KR20200031034A - Organic light emitting display device and manufacturing method thereof - Google Patents

Abstract

The object of the present invention is to provide an organic light emitting display device and a manufacturing method thereof, which have excellent shielding properties against oxygen and moisture and have a narrow bezel. In the present invention, the organic light emitting display device comprises: a device substrate; an organic light emitting device layer provided on the device substrate; a dam material provided around the organic light emitting device layer on the device substrate; an opposite substrate provided on the dam material to be opposite the device substrate; and an encapsulation film installed on an exterior surface of the dam material.

Description

Organic light emitting display device and manufacturing method of organic light emitting display device

The present invention relates to an organic light emitting display device and a method for manufacturing the organic light emitting display device.

An organic light emitting display (OLED) is characterized by being capable of driving low voltage, being thin, having a good viewing angle and a fast response speed.

On the other hand, in the organic light emitting display device, deterioration of the organic light emitting element (organic light emitting diode) occurs due to the influence of oxygen and moisture, and the light emission performance is deteriorated. For this reason, the development of a technology for suppressing oxygen and moisture permeation to the organic light emitting display device is progressing.

For example, Patent Literature 1 discloses an organic light emitting display device that suppresses oxygen and water permeation by sealing the periphery of an organic light emitting element by a dam material (encapsulation wall) provided between the element substrate and the counter substrate.

Patent Document 1: Japanese Patent Publication No. 2015-076195

In the organic light emitting display device described in Patent Document 1, since the dam material is formed of resin, it is necessary to increase the width of the dam material (thickness in the plane direction) in order to obtain sufficient shielding properties against oxygen and moisture. On the other hand, in the organic light emitting display device, from the viewpoint of reducing the non-display area, improving design, miniaturization and weight reduction, it is preferable that the width of the dam material is narrow, and narrow bezelization (slim bezelization) is strongly demanded.

Therefore, excellent shielding properties against oxygen and moisture and narrow bezel are in a trade-off relationship, and it is required to achieve them at a high level.

In view of all the problems in the prior art described above, the present invention has an object to provide an organic light emitting display device having an excellent shielding property against oxygen and moisture and a narrow bezel, and a method of manufacturing the organic light emitting display device. do.

According to one aspect of the present invention, the device substrate, an organic light emitting device layer provided on the device substrate, a dam material provided around the organic light emitting device layer on the device substrate, and facing the device substrate, the An organic light emitting display device is provided having a counter substrate provided on a dam material and a sealing film provided on an outer wall surface of the dam material.

According to another aspect of the present invention, a step of installing an organic light emitting element layer on an element substrate, and applying a coating solution containing a resin around the organic light emitting element layer on the element substrate to install an uncured dam material A step of installing a counter substrate on the uncured dam material facing the element substrate, a step of curing the uncured dam material to form a dam material, and a sealing film on the outer wall surface of the dam material There is provided a method of manufacturing an organic light emitting display device having a process of the.

According to the present invention, an organic light emitting display device having an excellent shielding property against oxygen and moisture and a narrow bezel is achieved, and a method of manufacturing the organic light emitting display device.

1 is a perspective view showing an organic light emitting display device according to a first embodiment of the present invention.
2 is a block diagram showing an organic light emitting display device according to a first embodiment of the present invention.
3 is a cross-sectional view showing an organic light emitting display device according to the first embodiment of the present invention.
4 is a flow chart showing a method of manufacturing the organic light emitting display device according to the first embodiment of the present invention.
5 is a diagram for explaining a method of manufacturing the organic light emitting display device according to the first embodiment of the present invention.
6 is a cross-sectional view showing an organic light emitting display device according to a second embodiment of the present invention.
7 is an enlarged cross-sectional view of a main portion illustrating a shielding structure of an organic light emitting display device according to a second embodiment of the present invention.
8 is a flow chart showing a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention.
9 is a view for explaining the manufacturing method of the organic light emitting display device in the second embodiment of the present invention.
10 is a cross-sectional view showing an organic light emitting display device according to a modified embodiment of the present invention.
11 is a cross-sectional view showing an organic light emitting display device according to a modified embodiment of the present invention.

<First Embodiment>

1 is a perspective view showing an organic light emitting display device 100 according to the present embodiment. 2 is a block diagram showing the organic light emitting diode display 100 according to the present embodiment. In addition, in this embodiment, each drawing is a schematic drawing for description, and it is not according to dimensions. In particular, a number of repetitive elements are shown by greatly reducing the quantity for the sake of clarity of the city.

1 and 2, the organic light emitting display device 100 according to the present embodiment includes a display panel 110, a scan driver 120, a data driver 130, and a timing controller 160. ), And a host system 170.

As shown in FIG. 1, the display panel 110 includes a pair of opposing substrates, an element substrate 111 and an opposing substrate 112. In addition, a sealing film 113 is provided on a wall surface (outer wall surface) in the outer circumferential direction of the display panel 110. In addition, in the following description, the directions of the two sides defining the display surface of the display panel 110 are referred to as the X direction and the Y direction, respectively, and the direction perpendicular to the display surface (that is, the direction perpendicular to the XY plane) is the Z direction. It is said. In addition, in this embodiment, the expression 'upper' or 'lower' does not limit the positional relationship in actual use.

As shown in FIG. 2, the display panel 110 includes a display area, which is an area where pixels P are provided and displays images. Data lines D1 to Dm and m are positive integers of 2 or more and scan lines S1 to Sn and n are positive integers of 2 or more are formed on the display panel 110. The data lines D1 to Dm are formed to intersect the scan lines S1 to Sn. The pixel P is formed in an area defined by the crossing structure of the gate line and the data line.

Each of the pixels P of the display panel 110 may be connected to any one of the data lines D1 to Dm and one of the scan lines S1 to Sn. Each of the pixels P of the display panel 110 is turned on by a drive transistor that adjusts the drain-source current according to the data voltage applied to the gate electrode, and the scan signal of the scan line, and the data of the data line. A scan transistor that supplies a voltage to the gate electrode of the driving transistor, an organic light emitting diode that emits light according to the drain-to-source current of the driving transistor, and a capacitor (Capacitor) for preserving the voltage of the gate electrode of the driving transistor ). In this way, each of the pixels P can emit light according to the current supplied to the organic light emitting diode.

The scan driver 120 receives a scan control signal GCS from the timing controller 160. The scan driver 120 supplies a scan signal to the scan lines S1 to Sn based on the scan control signal GCS.

The scan driver 120 may be formed in a gate driver in panel (GIP) method on the outside non-display areas of one or both sides of the display area of the display panel 110. Alternatively, the scan driving unit 120 is made of a driving chip and mounted using a flexible film 140, and an outer non-display area on one side or both sides of the display area of the display panel 110 in a Tape Automated Bonding (TAB) method. It can also be attached to.

The data driver 130 receives digital video data DATA and a data control signal DCS from the timing controller 160. The data driver 130 converts digital video data DATA into an analog bipolar / negative polarity data voltage based on the data control signal DCS and supplies the data to the data line. That is, the pixel P to which the data voltage is supplied is selected by the scan signal of the scan driver 120, and the data voltage is supplied to the selected pixel P.

The data driver 130 may include a plurality of source drive ICs 131 as shown in FIG. 1. Each of the plurality of source drive ICs 131 may be mounted on the flexible film 140 in a chip on film (COF) or chip on plastic (COP) method. The flexible film 140 is attached on a pad provided in a non-display area of the display panel 110 using an anisotropic conducting film. Thereby, the plurality of source drive ICs 131 can be connected to the pad.

The circuit board 150 can be attached to the flexible film 140. A plurality of circuits mounted on the driving chip may be mounted on the circuit board 150. For example, the timing controller 160 may be mounted on the circuit board 150. The circuit board 150 may be a printed circuit board or a flexible printed circuit board.

The timing controller 160 receives digital video data DATA and timing signals from the host system 170. The timing signal may include a vertical synchronization signal, a horizontal synchronization signal, a data enable signal, and a dot clock. The vertical synchronization signal is a signal defining one frame period. The horizontal synchronization signal is a signal that defines one horizontal period required to supply a data voltage to pixels P of one horizontal line of the display panel 110. The data enable signal is a signal that defines a period during which valid data is input. The dot clock is a signal that repeats at a predetermined short period.

The timing controller 160 is a data control signal (DCS) for controlling the operation timing of the data driver 130 based on the timing signal to control the driving timing of the scan driver 120 and the data driver 130. In addition, a scan control signal GCS for controlling an operation timing of the scan driver 120 is generated. The timing controller 160 outputs the scan control signal GCS to the scan driver 120, and outputs digital video data DATA and data control signal DCS to the data driver 130.

The host system 170 may be mounted in a navigation system, a setup box, a DVD player, a Blu-ray player, a personal computer (PC), a home theater system, a broadcast receiver, a phone system, or the like. The host system 170 converts digital video data DATA of an input image including a system on chip (SoC) having a scaler into a format suitable for displaying on the display panel 110. The host system 170 transmits digital video data DATA and a timing signal to the timing controller 160.

3 is a cross-sectional view showing an organic light emitting display device 100 according to the present embodiment. 3 is a cross-sectional view in the X-Z plane of the display panel 110 shown in FIG. 1, but for convenience of description, the dimension light ratio of each member is different from FIG. 1. In the following description, the organic light emitting display device 100 of the front emission type is described as an example, but the organic light emitting display device of the present invention is not limited to the front emission type, and may be an organic light emitting display device of the back emission type.

As shown in FIG. 3, the organic light emitting display device 100 according to the present embodiment includes an element substrate 111, a counter substrate 112, an encapsulation film 113, and an organic light emitting element layer 114. A passivation layer 115, a dam material 116, and a filler 117 are provided.

The element substrate 111 is, for example, a glass substrate. In addition, the element substrate 111 is not limited to a glass substrate, and substrates of various materials can be used. In addition, a barrier layer (not shown) is formed on the element substrate 111. The material of the barrier layer is not particularly limited as long as it is a material having shielding properties against oxygen and moisture, and examples thereof include silicon oxide, silicon nitride, and alumina. Moreover, the barrier layer may be a single layer, or may be a laminated structure of two or more layers. Moreover, a TFT layer (not shown) including a thin film transistor (TFT) constituting a driving circuit for driving the organic light emitting element layer 114 is formed on the barrier layer.

The counter substrate 112 is, for example, a glass substrate. When the counter substrate 112 having transparency is positioned in the light emitting direction of the organic light emitting element layer 114, a display device of a front emission type can be configured. The counter substrate 112 is adhered and fixed on the dam material 116 and the filler 117.

The sealing film 113 is provided on the outer wall surface of the dam material 116. In this embodiment, as shown in FIG. 1, the sealing film 113 is continuously provided on three outer wall surfaces perpendicular to the XY plane in the drawing in the display panel 110. In addition, in the thickness direction (Z direction) of the display panel 110, the encapsulation film 113 spans the outer wall surfaces of the three members of the element substrate 111, the dam material 116, and the opposing substrate 112. It is formed continuously. In addition, the encapsulation film 113 is a deposition film containing at least one of a metal oxide and a metal nitride, and is formed by an aerosol deposition method (AD method), which is one of known deposition methods.

In the aerosol deposition method, a fine particle aerosol of a brittle material composed of a metal oxide and a metal nitride is jetted from a nozzle toward a target object at high speed to collide fine particles with the object, and use the mechanical impact force to create a polycrystalline structure of the brittle material. It is a method of forming on the surface of an object. According to the aerosol deposition method, it is possible to obtain a compact structure having both non-humidity and mechanical strength equivalent to that of a fired body under non-heating conditions, and high shielding properties against oxygen and moisture.

The high shielding property against moisture (high water vapor barrier property) is generally expressed by water vapor transmission rate (WVTR). As a unit of water vapor permeability, a water vapor amount converted to a unit time (1 day) and a unit area (1 m ² ) is generally used. In particular, for the use of the organic electronic substrate, a very low permeability of 10 ^-5 to 10 ^-6 g / m ² / day is required, and the encapsulation film 113 of this embodiment is also considered to satisfy the above criteria.

As the material of the sealing film 113, alumina, zirconia (zirconium dioxide), titania (titanium oxide), or the like is used. Moreover, it is preferable if the sealing film 113 has transparency. The thickness of the encapsulation film 113 is preferably 100 nm to 100 μm.

The organic light emitting element layer 114 is provided on the TFT layer described above. The organic light emitting element layer 114 includes an organic light emitting element (not shown) and a bank (not shown). The organic light emitting device has an anode (anode), an organic compound layer (organic light emitting layer) formed on the anode, and a cathode (cathode) formed on the organic compound layer. In addition, the organic compound layer has a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in order from the anode side. Further, each layer constituting the organic light emitting element layer 114 can be formed using a known material.

As the anode, for example, a reflective electrode made of a thin film of a material having high reflectance such as aluminum, silver, platinum, and chromium, and a thin film of transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) And the formed reflective electrode.

The organic compound layer includes, for example, an organic compound layer for R that emits red light, an organic compound layer for G that emits green light, and an organic compound layer for B that emits blue light, depending on the subpixel constituting the pixel. The organic compound layers for R, G, and B are made of known materials according to their respective emission colors.

As the cathode, for example, a translucent electrode or a transparent electrode made of a thin film such as silver, silver alloy, ITO, or IZO is used.

The bank is formed to partition the pixel P, for example, to cover the end of the anode. That is, the bank serves as a pixel defining film defining the pixel P. As the bank, an organic film such as an acrylic resin and an epoxy resin is used, for example.

The passivation layer 115 is provided on the top and side surfaces of the organic light emitting element layer 114 so as to cover the organic light emitting element layer 114. The passivation layer 115 is made of an inorganic film having low moisture permeability, and functions as a protective film that protects the organic light emitting element layer 114 from oxygen and moisture. As the passivation layer 115, for example, a silicon oxide film, a silicon nitride film, or the like is used.

The dam material 116 is provided around the plurality of organic light emitting element layers 114 formed in a matrix on the element substrate 111. The dam material 116 is made of a transparent resin such as a thermosetting resin or a photocurable resin. As the material of the dam material 116, for example, epoxy resin, acrylic resin, or the like is used.

On the dam material 116, an opposing substrate 112 is provided against the element substrate 111. The dam material 116 is provided between the element substrate 111 (barrier layer) and the counter substrate 112 and functions as an adhesive member of a pair of substrates by being cured by heat and light. In addition, in the thickness direction of the manufactured display panel 110, the transmittance of light passing through the stacked regions of the element substrate 111, the dam material 116, and the opposing substrate 112 is 80% or more, so that each member It is preferable if the material is selected.

The filler 117 is filled in a space area surrounded by the passivation layer 115, the dam material 116 and the counter substrate 112. The filler 117 is made of a transparent resin such as a thermosetting resin and a photocurable resin, similarly to the dam material 116. The filler 117 functions as an adhesive member of a pair of substrates by being cured by heat and light like the dam material 116. In addition, the refractive index of the dam material 116 and the filler 117 is preferably 0.5 to 0.55. The difference in refractive index between the upper and lower substrates (element substrate 111 and counter substrate 112) and dam material 116 is preferably 0.1 or less.

Subsequently, a method of manufacturing the organic light emitting display device 100 in this embodiment will be described with reference to FIGS. 4 and 5. 4 is a flow chart showing a method of manufacturing the organic light emitting display device 100 according to the present embodiment. 5 is a diagram for explaining a method of manufacturing the organic light emitting display device 100 according to the present embodiment.

First, as shown in FIG. 5 (A), an organic light emitting element layer 114 is formed on the upper surface of the element substrate 111 (step S11).

Subsequently, as shown in FIG. 5 (B), the passivation layer 115 is formed on the top and side surfaces of the organic light emitting element layer 114 to cover the organic light emitting element layer 114 (step S12).

Next, in preparation for the injection of the filler 117, which will be described later, as shown in FIG. 5 (C), the uncured resin around the organic light emitting element layer 114 and the passivation layer 115 in the element substrate 111 is shown. The phosphorus dam material 116 is applied (step S13).

Next, the dam material 116 is irradiated with ultraviolet light for a predetermined time to temporarily cure the dam material 116 (step S14).

Next, as shown in FIG. 5 (D), the filler 117 is injected into the space surrounded by the element substrate 111, the passivation layer 115, and the dam material 116 (step S15).

Next, as shown in FIG. 5 (E), the opposite substrate 112 is attached on the dam material 116 and the filler 117 to face the element substrate 111 (step S16).

Next, as shown in FIG. 5 (F), after the intermediate body of the display panel 110 (see FIG. 5 (E)) is brought into the chamber C1 in a normal temperature state, which is decompressed to about 100 Pa, for example, By spraying particulate aerosol (AS) from the nozzle (N1) on the outer wall surfaces of the dam material (116), the element substrate (111), and the counter substrate (112) in the intermediate body, on the outer wall surface based on the AD method An encapsulation film 113 is formed (step S17).

In addition, the filler 117 and the dam material 116 are cured by continuously heat-treating the intermediate for a predetermined time in the chamber C1 in which the temperature is raised to, for example, 100 ° C., or irradiating the intermediate for 30 minutes with ultraviolet light. (Step S18). Curing conditions are appropriately selected depending on the filler 117 and the dam material 116 material. Thus, the manufacturing process of the display panel 110 of the organic light emitting diode display 100 is completed.

As described above, according to the organic light emitting display device 100 according to the present embodiment, narrow bezelization is achieved while having excellent shielding properties against oxygen and moisture.

In detail, since the shielding property (high water vapor barrier property) is secured only by the encapsulation film 113 formed of a very thin thickness (100 nm to 100 μm), it is possible to significantly narrow the width of the dam material 116 than the conventional device. . In addition, since the dam material 116 of the conventional device includes a getter material having a moisture absorption function, the edge portion of the display panel 110 becomes cloudy, which causes an increase in the non-display area. On the other hand, the organic light emitting display device 100 according to the present embodiment has a structure in which it is not necessary to include a getter material inside the dam material 116 due to the shielding property of the encapsulation film 113. ) Can be formed of only transparent resin, and as a result, transparent display area enlargement (narrow bezel) can be achieved.

In addition, since the dam material 116 is formed of only resin, the adhesion between the dam material 116 and the element substrate 111 and the opposing substrate 112 is improved compared to the case where the dam material 116 includes a getter material. There are also advantages.

In addition, by using the AD method, compared with the CVD (Chemical Vapor Deposition) method in which film formation is performed while rotating a substrate at a high speed in a high temperature (for example, 250 ° C.) chamber, the following advantages are also provided.

(A) Since the encapsulation film 113 can be deposited on the outer wall surface (side) of the substrate under a room temperature environment, the cost required for the film forming process can be suppressed.

(B) Unlike the CVD method of depositing the entire surface of the substrate, the encapsulation film 113 can be formed in a limited portion.

Moreover, by the structure in which the shielding property (high water vapor barrier property) is ensured only by the sealing film 113, there is also an advantage that the thickness of the dam material 116 can be made thin. As a result, since the thickness of the entire display panel 110 is also thinned, the flexibility of the display panel 110 can be improved.

<Second Embodiment>

Subsequently, the organic light emitting display device 200 in this embodiment will be described with reference to FIGS. 6 to 9. In addition, in the drawing of 1st Embodiment, the code | symbol given to the code | symbol and the common code | symbol represent the same object. Hereinafter, descriptions of parts common to those of the first embodiment will be omitted, and description will be mainly focused on the configuration and operation different from those of the first embodiment.

6 is a cross-sectional view showing the organic light emitting display device 200 according to the present embodiment. The sealing film 118 in the present embodiment is the first in that it is a nano sheet composite film in which nano sheets 118a separated from a layered inorganic compound and an organic resin layer 118b are alternately stacked in nanometer units. It is different from the embodiment. The material of the nano sheet 118a is, for example, montmorillonite, bentonite, hectorite, octosilicate, and the like. In addition, the aspect ratio of the encapsulation film 118 is preferably 300: 1 or more, and the content rate is 30wt% or more. The thickness of the encapsulation film 118 is preferably 100 nm to 100 μm.

7 is an enlarged cross-sectional view of a main portion illustrating a shielding structure of the organic light emitting diode display 200 according to the present embodiment. As shown in FIG. 7, the nanosheet 118a is dispersed inside the encapsulation film 118 while the surface direction of the nanosheet 118a is the surface direction of the encapsulation film 118 (Z direction in the drawing) It is installed so as to be substantially parallel to. In addition, in the drawing, the broken arrow shows the direction of progress of moisture (H ₂ O) that has entered the organic resin layer 118b. In FIG. 7, the oxygen and moisture cannot reach the dam material 116 unless the shortest path inside the encapsulation film 118 can be obtained and a long and complicated path far from the shortest path is reached. Dot is shown. That is, since the encapsulation film 118 is formed by laminating the nano sheet 118a and the organic resin layer 118b in the X-direction or Y-direction in nanometer units, it means that they have high shielding properties.

Subsequently, a method of manufacturing the organic light emitting display device 200 according to the present embodiment will be described with reference to FIGS. 8 and 9. 8 is a flowchart showing a method of manufacturing the organic light emitting display device 200 in the present embodiment. 9 is a view for explaining a manufacturing method of the organic light emitting display device 200 in the present embodiment.

First, as shown in Fig. 9A, an organic light emitting element layer 114 is formed on the upper surface of the element substrate 111 (step S21).

Subsequently, as shown in FIG. 9 (B), the passivation layer 115 is formed on the top and side surfaces of the organic light emitting element layer 114 to cover the organic light emitting element layer 114 (step S22).

Next, as shown in Fig. 9C, a dam material 116, which is an uncured resin, is applied around the organic light emitting element layer 114 and the passivation layer 115 in the element substrate 111 (step). S23).

Next, the dam material 116 is irradiated with ultraviolet light for a predetermined time to temporarily cure the dam material 116 (step S24).

Next, as shown in FIG. 9 (D), the filler 117 is injected into the space surrounded by the device substrate 111, the passivation layer 115, and the dam material 116 (step S25).

Next, as shown in Fig. 9 (E), the opposing substrate 112 is attached on the dam material 116 and the filler 117, facing the element substrate 111 (step S26).

Next, as shown in FIG. 9 (F), after the intermediate body (see FIG. 9 (E)) of the display panel 110 is brought into the chamber C2, the dam material 116 and the element substrate ( 111), the coating liquid adjusted for forming the sealing film 118 is repeatedly applied from the nozzle N2 to each outer wall surface of the opposing substrate 112 (step S27). At this time, the temperature in the chamber C2 may be room temperature. Further, the coating solution is preferably adjusted by, for example, monolayer peeling and dispersion of the nano sheet 118a having an aspect ratio of about 1000: 1 in a solvent and a resin.

Then, the temperature in the chamber C2 is raised to, for example, 100 ° C., and the intermediate body of the display panel 110 is irradiated with ultraviolet light for 30 minutes to fill the filler 117, the dam material 116, and the sealing film 118. Each is cured (step S28). Thus, the manufacturing process of the display panel 110 of the organic light emitting diode display 200 is completed.

As described above, according to the organic light emitting diode display 200 according to the present embodiment, narrow bezelization is achieved while having excellent shielding properties against oxygen and moisture. Thereby, the effect similar to 1st Embodiment mentioned above is obtained.

Moreover, unlike the first embodiment described above, after applying the coating solution containing the nanosheet 118a to the outer wall surface, the encapsulation film is dried only by drying the coating solution under a predetermined temperature condition while irradiating ultraviolet rays in the chamber C2. Since (118) can be easily formed, there is also an advantage that film formation in a more limited range is possible than in the case of the first embodiment.

<Modified embodiment>

Although preferred embodiments of the present invention have been described above, the present invention can be modified in various forms, for example, as described below.

10 is a cross-sectional view showing an organic light emitting display device 300 according to a modified embodiment. Here, a case where a hybrid film 119 formed from an organic resin and an inorganic resin is formed on the outer wall surface of the dam material 116 and the encapsulation film 113 is deposited on the hybrid film 119 is illustrated. . The hybrid membrane 119 is, for example, a silane-modified epoxy resin, a polyhedral oligomeric silsesquioxane (POSS) hybrid membrane, or the like. When the hybrid film 119 is provided on the outer wall surface (side) of the element substrate 111, the dam material 116, and the counter substrate 112 as the intermediate layer, the encapsulation film 113 deposited by the AD method ) And the strength of the sealing film 113 and the adhesive force of the outer wall surface.

In addition, in the above-described first and second embodiments, a case has been described in which the outer wall surfaces of the element substrate 111, the dam material 116, and the counter substrate 112 are aligned in the Z direction for convenience of explanation. However, the deposition film and the nano sheet composite film based on the AD method can be formed on a desired portion of the display panel 110. Therefore, even when a step portion is provided at the boundary between the element substrate 111, the dam material 116, and the counter substrate 112, the sealing films 113 and 118 are formed on each outer wall surface in the same manner as in the above-described embodiment. can do. For example, when the outer wall surfaces of the element substrate 111 and the opposing substrate 112 protrude outside the outer wall surface of the dam material 116, at least the outer wall surface of the dam material 116, the dam material 116 and the device By providing the encapsulation films 113 and 118 in the boundary region of the substrate 111 and the boundary region of the dam material 116 and the counter substrate 112, oxygen from the directions perpendicular to the outer wall surface (X and Y directions) And moisture intrusion.

In addition, the shielding structure described in the above-described first and second embodiments is not limited to an organic light emitting display device, and can be applied to other display devices such as liquid crystal display devices and plasma display devices, lighting devices, and the like. The lighting device is not particularly limited in its use, and may be used as, for example, indoor lighting or outdoor lighting, or may be used as lighting for electronic devices such as backlights of liquid crystal displays.

Further, in the above-described first and second embodiments, the organic light emitting element layer 114 includes an organic compound layer for R emitting red light, an organic compound layer for G emitting green light, and an organic compound layer for B emitting blue light. Although the structure included is illustrated, the display method is not limited to this. For example, the pixel P may have a configuration in which a light emitting element having a red emission color, a light emitting element having a green emission color, a light emitting element having a blue emission color, and a light emitting element having a white emission color may be provided. Further, all light-emitting elements are of the same light-emitting color (for example, white or blue), and a configuration in which a color filter necessary for each pixel P is added may be employed.

Further, in the above-described first and second embodiments, the internal structure of the display panel 110 has been described based on the schematic drawing, but the internal structure of the display panel 110 can be arbitrarily changed. 11 is a cross-sectional view showing an organic light emitting display device 400 according to a modified embodiment. Here, the organic light emitting element layer 114 includes a cathode 114a, a bank 114b, and an organic compound layer 114c. In the layer of the filler 117, a color filter 401 is provided at a position opposite to the organic light emitting element layer 114 partitioned by the bank 114b in the Z direction. Thereby, for example, when the light emitting element of the organic compound layer 114c emits white or blue light, RGB color development is obtained by color conversion by the color filter 401.

In FIG. 11, a passivation (PAS) layer 402 and an overcoat layer 403 are stacked between the device substrate 111 and the organic light emitting device layer 114 in order from the bottom. It is done. The passivation layer 402 is formed from an insulating material, for example, an inorganic insulating material such as silicon oxide or silicon nitride, and functions as a protective layer. The passivation layer 402 is formed on the entire upper surface of the element substrate 111. Therefore, the passivation layer 402 can suppress oxygen and moisture penetration from the element substrate 111 side. Further, inside the passivation layer 402, a scan driver 120 is provided in a GIP format.

On the other hand, the overcoat layer 403 functions as a planarization layer that removes the step difference generated on the upper surface side of the passivation layer 402 by a thin film transistor (not shown) or the like formed on the element substrate 111. The overcoat layer 403 is formed from an insulating material, for example, an organic insulating material. As the material of the overcoat layer 403, for example, olefin-based polymers (such as polyethylene and polypropylene), polyethylene terephthalate (PET), epoxy resins, fluorine resins, polysiloxanes, and the like are used.

Furthermore, in FIG. 11, the passivation layer 115 is formed to cover the top and side surfaces of the organic light emitting element layer 114 and the ends of the overcoat layer 403, so that the outer peripheral direction of the passivation layer 115 ( In the drawing, a plurality of stepped portions are formed at the ends of the X-direction). In addition, the dam material 116 is formed on the passivation layer 402 so as to cover the end of the passivation layer 115. That is, unlike FIG. 3, the dam material 116 is not spaced from the passivation layer 115, but the passivation layer 115 and passivation by the dam material 116, the element substrate 111 and the opposing substrate 112 It is a structure for clamping and fixing the layer 402 and the organic light emitting element layer 114 therein. Therefore, there is an advantage that the impact resistance of the display panel 110 can be further improved. Further, the organic light emitting element layer 114 is protected in the vertical direction and the horizontal direction by the passivation layer 115 and the passivation layer 402. Therefore, there is an advantage that the shielding property of the device can be further improved.

100, 200, 300, 400: organic light emitting diode display
110: display panel
111: device substrate
112: opposite substrate
113: encapsulation film (ceramic deposition film)
114: organic light emitting device layer
115: passivation layer
116: dam material
117: filler
118: sealing film (nano sheet composite film)
118a: nano sheet
118b: organic resin layer
119: hybrid membrane
120: scan driver
130: data driver
131: source drive IC
140: flexible film
150: circuit board
160: timing controller
170: host system

Claims (10)

A device substrate,
An organic light emitting device layer provided on the device substrate,
A dam material provided around the organic light emitting element layer on the element substrate,
An opposing substrate installed on the dam material opposite the element substrate,
An organic light emitting display device having an encapsulation film provided on an outer wall surface of the dam material.
According to claim 1,
The opposing substrate, the dam material and the encapsulation film have transparency,
The counter substrate is an organic light emitting display device positioned in a light emitting direction of the organic light emitting element layer.
The method of claim 1 or 2,
The encapsulation film is an evaporation film including at least one of a metal oxide and a metal nitride, and an organic light emitting display device formed by an aerosol deposition method.
The method of claim 3,
On the outer wall surface of the dam material, a hybrid film formed from an organic resin and an inorganic resin is provided,
The encapsulation film is an organic light emitting display device deposited on the hybrid film.
The method of claim 1 or 2,
The encapsulation film is an organic light emitting display device, which is a composite film obtained by laminating a nano sheet separated from a layered inorganic compound and an organic resin layer in nanometer units.
The method of claim 5,
The nano sheet is dispersed within the encapsulation film, and the surface direction of the nano sheet is substantially parallel to the surface direction of the encapsulation film.
The method of claim 1 or 2,
An organic light emitting display device having transparency, and further comprising a filling material provided in an area surrounded by the dam material, the organic light emitting element layer, and the counter substrate.
A step of installing an organic light emitting element layer on the element substrate,
A step of applying a coating solution containing a resin around the organic light emitting element layer on the element substrate to install an uncured dam material;
A step of installing a counter substrate on the uncured dam material facing the device substrate;
Forming a dam material by curing the uncured dam material;
A method of manufacturing an organic light emitting display device comprising the step of installing a sealing film on the outer wall surface of the dam material.
The method of claim 8,
The process of installing the encapsulation film includes a step of spraying a fine particle aerosol containing an oxide or nitride of a metal onto the outer wall surface.
The method of claim 8,
The process of installing the encapsulation film includes a method of laminating a nano sheet separated from a layered inorganic compound and an organic resin layer in nanometer units.

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