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5-20 μm. Since the frame 200 has a plurality of mask cell regions CR (CR11 to CR56), it is also possible to have a plurality of masks 100, the masks 100 having mask cells C (C11 to C56) corresponding to each mask cell region CR (CR11 to CR 56).

The mask 100 preferably has a flat surface because the one surface 101 is in contact with and attached to the one surface of the frame 200. One side 101 may be planarized and mirrored using a planarization process described below. The other side 102 of the mask 100 may face a side of the template 50 described below.

An apparatus and a series of manufacturing processes for manufacturing a mask integrated with a frame by mounting the mask plate 50 supporting the mask 100 on the frame 200 and attaching the mask 100 to the frame 200, and manufacturing the mask 100 by manufacturing the mask metal film 110' and supporting the mask on the mask plate 50 will be described below.

Fig. 10 and 11 are a schematic plan view and a schematic front view of an apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. Fig. 12 is a partially enlarged schematic view of the apparatus 10 for manufacturing a frame-integrated mask according to an embodiment of the present invention. According to an embodiment, the mask unit regions CR (CR11 to CR52) of the frame 200 having 2X5 are illustrated in fig. 10 to 12 as an example.

Referring to fig. 10 to 12, the apparatus 10 for manufacturing a frame-integrated mask includes a table 15, a table part 20, a jig part 30, a jig moving part 40, a head part 60, a head moving part 70, a vibration damping table 80, and the like.

First, the table 15, also called a revolving rack (gantry), is provided on a structure that is firmly provided on the ground to prevent external vibration or impact. In order to make the process performed on the table 15 more reliable, the upper surface of the table 15 should be formed to be an accurate horizontal surface.

The table 15 is provided with a table part 20 for seating and supporting the frame 200. The table part 20 may include a loading part 21, a frame alignment unit 23, and a frame support unit 25. Further, a heating unit (not shown) and a backlight unit (not shown) may be further included.

The loading part 21 may correspond to a body of the table part 20 and have a wide plate form, thereby being able to provide an area for loading the frame 200. The table 15 may further include a table moving unit 27, and the table moving unit 27 may move the table unit 20 (or the loading unit 21) in at least one direction of the X, Y, Z and the θ axis. The θ -axis direction may refer to an angle of rotation on an XY plane, a YZ plane, and an XZ plane. In fig. 10 and 11, the table moving unit 27 is illustrated in a rail form so as to be movable in the Y-axis direction. However, the present invention is not limited to this, and any known moving/rotating means such as an orbital form, a belt form, a caterpillar form, an engine, a gear, etc. may be used to move/rotate in various directions.

The frame alignment unit 23 may align the position of the frame 200 by being disposed at each side or each corner of the frame support 25 or the frame 200.

In order to position and support the frame 200, the frame supporting unit 25 may have a quadrangular frame shape similar to the frame 200, and may be disposed on the loading part 21 or the frame aligning part 23. The frame supporting unit 25 may prevent the edge frame part 210 and the mask unit sheet part 220 from being deformed by tension in a process of attaching the mask 100 to the frame 200. The frame supporting unit 25 may be disposed in a form of being closely attached to the frame 200 at a lower portion of the frame 200. The frame support unit 25 may be formed thereon with a plurality of grooves into which the edge frame part 210 and the grid frame part 220 are completely inserted, and the frames 200 may be arranged in such a manner as to be inserted into the plurality of grooves. Therefore, even in a state where the mask 100 is attached to the frame 200 and tension is applied, the frame 200 can be prevented from being deformed. The frame support unit 25 may also be integrally formed with a lower support unit 90 described later in fig. 19.

After one mask 100 is attached to the cell C, if the mask 100 is reattached to an adjacent cell C, the adjacent masks 100 may apply opposite forces to the frame 200 disposed therebetween, with the result that the tensile forces applied to the frames 200 may be cancelled out. By mounting and accommodating the frame 200 on the frame supporting unit 25 before the tensions cancel each other as above, that is, when only one mask 100 is attached, the frame 200 can be prevented from being deformed in the process of attaching the mask 100. Of course, the process of attaching the mask 100 to the frame 200 after raising the temperature of the process field to the first temperature, which will be described later, can prevent the tensile force from being applied to the frame 200.

The heating unit 29 may control the temperature of a process area in a process of attaching the mask 100 to the frame 200, or may apply heat to the frame 200. The heating unit 29 may be disposed at a lower portion of the frame supporting unit 25 or a lower supporting unit 90 described later in fig. 19. But not limited thereto, the arrangement position may be adjusted within a range of controlling the temperature of the process area or heating to the frame.

The heating unit 29 may raise the temperature of the process field to a first temperature, and may control and maintain the temperature of the process field after lowering the temperature to a second temperature lower than the first temperature.

The backlight unit (not shown) can help the camera unit 65 of the head unit 60 to confirm the alignment of the mask pattern P by emitting light in the vertical upper (Z-axis) direction. As a method of emitting light in the vertical upper direction, a transmission type direct light emitting mode, a reflection type mode in which light emitted in the vertical lower direction is reflected and emitted in the upper direction, and the like can be used.

The clamp part 30 may include a clamp unit 31, a clamp moving unit 35, and a connecting unit 37. Also, a jig heating unit 34 may be further included. The clamp part 30 may clamp (grip) the template 50 to which the mask 100 is adhered and supported. At this time, clamping may be performed by adsorbing at least a portion of the upper face of the template 50. Alternatively, the clamping may include a configuration capable of holding a part of the template 50 and performing work within a range not affecting the mask 100.

The clamp unit 31 may clamp by adsorbing an upper surface of the template 50. The jig unit 31 may be formed to be horizontal to the XY plane, and a plurality of suction units 32 may be formed on the lower surface.

The adsorption unit 32 may be separately attached to a lower portion of the clamp unit 31, or may be a portion formed in an adsorption hole form in the clamp unit 31. As the suction pressure is applied to the upper surface of the template 50 by the suction unit 32, the template 50 may be sucked on the lower surface of the jig unit 31. Although the arrangement form of the suction unit 32 is not limited, it is preferable that the area in the Z axis does not overlap with the welding portion WP (area where laser welding is performed) of the mask 100[ see fig. 9] so as not to obstruct the laser beam entrance path.

The jig heating unit 34 may heat the template 50[ and the mask 100] clamped by the jig part 30. The chuck heating unit 34 may preheat the template 50 and the mask 100 before the template 50 and the mask 100 are moved to the process area near the frame 200. The jig heating unit 34, similar to the heating unit 29, may preheat the template 50 and the mask 100 at a level of the first temperature. Thus, when the clamping part 30 clamps the template 50[ and the mask 100] and moves onto the frame 200, since the attachment process is directly performed at the process area of the first temperature without waiting, it may contribute to a rapid process.

The jig heating unit 34 may be included in the jig unit 31 in the form of a heat-generating coil, but is not limited thereto, and may be in the form of a heat-generating body disposed on the surface of the jig unit 31, as long as the jig section 30 is disposed at any position within the range of preheating by heating the template 50[ and the mask 100 ].

The apparatus 10 for manufacturing a frame-integrated mask of the present invention may further include a preheating unit 5 in addition to the jig heating unit 34. Although the preheating part 5 is illustrated as being disposed outside the table 15 in fig. 10 and 12, it may be disposed inside the table 15 within a range that does not affect a process area where the attaching process of the mask 100 and the frame 200 is performed. However, the preheating section 5 is preferably disposed at a position where the jig section 30 can be approached.

The preheating part 5 may provide a space for loading and preheating the template 50 supporting the mask 100 before the clamping part 30 clamps the template 50 and the mask 100. A heating body is disposed inside or outside the preheating part 5 so that the template 50 supporting the mask 100 can be heated. The preheating part 5 may preheat the template 50 and the mask 100 at a first temperature level, similar to the heating unit 29. Accordingly, the template 50 and the mask 100 are maintained at the first temperature level before being clamped by the clamp part 30, so that the attachment process can be directly performed at the process area of the first temperature level when the clamp part 30 clamps the template 50[ and the mask 100] and moves onto the frame 200, thereby having an advantage of further shortening the standby time.

The jig moving unit 35 may move the jig unit 31 in at least one of directions X, Y, Z and the θ axis. In the present invention, the movement of the jig unit 31 in the X-axis and Y-axis directions is performed by the jig moving unit 40, and the movement of the jig moving unit 35 in the Z, θ -axis directions is assumed and described. The jig moving unit 35 may use a known moving/rotating means capable of moving/rotating in various directions without limitation. In addition, an auxiliary unit 33 intermediating in the connecting jig unit 31 and the jig moving unit 35 may be further included.

The connection unit 37 may function as an intermediary for connecting the jig moving unit 35 to the jig moving part 40 or the jig supporting unit 43. Further, the connecting unit 37 may use a known moving/rotating means capable of moving/rotating the jig moving unit 35 in the θ -axis direction without limitation. Accordingly, the gripper unit 31 can rotate and approach the template 50 on the preheating section 5.

The clamp moving unit 40 can move the clamp unit 30 in at least one of the directions X, Y, Z and θ. The concept of movement is understood to include not only moving the clamp portions 30 together by moving the clamp moving portion 40 in at least one of the directions X, Y, Z and θ in a state where the clamp portion 30 is fixed to the clamp moving portion 40, but also moving only the clamp portion 30 in a state where the clamp moving portion 40 is not moved. In the present invention, the description will be made assuming that the jig moving unit 40 moves in the X, Y axis direction of the jig unit 30 and the jig moving unit 35 or the jig supporting unit 45 moves in the Z and θ axis directions of the jig unit 30.

The jig moving part 40 may include a base unit 41, a jig supporting unit 43, and a jig rail unit 45.

The base unit 41 is in a wide plate form, and the upper portion may provide a space for arranging the jig support unit 43. The both side portions are connected to the jig rail unit 45 so as to be movable in the forming direction of the jig rail unit 45.

The clamp supporting unit 43 may be disposed on the base unit 41 and serves to support the clamp portion 30. The jig supporting unit 43 is movable along a forming direction of the base rail unit 44 formed on the base unit 41.

The jig rail units 45 may be formed at both sides of the table part 20 along the forming direction of the table part 20[ or the loading part 21], and the base unit 41 may move on the jig rail units 45.

According to an embodiment, the table part 20 is formed substantially long in the X-axis direction, and a dual jig rail unit 45 may be formed on a corner portion of the long side of the table part 20 in the X-axis direction. The base unit 41 is formed to extend in the Y-axis direction, and both ends thereof are connected to a double clamp rail unit 45, respectively, so as to be movable in the X-axis direction. Also, a base rail unit 44 may be formed on the base unit 41 along the Y-axis direction, and the clamp supporting unit 43 is connected to the base rail unit 44 so as to be movable in the Y-direction.

The left side portion of the table part 20 is disposed with the frame 200, and the right side portion is disposed with the clamp part 30 and the clamp moving part 40. The base unit 41 is disposed apart from the table portion 20 on the Z axis. Therefore, even if the base unit 41 is moved in the X-axis direction toward the area where the left frame 200 is disposed by the clamp rail unit 45, the frame 200 and the base unit 41 do not interfere with each other. Based on this, the template 50 clamped by the clamp portion 30 supported on the base unit 41 can be corresponded to the specific unit region CR on the frame 200.

The head portion 60 may be disposed at an upper portion of the table portion 20 or the clamp portion 30. The head 60 may be provided with a laser unit 61(61a, 61b), a camera unit 65, a gap sensor (gap sensor), a failure analysis unit 67, and the like.

The laser unit 61 may generate laser light L for welding the mask 100 and the frame 200. Alternatively, the laser unit 61 may also generate cutting laser light for laser trimming (trimming) by irradiating the mask 100. A pair of laser units 61(61a, 61b) are arranged at intervals and are provided so that the positions of the X axis and the Y axis can be adjusted. The spaced distance may correspond to the distance of the left and right welding parts WP of the mask 100. When the mask 100 is attached to the frame 200 and the laser beam L is irradiated, the welding can be performed only once by irradiating the laser beam L without irradiating the laser beam L to each of the left and right welding portions WP of the mask 100. Therefore, both sides of the mask 100 are attached to the frame 200 at the same time, and thus, compared to a process of attaching one side at a time, there is an advantage in that a process time can be shortened, and the mask 100 is stably attached to the frame 200 without being deformed.

The camera unit 65 can sense the alignment state of the mask 100 and the mask pattern P by photographing. A gap sensor unit may measure a Z-axis displacement of the mask 100 or may sense a distance of the head 60 from the mask 100, the frame 200, and the like. The failure analysis unit may detect a failure state of the mask 100.

The head moving section 70(71, 75) can move the head section 60 in at least one direction of the X, Y, Z axes. The present invention is explained assuming that the head moving unit 70 moves the head 60 to the X axis. The first head moving unit 71 is connected to an upper portion of the head unit 60 and receives moving power, and a second head moving unit 75 provided at a distance from a lower portion of the first head moving unit 71 is connected to a main component of the head unit 60, and the head unit 60 is guided by the X-axis guide 76 to move in the X-axis direction.

A vibration damping table 80 may be provided to prevent vibration of the table 15. When the mask 100 is attached to the frame 200, the alignment error (PPA) of the mask pattern P is affected even in an environment where very minute vibration occurs. Accordingly, the vibration canceling table 80 may preferably provide a passive isolator (passive isolator) at the lower portion of the table 15 to prevent vibration.

Fig. 13 to 14 are schematic views of a process of manufacturing a mask supporting template by bonding a mask metal film 110 on a template 50 and forming a mask 100 according to an embodiment of the present invention.

Referring to fig. 13 (a), a template (template)50 may be provided. The stencil 50 is a medium having one side to which the mask 100 is attached and moving the mask 100 in a state of supporting the mask 100. One side of the stencil 50 is preferably a flat side to support and carry the flat mask 100. The center portion 50a may correspond to the mask cell C of the mask metal film 110, and the edge portion 50b may correspond to a dummy portion of the mask metal film 110. In order to be able to support the mask metal film 110 as a whole, the area of the stencil 50 is larger than that of the mask metal film 110, and may be a flat shape.

The template 50 is preferably a transparent materialFor visual (vision) observation or the like during alignment and attachment of the mask 100 to the frame 200. In addition, when a transparent material is used, the laser light can also be passed through. As the transparent material, glass (glass), silica gel (silica), heat-resistant glass, quartz (quartz), alumina (Al) can be used₂O₃) Borosilicate glass (borosilicate glass), zirconia (zirconia), and the like. For example, borosilicate glass, which is excellent in heat resistance, chemical durability, mechanical strength, transparency, and the like, can be used as the template 50

33 of a material. In addition to this, the present invention is,

33 has a thermal expansion coefficient of about 3.3, and has an advantage that the difference between the thermal expansion coefficient and the invar mask metal film 110 is small, and the mask metal film 110 can be easily controlled.

In addition, in order to prevent an air gap (air gap) from occurring between boundaries with the mask metal film 110[ or the mask 100], a surface of the stencil 50 contacting the mask metal film 110 may be a mirror surface. In view of this, the surface roughness Ra of one side of the template 50 may be 100nm or less. In order to realize the template 50 having the surface roughness Ra of 100nm or less, a wafer (wafer) may be used as the template 50. The wafer (wafer) has a surface roughness Ra of about 10nm, is commercially available in many products, and has a widely known surface treatment process, and thus can be used as the template 50. Since the surface roughness Ra of the template 50 is in the order of nm, it can be of a level having no air gap or almost no air gap, so that the solder ball WB is easily generated by laser welding, and alignment errors of the mask pattern P are not affected.

In order to allow the laser beam L irradiated from the upper portion of the mask 50 to reach a welding portion WP (a welding region) of the mask 100 (see fig. 9), the mask 50 may be formed with a laser through hole 51. The laser through holes 51 can be formed in the die plate 50 so as to correspond to the positions and the number of the welding portions WP. Since a plurality of welding portions WP are arranged at predetermined intervals on the edge of the mask 100 or the dummy portion DM portion, a plurality of laser penetration holes 51 are also formed at predetermined intervals in correspondence therewith. As an example, since a plurality of welding portions WP are arranged at predetermined intervals on both sides (left/right sides) of the dummy portion DM of the mask 100, a plurality of laser penetration holes 51 may be formed at predetermined intervals on both sides (left/right sides) of the mask 50.

The laser penetration holes 51 do not necessarily correspond to the positions and the number of the welding portions WP. For example, the laser L may be irradiated to only a part of the laser through-hole 51 to perform welding. In addition, a part of the laser through-hole 51 that does not correspond to the welding portion WP may be used instead of the alignment mark when aligning the mask 100 and the mask 50. If the material of the template 50 is transparent to the light of the laser light L, the laser through-hole 51 may not be formed.

A temporary bonding portion 55 may be formed on one surface of the template 50. The temporary bonding portion 55 may temporarily attach the mask 100[ or the mask metal film 110] to one surface of the stencil 50 and support it on the stencil 50 before the mask 100 is attached to the frame 200.

The temporary bonding portion 55 may use an adhesive or a bonding sheet (thermal release type) that is separable by heat, an adhesive or a bonding sheet (UV release type) that is separable by irradiation of UV.

For example, liquid wax (liquid wax) may be used for the temporary bonding portion 55. The liquid wax may be the same wax as that used in the polishing step of the semiconductor wafer or the like, and the type thereof is not particularly limited. As the resin component mainly used for controlling the adhesive force, impact resistance, and the like associated with the holding power, the liquid wax may include substances such as acrylic acid, vinyl acetate, nylon, and various polymers, and solvents. For example, the temporary bonding portion 55 may be formed of SKYLIQUIDABR-4016 containing Acrylonitrile Butadiene Rubber (ABR) as a resin component and n-propanol as a solvent component. A liquid wax is formed on the temporary bonding portion 55 by a spin coating method.

The temporary bonding portion 55, which is liquid wax, has a decreased viscosity at a temperature higher than 85 ℃ to 100 ℃ and an increased viscosity at a temperature lower than 85 ℃, and a portion thereof may be solidified as a solid, so that the mask metal film 110 may be fixedly bonded to the mask 50.

The mask metal film 110 may be prepared before or after the template 50 is prepared.

As an example, the mask metal film 110 may be prepared by rolling. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundreds of μm based on the manufacturing process. As described earlier in fig. 8, fine patterning can be performed only by using a thin mask metal film 110 having a thickness of 20 μm or less in order to obtain high resolution of UHD level, and it is necessary to use a thin mask metal film 110 having a thickness of 10 μm in order to obtain ultra high resolution of UHD or more. However, the mask metal film 110' formed by the rolling process has a thickness of about 25 to 500 μm, and thus it is necessary to reduce the thickness.

Therefore, a process of planarizing one side of the PS [ refer to (b) of fig. 13 ] mask metal film 110' may be further performed. Here, the planarization PS is to reduce the thickness by partially removing the upper portion of the mask metal film 110 'while mirror-rendering one surface (upper surface) of the mask metal film 110'. The planarization PS can be performed by a CMP (chemical mechanical polishing) method, and any known CMP method can be used without limitation. In addition, the thickness of the mask metal film 110' may be thinned using a chemical wet etching (chemical wet etching) or dry etching (dry etching) method. In addition to this, a process of planarization that thins the thickness of the mask metal film 110' may be used without limitation.

In the process of performing the planarization PS, the surface roughness Ra of the upper surface of the mask metal film 110' may be controlled in the CMP process, as an example. Preferably, a mirroring for further reducing the surface roughness may be performed. Alternatively, as another example, the planarization PS may be performed by a chemical wet etching or dry etching process, and then an additional polishing process such as a CMP process may be performed to reduce the surface roughness Ra.

Thus, the mask metal film 110' can be made thin to a thickness of about 50 μm or less. Thus, the thickness of the mask metal film 110 is preferably about 2 μm to 50 μm, and more preferably about 5 μm to 20 μm. But is not necessarily limited thereto.

As another example, the mask metal film 110 may be prepared by electroforming.

In order to be able to perform electroforming (electroforming), the base material of the master may be a conductive material. The master plate can be used as a cathode (cathode) electrode in electroforming.

As the conductive material, metal oxide may be formed on the surface of metal, impurities may be doped during the production of metal, inclusions or grain boundaries (grain boundary) may be present in the polycrystalline silicon substrate, impurities may be highly contained in the conductive polymer substrate, and the strength, acid resistance, and the like may be relatively weak. Elements such as metal oxides, impurities, inclusions, grain boundaries, etc., which prevent the electromagnetic field from being uniformly formed on the surface of the mother substrate (or cathode) are called "defects" (defects). Since a uniform electromagnetic field cannot be introduced to the cathode of the above-mentioned material due to a Defect (Defect), a part of the plating film 110[ or the mask metal film 110] can be formed non-uniformly.

In the process of realizing a pixel of ultra high definition of UHD level or higher, unevenness of the plating film and the plating film pattern [ mask pattern P ] adversely affects formation of the pixel. For example, the current QHD image quality is 500-600PPI (pixel) and the pixel size reaches about 30-50 μm, while the 4K UHD and 8K UHD high definition have higher resolution of 860PPI and 1600 PPI. And the micro-display directly applied to the VR machine or the micro-display inserted into the VR machine is targeted at super high image quality of more than 2000PPI, and the pixel size is about 5-10 μm. Since the pattern width of the FMM or shadow mask used herein may be several μm to several tens μm, and preferably less than 30 μm, even a defect of several μm has a large weight in the pattern size of the mask. Furthermore, in order to remove defects in the cathode of the above-described material, an additional process for removing metal oxide, impurities, and the like may be performed, and other defects such as etching of the cathode material may also be induced in the process.

Thus, the present invention may use a master (or cathode) of single crystal material. In particular, a single crystal silicon material is preferable. To be conductive, a single crystal silicon material may be implemented in a motherboard 10¹⁹/cm³The above is doped at high concentration. Can be dopedThe process may be performed for all of the mother board, or may be performed for only a surface portion of the mother board.

Further, as the single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, and Ge, carbon-based materials such as graphite (graphite) and graphene (graphene), including CH, can be used₃NH₃PbCl₃，CH₃NH₃PbBr₃，CH₃NH₃PbI₃，SrTiO₃And single crystal ceramics for superconductors such as perovskite (perovskite) structures, and single crystal superalloys for aircraft parts. The metal or carbon-based material is basically a conductive material. For semiconductor materials, 10 can be done to have conductivity¹⁹/cm³So as to have a high concentration of doping. For other materials, conductivity can be formed by doping or forming oxygen vacancies (oxygen vacancies) or the like. The doping may be performed on all of the motherboard or only on a portion of the surface of the motherboard.

As for the single crystal material, since it has no defect, there is an advantage that the plating film 110 can be formed uniformly since the electromagnetic field is formed uniformly over the entire surface at the time of electroforming. The frame-integrated mask 100, 200 manufactured by uniform plating can further improve the image quality level of the OLED pixel. In addition, because an additional process for removing and removing the defects is not required, the method has the advantages of reducing the process cost and improving the production efficiency.

By using a conductive substrate as a master (Cathode) and disposing an anode (not shown) at a distance, the plating film 110[ or the mask metal film 110] can be formed on the conductive substrate by electroforming.

Then, the plated film 110 may be separated from the conductive substrate.

In addition, the heat treatment H may be performed before the plated film 110 is separated from the conductive substrate. In order to reduce the thermal expansion coefficient of the mask 100 and to prevent the mask 100 and the mask pattern P from being deformed by heat, heat treatment is performed before the plating film 110 is separated from the conductive substrate [ or the master, the cathode ]. The heat treatment may be performed at a temperature of 300 ℃ to 800 ℃.

The coefficient of thermal expansion of invar alloy sheets typically produced by electroforming is higher than that of invar alloy sheets produced by calendering. Therefore, the thermal expansion coefficient can be reduced by heat-treating the invar alloy thin plate, but the invar alloy thin plate may be deformed or the like during the heat treatment. Therefore, if the plating film 110 is formed on the upper surface, the side surface, or a part of the lower surface of the conductive substrate in a state of being bonded to the conductive substrate, peeling, deformation, or the like does not occur even if heat treatment is performed, and heat treatment can be stably performed.

The mask metal film 110 generated by the electroforming process may have a thinner thickness than the mask metal film 110 generated by the rolling process. Thus, although the planarization PS process for reducing the thickness may also be omitted, different etching characteristics may be possible based on the composition, crystalline structure/fine structure of the surface layer of the gold-plated mask metal film 110, and thus it is necessary to control the surface characteristics, thickness by the planarization PS.

Then, referring to fig. 13 (b), a mask metal film 110' may be adhered on the stencil 50. After the liquid wax is heated to 85 ℃ or higher and the mask metal film 110 'is brought into contact with the stencil 50, the mask metal film 110' and the stencil 50 are passed between rollers to perform adhesion.

According to an embodiment, the masking metal film lamination (plating) process may be performed immediately after the solvent of the temporary bonding portion 55 is vaporized by baking (baking) at about 120 ℃ for about 60 seconds on the template 50. The lamination is performed by loading a mask metal film 110' on a stencil 50 having a temporary bonding portion 55 formed on one side thereof and passing it between an upper roller (roll) of about 100 c and a lower roller of about 0 c. As a result, the mask metal film 110' can be in contact with the template 50 with the temporary bonding portion 55 interposed therebetween.

Fig. 15 is an enlarged cross-sectional view of the temporary bonding portion 55 according to an embodiment of the present invention. As another example, a thermal release tape (thermal release tape) may be used as the temporary adhesive portion 55. A core film (core film)56 such as a PET film is disposed in the middle of the thermal peeling tape, thermally peelable adhesive layers (thermal release films) 57a, 57b are disposed on both sides of the core film 56, and the outer contours of the adhesive layers 57a, 57b may be in a form in which the peeling films/ release films 58a, 58b are disposed. Wherein the mutual peeling temperatures of the adhesive layers 57a, 57b disposed on both sides of the core film 56 may be different from each other.

According to an embodiment, in a state where the release films/ release films 58a, 58b are removed, the lower surface [ second adhesive layer 57b ] of the thermal release tape is adhered on the stencil 50, and the upper surface [ first adhesive layer 57a ] of the thermal release tape may be adhered on the mask metal film 110'. Since the first adhesive layer 57a and the second adhesive layer 57b have mutually different peeling temperatures, when the template 50 is separated from the mask 100 in fig. 20 described later, the mask 100 can be separated from the template 50 and the temporary adhesive portion 55 by applying heat for peeling the first adhesive layer 57 a.

Next, referring again to fig. 13 (b), one surface of the PS mask metal film 110' may be planarized. As described above, the mask metal film 110 'manufactured by the rolling process can be reduced in thickness (110' - >110) by the planarization PS process. In addition, the mask metal film 110 manufactured by the electroforming process may be subjected to the planarization PS process in order to control the surface characteristics and thickness.

Thus, as the thickness of the mask metal film 110 'is reduced (110' - >110), the thickness of the mask metal film 110 may be about 5 μm to 20 μm, as in (c) of fig. 13.

Then, referring to fig. 14 (d), a patterned insulating portion 25 may be formed on the mask metal film 110. The insulating portion 25 may be formed of a photoresist material using a printing method or the like.

Next, the mask metal film 110 may be etched. At this time, dry etching, wet etching, or the like may be used without limitation, and as a result of etching, the portions of the mask metal film 110 exposed by the empty spaces 26 between the insulating portions 25 may be etched. The etched portion of the mask metal film 110 constitutes a mask pattern P, so that the mask 100 formed with a plurality of mask patterns P can be manufactured.

Then, referring to fig. 14 (e), the manufacture of the template 50 for supporting the mask 100 may be ended by removing the insulation part 25.

Since the frame 200 has a plurality of mask unit regions CR, it is also possible to have a plurality of masks 100, the masks 100 having mask units C corresponding to each mask unit region CR. Further, there may be a plurality of templates 50 for respectively supporting a plurality of masks 100.

Fig. 16 is a schematic view of a process of loading a mask support template on a frame according to an embodiment of the present invention.

Referring to fig. 16, the template 50 may be transferred by the clamp portion 30. The suction unit 32 of the jig part 30 can be transferred by sucking the mask 100 to the surface opposite to the surface of the stencil 50. The jig part 30 sucks and transfers the mask 50, and the mask 100 is adhered and supported on the mask 50 through the temporary adhering part 55, so that the adhering state and the alignment state of the mask 100 are not affected in the process of transferring the mask 50 to the frame 200.

Fig. 17 is a schematic view illustrating a state in which the template 50 is loaded on the frame 200 after the temperature of the process region is raised and the mask 100 corresponds to the cell regions CR (CR11 to CR52) of the frame 200 according to an embodiment of the present invention. The following description will be given taking as an example a frame 200 having mask cell regions CR (CR11 to CR52) of 2X 5. Fig. 17 illustrates an example in which one mask 100 is corresponding/attached to the cell region CR, but a process of attaching the mask 100 to the frame 200 by simultaneously corresponding a plurality of masks 100 to all the cell regions CR, respectively, may also be performed. In this case, there may be a plurality of templates 50 for respectively supporting a plurality of masks 100.

Then, referring to fig. 17, after raising the temperature of the process area by ET, the mask 100 may be aligned to one mask cell area CR of the frame 200. The present invention is characterized in that any tensile force is not applied to the mask 100 during the process of corresponding the mask 100 to the mask cell region CR of the frame 200.

Since the mask unit sheet portions 220 of the frame 200 have a thin thickness, if the mask 100 is attached to the mask unit sheet portions 220 in a state where a tensile force is applied thereto, the tensile force remaining in the mask 100 may act on and deform the mask unit sheet portions 220 and the mask unit regions CR. Therefore, the mask 100 should be attached to the mask die portion 220 in a state where no tensile force is applied to the mask 100. Accordingly, it is possible to prevent the frame 200[ or the mask unit sheet portion 220] from being deformed by the tensile force applied to the mask 100 acting on the frame 200 in turn in the form of tension (tension).

However, a problem may occur when the frame-integrated mask is manufactured by attaching the mask 100 to the frame 200 or the mask die part 220 without applying a tensile force thereto, and the frame-integrated mask is used in a pixel deposition process. When the pixel deposition process is performed at a temperature of about 25 to 45 deg.c, the mask 100 expands by a predetermined length. Even the mask 100 made of invar alloy material has a length varying by about 1 to 3ppm based on a temperature rise of about 10 ℃ in a process atmosphere for forming a pixel deposition. For example, when the total length of the mask 100 is 500mm, the length thereof can be increased by about 5 to 15 μm. This causes deformation such as sagging of the mask 100 due to its own weight or distortion such as twisting due to elongation while being fixed to the frame 200, and causes a problem of an increase in alignment error between the patterns P.

Accordingly, the present invention is characterized in that it is attached to the mask unit region CR of the frame 200 in a state where no tensile force is applied to the mask 100 at an extraordinary temperature higher than the ordinary temperature. It is stated in this specification that the mask 100 is aligned and attached to the frame 200 after the temperature of the process region is raised to the first temperature ET.

The "process area" may refer to a space for placing the constituent elements of the mask 100, the frame 200, etc., and for performing an attaching process of the mask 100, etc. The process region may be a space within the closed chamber or may be an open space. Also, the "first temperature" may refer to a temperature equal to or higher than a temperature of a pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the temperature of the pixel deposition process is about 25 to 45 deg.c, the first temperature may be about 25 to 60 deg.c. The temperature rise of the process area may be performed by a method of driving the heating unit 29 or providing heating means in the chamber, or providing heating means around the process area, or the like.

Referring again to fig. 17, after raising the temperature of the process area including the frame 200 to the first temperature ET, the mask 100 may be corresponded to the mask cell area CR. Alternatively, after the mask 100 is corresponded to the mask cell region CR, the temperature of the process region including the frame 200 may be raised to the first temperature ET.

The mask 100 may be corresponded to the mask unit region CR by loading the template 50 on the frame 200 or the mask unit sheet part 220. Whether the mask 100 corresponds to the mask unit region CR or not can be observed by the camera unit 65 of the head portion 60 while controlling the position of the jig portion 30. Since the template 50 presses the mask 100, the mask 100 can be closely attached to the frame 200. Since the mask 100 may be corresponded to the mask cell region CR by controlling the position of the template 50, any tensile force may not be directly applied to the mask 100.

In addition, the lower support unit 90[ refer to fig. 19] may also be disposed at the lower portion of the frame 200. The lower support unit 90 may be integrally formed with the frame support unit 26. The lower support unit 90 may have a size to be just placed in the hollow area of the frame edge portion 210 and have a flat plate shape. In addition, a predetermined supporting groove (not shown) corresponding to the shape of the mask unit piece portion 220 may be formed on the upper surface of the lower supporting unit 90. In this case, since the edge sheet part 221 and the first and second grid sheet parts 223 and 225 are inserted into the supporting grooves, the mask unit sheet part 220 is more firmly fixed.

The lower support unit 90 may press the opposite side of the mask unit region CR, which the mask 100 contacts. That is, the lower supporting unit 90 supports the mask unit sheet part 220 in the upper direction, so that the mask unit sheet part 220 can be prevented from hanging down in the lower direction during the attachment of the mask 100. Meanwhile, the mask 100 may be maintained in an aligned state without being disturbed by causing the lower support unit 90 and the stencil 50 to press the edge of the mask 100 and the frame 200[ or the mask unit sheet part 220] in opposite directions.

In this manner, the process of corresponding the mask 100 to the mask unit region CR of the frame 200, in which no tensile force is applied to the mask 100, can be finished only by attaching the mask 100 to the stencil 50 and loading the stencil 50 onto the frame 200.

Fig. 18 is a schematic diagram of a process of attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Then, the mask 100 may be irradiated with the laser L and the mask 100 may be attached to the frame 200 based on the laser welding. A bead WB is generated on a welding portion WP portion of the mask by laser welding, and the bead WB may have the same material as the mask 100/frame 200 and be integrally connected thereto. The pair of laser units 61a, 61b arranged at intervals can perform welding by simultaneously irradiating laser light L to the left-side welding portion WP and the right-side welding portion WP of the mask 100.

Fig. 19 is a schematic view of a state in which an adsorption force is applied to the mask 100 through the adsorption holes 229 according to an embodiment of the present invention.

In addition, according to another embodiment, a plurality of adsorption holes 229 may be formed near corners of the frame 200 where the mask unit region CR exists. Specifically, a plurality of suction holes 229 may be formed at portions spaced apart from the corners of the mask unit sheet portion 220 by a predetermined distance, and more specifically, at portions spaced apart from the inner corners of the edge sheet portion 221 by a predetermined distance and at portions spaced apart from the corners of the first and second grid sheet portions 223 and 225 by a predetermined distance.

The form, size, and the like of the plurality of adsorption holes 229 are not limited to a range capable of functioning as a vacuum adsorption pressure. However, the positions of the plurality of suction holes 229 preferably do not overlap the welding portion WP of the mask 100. If the welding part WP overlaps the suction hole 229, the mask 100 and the frame 200[ or the mask unit piece part 220] are not in close contact, and thus the welding bead WB cannot be satisfactorily generated by laser welding. It is preferable that the plurality of suction holes 229 are formed at a portion near the welding portion WP so that the welding portion WP of the mask 100 can be more closely attached to the frame 200[ or the mask unit sheet portion 220 ].

As shown in fig. 19, if the template 50 is mounted on the frame 200[ or the mask die portions 220], a part of the lower surface of the mask 100 abuts on the upper portion of the frame 200[ or the mask die portions 220 ]. The upper portion of the adsorption hole 229 formed in the frame 200 or the mask unit sheet portion 220 corresponds to the lower surface of the mask 100, and an adsorption force (adsorption pressure) applying means corresponding to the lower portion of the adsorption hole 229 applies an adsorption force VS or an adsorption pressure VS to the mask 100 through the adsorption hole 229, so that the portion of the mask 100 corresponding to the adsorption hole 229 can be pulled. Thereby, the mask 100 can be more closely attached to the frame 200, and the welding bead WB can be more stably generated when the laser welding is performed.

An adsorption part 95 may be formed at an upper portion of the lower supporting unit 90. The adsorption part 95 is preferably disposed at a position corresponding to the adsorption hole 229 formed on the frame 200 or the mask unit sheet part 220. In other words, the adsorption part 95 may be disposed at a position capable of collectively applying the adsorption force VS [ or the adsorption pressure VS ] to the adsorption holes 229 on the lower support unit 90. The suction unit 95 may be a vacuum suction device, and may be connected to an external suction pressure generating means. For example, the lower support unit 90 has a vacuum line 96 formed therein, and has the other end connected to an external suction pressure generating means (not shown) such as a pump, and the other end connectable to the suction portion 95. The upper surface of the suction unit 95 connected to the vacuum line 96 is formed with a plurality of holes, slits, and the like, and thus can be used as a passage for applying suction pressure. The external suction pressure generating means is connected to the plurality of vacuum pipes 96 of the lower support unit 90, so that the suction pressure of each vacuum pipe 96 can be individually controlled, or the suction pressures of all the vacuum pipes 96 can be simultaneously controlled.

The adsorption part 95 of the lower support unit 90 supplies an adsorption force VS [ or an adsorption pressure VS ], and the adsorption force VS is applied to the mask 100 through the adsorption holes 229, whereby the mask 100 can be pulled toward the adsorption part 95 side (lower side). At this time, the interfaces of the mask 100 and the frame 200[ or the main die sheet portion 220] may be in close contact with each other.

Since the adsorption part 95 pulls the mask 100 strongly, a fine air gap does not exist between the interface between the mask 100 and the frame 200. As a result, since the mask 100 is in close contact with the frame 200[ in the enlarged view of fig. 19, the first grid sheet portion 223], even if the laser light L is irradiated to any position of the welding portion WP, the welding bead WB can be generated well between the mask 100 and the frame 200. The welding bead WB integrally connects the mask 100 and the frame 200, thereby having an advantage that welding can be stably performed.

As illustrated in fig. 10, the lower support unit 90 may also be integrally formed with the frame support unit 25. Referring again to fig. 19, the lower portion of the lower support unit 90[ the frame support unit 25] is disposed with a heating unit 29 so that the temperature of the process area can be controlled to a first temperature, a second temperature, etc. by heating.

Fig. 20 is a schematic view of a process of separating the mask 100 from the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.

Referring to fig. 20, after the mask 100 is attached to the frame 200, the mask 100 may be separated (bonding) from the template 50. The separation of the mask 100 from the template 50 may be performed by at least one of heating EP, chemical treatment CM, application of ultrasonic waves US, and application of ultraviolet rays UV to the temporary bonding portion 55. Since the mask 100 is maintained in the state of being attached to the frame 200, only the mask 50 can be lifted. For example, if a thermal EP at a temperature higher than 85 to 100 ℃ is applied, the adhesiveness of the temporary bonding portion 55 is lowered, the bonding force between the mask 100 and the template 50 is weakened, and the mask 100 and the template 50 can be separated. As another example, the mask 100 and the template 50 may be separated by immersing the temporary adhesive portion 55 in a chemical substance such as IPA, acetone, or ethanol so as to dissolve or remove the temporary adhesive portion 55. As another example, the mask 100 and the stencil 50 may be separated by weakening the adhesive force between the mask 100 and the stencil 50 by applying the ultrasonic wave US or the ultraviolet light UV.

Further, the temporary bonding part 55, which is an intermediary of the bonding mask 100 and the template 50, is a TBDB bonding material (bonding) so that various separation (bonding) methods can be used.

As an example, a Solvent partitioning (Solvent partitioning) method based on chemically treated CM may be used. The temporary bonding portion 55 may be dissolved and separated based on penetration of a solvent (solvent). At this time, the mask 100 has the pattern P formed thereon, so that the solvent may permeate through the mask pattern P and the boundary between the mask 100 and the template 50. The solvent separation may be performed at a normal temperature (roomtemperature), and has an advantage of being relatively inexpensive compared to other separation methods since an additional complicated separation apparatus is not required.

As another example, a Heat separation (Heat Debonding) method based on heated EP may be used. By inducing the decomposition of the temporary bonding portion 55 by the heat of high temperature, if the bonding force between the mask 100 and the template 50 is weakened, the separation can be performed in the vertical direction or the horizontal direction.

As another example, a release adhesive separation (peelabeadhesive Debonding) method based on heating EP, application of ultraviolet UV, or the like can be used. When the temporary bonding portion 55 is a thermal release tape, the separation may be performed using a release adhesive separation method, which does not require high-temperature heat treatment such as a thermal separation method and does not require additional expensive heat treatment equipment, and has an advantage of relatively simple performing process.

As another example, a Room Temperature separation (Room Temperature separation) method based on chemical treatment CM, application of ultrasonic waves US, application of ultraviolet rays UV, or the like may be used. If the non-stick process is performed on a part (central part) of the mask 100 or the template 50, only the edge part is adhered by using the temporary adhesion part 55. Further, the solvent penetrates to the edge portion at the time of separation to dissolve the temporary bonding portion 55 to thereby effect separation. This method has advantages that direct loss of the remaining portions other than the edge regions of the mask 100 and the template 50 during the bonding and separation process or defects due to residues of the bonding material (residue) do not occur at the time of separation. In addition, unlike the thermal separation method, since a high-temperature heat treatment process is not required at the time of separation, there is an advantage that the process cost can be relatively reduced.

Fig. 21 is a schematic view illustrating a state in which the mask 100 is aligned with the cell region CR of the adjacent frame 200 according to an embodiment of the present invention.

Referring to fig. 21, the mask 100 may be corresponded to a mask cell region CR121 adjacent to the mask cell region CR111 to which the mask 100 is attached. The temperature of the process zone may maintain the state of fig. 17 raised to the first temperature ET. Thus, the mask 100 can maintain the volume of the first temperature without applying a tensile force.

The mask 100 may be corresponded to the mask unit region CR121 by loading the template 50 on the frame 200 or the mask unit sheet part 220. A method of corresponding the mask 100 to the mask unit region CR121 by controlling the position of the template 50 is the same as the process of fig. 17. The mask 100 may be first associated with a mask cell region CR other than the mask cell region CR121 adjacent to the mask cell region CR 111.

Next, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 and based on the laser welding. The welding part of the laser welded mask is formed with a welding bead WB, which may have the same material as the mask 100/frame 200 and be integrally connected thereto.

Fig. 22 is a schematic view illustrating a process of separating the mask 100 from the mask 50 after attaching the mask 100 to the cell region CR of the adjacent frame 200 according to an embodiment of the present invention.

Referring to fig. 22, after the mask 100 is attached to the frame 200, the mask 100 may be separated (bonding) from the template 50. The separation of the mask 100 from the template 50 may be performed by at least one of heating EP, chemical treatment CM, application of ultrasonic waves US, and application of ultraviolet rays UV to the temporary bonding portion 55. Since the mask 100 is maintained in the state of being attached to the frame 200, only the mask 50 can be lifted. This is the same as that described in fig. 20.

Fig. 23 is a schematic view of a state in which the mask 100 is attached to the frame 200 according to an embodiment of the present invention.

Then, referring to fig. 23, a process of corresponding the mask 100 to the remaining mask unit regions CR and attaching may be performed. All the masks 100 may be attached on the mask unit regions CR of the frame 200.

The conventional mask 10 of FIG. 1 includes 6 cells C1-C6 and thus has a longer length, whereas the mask 100 of the present invention includes one cell C and thus has a shorter length, and thus the degree of PPA (pixel position access) twist is reduced. Assuming that the length of the mask 10 including the plurality of cells C1 to C6 … is 1m and a PPA error of 10 μm occurs in the total length of 1m, the mask 100 of the present invention can change the above error range to 1/n as the relative length decreases (corresponding to the decrease in the number of cells C). For example, the mask 100 of the present invention has a length reduced from 1m of the conventional mask 10 to 1/10 when the length is 100mm, so that a PPA error of 1 μm occurs in a total length of 100mm, and an alignment error is significantly reduced.

On the other hand, the mask 100 is provided with a plurality of cells C, and even if the respective cells C are made to correspond to the respective cell regions CR of the frame 200 within a range in which the alignment error is minimized, the mask 100 may correspond to the plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell region CR. In this case, the mask 100 is preferably provided with as few cells C as possible in consideration of alignment-based process time and productivity.

In the present invention, since only one cell C of the mask 100 needs to be matched and the alignment state needs to be confirmed, the manufacturing time can be significantly reduced as compared to the conventional method in which a plurality of cells C (C1 to C6) are simultaneously matched and all the alignment states need to be confirmed.

That is, the method of manufacturing the frame-integrated mask of the present invention can significantly reduce time by corresponding the cells C11 to C16 included in the 6 masks 100 to one cell regions CR11 to CR16, respectively, and by 6 processes of confirming the respective alignment states, as compared with the conventional method of simultaneously matching the 6 cells C1 to C6 and simultaneously confirming the alignment states of the 6 cells C1 to C6.

In the method for manufacturing a frame-integrated mask of the present invention, the yield of products in 30 processes in which 30 masks 100 are aligned in correspondence with 30 cell regions CR (CR11 to CR56), respectively, can be significantly higher than the yield of existing products in 5 processes in which 5 masks 10 (see fig. 2 (a)) each including 6 cells C1 to C6 are aligned in correspondence with a frame 20. The existing method of aligning 6 cells C1-C6 in an area corresponding to 6 cells C at a time is a significantly cumbersome and difficult work, and the product yield is low.

Fig. 24 is a schematic view illustrating a process of decreasing the temperature of the process field after the mask 100 is attached to the cell region CR of the frame 200 according to an embodiment of the present invention.

Then, referring to fig. 24, the temperature of the process area is lowered to the second temperature LT. "second temperature" refers to a temperature lower than the first temperature. Considering that the first temperature is about 25 to 60 c and the second temperature is lower than the first temperature, it may be about 20 to 30 c, and preferably, the second temperature may be a normal temperature. The temperature drop of the process area may be controlled by the heating unit 29, or a method of providing a cooling means in the chamber or around the process area, a method of natural cooling at normal temperature, and the like may be performed.

If the temperature of the process area is lowered to the second temperature LT, the mask 100 may be heat-shrunk by a predetermined length. The mask 100 may be heat-shrunk isotropically in all lateral directions. Simply, since the mask 100 is fixedly attached to the frame 200[ or the mask die portions 220] by soldering, the thermal contraction of the mask 100 itself applies a tension TS to the surrounding mask die portions 220. The mask 100 may be more tightly attached to the frame 200 based on the tension TS applied by the mask 100 itself.

In addition, after the masks 100 are all attached to the corresponding mask unit regions CR, the temperature of the process region is lowered to the second temperature LT, whereby all the masks 100 are simultaneously thermally shrunk, thereby causing a problem that the frame 200 is deformed or an alignment error of the pattern P becomes large. To explain, even though the tension TS is applied to the mask unit sheet portions 220, since the plurality of masks 100 apply the tensions TS contracted in opposite directions, the tensions TS are offset from each other, and thus the mask unit sheet portions 220 are not deformed. For example, in the first grid sheet portion 223 between the mask 100 attached to the CR11 cell region and the mask 100 attached to the CR12 cell region, the tension TS acting in the right direction of the mask 100 attached to the CR11 cell region and the tension TS acting in the left direction of the mask 100 attached to the CR12 cell region may cancel each other. Accordingly, there is an advantage in that an alignment error of the mask 100 or the mask pattern P can be minimized by minimizing deformation of the frame 200 or the mask die portion 220 due to the tension TS.

Fig. 25 is a schematic view of an OLED pixel deposition apparatus 1000 using a frame-integrated mask 100, 200 according to an embodiment of the present invention.

Referring to fig. 25, the OLED pixel deposition apparatus 1000 includes: a magnetic plate 300 which accommodates the magnet 310 and in which the cooling water pipe 350 is arranged; and a deposition source supply part 500 for supplying the organic material 600 from a lower part of the magnetic plate 300.

A target substrate 900 such as glass for depositing the organic source 600 may be inserted between the magnetic plate 300 and the deposition source deposition part 500. The frame-integrated masks 100 and 200 (or FMM) for depositing the organic material source 600 in different pixels may be disposed on the target substrate 900 in close contact or close proximity. The magnet 310 may generate a magnetic field and be attached to the target substrate 900 by the magnetic field.

The deposition source supply part 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material source 600 supplied from the deposition source supply part 500 may be attached to one side of the target substrate 900 by the pattern P formed on the frame-integrated masks 100 and 200. The organic source 600 deposited after the pattern P of the frame-integrated mask 100, 200 may be used as the pixel 700 of the OLED.

In order to prevent the uneven deposition of the pixels 700 occurring due to the Shadow Effect, the pattern of the frame-integrated mask 100, 200 may be formed S obliquely (or formed in a tapered shape S). The organic source 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, and thus, the pixel 700 can be deposited with uniform thickness as a whole.

The mask 100 is attached to the frame 200 at the first temperature higher than the temperature of the pixel deposition process, and thus, even if it is raised to the temperature of the pixel deposition process, there is little influence on the position of the mask pattern P, and the PPA between the mask 100 and the mask 100 adjacent thereto can be maintained to be not more than 3 μm.

In addition, when a defect such as an impurity is included in the mask 100 attached to the frame 200 or the mask pattern P is damaged occurs, it is necessary to replace the mask 100. Alternatively, when the mask 100 is attached to the frame 200 but a portion of the mask pattern P is not aligned accurately, it is also necessary to make the alignment accurate by replacing the mask 100.

In this case, when the mask 100 is directly separated from the frame 200 without a temperature change of the process region, the frame 200 may be slightly deformed due to the tension TS of the mask 100 attached to the remaining cell regions CR12, CR13, CR21, and … other than the cell region CR 11. Such deformation may cause alignment errors of the mask pattern P and the mask unit C in sequence along the PL line (refer to an enlarged portion of fig. 23). That is, when any one of the masks 100[ the mask 100 of the cell region CR111 ] is separated from the frame 200, the forces of the plurality of masks 100 in the directions opposite to each other, which are offset by the application of the tension TS, are applied to the frame 200 again, and the alignment error occurs.

Therefore, the present invention is characterized in that the target mask 100[ for example, the mask 100 including the mask unit C11 ] which has a defect and needs to be separated and replaced is separated and replaced after the tension TS is readjusted to a state where the tension TS does not act on the frame 200.

First, the temperature of the process zone may be raised to a first temperature ET. The first temperature may refer to a temperature equal to or higher than a temperature of a pixel deposition process when the frame-integrated mask is used for the OLED pixel deposition process. Considering that the temperature of the pixel deposition process may be about 25 to 45 deg.C, the first temperature may be about 25 to 60 deg.C. This is the same as in the case of the rise to the first temperature ET in fig. 17.

If the temperature of the process area is raised to the first temperature ET, the mask 100, which is thermally shrunk, is simultaneously subjected to a predetermined thermal expansion. The degree of thermal expansion corresponds to the degree of release of the tension TS. In other words, if the temperature of the process area is raised to the first temperature ET, the tension TS exerted on the mask 100 attached to the frame 200 will be released. Therefore, the mask 100 and the frame 200 may be in an unstressed state.

Then, the target mask 100 requiring the detachment replacement may be detached from the frame 200. The mask 100 may be separated from the frame 200 by applying a physical force to the target mask 100. Only, in order to prevent deformation due to a force applied to the frame 200, it is necessary to press the remaining edges when one edge is peeled off.

After one side edge (right side edge) of the mask 100 including the mask unit C11 is removed from the frame 200, the other side edge (left side edge) may be removed from the frame 200. Specifically, one edge of the mask 100 may be attached to the first grid sheet portion 223 which is the right edge of the mask cell region CR 111. Therefore, when the mask 100 is removed by applying an external force to one side edge of the mask, there is a problem in that the portion of the first lattice sheet portion 223 is deformed due to the adhesion force of the mask 100 to the frame 200[ the first lattice sheet portion 223 ]. Therefore, it is necessary to remove the mask 100 after tightly fixing the frame 200[ the first grid sheet portion 223 ].

In order to firmly fix the frame 200 against the external force, an outer portion of one side corner (right side corner) of the mask 100, on which the external force directly acts, may be pressed. That is, the frame 200[ first grid sheet portion 223] portion located outside the corner on the side of the attached mask 100 may be pressed. The pressing is preferably performed on both the upper surface and the lower surface of the portion of the frame 200[ first grid sheet portion 223] located on the outer side of the one-side corner. The upper surface may be pressed using a pressing bar (not shown), and the lower surface may be pressed using a lower supporting unit 90[ refer to fig. 19] for supporting the frame 200. When the other side corner (left side corner) is detached from the frame 200, the outer side portion of the other side corner (left side corner) may be similarly pressed.

Then, a new mask 100 to be replaced may be corresponded to the mask cell region CR 111. The correspondence of the mask 100 to the mask unit region CR111 may be accomplished by loading the stencil 50 onto the frame 200 or the mask unit sheet part 220. Next, the mask 100 is attached to the frame 200 by irradiating the mask 100 with the laser light L based on the laser welding. This is the same as the process of fig. 18.

The temperature of the process zone may then be lowered to a second temperature LT. Considering that the first temperature is about 25 to 60 c and the second temperature is lower than the first temperature, it may be about 20 to 30 c, and preferably, the second temperature may be a normal temperature. This is the same as the case of falling to the second temperature LT in fig. 21.

If the temperature of the process area is lowered to the second temperature LT, the mask 100 may be heat-shrunk by a predetermined length. The mask 100 may be heat-shrunk in a lateral direction. Meanwhile, since the plurality of masks 100 apply the tensile force TS in the opposite directions to each other, the forces are offset from each other, and thus, no deformation occurs in the mask die portions 220.

As described above, when the mask 100 having the defect is separated/replaced, since the separation/replacement is performed in a stress-free state by raising the temperature of the process field to the first temperature, the deformation of the frame 200 can be prevented, and the alignment error of the mask pattern P and the mask unit C is not generated, which has an advantage that the mask 100 can be stably separated/replaced.

As described above, the present invention has been illustrated and described with reference to the preferred embodiments, but is not limited to the above-described embodiments, and those skilled in the art can make various changes and modifications without departing from the spirit of the present invention. Such variations and modifications are intended to be within the scope of the present invention and the appended claims.

Claims (14)

1. An apparatus for manufacturing a frame-integrated mask, comprising:

a table part for seating and supporting the frame;

a clamp portion for clamping the template to which the mask is bonded and supported;

a clamp moving part which moves the clamp part towards at least one of X, Y, Z and theta axis;

a head part for irradiating laser to a welding part of the mask and sensing an alignment state of the mask; and

a head moving part which moves the head part towards at least one direction of X, Y, Z axes,

the stage part includes a heating unit for raising a temperature of a process area including the frame to a first temperature.

2. The apparatus for manufacturing a frame-integrated mask according to claim 1,

further comprising a preheating section which provides a space for preheating the template bonded and supported with the mask before the clamping section clamps the template.

3. The apparatus for manufacturing a frame-integrated mask according to claim 1,

the clamp portion clamps the upper surface of the suction mold plate by at least a part of the suction mold plate.

4. The apparatus for manufacturing a frame-integrated mask according to claim 1,

the table part includes a frame alignment unit for aligning a position of the frame.

5. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein the jig portion comprises:

a clamp unit for clamping the template;

a clamp moving unit which moves the clamp unit towards at least one direction of X, Y, Z and theta axis; and

a connection unit for connecting the jig moving unit to the jig moving part.

6. The apparatus for manufacturing a frame-integrated mask according to claim 5,

the clamp part further includes a clamp heating unit that applies heat to the clamped template.

7. The apparatus for manufacturing a frame-integrated mask according to claim 5,

a plurality of suction units for applying suction pressure to the template are formed on the clamp unit at intervals.

8. The apparatus for manufacturing a frame-integrated mask according to claim 7,

the plurality of suction units are arranged on a region of the welding portion of the mask and the Z axis without overlapping.

9. The apparatus for manufacturing a frame-integrated mask according to claim 1,

the head includes a laser unit that welds the mask and the frame by irradiating the mask with laser light, or performs laser trimming by irradiating the mask with laser light.

10. The apparatus for manufacturing a frame-integrated mask according to claim 9,

a pair of laser units are arranged at intervals, and each laser unit irradiates laser to a welding part on one side and the other side of the mask.

11. The apparatus for manufacturing a frame-integrated mask according to claim 1, wherein the frame comprises:

an edge frame portion including a hollow region;

and a mask unit sheet portion having a plurality of mask unit regions and connected to the edge frame portion.

12. The apparatus for manufacturing a frame-integrated mask according to claim 11,

a plurality of suction holes are formed at a portion spaced apart from the corners of the mask unit sheet portion where the mask unit region exists by a predetermined distance, and the table portion further includes a lower support unit generating a suction pressure toward a lower portion of the frame.

13. The apparatus for manufacturing a frame-integrated mask according to claim 12,

the lower portion of the lower supporting unit is disposed with a heating unit.

14. The apparatus for manufacturing a frame-integrated mask according to claim 1,

the first temperature is greater than or equal to an OLED pixel deposition process temperature, and after attaching the mask to the frame, the temperature of a process area including the frame is lowered to a second temperature that is less than the first temperature, the first temperature being any one of 25 ℃ to 60 ℃, the second temperature being any one of 20 ℃ to 30 ℃ that is less than the first temperature, and the OLED pixel deposition process temperature being any one of 25 ℃ to 45 ℃.

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