JP4920001B2 - Organic device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an organic device using organic electroluminescence (hereinafter sometimes referred to as organic EL), and more particularly, to an organic device with improved hermeticity and a method for manufacturing the same.

  As shown in FIG. 5, the organic EL element 50 has a first electrode layer (anode) 52, an organic layer 53, and a second electrode layer (cathode) 54 laminated on the surface of a transparent glass or transparent resin substrate 51. It has a basic configuration. Organic EL elements have features such as a high contrast ratio, a wide viewing angle, and a reduction in thickness, and are beginning to be applied to fields such as displays. In a display using an organic EL element, a light emitting portion is formed on a driving transistor circuit. Therefore, in the normal element structure, light emitted from the transistor portion is absorbed or scattered, and there is a problem that the extraction rate to the outside deteriorates. In order to solve this problem, a structure called a top emission structure in which a cathode, an organic layer, and an anode are laminated in this order on a glass substrate has been studied. The first electrode layer (anode) 52 is formed of a transparent conductive material typified by ITO (tin-added indium oxide). The organic layer 53 includes a plurality of layers such as a hole injection layer 53a, a hole transport layer 53b, a light emitting layer 53c, an electron transport material layer 53d, and an electron injection layer 53e. The second electrode layer (cathode) 54 is made of a metal material such as Mg: Al, Al, or Cu.

  Organic EL devices are being researched and developed by many research institutions, and their light emission characteristics (emission efficiency, maximum luminance, power consumption, etc.) have been dramatically improved. For example, many researches and developments have been conducted, such as phosphorescent materials having higher luminous efficiency than conventional fluorescent materials, cathode materials having a low work function, and optimization of electron and hole carrier balance. Further, as a manufacturing method capable of realizing cost reduction, not only a conventional vacuum deposition but also a vacuum removal process using screen printing, gravure printing, an ink jet method or the like has been studied.

  When the organic material constituting the organic EL element is exposed to the atmosphere, it rapidly reacts with oxygen, moisture, etc., and the characteristics of the element deteriorate. Therefore, as disclosed in Patent Documents 1 to 5, an organic EL element 60 to which a sealing structure in which glass substrates 61 and 65 as shown in FIG. 6 are bonded together and an organic layer is formed therebetween is applied. There is. Here, one glass substrate (sealing glass) 65 has a structure in which the inside is hollowed, and an organic EL element is arranged in this portion. In addition, the interface between the sealing glass 65 and the transparent substrate 61 is generally fixed by an adhesive layer 66 using an adhesive. Here, examples of the method of curing the adhesive include ultraviolet rays, heating, and two-component mixing. Any adhesive may be used as long as the sealing glass 65 and the transparent substrate 61 can be bonded.

  A method for manufacturing this conventional organic EL element is as shown in FIG. First, a transparent substrate 61 is prepared as shown in FIG. 7A, and a light emitting portion is formed on the transparent substrate 61 as shown in FIG. 7B. Generally, the first electrode layer (anode) 62 and the organic layer 63 (a hole injection layer 63a, a hole transport layer 63b, a light emission layer 63c, an electron transport layer 63d, and an electron injection layer 63e) are used to form the light emitting portion. The second electrode layer (cathode) 64 is formed in order. Here, there is no limitation on the manufacturing method for forming the organic layer 63 as long as a desired film thickness can be formed with good control. Next, as shown in FIG. 7C, an ultraviolet curable adhesive 66 is applied by a method such as dispenser or screen printing. Next, as shown in FIG. 7D, the sealing glass 65 is placed in accordance with the position where the ultraviolet curable adhesive 66 is applied. Finally, as shown in FIG. 7E, a conventional organic EL element can be obtained by irradiating the ultraviolet curable adhesive 66 with ultraviolet rays to adhere the transparent substrate 61 and the sealing glass 65.

However, in the EL element having such a structure, oxygen and moisture may enter from the adhesive layer 66 where the sealing glass 65 and the transparent substrate 61 are bonded. As the adhesive, an ultraviolet curing adhesive such as epoxy or acrylate is usually used, but these materials have oxygen permeability and moisture permeability higher by several orders of magnitude than inorganic materials such as glass. Therefore, there is a possibility that oxygen or moisture may enter from the adhesive layer 66 and damage the internal organic layer 63. Therefore, as a result, there is a possibility that the life characteristic of the organic EL element is deteriorated.
In addition, a certain solvent is usually used for the adhesive, and when this solvent cures the adhesive to form the adhesive layer 66, a region surrounded by the sealing glass 65 and the transparent substrate 61, In other words, there is a risk of being emitted to the region where the organic EL element is disposed. Therefore, the problem that the organic layer 63 is damaged by this solvent also arises.
Japanese Patent Laid-Open No. 11-40347 JP 2000-30857 A JP 2001-126868 A Japanese Patent Laid-Open No. 2003-187762 Japanese Patent Laid-Open No. 2005-11760

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an organic device that can improve hermeticity and has high reliability over a long period of time and a method for manufacturing the same.

The organic device according to claim 1 of the present invention includes a transparent substrate and a structure including a first electrode, an organic layer, and a second electrode that are locally stacked in order on one surface of the transparent substrate. An organic device comprising at least a sealing member composed of fine particles is disposed on one surface of the transparent substrate so as to cover the structure, and the fine particles constituting the sealing member are disposed on one surface of the transparent substrate. It is characterized by being inserted.
The organic device according to claim 2 of the present invention is characterized in that, in claim 1, the sealing member forms a film, and the film is made of fine crystals of 1 nm to 20 nm.
An organic device according to a third aspect of the present invention is the organic device according to the first or second aspect, wherein the film is a dielectric.
The organic device according to claim 4 of the present invention, in claim 3, wherein the dielectric is characterized in that an inorganic material mainly composed of SiO _2.
The organic device according to claim 5 of the present invention is characterized in that in any one of claims 1 to 4, the thickness of the film is 1 μm or more and 100 μm or less.
The organic device according to claim 6 of the present invention is characterized in that, in any one of claims 1 to 5, a buffer is disposed in at least a part between the structure and the coating film. .

  The manufacturing method of the organic device according to claim 7 of the present invention is a structure comprising a transparent substrate and a first electrode, an organic layer, and a second electrode which are locally laminated in order on one surface of the transparent substrate. And a sealing member made of fine particles is arranged on one surface of the transparent substrate so as to cover the structure, and the fine particles constituting the sealing member are embedded in one surface of the transparent substrate. A rare method of manufacturing an organic device, the step of locally laminating a first electrode, an organic layer, and a second electrode in order on one surface of a transparent substrate to form a structure, and fine particles constituting a sealing member The method includes at least a step of forming primary particles, and a step of spraying the fine particles converted to primary particles onto one surface of the transparent substrate on which the structure is formed to form a sealing member.

According to the organic device of the present invention, the sealing member is disposed in close contact with the structure and the transparent substrate, and the sealing member is configured on the surface where the sealing member is in contact with the transparent substrate. The fine particles to be sunk into one surface of the transparent substrate. Therefore, hermeticity and adhesion can be improved, and entry of oxygen, moisture, and the like can be reduced. Therefore, it is possible to improve the life characteristics of the structure. Further, in the past, a gap was disposed between the structure and the sealing member, but the organic device of the present invention is disposed in close contact with the sealing member, so the sealing member and the first electrode, There is no separation part between the second electrode and the issuing part. Therefore, the size can be reduced as compared with the conventional organic device.
In the production method of the present invention, fine particles forming a sealing structure are converted into primary particles and sprayed onto a transparent substrate to form a sealing member. Therefore, the fine particles irradiated on the transparent substrate at a high speed have a structure in which the substrate is slightly recessed. Therefore, the adhesion strength between the transparent substrate and the sealing member can be improved as compared with the conventional case where the adhesive is sealed with an adhesive. Furthermore, since no adhesive is required at the interface between the sealing member and the transparent substrate, conventionally, the organic EL element is damaged by the oxygen and moisture permeability of the adhesive and the solvent generated when the adhesive is cured. However, according to the manufacturing method of the present invention, such damage does not occur, and the yield can be improved and the life characteristics of the light emitting element can be improved.

  Hereinafter, the present invention will be described in detail with reference to the drawings. However, the present invention is not limited thereto, and various modifications can be made without departing from the gist of the present invention.

<First Embodiment>
FIG. 1 is a diagram schematically illustrating an organic device 10A (10) according to the first embodiment. FIG. 1A is a cross-sectional view of the organic device 10A, and FIG. It is sectional drawing to which (alpha) in a) was expanded.
An organic device 10A according to the present invention includes a transparent substrate 1, a structure 6 that is formed on a surface 1a of the transparent substrate 1 and includes a first electrode 2, an organic layer 3, and a second electrode 4 that are locally laminated in order. It is roughly composed. Further, the sealing member 5 composed of fine particles is arranged on one surface 1a of the transparent substrate 1 so as to cover the structure 6, and the fine particles constituting the sealing member 5 are embedded in the one surface 1a of the transparent substrate 1. ing. Hereinafter, each will be described in detail.

The transparent substrate 1 is preferably made of a material that has electrical insulation and has excellent transparency for emitting light emitted from the organic layer 3 to the outside, and has a light transmittance of, for example, 85% or more in visible light. is there.
As such a transparent substrate 1, a substrate made of glass or resin can be used. Examples of the transparent substrate 1 made of glass include silicate glass, borate glass, and phosphate glass. Examples of the transparent substrate 1 made of resin include polycarbonate, polyimide, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).
When a resin is used as the transparent substrate 1, since the resin substrate transmits moisture, a gas barrier layer (not shown) is provided between the transparent substrate 1 and the structure 6 so as to cover the entire surface 1 a of the transparent substrate 1. It is necessary to provide. In general, organic materials are weak against oxygen and water, so oxygen and water cause deterioration in light emission quality. Therefore, the reliability of the emission quality can be improved by providing the gas barrier layer. As such a gas barrier layer, oxides or nitrides such as SiO ₂ and Si ₃ N ₄ can be used. Further, the gas barrier layer is required to have a high transmittance of light emitted from the organic layer 3 to the outside, and the transmittance is desirably 85% or more.
Further, the surface where the transparent substrate 1 is in contact with the sealing member 5 is in a state where the fine particles constituting the sealing member 5 are indented.

  As the first electrode (anode) 2, the surface roughness is about several nanometers, and a single-layer transparent conductive film made of ITO, IZO (zinc-added indium oxide), FTO (fluorine-added tin), or the like having a low resistance, An FTO / ITO laminate excellent in heat resistance (ITO is the lower layer and FTO is the upper layer) is preferable.

  The organic layer 3 is formed by sequentially stacking a hole injection layer 3a, a hole transport layer 3b, a light emitting layer 3c, an electron transport layer 3d, and an electron injection layer 3e.

  The hole injection layer 3a is not particularly limited as long as it is usually used as a hole injection layer, and a known one can be used. For example, PEDOT / PSS (Germany / Bayer), PETDHK / It may be selected from materials such as TBHFA (Kemipro Kasei Co., Ltd.).

  The hole transport layer 3b is not particularly limited as long as it is usually used as a hole transport layer, and a known one can be used, for example, diphenylnaphthyldiamine (α-NPD) or triphenyldiamine derivative ( TPD), 1,3,5-tris [(diphenylamino) phenyl] benzene (TDAPB) and the like.

The light emitting layer 3c is not particularly limited as long as it is usually used as a light emitting layer, and known materials can be used. For example, non-π conjugated materials such as polyaluminum quinolite complex and polyvinyl carbazole, poly Π-conjugated polymers such as paraphenylene vinylene derivatives, polyfluorene derivatives, polythiophene derivatives, polyphenylene derivatives, and the like can be given.
Especially, the problem that the light emitting layer 3c melt | dissolves with the solvent in the solution apply | coated on it by selecting the material which can provide the three-dimensional crosslinked structure by heating or light can be prevented. This is desirable because it can be expected to increase the degree of freedom of the material. Specifically, a polyspiro polymer material or the like can be cited as a type that crosslinks with light. Examples of the type that crosslinks by heat include polyparaphenylene vinylene that is polymerized from an aqueous precursor solution.

  The electron transport layer 3d is not particularly limited as long as it is usually used as an electron transport layer, and a known one can be used, and examples thereof include organometallic complex derivatives such as aluminum quinolinol.

  The electron injection layer 3e is not particularly limited as long as it is normally used as an electron injection layer, and a known one can be used, and examples thereof include organometallic complex derivatives such as aluminum quinolinol.

  The second electrode (cathode) 4 is preferably made of a material capable of obtaining a high work function and high conductivity, and examples thereof include Mg: Al, Al, and Cu.

  The sealing member 5 covers the structure 6 including the first electrode 2, the organic layer 3, and the second electrode 4 with the transparent substrate 1. As shown in FIG. 1B, the sealing member 5 has a portion 5 b in which the fine particles constituting the sealing member 5 are recessed into the one surface 1 a of the transparent substrate 1. Thus, by having the site | part 5b, the adhesiveness of the sealing member 5 and the transparent substrate 1 can be improved.

Further, the sealing member 5 forms a film and is made of fine crystals of 1 nm or more and 20 nm or less.
The coating is preferably made of a dielectric. As such a dielectric, an inorganic material such as glass mainly composed of SiO ₂ having low permeability to oxygen and moisture is preferable.
Further, the thickness of the sealing member 5 is preferably 1 μm or more and 100 μm or less. Thereby, sufficient airtightness and adhesiveness can be provided.

Next, the manufacturing method of the organic device of this invention is demonstrated.
In the manufacturing method of the present invention, a film forming technique by collision of fine particles constituting the sealing member 5 is used. This film forming technique is called an aerosol deposition method as described in, for example, Japanese Patent Application Laid-Open No. 2004-47863. An advantage of this method is that an insulating film can be formed on various substrates even at a low temperature close to room temperature. That is, by using the aerosol deposition method, the sealing insulating film (sealing member 5) can be directly formed on the transparent substrate 1 on which the organic EL element (structure 6) is formed.

  FIG. 2 is a cross-sectional view schematically showing an example of a film forming apparatus used in this manufacturing method. The film forming apparatus used in the present invention includes an aerosol generator 40 that converts fine particles 5a constituting the sealing member 5 into primary particles, a film forming chamber 30 that forms the fine particles 5a on the substrate 1, and a pressure in the film forming chamber 30. It consists of a mechanical booster pump 36 and a rotary pump 37 that control the operation. Further, the aerosol generator 40 and the film forming chamber 30 are connected by a first pipe 34, and the fine particles 5 a converted into primary particles by the aerosol generator 40 are jetted into the film forming chamber 30.

In the aerosol generator 40, a mass flow controller 43 and a gas cylinder 44 are sequentially connected via a second pipe 45 to a container 41 in which the fine particles 5 a are converted into primary particles. The gas cylinder 44 is filled with a high-pressure carrier gas, and the flow rate of the carrier gas is controlled by the mass flow controller 43. By adjusting the flow rate of the carrier gas by the mass flow controller 43, the amount of particles 5a generated in the container 41 containing the particles 5a and the amount of primary particles ejected in the film forming chamber 30 are controlled. be able to.
Here, as the carrier gas, in addition to argon, an inert gas such as helium, neon, or nitrogen can be used. In the case where oxide ceramics having a perovskite structure is used as the fine particle raw material, an oxidizing gas such as oxygen or air may be used as the carrier gas.

  Further, the aerosol generator 40 is provided with a vibrator 42 adjacent to the container 41 for primary particles of the fine particles 5a by ultrasonic vibration, electromagnetic vibration, or mechanical vibration. A fine and uniform thin film can be formed on the transparent substrate 1 by making the fine particles 5 a into primary particles by the aerosol generator 40.

  In the film forming chamber 30, a nozzle 35 connected from the aerosol generator 40 via a pipe 34, and a substrate holder 31 that holds the transparent substrate 1 on which the structural body 6 is disposed and is provided facing the nozzle 35. Is arranged. Further, an XYZ stage (not shown) for controlling the position of the transparent substrate 1 is connected to the substrate holding base 31 via the drive unit 32. Further, a mechanical booster pump 36 and a rotary pump 37 are connected to reduce the pressure in the film forming chamber 31 to a low pressure.

  As a manufacturing method of the sealing member using this film forming apparatus, first, the aerosol generator 40 (container 41) is filled with fine particles 5a which are materials for forming the sealing member 5. Then, when supplying, for example, argon gas as a carrier gas from the gas cylinder 44 to the film forming chamber 30, the container 41 is vibrated by the vibrator 42 to aerosolize the fine particles 5a (primary particles). Thereafter, the aerosolized microparticles 5a are jetted together with the carrier gas, become a jet stream, and the microparticles 5a are deposited on the transparent substrate 1 on which the structure 6 is formed, whereby the sealing member 5 is formed.

Hereinafter, the manufacturing method of the organic device of this invention is demonstrated in detail.
First, as shown in FIG. 3 (a), a transparent substrate 1 is prepared, and as shown in FIG. 3 (b), the first electrode layer 2, the organic layer 3 and the first layer 1a are locally formed on one surface 1a of the transparent substrate 1. A structure 6 composed of the two electrode layers 4 is formed. Regarding the formation of the structure 6, the first electrode layer (anode) 2, the organic layer 3 (the hole injection layer 3a, the hole transport layer 3b, the light emitting layer 3c, the electron transport material layer 3d, the electron injection layer 3e), the first Two electrode layers (cathodes) 4 are sequentially formed. Here, the film formation of the structure 6 is not particularly limited as long as a desired film thickness can be formed with good control.

Next, the transparent substrate 1 on which the structure 6 is formed is installed on the substrate holding base 31 shown in FIG. 2, and the nozzle 35 is used from a position facing the structure 6 as shown in FIG. The fine particles 5a constituting the sealing member 5 are ejected.
As the fine particles 5a, it is preferable to use an inorganic material mainly composed of SiO ₂ having advantages such as easy formation of a thin film, low material cost, and low permeability of oxygen and moisture.
If the diameter of the fine particles 5 a is larger than 10 μm, the kinetic energy when the fine particles are ejected increases, and the transparent substrate 1 is etched when it collides with the transparent substrate 1. May not be formed. On the other hand, when the diameter of the fine particles 5a is smaller than 1 nm, the energy for forming the sealing member 5 is insufficient when the kinetic energy is too small to collide with the transparent substrate 1, and the sealing member 5 is not formed. Therefore, the diameter of the fine particles 5a is preferably 1 nm or more and 10 μm or less.
Furthermore, it is preferable that the fine particles 5a be primary particles before being jetted. By forming the fine particles 5 a into primary particles, a dense and uniform sealing member 5 can be formed on the transparent substrate 1.

  A film is formed by the impact of the fine particles 5a ejected in FIG. 3 (c) colliding with the transparent substrate 1, and this film is used as the sealing member 5 to use the organic material of the present invention as shown in FIG. 3 (d). Device 10 is obtained.

  According to the manufacturing method of the present invention, since the ultraviolet curable adhesive layer having a high oxygen and moisture permeability is not used, the structure 6 is hardly exposed to oxygen and moisture. Further, there is no gas generated when the ultraviolet curable adhesive is irradiated with ultraviolet rays, and the light emitting portion can be prevented from being damaged by the gas. Furthermore, since the risk of the structure 6 being irradiated with ultraviolet rays is reduced, damage to the organic layer 3 due to the ultraviolet rays can be prevented.

FIG. 4 is a cross-sectional view schematically showing an organic device 10B (10) according to the second embodiment of the present invention.
The organic device 10B of this embodiment is different from the organic device 10A of the first embodiment in that a buffer 7 is disposed between the structure 6 and the sealing member 5.

The buffer 7 is not particularly limited as long as it is not electrically connected to the second electrode 4 of the structure 6 and is an insulating material. Examples of such a buffer 7 include resins such as polyimide, delrin, bakelite, epoxy, silicon, and ABS. Further, the thickness of the buffer 7 is, for example, 1 μm to 100 μm.
When the sealing member 5 is formed by collision of the fine particles 5a, the fine particles 5a are beaten on the transparent substrate 1 at a very high speed of several hundreds m / s. For this reason, in a soft material such as the organic layer 3, there is a possibility that the fine particles 5 a may enter the inside due to the collision of the fine particles 5 a and deteriorate the characteristics of the organic EL element. By arranging the buffer 7 between the structure 6 and the sealing member 5 as in the present embodiment, it is possible to reduce the collision of the fine particles 5a with the structure 6.

<Production of organic EL element>
First, residual components such as an organic layer on the surface were removed by performing oxygen plasma treatment on a glass substrate that had been subjected to ultrasonic cleaning using various organic solvents and pure water. Next, after forming an ITO film with a thickness of 150 nm using a sputtering apparatus, an organic layer and a cathode were formed using a resistance wire heating vapor deposition machine. Here, 40 nm of 4,4′bis [N- (1-napthyl) -N-phenyl-amino] -biphenyl (α-NPD) and 60 nm of tris (8-hydroxyquinoline) aluminum) (Alq ₃ ) on ITO. Then, an organic EL element was fabricated by depositing LiF in a thickness of 0.5 nm and Al in a thickness of 150 nm.

<Example>
The organic EL element produced as described above was moved into a film forming apparatus using collision of fine particles as shown in FIG. 2 to form a film as a sealing member.
First, SiO ₂ fine particles having an average particle diameter of 1 μm were placed in an aerosol generator. Dry air was used as a carrier gas, and SiO ₂ fine particles were supplied to the container at a pressure of 5 Mpa. Here, the container was mechanically vibrated at a frequency of 1 Hz to make the particles primary particles.
Next, aerosolized fine particles were sprayed from the front of the organic EL element to form a SiO ₂ thin film. Here, the glass substrate on which the organic EL element was formed was scanned with an XYZ stage to form a thin film so as to cover the entire light emitting portion, and this was taken as an example.

<Comparative example>
The organic EL element produced above was sealed using a sealing glass usually used. Here, an ultraviolet curable adhesive was used for fixing between the sealing glass and the transparent substrate, and cured by irradiating with 10 mW / cm ² of ultraviolet rays. Furthermore, by scanning the transparent substrate, the entire periphery of the light emitting portion was fixed with an ultraviolet curing adhesive, and this was used as a comparative example.

A current of 0.1 mA was applied to each of the organic EL elements of the example and the comparative example, and the change with time in luminance was evaluated in a state where the light was continuously lit. Here, the drive voltage was 5 V and the initial luminance was 600 cd / m 2.
The organic EL element of the comparative example manufactured using the conventional sealing method has a luminance half-life of 1100 hours, whereas the organic EL element of the example of the present invention has a luminance half-life of 2000 hours. there were. From this result, it was shown that the lifetime characteristic of an organic EL element improves by using the organic device of this invention.

  The present invention can be applied to an organic EL element, and the life characteristics of the organic EL element can be improved.

It is sectional drawing which showed typically the organic device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed typically the aerosol generator used for manufacture of the organic device of this invention. It is sectional process drawing which showed typically the manufacturing method of the organic device which concerns on 1st Embodiment of this invention. It is sectional drawing which showed typically the organic device which concerns on 2nd Embodiment of this invention. It is sectional drawing which showed the organic EL element typically. It is sectional drawing which showed the conventional organic device typically. It is sectional process drawing which showed the manufacturing process of the conventional organic device typically.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Transparent substrate, 2 1st electrode, 3 Light emitting layer, 3a Hole injection layer, 3b Hole transport layer, 3c Light emitting layer, 3d Electron transport layer, 3e Electron injection layer, 4 2nd electrode, 5 Sealing member, 5a Fine particle, 6 structure, 7 buffer, 30 deposition chamber, 31 substrate holder, 34 first piping, 35 nozzle, 36 mechanical booster pump, 37 rotary pump, 40 aerosol generator, 41 container, 42 vibrator, 43 mass flow Controller, 44 Gas cylinder, 45 Second piping.

Claims (7)

An organic device comprising at least a transparent substrate and a structure composed of a first electrode, an organic layer, and a second electrode locally laminated in order on one surface of the transparent substrate,
A sealing member composed of fine particles is disposed on one surface of the transparent substrate so as to cover the structure, and the fine particles constituting the sealing member are embedded in one surface of the transparent substrate. And organic devices.   The organic device according to claim 1, wherein the sealing member forms a film, and the film is made of microcrystals having a thickness of 1 nm to 20 nm.   The organic device according to claim 1, wherein the coating is a dielectric. The organic device according to claim 3, wherein the dielectric is an inorganic material mainly composed of SiO ₂ .   The organic device according to claim 1, wherein the film has a thickness of 1 μm to 100 μm.   The organic device according to claim 1, wherein a buffer is disposed at least at a part between the structure and the film. A sealing member comprising at least a transparent substrate and a structure composed of a first electrode, an organic layer, and a second electrode locally laminated in order on one surface of the transparent substrate, the sealing member including fine particles, It is disposed on one surface of the transparent substrate so as to cover the structure, and is a method for producing an organic device in which fine particles constituting the sealing member are embedded in one surface of the transparent substrate,
A step of forming a structure by locally laminating a first electrode, an organic layer, and a second electrode in order on one surface of a transparent substrate;
A step of making the fine particles constituting the sealing member into primary particles,
And a method of producing an organic device comprising at least a step of injecting the fine particles formed into primary particles onto one surface of the transparent substrate on which the structure is formed to form a sealing member.

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