JP7297417B2 - Organic light-emitting display device and method for manufacturing organic light-emitting display device - Google Patents

Description

The present invention relates to an organic light-emitting display device and a method for manufacturing an organic light-emitting display device.

An organic light emitting display (OLED) can be driven at a low voltage, is thin, has an excellent viewing angle, and has a fast response speed.

On the other hand, in the organic light-emitting display device, the organic light-emitting element (organic light-emitting diode) deteriorates due to the influence of oxygen and moisture, resulting in a decrease in light-emitting performance. Therefore, techniques for suppressing permeation of oxygen and moisture to the organic light-emitting display device are being developed.

For example, Patent Document 1 discloses an organic light-emitting display device in which permeation of oxygen and moisture is suppressed by sealing the periphery of an organic light-emitting element with a dam material (sealing wall) provided between an element substrate and a counter substrate. is disclosed.

JP 2015-076195 A

In the organic light-emitting display device described in Patent Document 1, the dam material is made of resin, so the width (thickness in the plane direction) of the dam material is increased in order to obtain sufficient shielding properties against oxygen and moisture. is required. On the other hand, in organic light-emitting display devices, from the viewpoint of reducing the non-display area, improving design, miniaturization and weight reduction, it is preferable that the width of the dam material is narrow, and there is a strong desire to narrow the bezel (narrow frame). It has been demanded.
Therefore, there is a trade-off relationship between excellent shielding properties against oxygen and moisture and a narrow bezel, and it is required to achieve these at a high level.

SUMMARY OF THE INVENTION In view of the above-described problems in the prior art, it is an object of the present invention to provide an organic light-emitting display device that has excellent shielding properties against oxygen and moisture and achieves a narrow bezel, and a method for manufacturing the organic light-emitting display device. aim.

According to one aspect of the present invention, an element substrate, an organic light-emitting element layer provided on the element substrate, a dam material provided on the element substrate around the organic light-emitting element layer, and the element substrate and a sealing film provided on an outer wall surface of the dam member.

According to another aspect of the present invention, a step of providing an organic light-emitting element layer on an element substrate; providing a counter substrate on the uncured dam material facing the element substrate; curing the uncured dam material to form a dam material; and an outer wall surface of the dam material. and providing a sealing film in the organic light-emitting display device.

According to the present invention, an organic light-emitting display device having excellent shielding properties against oxygen and moisture and achieving a narrow bezel and a method for manufacturing the organic light-emitting display device are provided.

1 is a perspective view showing an organic light-emitting display device according to a first embodiment of the present invention; FIG. 1 is a block diagram showing an organic light-emitting display device according to a first embodiment of the invention; FIG. 1 is a cross-sectional view showing an organic light-emitting display device according to a first embodiment of the present invention; FIG. 4 is a flow chart showing a method for manufacturing an organic light-emitting display device according to the first embodiment of the present invention; FIG. 4 is a diagram illustrating a method for manufacturing the organic light-emitting display device according to the first embodiment of the present invention; FIG. 4 is a cross-sectional view showing an organic light emitting display device according to a second embodiment of the present invention; FIG. 5 is an enlarged cross-sectional view of a main part for explaining a shielding structure of an organic light-emitting display device according to a second embodiment of the invention; 6 is a flow chart showing a method of manufacturing an organic light emitting display device according to a second embodiment of the present invention; 8A to 8C are diagrams illustrating a method for manufacturing an organic light-emitting display device according to a second embodiment of the present invention; FIG. FIG. 3 is a cross-sectional view showing an organic light-emitting display device according to a modified embodiment of the present invention; FIG. 3 is a cross-sectional view showing an organic light-emitting display device according to a modified embodiment of the present invention;

[First embodiment]
FIG. 1 is a perspective view showing an organic light-emitting display device 100 according to this embodiment. FIG. 2 is a block diagram showing the organic light-emitting display device 100 according to this embodiment. In addition, in this embodiment, each drawing is a schematic diagram for description, and is not dimensional. In particular, many repetitive elements are shown in greatly reduced numbers for clarity of illustration.

As shown in FIGS. 1 and 2, the organic light emitting diode display 100 according to the present embodiment includes a display panel 110, a scan driver 120, a data driver 130, a timing controller 160, and a host system 170. FIG.

As shown in FIG. 1, the display panel 110 includes an element substrate 111 and a counter substrate 112, which are a pair of opposing substrates. A sealing film 113 is provided on a wall surface (outer wall surface) of the display panel 110 in the outer peripheral direction. In the following description, the directions of the two sides defining the display surface of the display panel 110 are referred to as the X direction and the Y direction, respectively, and the direction perpendicular to the display surface (that is, the direction perpendicular to the XY plane) is the Z direction. called direction. Moreover, in the present embodiment, the expressions "above" and "below" do not limit the positional relationship in actual use.

As shown in FIG. 2, the display panel 110 includes a display area in which pixels P are provided and an image is displayed. Data lines (D1 to Dm, m is a positive integer of 2 or more) and scan lines (S1 to Sn, n is a positive integer of 2 or more) are formed on the display panel 110 . The data lines (D1-Dm) are formed to cross the scan lines (S1-Sn). Pixels P are formed in regions defined by crossing structures of gate lines and data lines.

Each of the pixels P of the display panel 110 can be connected to one of the data lines (D1-Dm) and one of the scan lines (S1-Sn). Each of the pixels P of the display panel 110 is turned on by a driving transistor that adjusts the current between the drain and the source according to the data voltage applied to the gate electrode, the scan signal of the scan line, and the data voltage of the data line. to the gate electrode of the drive transistor, an organic light emitting diode that emits light in accordance with the drain-source current of the drive transistor, and a capacitor for storing the voltage of the gate electrode of the drive transistor. (Capacitor). Thereby, each of the pixels P can emit light according to the current supplied to the organic light emitting diode.

The scan driver 120 receives a scan control signal (GCS) from the timing controller 160 . The scan driver 120 supplies scan signals to the scan lines (S1 to Sn) based on the scan control signal (GCS).

The scan driver 120 may be formed in a non-display area on one side or both sides of the display area of the display panel 110 using a gate driver in panel (GIP) method. Alternatively, the scan driver 120 is made of a driving chip, mounted using a flexible film 140, and attached to a non-display area on one side or both sides of the display area of the display panel 110 by a TAB (Tape Automated Bonding) method. It can also be attached.

The data driver 130 receives digital video data (DATA) and a data control signal (DCS) from the timing controller 160 . The data driver 130 converts the digital video data (DATA) into analog positive/negative data voltages based on the data control signal (DCS) and supplies the analog positive/negative data voltages to the data lines. That is, the pixel P to which the data voltage is supplied is selected according to the scan signal of the scan driver 120, and the selected pixel P is supplied with the data voltage.

The data driver 130 may include a plurality of source driver ICs 131, as shown in FIG. Each of the plurality of source drive ICs 131 may be mounted on the flexible film 140 in a COF (Chip On Film) or COP (Chip On Plastic) method. The flexible film 140 is attached on pads provided in the non-display area of the display panel 110 using an anisotropic conducting film. Thereby, a plurality of source driver ICs 131 can be connected to the pads.

A circuit board 150 can be attached to the flexible film 140 . Circuit board 150 may be mounted with a number of circuits mounted on a driver chip. For example, the timing controller 160 may be mounted on the circuit board 150 . Circuit board 150 may be a printed circuit board or a flexible printed circuit board.

Timing controller 160 receives digital video data (DATA) from host system 170 and timing signals. The timing signals may include vertical synchronization signals, horizontal synchronization signals, data enable signals, dot clocks, and the like. A vertical sync signal is a signal that defines one frame period. A horizontal synchronizing signal is a signal that defines one horizontal period required to supply a data voltage to pixels P in one horizontal line of the display panel 110 . A data enable signal is a signal that defines a period in which valid data is input. A dot clock is a signal that repeats at a predetermined short period.

The timing controller 160 controls the operation timing of the scan driver 120 and the data driver 130 based on the timing signal, a data control signal (DCS) for controlling the operation timing of the data driver 130; A scan control signal (GCS) for controlling the operation timing of the scan driver 120 is generated. The timing controller 160 outputs a scan control signal (GCS) to the scan driver 120 and outputs digital video data (DATA) and a data control signal (DCS) to the data driver 130 .

Host system 170 may be implemented in a navigation system, set-top box, DVD player, Blu-ray player, personal computer (PC), home theater system, broadcast receiver, phone system, and the like. The host system 170 converts digital video data (DATA) of an input image including an SoC (System on chip) with a built-in scaler into a format suitable for display on the display panel 110 . Host system 170 transmits digital video data (DATA) and timing signals to timing controller 160 .

FIG. 3 is a cross-sectional view showing the organic light-emitting display device 100 according to this embodiment. Although FIG. 3 is a cross-sectional view of the display panel 110 shown in FIG. 1 taken along the XZ plane, for convenience of explanation, the dimensions and proportions of each member are different from those in FIG. Further, although the top emission type organic light emitting display device 100 will be described below as an example, the organic light emitting display device of the present invention is not limited to the top emission type, and may be a bottom emission type organic light emitting display device. There may be.

As shown in FIG. 3, the organic light-emitting display device 100 according to this embodiment includes an element substrate 111, a counter substrate 112, a sealing film 113, an organic light-emitting element layer 114, a passivation layer 115, and a dam material 116. , and a filler 117 .
ing.

The element substrate 111 is, for example, a glass substrate. Note that the element substrate 111 is not limited to a glass substrate, and substrates made of various materials can be used. A barrier layer (not shown) is formed on the element substrate 111 . The material of the barrier layer is not particularly limited as long as it has a shielding property against oxygen and moisture, and examples thereof include silicon oxide, silicon nitride, and alumina. Also, the barrier layer may be a single layer, or may have a laminated structure of two or more layers. Furthermore, a TFT layer (not shown) including a thin film transistor (TFT) constituting a driving circuit for driving the organic light emitting element layer 114 is formed on the barrier layer.

The counter substrate 112 is, for example, a glass substrate. A top-emission type display device can be configured by positioning the transparent counter substrate 112 in the light emitting direction of the organic light emitting element layer 114 . The opposing substrate 112 is adhered and fixed onto the dam material 116 and the filler material 117 .

The sealing film 113 is provided on the outer wall surface of the dam material 116 . In this embodiment, as shown in FIG. 1, the sealing film 113 is continuously provided on three outer wall surfaces of the display panel 110 perpendicular to the XY plane in the drawing. The sealing film 113 is formed continuously across the outer wall surfaces of the element substrate 111 , the dam member 116 and the opposing substrate 112 in the thickness direction (Z direction) of the display panel 110 . The sealing film 113 is a deposited film containing at least one of a metal oxide and a metal nitride, and is formed by an aerosol deposition method (AD method), which is one of known film forming methods. be done.

In the aerosol deposition method, a fine particle aerosol of brittle materials such as metal oxides and metal nitrides is sprayed from a nozzle toward the surface of the target object at high speed. This is a method of forming a polycrystalline structure of a brittle material on the surface of an object using impact force. According to the aerosol deposition method, it is possible to obtain a dense structure having both mechanical strength equivalent to that of a sintered body and high shielding against oxygen and moisture under non-wet and non-heated conditions.

A high moisture shielding property (high water vapor barrier property) is generally represented by a water vapor transmission rate (WVTR). As the unit of water vapor transmission rate, the amount of water vapor converted per unit time (1 day) and per unit area (1 m ² ) is generally used. In particular, applications for organic electronic substrates require extremely low permeability of 10 ⁻⁵ to 10 ⁻⁶ g/m ² /day, and the sealing film 113 of the present embodiment also satisfies this standard.

Alumina, zirconia (zirconium dioxide), titania (titanium oxide), or the like is used as the material of the sealing film 113 . Moreover, it is preferable that the sealing film 113 has transparency. The thickness of the sealing film 113 is preferably 100 nm to 100 um.

The organic light emitting element layer 114 is provided on the TFT layer described above. The organic light emitting element layer 114 includes organic light emitting elements (not shown) and banks (not shown). An organic light-emitting element has an anode (anode), an organic compound layer (organic light-emitting layer) formed on the anode, and a cathode (cathode) formed on the organic compound layer. Also, the organic compound layer has, in order from the anode side, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. Each layer constituting the organic light-emitting element layer 114 can be formed using known materials.

As the anode, for example, a reflective electrode made of a thin film of a highly reflective material such as aluminum, silver, platinum, or chromium, and a transparent material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) is deposited on these thin films. A reflective electrode in which a thin film of a conductive oxide is formed can be used.

The organic compound layers include, for example, an R organic compound layer that emits red light, a G organic compound layer that emits green light, and a B organic compound layer that emits blue light, depending on the sub-pixels constituting the pixel. layer and The organic compound layers for R, G, and B are composed of known materials corresponding to respective emission colors.

As the cathode, for example, a translucent or transparent electrode made of a thin film of silver, silver alloy, ITO, IZO or the like is used.

The bank is formed so as to partition the pixel P, for example, so as to cover the end of the anode. That is, the bank serves as a pixel definition film that defines the pixel P. FIG. As the bank, for example, an organic film such as acrylic resin or epoxy resin is used.

The passivation layer 115 is provided on the upper and side surfaces of the organic light emitting element layer 114 so as to cover the organic light emitting element layer 114 . The passivation layer 115 is made of an inorganic film with low moisture permeability and functions as a protective film that protects the organic light emitting element layer 114 from oxygen and moisture. As the passivation layer 115, for example, a silicon oxide film, a silicon nitride film, or the like is used.

The dam material 116 is provided around the plurality of organic light-emitting element layers 114 formed in a matrix on the element substrate 111 . The dam member 116 is made of transparent resin such as thermosetting resin or photo-setting resin. As a material of the dam member 116, for example, epoxy resin, acrylic resin, or the like is used.

A counter substrate 112 is provided on the dam material 116 so as to face the element substrate 111 . The dam material 116 is provided between the element substrate 111 (barrier layer) and the counter substrate 112, and functions as an adhesive member between the pair of substrates by curing with heat or light. The material of each member is selected so that the transmittance of light passing through the layered region of the element substrate 111, the dam member 116, and the counter substrate 112 in the thickness direction of the manufactured display panel 110 is 80% or more. It is preferable to have

Filling material 117 fills a spatial region surrounded by passivation layer 115 , dam material 116 and opposing substrate 112 . Like the dam material 116, the filler 117 is made of a transparent resin such as a thermosetting resin or a photocurable resin. The filling material 117, like the dam material 116, also functions as an adhesive member for a pair of substrates by curing with heat or light. It is preferable that the dam material 116 and the filler material 117 have a refractive index of 0.5 to 0.55. The difference in refractive index between the upper and lower substrates (the element substrate 111 and the counter substrate 112) and the dam member 116 is preferably 0.1 or less.

Next, a method for manufacturing the organic light-emitting display device 100 according to this embodiment will be described with reference to FIGS. 4 and 5. FIG. FIG. 4 is a flow chart showing a method for manufacturing the organic light emitting display device 100 according to this embodiment. 5A and 5B are diagrams illustrating a method for manufacturing the organic light-emitting display device 100 according to this embodiment.

First, as shown in FIG. 5A, the organic light-emitting element layer 114 is formed on the upper surface of the element substrate 111 (step S11).

Next, as shown in FIG. 5B, a passivation layer 115 is formed on the upper and side surfaces of the organic light emitting element layer 114 to cover the organic light emitting element layer 114 (step S12).

Next, as shown in FIG. 5C, a dam material 116, which is an uncured resin, is applied around the organic light emitting element layer 114 and the passivation layer 115 on the element substrate 111 in preparation for the injection of the filler 117, which will be described later. (step S13).

Next, the dam material 116 is temporarily cured by irradiating the dam material 116 with ultraviolet light for a predetermined time (step S14).

Next, as shown in FIG. 5D, a filling material 117 is injected into the space surrounded by the element substrate 111, the passivation layer 115 and the dam material 116 (step S15).

Next, as shown in FIG. 5E, the opposing substrate 112 is attached on the dam material 116 and the filling material 117 so as to face the element substrate 111 (step S16).

Next, as shown in FIG. 5(F), after the intermediate body of the display panel 110 (see FIG. 5(E)) is carried into the chamber C1 at normal temperature, which is depressurized to about 100 Pa, the intermediate body A sealing film 113 is formed on the outer wall surfaces of the dam material 116, the element substrate 111, and the counter substrate 112 by spraying the fine particle aerosol AS from the nozzle N1 on the outer wall surfaces based on the AD method (step S17).

Then, the filler 117 and the dam material 116 are removed by continuously heat-treating the intermediate for a predetermined period of time in the chamber C1 whose internal temperature is raised to, for example, 100° C., or by irradiating the intermediate with ultraviolet rays for 30 minutes. Final curing is performed (step S18). Curing conditions are appropriately selected according to the material of the filler 117 and the dam material 116 . Thus, the manufacturing process of the display panel 110 of the organic light emitting display device 100 is completed.

As described above, according to the organic light-emitting display device 100 of the present embodiment, excellent shielding properties against oxygen and moisture are achieved, and a narrow bezel is achieved.

More specifically, the width of the dam material 116 is significantly reduced compared to the conventional device because of the structure in which the shielding property (high water vapor barrier property) is ensured only by the sealing film 113 formed with an extremely thin thickness (100 nm to 100 um). can be made narrower. In addition, since the dam material 116 of the conventional device contains a getter material having a moisture absorption function, the edge of the display panel 110 becomes cloudy, causing an increase in the non-display area. In contrast, in the organic light-emitting display device 100 according to the present embodiment, the dam material 116 does not need to contain a getter material inside the dam material 116 due to the shielding properties of the sealing film 113. Therefore, the dam material 116 is formed only from a transparent resin. As a result, expansion of the transparent display area (narrow bezel) can be achieved.

In addition, since the dam member 116 is made of resin only, the adhesive force between the dam member 116 and the element substrate 111 and the opposing substrate 112 can be improved compared to the case where the dam member 116 includes a getter material. There are also advantages.

In addition, the AD method has the following advantages over the CVD (Chemical Vapor Deposition) method in which film formation is performed while a substrate is rotated at high speed in a chamber at a high temperature (for example, 250° C.).
(A) Since the sealing film 113 can be vapor-deposited on the outer wall surface (side surface) of the substrate under a room temperature environment, the cost required for the film formation process can be suppressed.
(B) Unlike the CVD method that forms a film on the entire surface of the substrate, it is possible to form the sealing film 113 only on a desired portion.

Furthermore, there is an advantage that the thickness of the dam material 116 can be made thinner due to the structure in which the shielding property (high water vapor barrier property) is ensured only by the sealing film 113 . As a result, the thickness of the display panel 110 as a whole is reduced, so that there is an advantage that the flexibility of the display panel 110 can be improved.

[Second embodiment]
Next, the organic light-emitting display device 200 according to the present embodiment will be described with reference to FIGS. 6 to 9. FIG. Reference numerals common to the reference numerals given in the drawings of the first embodiment indicate the same objects. In the following, descriptions of parts common to the first embodiment will be omitted, and descriptions will focus on configurations and operations that differ from the first embodiment.

FIG. 6 is a cross-sectional view showing the organic light-emitting display device 200 according to this embodiment. The sealing film 118 in this embodiment differs from the first embodiment in that it is a nanosheet composite film in which nanosheets 118a separated from a layered inorganic compound and organic resin layers 118b are alternately laminated in units of nanometers. there is The material of the nanosheet 118a is, for example, montmorillonite, bentonite, hectorite, octosilicate, or the like. Further, it is preferable that the sealing film 118 has an aspect ratio of 300:1 or more and an oil content of 30 wt % or more. The thickness of the sealing film 118 is preferably 100 nm to 100 um.

FIG. 7 is an enlarged cross-sectional view of a main part for explaining the shielding structure of the organic light-emitting display device 200 according to this embodiment. As shown in FIG. 7, the nanosheets 118a are dispersed inside the sealing film 118, and the surface direction of the nanosheets 118a is provided so as to be substantially parallel to the surface direction of the sealing film 118 (the Z direction in the figure). It is Also, the dashed arrows in the drawing indicate the traveling direction of water (H ₂ O) that has entered the organic resin layer 118b. FIG. 7 shows that oxygen and moisture cannot take the shortest path inside the sealing film 118 and cannot reach the dam material 116 unless they follow a complicated and very long path that deviates greatly from the shortest path. there is That is, since the sealing film 118 is formed by laminating the nanosheet 118a and the organic resin layer 118b in units of nanometers in the X direction or the Y direction, it means that the sealing film 118 has a high shielding property.

Next, a method for manufacturing the organic light-emitting display device 200 according to this embodiment will be described with reference to FIGS. 8 and 9. FIG. FIG. 8 is a flowchart showing a method for manufacturing the organic light emitting display device 200 according to this embodiment. 9A and 9B are diagrams illustrating a method for manufacturing the organic light-emitting display device 200 according to this embodiment.

First, as shown in FIG. 9A, the organic light-emitting element layer 114 is formed on the upper surface of the element substrate 111 (step S21).

Next, as shown in FIG. 9B, a passivation layer 115 is formed on the top and side surfaces of the organic light emitting element layer 114 to cover the organic light emitting element layer 114 (step S22).

Next, as shown in FIG. 9C, a dam material 116, which is an uncured resin, is applied around the organic light emitting element layer 114 and the passivation layer 115 on the element substrate 111 (step S23).

Next, the dam material 116 is temporarily cured by irradiating the dam material 116 with ultraviolet light for a predetermined time (step S24).

Next, as shown in FIG. 9D, filling material 117 is injected into the space surrounded by element substrate 111, passivation layer 115 and dam material 116 (step S25).

Next, as shown in FIG. 9E, the opposing substrate 112 is attached on the dam material 116 and the filling material 117 so as to face the element substrate 111 (step S26).

Next, as shown in FIG. 9(F), after the intermediate body of the display panel 110 (see FIG. 9(E)) was carried into the chamber C2, it was adjusted for forming the sealing film 118 from the nozzle N2. The coating liquid is repeatedly applied to each outer wall surface of the dam material 116, the element substrate 111, and the counter substrate 112 in the intermediate body (step S27). At this time, the temperature in the chamber C2 may be room temperature. The coating liquid is preferably prepared by exfoliating and dispersing nanosheets 118a having an aspect ratio of about 1000:1 in a solvent and a resin.

Then, the temperature in the chamber C2 is raised to, for example, 100° C., and the intermediate body of the display panel 110 is irradiated with ultraviolet rays for 30 minutes to fully cure the filling material 117, the dam material 116 and the sealing film 118 (step S28). . Thus, the manufacturing process of the display panel 110 of the organic light emitting display device 200 is completed.

As described above, according to the organic light-emitting display device 200 of the present embodiment, it has excellent shielding properties against oxygen and moisture and achieves a narrow bezel. This provides the same effects as the first embodiment described above.

Furthermore, unlike the first embodiment described above, after the coating liquid containing the nanosheets 118a is applied to the outer wall surface, the coating liquid is dried under a predetermined temperature condition while irradiating ultraviolet rays in the chamber C2. Since the sealing film 118 can be easily formed with only one step, there is an advantage that the film can be formed in a more limited range than in the case of the first embodiment.

[Modified embodiment]
Although preferred embodiments of the present invention have been described above, the present invention can be modified in various ways, for example, as shown below.

FIG. 10 is a cross-sectional view showing an OLED display 300 according to a modified embodiment. Here, a hybrid film 119 made of an organic resin and an inorganic resin is formed on the outer wall surface of the dam material 116, and the sealing film 113 is vapor-deposited on the hybrid film 119. As shown in FIG. The hybrid film 119 is, for example, a silane-modified epoxy resin, a POSS (polyhedral oligomeric silsesquioxane) hybrid film, or the like. In this way, when the hybrid film 119 is provided as an intermediate layer on the outer wall surfaces (side surfaces) of the element substrate 111, the dam material 15, and the counter substrate 112, the sealing film 113 deposited by the AD method and the outer wall surface are separated from each other. , and the strength of the sealing film 113 can be increased.

Further, in the first and second embodiments described above, for convenience of explanation, the case where the outer wall surfaces of the element substrate 111, the dam member 116 and the opposing substrate 112 are aligned in the Z direction has been explained. However, the deposition film and nanosheet composite film based on the AD method can be formed on desired portions of the display panel 110 . Therefore, even when a stepped portion is provided at the boundary between the element substrate 111, the dam member 116, and the opposing substrate 112, the sealing films 113 and 118 can be formed on the respective outer wall surfaces in the same manner as in the above-described embodiment. For example, when the outer wall surfaces of the element substrate 111 and the counter substrate 112 protrude outside the outer wall surface of the dam member 116, at least the outer wall surface of the dam member 116, the boundary region between the dam member 116 and the element substrate 111, the dam member By providing the sealing films 113 and 118 in the boundary region between 116 and the opposing substrate 112, it is possible to suppress the intrusion of oxygen and moisture from directions (X direction and Y direction) perpendicular to the outer wall surface.

In addition, the shielding structure described in the above-described first and second embodiments is not limited to organic light-emitting display devices, and can be applied to other display devices such as liquid crystal display devices and plasma display devices, lighting devices, and the like. . The use of the lighting device is not particularly limited, and for example, it may be used as indoor lighting or outdoor lighting, or may be used as electronic device lighting such as the backlight of a liquid crystal display device.

In addition, in the first and second embodiments described above, the organic light-emitting element layer 114 includes an R organic compound layer that emits red light, a G organic compound layer that emits green light, and a G organic compound layer that emits blue light. Although the configuration including the organic compound layer for B has been exemplified, the display method is not limited to this. For example, the pixel P may be provided with a light emitting element emitting red light, a light emitting element emitting green light, a light emitting element emitting blue light, and a light emitting element emitting white light. Further, a configuration in which all the light emitting elements emit the same color (for example, white or blue) and a necessary color filter is added to each pixel P may be employed.

Further, in the first and second embodiments described above, the internal structure of the display panel 110 has been described based on schematic drawings, but the internal structure of the display panel 110 can be arbitrarily changed. FIG. 11 is a cross-sectional view showing an OLED display 400 according to a modified embodiment. Here, the organic light emitting element layer 114 comprises a cathode 114a, a bank 114b and an organic compound layer 114c. A color filter 401 is provided in the layer of the filler 117 at a position facing the organic light emitting element layer 114 partitioned by the bank 114b in the Z direction. As a result, for example, when the light-emitting elements of the organic compound layer 114c emit white or blue light, the color conversion by the color filter 401 produces RGB colors.

In FIG. 11, a passivation (PAS) layer 402 and an overcoat layer 403 are laminated in order from the bottom between the element substrate 111 and the organic light emitting element layer 114 . The passivation layer 402 is made of an insulating material, such as inorganic insulating material such as silicon oxide or silicon nitride, and functions as a protective layer. A passivation layer 402 is formed over the entire upper surface of the element substrate 111 . Therefore, the passivation layer 402 can suppress permeation of oxygen and moisture from the element substrate 111 side. Further, inside the passivation layer 402, the scan driver 120 is provided in the GIP format.

On the other hand, the overcoat layer 403 functions as a planarization layer that removes a step formed on the upper surface side of the passivation layer 402 by a thin film transistor (not shown) or the like formed on the element substrate 111 . Overcoat layer 403 is formed from an insulating material, such as an organic insulating material. As a material for the overcoat layer 403, for example, an olefin polymer (polyethylene, polypropylene, etc.), polyethylene terephthalate (PET), epoxy resin, fluororesin, polysiloxane, or the like is used.

Furthermore, in FIG. 11, the passivation layer 115 is formed so as to cover the top and side surfaces of the organic light-emitting element layer 114 and the end portion of the overcoat layer 403. A plurality of stepped portions are formed at the ends of the . Also, the dam material 116 is formed on the passivation layer 402 so as to cover the end of the passivation layer 115 . That is, unlike FIG. 3, the dam material 116 is not separated from the passivation layer 115, and the passivation layer 115, the passivation layer 402, and the organic light emitting element layer 114 therein are formed by the dam material 116, the element substrate 111, and the counter substrate 112. It is a structure that clamps and fixes the Therefore, there is an advantage that the impact resistance of the display panel 110 can be further enhanced. Also, the organic light-emitting element layer 114 is protected vertically and horizontally by the passivation layer 115 and the passivation layer 402 . Therefore, there is an advantage that the shielding property of the device can be further improved.

REFERENCE SIGNS LIST 100, 200, 300, 400 Organic Light Emitting Display Device 110 Display Panel 111 Element Substrate 112 Counter Substrate 113 Sealing Film (Ceramic Deposition Film)
114 Organic Light Emitting Element Layer 115 Passivation Layer 116 Dam Material 117 Filler 118 Sealing Film (Nanosheet Composite Film)
118a nanosheet 118b organic resin layer 119 hybrid film 120 scan driver 130 data driver 131 source drive IC
140 flexible film 150 circuit board 160 timing controller 170 host system

Claims (4)

an element substrate;
an organic light-emitting element layer provided on the element substrate;
a dam material provided around the organic light-emitting element layer on the element substrate;
a counter substrate provided on the dam member so as to face the element substrate;
a sealing film provided on the outer wall surface of the dam material;
with
the sealing film includes at least one of a metal oxide and a metal nitride;
a hybrid film made of an organic resin and an inorganic resin is provided on the outer wall surface of the dam material, the outer wall surface of the element substrate, and the outer wall surface of the counter substrate;
An organic light-emitting display device, wherein the sealing film is provided on the hybrid film. the counter substrate, the dam material and the sealing film have transparency,
The counter substrate is positioned in the light emitting direction of the organic light emitting element layer,
The organic light-emitting display device of claim 1. a filling material having transparency and provided in a region surrounded by the dam material, the organic light-emitting element layer, and the counter substrate;
3. The organic light-emitting display device according to claim 1, further comprising: providing an organic light-emitting element layer on the element substrate;
a step of applying a coating liquid containing a resin around the organic light-emitting element layer on the element substrate to provide an uncured dam material;
providing a counter substrate on the uncured dam material so as to face the element substrate;
curing the uncured dam material to form a dam material;
providing a hybrid film made of an organic resin and an inorganic resin on the outer wall surface of the dam material, the outer wall surface of the element substrate, and the outer wall surface of the counter substrate;
providing a sealing film on the hybrid film;
with
The method of manufacturing an organic light-emitting display device, wherein the step of providing the sealing film includes the step of injecting fine particle aerosol containing a metal oxide or nitride onto the hybrid film.

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