JP2015165522A - Conductive pattern member and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive pattern member whose manufacturing cost is reduced.SOLUTION: A conductive pattern member 44 has a conductive pattern 2, formed by applying press work to a metal plate, provided with at least two soldering parts 14, 16 for soldering an electronic component. The soldering parts are formed in a state where no projection exists on a same plane of the conductive pattern and a surface thereof is applied with plating. The conductive pattern has an isolation part 18 for isolating the soldering parts and non-soldering parts.

Description

  The present invention relates to a conductive pattern member on which an electronic component is mounted and a method for manufacturing the conductive pattern member.

  Conventionally, as a method of forming a conductive pattern for mounting an LED chip, a method of forming a conductive pattern by pressing a metal plate (see, for example, Patent Document 1), or a copper foil is disposed on a substrate. There is a method for forming a conductive pattern by removing unnecessary portions by etching (for example, see Patent Document 2).

Japanese Patent No. 3880522 JP2011-228687A

  When a conductive pattern is formed by pressing a metal plate, when mounting an electronic component on the conductive pattern, a socket structure is formed on the conductive pattern and the electronic component is mounted on the conductive pattern using the socket structure. However, it is necessary to mount the electronic component by connecting it to the conductive pattern by wire bonding or by soldering the electronic component to the conductive pattern by hand, resulting in an increase in manufacturing cost.

  The objective of this invention is providing the manufacturing method of the conductive pattern member and conductive pattern member which reduced manufacturing cost.

  The conductive pattern member of the present invention is a conductive pattern member formed by pressing a metal plate and having a conductive pattern provided with at least two soldering portions for soldering an electronic component, the soldering portion Is formed on the same plane of the conductive pattern with no protrusions, and the surface is plated, and the conductive pattern has an isolation portion that separates the soldered portion and the non-soldered portion. It is characterized by that.

  Further, the conductive pattern member of the present invention is characterized in that the isolation part is constituted by an isolation groove.

  Further, the conductive pattern member of the present invention is characterized in that the isolation portion is constituted by a peeling region where the plating is peeled off.

  The conductive pattern member of the present invention is formed in a planar shape having a predetermined width and extending in the arrangement direction of the electronic components, and a sheet-like shape extending in the arrangement direction of the electronic components on the front and back surfaces of the conductive pattern. An insulating sheet, which is an insulator, is attached, and the insulating sheet attached to the surface of the conductive pattern has a predetermined opening that exposes the electronic component soldered to the soldering portion.

  The conductive pattern member of the present invention is formed in a three-dimensional shape having a predetermined width and extending in the arrangement direction of the electronic components, and the periphery of the electronic components soldered to the soldering portion is covered with an insulator. It is characterized by.

  In the conductive pattern member of the present invention, at least one side of the electronic component is in contact with the insulator.

  The conductive pattern member of the present invention is characterized in that one edge portion in the longitudinal direction of the conductive pattern is bent and has an L-shaped cross section.

  The conductive pattern member of the present invention is characterized in that it has a plurality of holes along the bent position of the conductive pattern.

  The conductive pattern member of the present invention is characterized by having slits extending in the width direction from one edge in the longitudinal direction of the conductive pattern to the bending position at predetermined intervals.

  The conductive pattern member of the present invention is characterized in that the conductive pattern has a cut portion.

  In the conductive pattern member of the present invention, the electronic component is an LED chip.

  In addition, the conductive pattern member of the present invention includes a lens disposed on the light emitting direction side of the electronic component.

  Also, the method for producing a conductive pattern member of the present invention includes pressing at least a metal plate with plating so as to have at least two soldering parts that do not have a protrusion for soldering an electronic component, the soldering part and the non-soldering part. A pressing process for creating a planar conductive pattern having an isolation part for isolating the attaching part; an applying process for applying solder to the soldering part; and a mounting process for mounting the electronic component on the soldering part; A mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method, and a sheet-like insulation having a predetermined opening extending in the arrangement direction of the electronic component and exposing the electronic component A first insulating sheet sticking step for sticking a first insulating sheet as a body to the surface of the conductive pattern, and a sheet-like insulator extending in the arrangement direction of the electronic components A second insulating sheet characterized by comprising a second insulating sheet sticking step takes affixed to the bottom of the conductive pattern.

  Further, the method for producing a conductive pattern member of the present invention is a press for producing a conductive pattern having a planar shape having at least two soldered portions that do not have protrusions for soldering an electronic component by pressing a metal plate. Processing step, plating step of plating the conductive pattern, isolation portion forming step of isolating the soldered portion and the non-soldered portion in the conductive pattern, and soldering to the soldered portion An application step of applying the electronic component; a mounting step of mounting the electronic component on the soldering portion; a mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method; and the electronic component A first insulating sheet, which is a sheet-like insulator extending in the direction of the arrangement and exposing the electronic component and having a predetermined opening, is attached to the surface of the conductive pattern. Including a first insulating sheet sticking step and a second insulating sheet sticking step for sticking a second insulating sheet, which is a sheet-like insulator extending in the arrangement direction of the electronic components, to the back surface of the conductive pattern. To do.

  In the method for producing a conductive pattern member of the present invention, after the first insulating sheet pasting step, the auxiliary member used when the metal plate is sent in the arrangement direction of the electronic component during the pressing process is removed from the conductive pattern. An auxiliary member removing step is included.

  Moreover, the manufacturing method of the conductive pattern member of this invention includes the bending process which bends one edge part of the longitudinal direction of the said conductive pattern after the said mounting process, and forms the cross section of the said conductive pattern member in L shape. It is characterized by that.

  Also, the method for producing a conductive pattern member of the present invention includes pressing at least a metal plate with plating so as to have at least two soldering parts that do not have a protrusion for soldering an electronic component, the soldering part and the non-soldering part. A pressing process for creating a three-dimensional conductive pattern having an isolation part for isolating the attaching part; an applying process for applying solder to the soldering part; and a mounting process for mounting the electronic component on the soldering part; And a mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method, and an insulator adding step of adding an insulator around the electronic component.

  Further, the method for producing a conductive pattern member of the present invention is a press for producing a three-dimensional conductive pattern having at least two soldered portions not having protrusions for soldering an electronic component by pressing a metal plate. Processing step, plating step of plating the conductive pattern, isolation portion forming step of isolating the soldered portion and the non-soldered portion in the conductive pattern, and soldering to the soldered portion An application step of applying the electronic component; a mounting step of mounting the electronic component on the soldering portion; a mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method; and the electronic component And an insulator adding step for adding an insulator around the substrate.

  Moreover, the manufacturing method of the conductive pattern member of this invention forms a cutting part in the said conductive pattern further by the said press work process, and cut | disconnects the said cutting part after the said insulator addition process or the said 1st insulating sheet sticking process. It has the cutting process to perform.

  In the method for producing a conductive pattern member of the present invention, the electronic component is an LED chip.

  Moreover, the manufacturing method of the conductive pattern member of this invention has the lens attachment process which attaches a lens to the light emission direction side of the said electronic component after the said insulator addition process or the said 2nd insulating sheet sticking process, It is characterized by the above-mentioned.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the conductive pattern member and conductive pattern member which reduced manufacturing cost can be provided.

It is a top view which shows the conductive pattern which concerns on 1st Embodiment. It is a figure which shows the state which mounted the LED chip in the electronic component mounting part of the electrically conductive pattern which concerns on 1st Embodiment. It is a figure which shows the cutting | disconnection of the cutting part performed after affixing an insulating tape on the surface of the conductive pattern which concerns on 1st Embodiment. It is a figure which shows the state by which the conductive pattern which concerns on 1st Embodiment was divided | segmented into + side and-side. It is a figure which shows attachment of the insulation member to the fitting part of the conductive pattern which concerns on 1st Embodiment. It is a figure which shows the breaking of the auxiliary | assistant part performed after the cutting | disconnection of the cutting part of the conductive pattern which concerns on 1st Embodiment. It is a figure which shows the insulating tape affixed on the back surface of the conductive pattern which concerns on 1st Embodiment. It is a figure which shows the state which attached the lens to the electrically conductive pattern which concerns on 1st Embodiment. It is a perspective view of the conductive pattern member which concerns on 1st Embodiment. It is a top view of the electronic component mounting part of the conductive pattern member which concerns on 2nd Embodiment. It is a perspective view of the electronic component mounting part of the conductive pattern member which concerns on 2nd Embodiment. It is a top view of the power connector mounting part of the conductive pattern member which concerns on 2nd Embodiment. It is a perspective view of the power connector mounting part of the conductive pattern member which concerns on 2nd Embodiment. It is a figure which shows the state by which the LED chip and the power supply connector were mounted in the electrically conductive pattern which concerns on 2nd Embodiment. It is a figure which shows the state by which the insulator was added to the electrically conductive pattern which concerns on 2nd Embodiment. It is a figure which shows the cutting | disconnection of the cutting part performed after an insulator is added to the electrically conductive pattern which concerns on 2nd Embodiment. It is a top view of the conductive pattern which concerns on 3rd Embodiment. It is a perspective view which shows the state which formed the isolation region in the conductive pattern of the conductive pattern which concerns on 3rd Embodiment. It is a figure which shows the modification of the insulator added to the electrically conductive pattern which concerns on embodiment. It is a top view which shows the conductive pattern which concerns on 4th Embodiment. It is an enlarged plan view of a unit region of a conductive pattern according to a fourth embodiment. It is a figure which shows the LED chip mounted in the electronic component mounting part of the conductive pattern which concerns on 4th Embodiment. It is a figure which shows the state which bent the conductive pattern which concerns on 4th Embodiment in the L shape. It is a figure which shows the state which mounted the LED chip in the electronic component mounting part of the electrically conductive pattern which concerns on 4th Embodiment, and affixed the insulating tape. It is an enlarged plan view which shows the connection part exposed to the opening part of the electrically conductive pattern which concerns on 4th Embodiment. It is a top view which shows the state which cut | disconnected the connection part of the electrically conductive pattern which concerns on 4th Embodiment. It is a top view which shows the state which cut | disconnected the connection part of the electrically conductive pattern which concerns on 4th Embodiment. It is a top view which shows the state which cut | disconnected the connection part of the electrically conductive pattern which concerns on 4th Embodiment. It is an enlarged plan view which shows the state which cut | disconnected the connection part of the electrically conductive pattern which concerns on 4th Embodiment. It is a figure which shows the state which affixed the insulating tape on the back surface of the conductive pattern which concerns on 4th Embodiment. It is a top view of the conductive pattern member concerning a 4th embodiment. It is sectional drawing which shows the state which has arrange | positioned the conductive pattern member which concerns on 4th Embodiment in the display. It is sectional drawing which shows the state which has arrange | positioned the conventional conductive pattern member in a display.

  Hereinafter, with reference to drawings, the conductive pattern member concerning the 1st embodiment of the present invention and the manufacturing method of a conductive pattern member are explained.

  When manufacturing a conductive pattern member, first, a metal thin plate for forming a conductive pattern is prepared. Here, the metal thin plate has a predetermined width and a shape extending in the LED chip arrangement direction so that a plurality of electronic components such as LED chips can be mounted in a row. As a material for the metal thin plate, a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used. The metal thin plate is plated.

  Next, a flat conductive pattern without unevenness is created by pressing the metal sheet (pressing process). Here, when the metal thin plate is pressed, the same shape is repeatedly formed on the metal thin plate with a mold while feeding the metal thin plate in the longitudinal direction.

  FIG. 1A is a plan view showing a conductive pattern formed by a pressing process. The conductive pattern 2 has a plurality of electronic component mounting portions 4 on which LED chips 22 having LEDs (see FIG. 2) are to be mounted, and a first insulating tape 24 (see FIG. 3) described later is attached to the conductive pattern 2. A plurality of cutting parts 6 to be cut, an auxiliary part 8 used for feeding the metal thin plate in the longitudinal direction at the time of pressing, and a breaker part 10 to be taken off when the auxiliary part 8 is removed from the conductive pattern 2 Yes. In addition, at one end of the conductive pattern 2 (the right end in FIG. 1A), the insulating member 33 (FIG. 5) is formed when a connector insertion portion 34 (see FIG. 5B) described later is formed. A fitting part 11 is formed to be fitted with (see (a)).

  FIG. 1B is an enlarged plan view of the electronic component mounting portion 4 of the conductive pattern 2. When the LED chip 22 (see FIG. 2) is mounted on the electronic component mounting portion 4, a first soldering portion 14 to which the anode of the LED is soldered and a second soldering portion 16 to which the cathode of the LED is soldered. Are formed on the same plane. Here, the first soldering part 14 and the second soldering part 16 have no protrusions.

  In addition, the electronic component mounting part 4 is formed with an isolation groove 18 that isolates the first soldering part 14 and the second soldering part 16 from the non-soldering part, which is another part, and prevents solder flow. The electronic component mounting part 4 is formed with a positioning hole 19a and a positioning notch 19b for positioning when a lens 40 (see FIG. 8) described later is attached.

  Next, the conductive pattern 2 created by the press working process is washed, and then the first soldering portion 14 and the second soldering portion 16 of the conductive pattern 2 are creams as the first step of reflow soldering. The solder 20 (see FIG. 1B) is applied by screen printing using a metal mask (application process).

  Next, the LED chip 22 is mounted on the conductive pattern 2 using a chip mounter (mounting process). That is, as shown in FIGS. 2A and 2B, the LED chip 22 is aligned with the first soldering portion 14 and the second soldering portion 16 formed in the electronic component mounting portion 4. The LED chip 22 is mounted on the conductive pattern 2.

  Next, the LED chip 22 is soldered and mounted on the first soldering part 14 and the second soldering part 16 formed in the electronic component mounting part 4 by a batch reflow method (mounting process). That is, by applying heat to the conductive pattern 2 on which the plurality of LED chips 22 are mounted, the cream solder is dissolved, and the cream solder is solidified by cooling, whereby the plurality of LED chips 22 are collectively mounted on the conductive pattern 2.

  Next, as shown to Fig.3 (a), the 1st insulating tape 24 which insulates between conductive patterns is affixed on the surface of the conductive pattern 2 (1st insulating tape affixing process). Here, the first insulating tape 24 has a strip shape extending in the arrangement direction of the LED chips 22 and has a width capable of covering the surface of the portion excluding the auxiliary portion 8 of the conductive pattern 2. Yes. Further, a position where the lens 40 (see FIG. 8) is mounted has a circular portion 24a that expands in a circular shape in accordance with the shape of the lens 40.

  The first insulating tape 24 has an opening 26 for exposing the LED chip 22, a cutting opening 28 for exposing the cutting part 6, a guide hole 30, and a screw hole 32. Here, as the first insulating tape 24, a PET tape or the like formed using polyethylene terephthalate (PET) is used. Further, an adhesive is applied to the back surface of the first insulating tape 24, and the first insulating tape 24 is bonded to the conductive pattern 2 by the adhesive.

  The first insulating tape 24 may be formed of a thermoplastic resin. In this case, the first insulating tape 24 is brought into close contact with the conductive pattern 2 heated in the mounting process and melted (hot melted), then solidified by cooling and bonded to the conductive pattern 2.

  Next, the cutting portion 6 exposed at the opening 26 and the cutting opening 28 of the first insulating tape 24 is cut (cutting step). Here, FIG. 3B is an enlarged view showing the cutting opening 28, and FIG. 3C is an enlarged view showing the opening 26. In the cutting process, as shown in FIGS. 3B and 3C, the cutting portion 6 (the portion indicated by oblique lines) is cut, and unnecessary portions for supplying electric power to the LED chip 22 become conductive patterns 2. Removed from. Thereby, as shown in FIG. 4, the conductive pattern 2 (part excluding the auxiliary portion 8) is divided into the + side conductive pattern 2a and the − side conductive pattern 2b.

  Next, as shown in FIG. 5A, the insulating member 33 is attached to the fitting portion 11 formed at one end of the conductive pattern 2 (the right end in FIG. 5A). Process). Here, the insulating member 33 is attached by aligning the position of the fitting portion 11 with the alignment groove 33 a formed on the surface of the insulating member 33. The insulating member 33 is formed by molding a heat-resistant member such as nylon, LCP, PBT, or PPS. Thereby, as shown in FIG. 5B, a connector insertion portion 34 for connecting the conductive pattern member 44 (see FIG. 9) to a predetermined power source is created.

  Next, as shown in the side view of FIG. 6, the auxiliary portion 8 is bent to the back side of the conductive pattern 2 at the position of the breaker portion 10 to cut the breaker portion 10, and the auxiliary portion 8 is removed from the conductive pattern 2. (Auxiliary part removal process).

  Next, the 2nd insulating tape which insulates between conductive patterns and other metals, such as a back chassis, is stuck on the back surface of the conductive pattern 2 (2nd insulating tape sticking process). Here, Fig.7 (a) is a top view which shows a 2nd insulating tape, FIG.7 (b) is the figure which looked at the conductive pattern 2 which affixed the 2nd insulating tape on the back surface from the front side. As shown in FIGS. 7A and 7B, the second insulating tape 35 has a strip shape extending in the arrangement direction of the LED chips 22 like the first insulating tape 24, and the first insulating tape It has the same width as 24.

  The second insulating tape 35 has a guide hole 36 (corresponding to the guide hole 30 of the first insulating tape 24) and a screw hole 38 (corresponding to the screw hole 32 of the first insulating tape 24). As the second insulating tape 35, a PET tape or the like is used similarly to the first insulating tape 24, and the second insulating tape 35 is bonded to the conductive pattern 2 with an adhesive. Alternatively, a thermoplastic resin may be used for the second insulating tape 35 and attached to the conductive pattern 2 by hot melt.

  In addition, when a 2nd insulating tape is affixed on the back surface of the conductive pattern 2, the space | interval of A, B, C, D shown in FIG.7 (b) is each hold | maintained at 1.0 mm or more. Here, A indicates the shortest distance between the + side conductive pattern 2a and the − side conductive pattern 2b. B represents the distance between the outer edge 2a1 of the + side conductive pattern 2a and the edge 35a of the second insulating tape 35, and the outer edge 2b1 of the − side conductive pattern 2b and the edge 35b of the second insulating tape 35. And the distance. C indicates the distance between the inner edges 2b2 and 2b3 of the negative conductive pattern 2b and the edge 36a of the guide hole 36. D indicates the distance between the inner edge portions 2b4 and 2b5 of the negative side conductive pattern 2b and the edge portion of the screw hole 38.

  Next, the lens 40 is attached to the upper part (light emission direction side) of the LED chip 22 mounted on the conductive pattern 2 (lens mounting step). FIG. 8A is a plan view of the conductive pattern 2 to which the lens 40 is attached as viewed from above, and FIG. 8B is a side view thereof. As shown in FIG. 8C, the lens 40 is attached by aligning the alignment protrusions 42 provided on the back surface of the lens 40 with the alignment holes 19a and the alignment notches 19b ( (See FIG. 1B). Next, a predetermined inspection is performed (inspection process), and the production of the conductive pattern member is completed.

  FIG. 9 is a view showing the completed conductive pattern member 44. As shown in FIG. 9, a plurality of LED chips (lenses 40) are mounted in a row on the conductive pattern member 44. A guide hole 30 and a screw hole 32 are formed between the lenses 40, and a connector insertion portion 34 is provided at the end of the conductive pattern member 44.

  According to the first embodiment, the first soldering portion 14 and the second soldering portion 16 do not have protrusions, so that automatic mounting using a metal mask is possible, and the conductive pattern is reduced in manufacturing cost. The manufacturing method of a member and a conductive pattern member can be provided. In addition, when the reflow soldering is employed, the separation groove 18 can accurately prevent the solder flow. A plurality of LED chips (lenses 40) are mounted on the conductive pattern member 44 in a line. Therefore, the conductive pattern member 44 can be used as a backlight as it is by arranging it directly under the back side of a television receiver or a liquid crystal display device of a personal computer, for example.

  Further, by using the insulating tape 24 as an insulating member that insulates the conductive patterns, the conductive pattern member can be reduced in weight. In addition, since the first insulating tape 24 has a circular portion 24a that expands in a circular shape in accordance with the shape of the lens 40 at a position where the lens 40 is mounted, the first insulating tape 24 is attached to the surface of the conductive pattern 2 by attaching the first insulating tape 24 to the surface. LED light can be prevented from leaking to the back side of the conductive pattern 2.

  Next, with reference to drawings, the conductive pattern member which concerns on the 2nd Embodiment of this invention and the manufacturing method of a conductive pattern member are demonstrated.

  When manufacturing a conductive pattern member, first, a metal thin plate for forming a conductive pattern is prepared. Here, the metal thin plate has a predetermined width and a shape extending in the LED chip arrangement direction so that a plurality of electronic components such as LED chips can be mounted in a row. As a material for the metal thin plate, a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used. The metal thin plate is plated.

  Next, a conductive pattern is created by pressing a thin metal plate (pressing process). Note that the conductive pattern is formed into a three-dimensional shape by pressing to ensure a predetermined strength. Here, when pressing the metal thin plate, after forming the electronic component mounting portion of the same shape on the metal thin plate repeatedly with a mold while feeding the metal thin plate in the longitudinal direction, after forming a predetermined number of electronic component mounting portions A power connector mounting portion is formed. In this pressing process, the conductive pattern is formed into a shape that can be pressed, that is, a shape that leaves a cut portion 72 (see FIG. 15) that is cut after adding an insulator 86 (see FIG. 15) described later. Is done.

  FIG. 10 is a plan view of the electronic component mounting portion of the conductive pattern formed by the press working process, and FIG. 11 is a perspective view of the electronic component mounting portion of the conductive pattern. The electronic component mounting portion 62 of the conductive pattern 60 is soldered with the first soldering portion 64 to which the anode of the LED is soldered and the LED cathode when the LED chip 82 (see FIG. 14) having the LED is mounted. The second soldering portion 66 is formed on the same plane. The electronic component mounting portion 62 of the conductive pattern 60 has an isolation groove 68 that isolates the first soldering portion 64 and the second soldering portion 66 from the non-soldering portion that is the other portion, and prevents solder flow. Is formed. Further, the electronic component mounting portion 62 of the conductive pattern 60 is formed with a cutting portion 72 that is cut after an insulator 86 described later is added to the conductive pattern. In addition, the conductive pattern 60 has an auxiliary portion 74 that is used when feeding the metal thin plate in the longitudinal direction during press working.

  FIG. 12 is a plan view of the power connector mounting portion of the conductive pattern member formed by the press working process, and FIG. 13 is a perspective view of the power connector mounting portion of the conductive pattern. On the power connector mounting portion 80 of the conductive pattern 60, a soldering portion 85 to which the power connector 84 is soldered when the power connector 84 (see FIG. 14) is mounted is formed on the same plane. The power connector mounting portion 80 of the conductive pattern 60 is formed with an isolation groove 68 that isolates the soldering portion 85 from the non-soldering portion, which is another portion.

  Next, the conductive pattern 60 created by the press working process is cleaned, and then the first soldering portion 64, the second soldering portion 66, and the soldering portion 85 of the conductive pattern 60 are subjected to the first reflow soldering. Application of cream solder, which is a process, is performed by screen printing using a metal mask (application process).

  Next, the LED chip 82 and the power connector 84 are mounted on the conductive pattern 60 using a chip mounter (mounting process). That is, as shown in FIG. 14, the LED is applied to the first soldering portion 64 (see FIG. 10) and the second soldering portion 66 (see FIG. 10) formed in the electronic component mounting portion 62 (see FIG. 10). The chip 82 is aligned and the LED chip 82 is mounted on the conductive pattern 60. Further, the power connector 84 is aligned with the soldering portion 85 (see FIG. 12) formed on the power connector mounting portion 80 to mount the power connector 84 on the conductive pattern 60.

  Next, the LED chip 82 is soldered and mounted on the first soldering portion 64 and the second soldering portion 66 formed on the electronic component mounting portion 62 and formed on the power connector mounting portion 80 by a batch reflow method. The power connector 84 is soldered and mounted on the soldered portion 85 (mounting process). That is, by applying heat to the conductive pattern 60 on which the plurality of LED chips 82 and the power connector 84 are mounted, the cream solder is dissolved, and the cream solder is solidified by cooling, whereby the plurality of LED chips 82 and the power connector 84 are electrically connected. 60 in a batch.

  Next, as shown in FIG. 15, an insulator 86 is added by insert molding so as to cover the periphery of the LED chip 82 and the power connector 84 mounted on the conductive pattern 60 (insulator adding step). In this case, the insulator 86 is added in contact with the four sides of the rectangular LED chip 82. The insulator 86 is formed with an opening 88 that exposes the cut portion 72 formed in the conductive pattern. Here, the insulator 86 insulates the conductive patterns between the conductive patterns and other metals such as the back chassis. As the insulator 86, a white resin such as an epoxy resin or a silicone resin containing silica and titanium oxide is used.

  Next, as shown in FIG. 16, the cutting portion 72 exposed at the opening 88 of the insulator 86 is cut (cutting step). As a result, unnecessary portions for supplying power to the LED chip 82 are removed from the conductive pattern 60, and the manufacture of the conductive pattern member is completed.

  According to the second embodiment, reflow soldering that can be soldered at low cost can be employed, and an insulator can be added only to a necessary portion, so that the conductive pattern with reduced manufacturing cost can be obtained. The manufacturing method of a member and a conductive pattern member can be provided. A plurality of LED chips 82 are mounted in a row on the conductive pattern member. Therefore, this conductive pattern member can be used as a backlight as it is by arranging it on the back side or the back side end of a television receiver, a liquid crystal display device of a personal computer or the like.

  Next, a conductive pattern member and a method for manufacturing the conductive pattern member according to the third embodiment will be described. In the description of the third embodiment, the same reference numerals as those used in the description of the second embodiment are given to the same configurations as those of the conductive pattern member according to the second embodiment. The explanation will be given by using.

  First, a metal thin plate which is the same material and shape as used in the second embodiment but is not plated is prepared. Next, the conductive pattern 60 which has a conductive pattern is created by pressing a metal thin plate by the press work process similar to the press work process in 2nd Embodiment. Here, FIG. 17 is a plan view of the electronic component mounting portion 62 of the conductive pattern 60 formed by the press working process. When the LED chip 82 (see FIG. 14) is mounted on the electronic component mounting portion 62 of the conductive pattern 60, the first soldering portion 64 where the anode of the LED is soldered and the second cathode where the cathode of the LED is soldered. A soldering portion 66 is formed on the same plane. The electronic component mounting portion 62 of the conductive pattern 60 is formed with a cutting portion 72 that is cut after an insulator 86 described later is added to the conductive pattern (see FIG. 15). Although not shown in FIG. 17, the power connector mounting portion 80 of the conductive pattern 60 has a soldering portion 85 on the same plane to which the power connector 84 is soldered when the power connector 84 is mounted. (See FIG. 12). The conductive pattern 60 has an auxiliary portion 74 that is used when feeding the metal thin plate in the longitudinal direction during press working.

  Next, the conductive pattern 60 formed by the press working process is plated (plating process). Next, in the electronic component mounting portion 62 of the conductive pattern 60, the first soldering portion 64 and the second soldering portion 66 are isolated from the other non-soldering portions to form an isolation region for preventing solder flow. Then, an isolation region is formed in the power connector mounting portion 80 of the conductive pattern 60 to isolate the soldering portion 85 from the non-soldering portion which is another portion (isolation portion forming step). FIG. 18 is a plan view of the conductive pattern 60 in which the isolation region 90 is formed. The isolation region 90 is formed by peeling the plating by secondary press processing performed after the plating step or laser irradiation.

  Next, the conductive pattern 60 created by the press working process is cleaned, and the cream solder which is the first process of reflow soldering is applied in the same manner as in the first embodiment (application process). Next, the LED chip 82 and the power connector 84 are mounted on the conductive pattern 60 using a chip mounter (mounting process), and then the LED chip 82 and the power connector 84 are soldered and mounted on the conductive pattern 60 by a batch reflow method. (Mounting process). Further, an insulator 86 is added around the LED chip by insert molding (insulator addition process), and the cut portion 72 exposed to the opening 88 after the insulator 86 is added around the LED chip 82. Cutting is performed (cutting step). As a result, unnecessary portions for supplying power to the LED chip 82 are removed from the conductive pattern 60, and the manufacture of the conductive pattern member is completed.

  According to this 3rd Embodiment, the manufacturing method of the conductive pattern member and conductive pattern member which reduced manufacturing cost can be provided. In addition, a plurality of LED chips 82 are mounted in a row on the conductive pattern member 60. Therefore, this conductive pattern member 60 can be used as a backlight as it is by arranging it on the back side or the back side end of a television receiver, a liquid crystal display device of a personal computer or the like.

  Next, with reference to drawings, the conductive pattern member concerning the 4th Embodiment of this invention and the manufacturing method of a conductive pattern member are demonstrated.

  When manufacturing a conductive pattern member, first, a metal thin plate for forming a conductive pattern is prepared. Here, the metal thin plate has a predetermined width and a shape extending in the LED chip arrangement direction so that a plurality of electronic components such as LED chips can be mounted in a row. As a material for the metal thin plate, a copper alloy such as C5210 or an alloy such as Fe—Ni or Cu—Ni—Sn is used. The metal thin plate is plated.

  Next, a flat conductive pattern without unevenness is created by pressing the metal sheet (pressing process). Here, when the metal thin plate is pressed, the same shape is repeatedly formed on the metal thin plate with a mold while feeding the metal thin plate in the longitudinal direction.

  FIG. 20 is a plan view showing a conductive pattern formed by a pressing process. The conductive pattern 102 includes a plurality of electronic component mounting portions 104 (portions surrounded by broken lines) on which LED chips 122 having LEDs (see FIG. 23) are to be mounted, and connections for connecting the respective portions constituting the conductive pattern 102. Unit 106, heat dissipation unit 107 that dissipates heat from LED chip 122, power supply unit 108 that supplies power to LED chip 122, communication unit 109 that communicates between power supply units 108, and power output from LED chip 122 is fed back A feedback unit 110 is included. The feedback unit 110 includes three members, a first feedback unit 110a, a second feedback unit 110b, and a third feedback unit 110c, which are connected by a connection unit 106. Further, specific functions of the heat radiating unit 107, the power feeding unit 108, the communication unit 109, and the feedback unit 110 will be described in detail later.

  Further, the heat radiating portion 107 is provided with a plurality of folding holes 112 for easily folding the conductive pattern 102 along the folding position AA when the conductive pattern 102 is folded in a folding process described later. ing. In addition, a slit 111 extending in the width direction from the edge in the long side direction of the conductive pattern 102 to the bending position AA is provided between the power supply unit 108 and the power supply unit 108.

  FIG. 21 is an enlarged plan view of a unit region of the conductive pattern 102. As shown in FIG. 21, the electronic component mounting unit 104 includes a first soldering unit 113 and a second soldering unit 114 to which the anode of the LED is soldered when the LED chip 122 is mounted, and an LED cathode. A third soldering portion 115 and a fourth soldering portion 116 to be soldered, and a fifth soldering portion 117 to which the center of the back surface of the LED chip 122 is soldered are formed on the same plane. Here, the first soldering part 113 to the fifth soldering part 117 have no protrusion.

  In addition, the electronic component mounting unit 104 and its edge are separated from the first soldering unit 113 to the fifth soldering unit 117, respectively, and the amount of solder applied to each soldering unit is kept uniform, An isolation groove 118 is formed that isolates the first soldering portion 113 to the fifth soldering portion 117 from the non-soldering portion, which is the other portion, and prevents solder flow.

  Next, the conductive pattern 102 created by the press working process is washed, and then the first soldering portion 113 to the fifth soldering portion 117 of the conductive pattern 102 are cream solder which is the first step of reflow soldering. Application of 120 (see FIG. 21) is performed by screen printing using a metal mask (application process).

  Next, the LED chip 122 is mounted on the conductive pattern 102 using a chip mounter (mounting process). Here, FIG. 22A is a perspective view of the LED chip 122 viewed from the upper side, and FIG. 22B is a perspective view of the LED chip 122 viewed from the lower side. As shown in FIGS. 22A and 22B, the LED chip 122 has a rectangular parallelepiped shape, and has anode portions 122a and 122b, cathode portions 122c and 122d, and a rear center portion 122e on the back surface. doing.

  In the mounting step, the LED chip 122 is aligned with respect to the first soldering part 113 to the fifth soldering part 117 (see FIG. 21) formed in the electronic component mounting part 104 to conduct the LED chip 122. Mounted on the pattern 102. That is, the position of the anode part 122a is aligned on the first soldering part 113, the position of the anode part 122b is aligned on the second soldering part 114, the position of the cathode part 122c is aligned on the third soldering part 115, The LED chip 122 is mounted on the conductive pattern 102 by aligning the position of the cathode portion 122 d on the fourth soldering portion 116 and aligning the position of the anode portion 122 e on the fifth soldering portion 117.

  Next, the LED chip 122 is soldered and mounted on the first soldering portion 113 to the fifth soldering portion 117 (see FIG. 21) formed in the electronic component mounting portion 104 by a batch reflow method (mounting process). ). That is, by applying heat to the conductive pattern 102 on which the plurality of LED chips 122 are mounted, the cream solder is dissolved, and the cream solder is solidified by cooling, whereby the plurality of LED chips 122 are collectively mounted on the conductive pattern 102.

  Next, the conductive pattern 102 is bent at a bending position AA (see FIG. 20), and the cross section of the conductive pattern 102 is formed in an L shape as shown in FIGS. Bending process). Here, as described above, the heat dissipating part 107 is provided with a plurality of bending holes 112, and the slit 111 extending to the bending position AA is provided between the power supply parts 108. The conductive pattern 102 can be easily bent at the bending position AA. Further, the bending of the conductive pattern 102 at the bending position A-A can be divided into a plurality of times, for example, for each of the power supply units 108 and for each of the heat dissipation units 107. Thereby, the conductive pattern 102 can be accurately bent at the bending position AA.

  Next, as shown in FIG. 24, the 1st insulating tape 124 which insulates between conductive patterns is affixed on the surface of the conductive pattern 102 (1st insulating tape affixing process). Here, the first insulating tape 124 has a belt-like shape extending in the arrangement direction of the LED chips 122, and has a width that can cover the surface of the portion excluding the bent portion 102a that is bent in the bending step. Have.

  The first insulating tape 124 is formed with an opening 26 that exposes the LED chip 122 and the connecting portion 106. Moreover, as the 1st insulating tape 124, the PET tape etc. which were formed using polyethylene terephthalate (polyethylene terephthalate: PET) are used. Further, an adhesive is applied to the back surface of the first insulating tape 124, and the first insulating tape 124 is bonded to the conductive pattern 102 by the adhesive.

  Note that the first insulating tape 124 may be formed of a thermoplastic resin. In this case, the first insulating tape 124 is brought into close contact with the conductive pattern 102 heated in the mounting process and melted (hot melted), and then solidified by cooling and adhered to the conductive pattern 102.

  Next, the connecting portion 106 exposed at the opening 126 of the first insulating tape 124 is cut (cutting step). Here, FIG. 25 is an enlarged plan view showing the connection portion exposed at the opening 126 in the unit region of the conductive pattern 102. In the cutting step, a portion that is unnecessary when power is supplied to the LED chip 122 in the connection portions 106a to 106f exposed to the opening 126 is cut.

  Here, as shown in FIGS. 26 to 28, the cutting of the connecting portion will be described by taking as an example the case where one conductive pattern 102 is composed of 4X (X = 3, 4, 5,...) Unit regions. To do. In this case, as shown in FIG. 29, in principle, the connecting portions 106a to 106c (see FIG. 25) exposed at the opening 126 of each unit region are cut off, but there are exceptions in part. That is, the unit region (X) shown in FIG. 26B, the unit region (2X) shown in FIG. 27A, the unit region (3X) shown in FIG. 27B, and the unit region (4X) shown in FIG. Then, the connection part 106b (refer FIG. 25) is maintained without cut | disconnecting. In the unit region (X + 1) shown in FIG. 26B, the unit region (2X + 1) shown in FIG. 27A, and the unit region (3X + 1) shown in FIG. 27B, the connecting portion 106c (see FIG. 25). Is maintained without being disconnected, and the connecting portion 106f (see FIG. 25) is disconnected.

  In addition, as shown in FIGS. 26A and 26B, in the unit regions (1) to (X + 1), the connecting portions 106d and 106e (see FIG. 25) are both disconnected. In addition, as shown in FIGS. 27A and 27B, in the unit regions (X + 2) to (3X−1), only the connection portion 106e is disconnected and the connection portion 106d is maintained. Further, as shown in FIGS. 27B and 28, in the unit regions (3X) to (4X), the connecting portions 106d and 106e are both maintained without being disconnected.

  Further, as shown in FIG. 26B, the first feedback unit 110a is divided in the unit region (X + 1), and as shown in FIG. 27B, the second feedback is made in the unit region (3X-1). The unit 110b and the third feedback unit 110c are divided.

  As described above, portions of the connecting portions 106 a to 106 f that are not necessary when power is supplied to the LED chip 122 are removed from the conductive pattern 102.

  Next, the 2nd insulating tape which insulates between conductive patterns and other metals, such as a back chassis, is stuck on the back surface of the conductive pattern 102 (2nd insulating tape sticking process). Here, FIG. 30 is a view of the conductive pattern 102 in which the second insulating tape is attached to the back surface as viewed from the front side. As shown in FIG. 30, the second insulating tape 135 has a strip shape extending in the arrangement direction of the LED chips 122 similarly to the first insulating tape 124, and is approximately the same as the width of the first insulating tape 124. It has a width. As the second insulating tape 135, a PET tape or the like is used similarly to the first insulating tape 124, and the second insulating tape 135 is bonded to the conductive pattern 2 with an adhesive. Alternatively, a thermoplastic resin may be used for the second insulating tape 135 and attached to the conductive pattern 102 by hot melt.

  When the second insulating tape attaching step is completed, a predetermined inspection is performed (inspection step), and the production of the conductive pattern member is ended. Here, FIG. 31 is a plan view showing the completed conductive pattern member 144. As shown in FIG. 31, a plurality of LED chips 122 are mounted in a row on the conductive pattern member 144.

  Next, the conductive pattern member 144 is mounted on the liquid crystal display. FIG. 32 is a sectional view of a liquid crystal display on which the conductive pattern member 144 is mounted. As shown in FIG. 32, the liquid crystal display 150 includes a liquid crystal panel 151, a frame 152 constituting the outer frame portion of the liquid crystal display 150, a holding member 154 attached to the rear end of the liquid crystal panel 151, and a conductive pattern member 144. In addition, a heat transfer unit 156 that transfers heat of the conductive pattern member 144 to the frame 152 is provided.

  Here, the liquid crystal panel 151 is fixed to the frame 152 via the holding member 154 and the heat transfer unit 156, and is held at a predetermined position in the frame 152. In addition, the conductive pattern member 144 is disposed in a gap portion 158 formed between the liquid crystal panel 151 and the frame 152, and the heat radiating portion 107 and the power feeding portion 108 bent in an L shape are fixed to the heat transfer portion 156. . The conductive pattern member 144 has the LED chip 122 aligned with the end of the liquid crystal panel 151 so that the distance between the end of the holding member 156 and the edge of the power feeding unit 108 is 0.5 mm or less. Be placed.

  Next, a power feedback configuration in the conductive pattern member 144 will be described. First, when electric power is supplied to the conductive pattern member 144 from a power source (not shown), the conductive pattern member is repeatedly meandering along the power supply portion 108 at the connecting portion 109 as shown by a line H in FIGS. 144 is transmitted in the longitudinal direction. Among these, as shown in FIG. 26B, the current transmitted to the connecting portion 109 of the unit region (X) is transmitted to the first soldering portion 113 and the second soldering portion 114 via the connecting portion 106b. Then, it is input to the LED chip 122 (not shown in FIG. 26) from the anode part 122a and the anode part 122b of the LED chip 122 shown in FIG. Thereby, the LED chip 122 mounted in the unit region (X) is turned on.

  Next, the current is transmitted to the third soldering part 115 and the fourth soldering part 116 through the cathode parts 122c and 122d (see FIG. 23), and further through the connection part 106f in the unit region (X-1). This is transmitted to the first soldering part 113 and the second soldering part 114. Then, the LED chip 122 (see FIG. 23) is input from the anode portion 122a and the anode portion 122b of the LED chip 122 mounted in the unit region (X-1), and the LED chip mounted in the unit region (X-1). 122 lights up.

  In the same manner, the current is transmitted to the unit areas in the smaller order, the LED chip 122 mounted in the unit area (X-2),..., The LED chip 122 mounted in the unit area (2), the unit area (1 The LED chips 122 mounted on are sequentially turned on.

  In addition, as shown in FIG. 27A, the current transmitted to the connecting portion 109 in the unit area (2X) is input to the LED chip 122 via the connecting portion 106b and mounted in the unit area (2X-1). The LED chips 122,..., The LED chip 122 mounted in the unit area (X + 2), and the LED chip 122 mounted in the unit area (X + 1) are sequentially turned on.

  Here, as indicated by a line I in FIG. 26B, the current output from the LED chip 122 mounted in the unit region (X + 1) is the third soldering portion 115, the fourth soldering unit 115 in the unit region (X + 1). After being transmitted to the soldering unit 116, it is transmitted to the first feedback unit 110a via the connection unit 106c and fed back to the power source.

  In addition, as shown in FIG. 27B, the current transmitted to the connecting portion 109 of the unit area (3X) is input to the LED chip 122 via the connection section 106b and mounted in the unit area (3X-1). The LED chips 122,..., The LED chip 122 mounted in the unit area (2X + 2), and the LED chip 122 mounted in the unit area (2X + 1) are sequentially turned on.

  Here, as indicated by a line J in FIG. 27A, the current output from the LED chip 122 mounted in the unit region (2X + 1) is the third soldering portion 115, the fourth soldering unit 115 in the unit region (2X + 1). It is transmitted to the soldering unit 116, transmitted to the second feedback unit 110b through the connection unit 106c and the connection unit 106e, and fed back to the power source. Since the first feedback unit 110a is divided by the unit region (X + 1) (see FIG. 26A), the current is supplied to the first feedback unit 110a of the unit region having a smaller order than the unit region (X + 1). Not transmitted.

  As shown in FIG. 28, the current transmitted to the connecting portion 109 in the unit area (4X) is input to the LED chip 122 via the connection portion 106b, and the LED mounted in the unit area (4X-1). The LED 122 mounted in the unit area (3X + 2) and the LED chip 122 mounted in the unit area (3X + 1) are sequentially turned on.

  Here, as indicated by the line K in FIG. 27B, the current output from the LED chip 122 mounted in the unit region (3X + 1) is the connection unit 106c, the first feedback unit 110a, the connection unit 106e, 2 is transmitted to the third feedback unit 110c via the feedback unit 110b and the connection unit 106c and fed back to the power source. Since the first feedback unit 110a and the second feedback unit 110b are divided by the unit region (3X-1), the current is the first feedback of the unit region having a smaller order than the unit region (3X-1). The signal is not transmitted to the unit 110a and the second feedback unit 110b.

  According to the fourth embodiment, the first soldering portion 114 and the second soldering portion 116 do not have protrusions, so that automatic mounting using a metal mask is possible, and the conductive pattern has reduced manufacturing costs. The manufacturing method of a member and a conductive pattern member can be provided. In addition, when reflow soldering is employed, the separation groove 118 can prevent the solder flow accurately. A plurality of LED chips 122 are mounted in a row on the conductive pattern member. Therefore, this conductive pattern member can be used as a backlight as it is by arranging it on the back side or the back side end of a liquid crystal display device of a television receiver or a personal computer, for example.

  In addition, the conductive pattern member 144 is a thin member in which the LED chip 122 is mounted on the planar conductive pattern 102 having no uneven surface, and can be disposed in a narrow gap. Even if the outer frame portion of the part is narrow, it can be used as a backlight. Further, since heat is radiated from the end of the heat radiating portion 107 bent into an L shape to the back surface of the frame 152 through the heat transfer portion 156, the heat radiating portion 160 is disposed on the back of the conductive pattern member 160 as shown in FIG. There is no need to dispose the member 162, and heat can be effectively radiated even when the outer frame portion of the display unit such as a liquid crystal display device is narrow. Further, by using an insulating tape as an insulating member that insulates the conductive patterns, the weight of the conductive pattern member can be reduced.

  In the second and third embodiments, the integrated insulator 86 is added around the plurality of LED chips by insert molding, but as shown in FIG. 19, the LED chips are formed by insert molding. You may make it add the separate insulator 100 for every.

  Further, in the above-described embodiment, the LED chip and the power connector are mounted on the conductive pattern using the chip mounter. However, the LED chip and the power connector may be mounted on the conductive pattern manually by an operator. Good.

  In the second and third embodiments, the insulator 86 is formed of white resin. However, LCP (liquid crystal polymer), PBT (polybutylene terephthalate), 6-6Ny (6,6-nylon), etc. You may form with a thermoplastic resin.

  In the second and third embodiments, after cutting the cutting portion 72 (after the cutting step), the lens is attached to the upper part (light emission direction side) of the LED chip 82 mounted on the conductive pattern 60. (Lens mounting process). Similarly, in the fourth embodiment, after the second insulating tape is attached to the back surface of the conductive pattern 102 (after the second insulating tape attaching step), the upper part of the LED chip 122 mounted on the conductive pattern 102 (light emission) A lens may be mounted on the direction side (lens mounting step).

  In the first and fourth embodiments, a metal thin plate that has not been plated is pressed (pressing process) to create a conductive pattern, and the created conductive pattern is plated (plating process). Also good. Then, in the electronic component mounting part of the conductive pattern, the first soldering part and the second soldering part are isolated from the other parts, ie, the non-soldering part, and an isolation region for preventing solder flow is formed (isolation part formation) Step).

  In the fourth embodiment, the conductive pattern 102 is bent (bending step) after the first insulating tape 124 is attached to the surface of the conductive pattern 102 (after the first insulating tape attaching step). May be. Alternatively, the connection portion 106 may be cut (after the cutting step), or after the second insulating tape is attached to the back surface of the conductive pattern 102 (after the second insulating tape attaching step). You may make it perform.

  The conductive pattern 60 of the second and third embodiments also has a feedback configuration similar to that of the conductive pattern 102 described in the fourth embodiment, and the current that sequentially turns on the LED chips 82 is the power connector. 84 is fed back.

DESCRIPTION OF SYMBOLS 2 ... Conductive pattern, 4 ... Electronic component mounting part, 6 ... Cutting part, 10 ... Breaking part, 11 ... Fitting part, 14 ... 1st soldering part, 16 ... 2nd soldering part, 18 ... Isolation groove, DESCRIPTION OF SYMBOLS 22 ... LED chip, 24 ... 1st insulating tape, 26 ... Opening part, 28 ... Cutting opening part, 33 ... Insulating member, 34 ... Connector insertion part, 35 ... 2nd insulating tape, 40 ... Lens, 44 ... Conductive pattern Element

Claims (21)

A conductive pattern member having a conductive pattern formed by pressing a metal plate and provided with at least two soldering portions for soldering an electronic component,
The soldering portion is formed in a state where there is no protrusion on the same plane of the conductive pattern, and the surface is plated.
The conductive pattern member has an isolation part that isolates the soldering part and the non-soldering part.   The conductive pattern member according to claim 1, wherein the isolation portion includes an isolation groove.   The conductive pattern member according to claim 1, wherein the isolation part is constituted by a peeling region where the plating is peeled off. The conductive pattern is formed in a planar shape having a predetermined width and extending in the arrangement direction of the electronic components,
On the front and back surfaces of the conductive pattern, an insulating sheet that is a sheet-like insulator extending in the arrangement direction of the electronic components is attached,
The insulating sheet attached to the surface of the conductive pattern has a predetermined opening that exposes the electronic component soldered to the soldering portion. Conductive pattern member.   The conductive pattern is formed in a three-dimensional shape having a predetermined width and extending in the arrangement direction of the electronic components, and the periphery of the electronic components soldered to the soldering portion is covered with an insulator. The electroconductive pattern member as described in any one of Claims 1-3.   The conductive pattern member according to claim 5, wherein at least one side of the electronic component is in contact with the insulator.   5. The conductive pattern member according to claim 1, wherein one edge portion in the longitudinal direction of the conductive pattern is bent to have an L-shaped cross section.   The conductive pattern member according to claim 7, wherein the conductive pattern member has a plurality of holes along a bending position of the conductive pattern.   9. The conductive pattern member according to claim 8, wherein the conductive pattern member has slits extending in a width direction from one edge in the longitudinal direction of the conductive pattern to a bending position at predetermined intervals.   The conductive pattern member according to claim 1, wherein the conductive pattern has a cut portion.   The said electronic component is a LED chip, The conductive pattern member as described in any one of Claims 1-10 characterized by the above-mentioned.   The conductive pattern member according to claim 11, further comprising a lens disposed on a light emitting direction side of the electronic component. Planar shape having at least two soldering parts that do not have protrusions for soldering an electronic component by pressing a plated metal plate, and an isolation part that separates the soldering part from the non-soldering part A pressing process for creating a conductive pattern of
An application step of applying solder to the soldering portion;
A mounting step of mounting the electronic component on the soldering portion;
A mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method;
A first insulating sheet sticking step of sticking a first insulating sheet, which is a sheet-like insulator having a predetermined opening extending in the arrangement direction of the electronic parts and exposing the electronic parts, to the surface of the conductive pattern;
A method of manufacturing a conductive pattern member, comprising: a second insulating sheet attaching step of attaching a second insulating sheet, which is a sheet-like insulator extending in the arrangement direction of the electronic components, to the back surface of the conductive pattern. A pressing process for creating a planar conductive pattern having at least two soldered portions that do not have protrusions for soldering electronic components by pressing a metal plate;
A plating step of plating the conductive pattern;
An isolation part forming step for forming an isolation part for isolating the soldered part and the non-soldered part in the conductive pattern;
An application step of applying solder to the soldering portion;
A mounting step of mounting the electronic component on the soldering portion;
A mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method;
A first insulating sheet sticking step of sticking a first insulating sheet, which is a sheet-like insulator having a predetermined opening extending in the arrangement direction of the electronic parts and exposing the electronic parts, to the surface of the conductive pattern;
A method of manufacturing a conductive pattern member, comprising: a second insulating sheet attaching step of attaching a second insulating sheet, which is a sheet-like insulator extending in the arrangement direction of the electronic components, to the back surface of the conductive pattern.   After the first insulating sheet sticking step, an auxiliary member removing step of removing an auxiliary member used when feeding the metal plate in the arrangement direction of the electronic parts during press processing from the conductive pattern is included. The manufacturing method of the conductive pattern member of Claim 13 or 14.   15. The bending step of forming a cross section of the conductive pattern member in an L shape by bending one edge portion in the longitudinal direction of the conductive pattern after the mounting step. A method for producing a conductive pattern member. Three-dimensional shape having at least two soldering parts that do not have protrusions for soldering electronic components by pressing a plated metal plate, and an isolation part that separates the soldering parts from the non-soldering parts A pressing process for creating a conductive pattern of
An application step of applying solder to the soldering portion;
A mounting step of mounting the electronic component on the soldering portion;
A mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method;
And an insulator adding step of adding an insulator around the electronic component. A pressing process for creating a three-dimensional conductive pattern having at least two soldered portions that do not have protrusions for soldering electronic components by pressing a metal plate;
A plating step of plating the conductive pattern;
An isolation part forming step for forming an isolation part for isolating the soldered part and the non-soldered part in the conductive pattern;
An application step of applying solder to the soldering portion;
A mounting step of mounting the electronic component on the soldering portion;
A mounting step of soldering and mounting the electronic component on the soldering portion of the conductive pattern by a reflow method;
And an insulator adding step of adding an insulator around the electronic component. By the pressing process, further forming a cut portion in the conductive pattern,
The method for producing a conductive pattern member according to any one of claims 13 to 18, further comprising a cutting step of cutting the cut portion after the insulator adding step or the first insulating sheet attaching step. .   The method of manufacturing a conductive pattern member according to any one of claims 13 to 19, wherein the electronic component is an LED chip.   21. The method of manufacturing a conductive pattern member according to claim 20, further comprising a lens attaching step of attaching a lens to a light emitting direction side of the electronic component after the insulator adding step or the second insulating sheet attaching step.

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