JP2020043035A - Organic light emitting display and manufacturing method thereof - Google Patents

Abstract

To provide an organic light emitting display and a manufacturing method thereof with excellent shielding properties against oxygen and moisture and achieving narrow bezel.SOLUTION: An organic light emitting display device according to the present invention includes an element substrate, an organic light-emitting element layer provided on the element substrate, a dam material provided on the element substrate around the organic light emitting element layer, an opposing substrate provided on the dam material in opposition to the element substrate, and a sealing film provided on an outer wall surface of the dam material.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an organic light emitting display and a method for manufacturing the organic light emitting display.

  2. Description of the Related Art An organic light emitting display (OLED) is characterized in that it can be driven at a low voltage, is thin, has a good viewing angle, and has a fast response speed.

  On the other hand, in the organic light emitting display device, the organic light emitting element (organic light emitting diode) is deteriorated by the influence of oxygen and moisture, and the light emitting performance is reduced. For this reason, a technique for suppressing the transmission of oxygen and moisture to the organic light-emitting display device has been developed.

  For example, Patent Literature 1 discloses an organic light emitting display device that suppresses the transmission of oxygen and moisture by sealing the periphery of the organic light emitting element with a dam material (sealing wall) provided between an element substrate and a counter substrate. Is disclosed.

JP-A-2015-076195

In the organic light-emitting display device described in Patent Literature 1, the dam material is formed of resin, so that the width (the thickness in the plane direction) of the dam material is increased to obtain sufficient shielding properties against oxygen and moisture. It is necessary. On the other hand, in the organic light-emitting display device, the width of the dam member is preferably narrow and the bezel narrowing (narrowing the frame) is strongly preferred from the viewpoint of reducing the non-display area, improving the design, and reducing the size and weight. It has been demanded.
Therefore, there is a trade-off between excellent shielding properties against oxygen and moisture and narrowing of the bezel, and it is required to achieve these in a higher dimension.

  The present invention has been made in view of the above-described problems in the related art, and has as its object to provide an organic light-emitting display device having excellent shielding properties against oxygen and moisture and achieving a narrow bezel and a method of manufacturing the organic light-emitting display device. Aim.

  According to one aspect of the present invention, an element substrate, an organic light emitting element layer provided on the element substrate, a dam material provided on the element substrate around the organic light emitting element layer, and the element substrate An organic light emitting display device comprising: a counter substrate provided on the dam member in opposition to the dam member; and a sealing film provided on an outer wall surface of the dam member.

  According to another aspect of the present invention, a step of providing an organic light-emitting element layer on an element substrate, and applying a coating liquid containing a resin around the organic light-emitting element layer on the element substrate to form an uncured dam Providing a material, providing an opposing substrate on the uncured dam material facing the element substrate, curing the uncured dam material to form a dam material, and outer wall surfaces of the dam material Providing a sealing film on the organic light emitting display device.

  According to the present invention, there are provided an organic light emitting display device having excellent shielding properties against oxygen and moisture and having a narrow bezel, and a method for manufacturing the organic light emitting display device.

1 is a perspective view illustrating an organic light emitting display device according to a first embodiment of the present invention. FIG. 1 is a block diagram illustrating an organic light emitting display device according to a first embodiment of the present invention. FIG. 1 is a cross-sectional view illustrating an organic light emitting display device according to a first embodiment of the present invention. 3 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to the first embodiment of the present invention. FIG. 4 is a diagram illustrating a method for manufacturing the organic light emitting display device according to the first embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to a second embodiment of the present invention. FIG. 6 is an enlarged cross-sectional view of a main part illustrating a shielding structure of an organic light emitting display according to a second embodiment of the present invention. 9 is a flowchart illustrating a method for manufacturing an organic light emitting display device according to a second embodiment of the present invention. It is a figure explaining a manufacturing method of an organic light emitting display in a 2nd embodiment of the present invention. FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to a modified embodiment of the invention. FIG. 4 is a cross-sectional view illustrating an organic light emitting display device according to a modified embodiment of the invention.

[First Embodiment]
FIG. 1 is a perspective view showing an organic light emitting display device 100 according to the present embodiment. FIG. 2 is a block diagram illustrating the organic light emitting display device 100 according to the present embodiment. In the present embodiment, each drawing is a schematic diagram for explanation, and is not to scale. In particular, a number of repeated components are shown in greatly reduced quantities for clarity of illustration.

  As shown in FIGS. 1 and 2, the organic light emitting display device 100 according to the present embodiment includes a display panel 110, a scan driver 120, a data driver 130, a timing controller 160, and a host system 170.

  As shown in FIG. 1, the display panel 110 includes a pair of opposed substrates, an element substrate 111 and a counter substrate 112. Further, a sealing film 113 is provided on a wall surface (outer wall surface) of the display panel 110 in the outer peripheral direction. In the following description, the directions of the two sides that define the display surface of the display panel 110 are called an X direction and a Y direction, respectively, and the direction perpendicular to the display surface (that is, the direction perpendicular to the XY plane) is Z. It is called direction. Further, in the present embodiment, the expression “above” or “below” does not limit the positional relationship in actual use.

  As shown in FIG. 2, the display panel 110 includes a display area where pixels P are provided and an image is displayed. On the display panel 110, data lines (D1 to Dm, m is a positive integer of 2 or more) and scan lines (S1 to Sn, n is a positive integer of 2 or more) are formed. The data lines (D1 to Dm) are formed to cross the scan lines (S1 to Sn). The pixel P is formed in a region defined by an intersection structure between a gate line and a data line.

  Each of the pixels P of the display panel 110 may be connected to any one of the data lines (D1 to Dm) and any one of the scan lines (S1 to Sn). Each of the pixels P of the display panel 110 is turned on by a driving signal (transistor) that adjusts a drain-source current according to a data voltage applied to the gate electrode, and a scan signal of a scan line, and the data voltage of the data line is changed. , A light-emitting diode (Organic Light Emitting Diode) that emits light in accordance with the drain-source current of the drive transistor, and a capacitor for storing the voltage of the gate electrode of the drive transistor (Capacitor). Thereby, each of the pixels P can emit light according to the current supplied to the organic light emitting diode.

  The scan driver 120 receives an input of a scan control signal (GCS) from the timing controller 160. The scan driver 120 supplies a scan signal to scan lines (S1 to Sn) based on a scan control signal (GCS).

  The scan driver 120 may be formed in a non-display area on one or both sides of a display area of the display panel 110 using a gate driver in panel (GIP) method. Alternatively, the scan driving unit 120 may be manufactured using a driving chip, mounted using the flexible film 140, and may be mounted on a non-display area outside one or both sides of the display area of the display panel 110 by a TAB (Tape Automated Bonding) method. It can also be attached.

  The data driver 130 receives digital video data (DATA) and a data control signal (DCS) from the timing controller 160. The data driver 130 converts digital video data (DATA) into an analog positive / negative data voltage based on a data control signal (DCS) and supplies the converted data to a data line. That is, the pixel P to which the data voltage is supplied is selected by the scan signal of the scan driver 120, and the data voltage is supplied to the selected pixel P.

  The data driver 130 may include a plurality of source drive ICs 131 as shown in FIG. Each of the plurality of source drive ICs 131 may be mounted on the flexible film 140 using a Chip On Film (COF) or a Chip On Plastic (COP) method. The flexible film 140 is attached to a pad provided in a non-display area of the display panel 110 by using an anisotropic conductive film. Thereby, the plurality of source drive ICs 131 can be connected to the pads.

  The circuit board 150 may be attached to the flexible film 140. A large number of circuits mounted on the driving chip can be mounted on the circuit board 150. For example, the timing controller 160 may be mounted on the circuit board 150. The circuit board 150 may be a printed circuit board or a flexible printed circuit board.

  The timing controller 160 receives digital video data (DATA) and a timing signal from the host system 170. The timing signal may include a vertical synchronizing signal, a horizontal synchronizing signal, a data enable signal, a dot clock, and the like. The vertical synchronization signal is a signal that defines one frame period. The horizontal synchronization signal is a signal that defines one horizontal period necessary to supply a data voltage to the pixels P on one horizontal line of the display panel 110. The data enable signal is a signal that defines a period during which valid data is input. The dot clock is a signal that repeats at a predetermined short cycle.

  The timing controller 160 includes a data control signal (DCS) for controlling the operation timing of the data driver 130 based on the timing signal in order to control the operation timing of the scan driver 120 and the data driver 130. A scan control signal (GCS) for controlling the operation timing of the scan driver 120 is generated. The timing controller 160 outputs a scan control signal (GCS) to the scan driver 120, and outputs digital video data (DATA) and a data control signal (DCS) to the data driver 130.

  The host system 170 may be implemented with a navigation system, a set-top box, a DVD player, a Blu-ray player, a personal computer (PC), a home theater system, a broadcast receiver, a mobile phone system (Phone system), and the like. The host system 170 converts digital video data (DATA) of an input video including an SoC (System on chip) having a built-in scaler into a format suitable for displaying on the display panel 110. The host system 170 transmits digital video data (DATA) and a timing signal to the timing controller 160.

  FIG. 3 is a cross-sectional view illustrating the organic light emitting display device 100 according to the present embodiment. Although FIG. 3 is a cross-sectional view of the display panel 110 shown in FIG. 1 in the XZ plane, for convenience of description, it is assumed that dimensions and ratios of each member are different from those in FIG. In the following, a top emission type organic light emitting display device 100 will be described as an example, but the organic light emitting display device of the present invention is not limited to a top emission type organic light emitting display device. There may be.

As shown in FIG. 3, the organic light emitting display device 100 according to the present embodiment includes an element substrate 111, a counter substrate 112, a sealing film 113, an organic light emitting element layer 114, a passivation layer 115, a dam member 116, , A filler 117.
ing.

  The element substrate 111 is, for example, a glass substrate. Note that the element substrate 111 is not limited to a glass substrate, and substrates of various materials can be used. Further, a barrier layer (not shown) is formed on the element substrate 111. The material of the barrier layer is not particularly limited as long as it has a shielding property against oxygen and moisture, and examples thereof include silicon oxide, silicon nitride, and alumina. Further, the barrier layer may be a single layer or may have a laminated structure of two or more layers. Further, a TFT layer (not shown) including a thin film transistor (TFT) constituting a driving circuit for driving the organic light emitting element layer 114 is formed on the barrier layer.

  The counter substrate 112 is, for example, a glass substrate. By positioning the transparent opposing substrate 112 in the light emitting direction of the organic light emitting element layer 114, a top emission display device can be formed. The counter substrate 112 is bonded and fixed on the dam member 116 and the filler 117.

  The sealing film 113 is provided on the outer wall surface of the dam member 116. In the present embodiment, as shown in FIG. 1, the sealing film 113 is continuously provided on three outer wall surfaces of the display panel 110 which are perpendicular to the XY plane in the figure. Further, the sealing film 113 is formed continuously so as to straddle the outer wall surfaces of the three members of the element substrate 111, the dam member 116, and the counter substrate 112 in the thickness direction (Z direction) of the display panel 110. Note that the sealing film 113 is an evaporation film containing at least one of a metal oxide and a metal nitride, and is formed by an aerosol deposition method (AD method), which is one of known film forming methods. Is done.

  In aerosol deposition, fine particles of a brittle material, such as metal oxides or metal nitrides, are ejected from a nozzle at high speed toward the surface of the object, causing the particles to collide with the object and the mechanical This is a method of forming a polycrystalline structure of a brittle material on the surface of an object by using an impact force. According to the aerosol deposition method, a dense structure having both mechanical strength equivalent to that of a fired body and high shielding properties against oxygen and moisture under non-wet and non-heating conditions can be obtained.

The high shielding property against water (high water vapor barrier property) is generally represented by a water vapor transmission rate (WVTR). As a unit of the water vapor permeability, a value obtained by converting the amount of water vapor into a unit time (1 day) and a unit area (1 m ² ) is generally used. In particular, in the use of an organic electronic substrate, an extremely low transmittance of 10 ⁻⁵ to 10 ⁻⁶ g / m ² / day is required, and the sealing film 113 of the present embodiment also satisfies the standard.

  As a material of the sealing film 113, alumina, zirconia (zirconium dioxide), titania (titanium oxide), or the like is used. Further, it is preferable that the sealing film 113 have transparency. The thickness of the sealing film 113 is preferably 100 nm to 100 μm.

  The organic light emitting element layer 114 is provided on the above-described TFT layer. The organic light emitting element layer 114 includes an organic light emitting element (not shown) and a bank (not shown). The organic light emitting device has an anode (anode), an organic compound layer (organic light emitting layer) formed on the anode, and a cathode (cathode) formed on the organic compound layer. Further, the organic compound layer includes, in order from the anode side, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. Note that each layer constituting the organic light-emitting element layer 114 can be formed using a known material.

  As the anode, for example, a reflective electrode made of a thin film of a material having high reflectivity such as aluminum, silver, platinum, and chromium, and a transparent material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide) formed on these thin films A reflective electrode on which a conductive oxide thin film is formed can be given.

  The organic compound layer includes, for example, an R organic compound layer that emits red light, a G organic compound layer that emits green light, and an B organic compound that emits blue light according to the sub-pixels that constitute the pixel. And layers. The R, G, and B organic compound layers are made of a known material corresponding to each emission color.

  As the cathode, for example, a translucent electrode or a transparent electrode made of a thin film of silver, silver alloy, ITO, IZO or the like is used.

  The bank is formed so as to partition the pixel P, for example, to cover an end of the anode. That is, the bank functions as a pixel defining film that defines the pixel P. As the bank, for example, an organic film such as an acrylic resin or an epoxy resin is used.

  The passivation layer 115 is provided on the top and side surfaces of the organic light emitting element layer 114 so as to cover the organic light emitting element layer 114. The passivation layer 115 is formed of an inorganic film having low moisture permeability and functions as a protective film for protecting the organic light emitting element layer 114 from oxygen and moisture. As the passivation layer 115, for example, a silicon oxide film, a silicon nitride film, or the like is used.

  The dam member 116 is provided around a plurality of organic light emitting element layers 114 formed in a matrix on the element substrate 111. The dam member 116 is made of a transparent resin such as a thermosetting resin or a photo-setting resin. As a material of the dam member 116, for example, an epoxy resin, an acrylic resin, or the like is used.

  An opposing substrate 112 is provided on the dam member 116 so as to oppose the element substrate 111. The dam member 116 is provided between the element substrate 111 (barrier layer) and the opposing substrate 112, and functions as an adhesive member for a pair of substrates by being cured by heat or light. In addition, in the thickness direction of the manufactured display panel 110, the material of each member is selected so that the transmittance of light passing through the stacked region of the element substrate 111, the dam member 116, and the counter substrate 112 is 80% or more. Is preferable.

  The filler 117 fills a space region surrounded by the passivation layer 115, the dam member 116, and the counter substrate 112. The filler 117 is made of a transparent resin such as a thermosetting resin or a photocurable resin, similarly to the dam member 116. The filler 117 functions as an adhesive member for a pair of substrates by being cured by heat or light similarly to the dam member 116. Note that the refractive index of the dam member 116 and the filler 117 is preferably 0.5 to 0.55. It is preferable that the difference between the refractive indices of the upper and lower substrates (the element substrate 111 and the counter substrate 112) and the dam member 116 is 0.1 or less.

  Subsequently, a method for manufacturing the organic light emitting display device 100 according to the present embodiment will be described with reference to FIGS. FIG. 4 is a flowchart illustrating a method for manufacturing the organic light emitting display device 100 according to the present embodiment. FIG. 5 is a diagram illustrating a method for manufacturing the organic light emitting display device 100 according to the present embodiment.

  First, as shown in FIG. 5A, the organic light emitting element layer 114 is formed on the upper surface of the element substrate 111 (Step S11).

  Next, as shown in FIG. 5B, a passivation layer 115 is formed on the upper surface and side surfaces of the organic light emitting element layer 114, and covers the organic light emitting element layer 114 (Step S12).

  Next, as shown in FIG. 5C, a dam material 116, which is an uncured resin, is applied around the organic light emitting element layer 114 and the passivation layer 115 on the element substrate 111 in preparation for injection of a filler 117 described later. (Step S13).

  Next, the dam member 116 is temporarily cured by irradiating the dam member 116 with ultraviolet rays for a predetermined time (step S14).

  Next, as shown in FIG. 5D, a filler 117 is injected into a space surrounded by the element substrate 111, the passivation layer 115, and the dam member 116 (Step S15).

  Next, as shown in FIG. 5E, the opposing substrate 112 is bonded on the dam member 116 and the filler 117 so as to oppose the element substrate 111 (step S16).

  Next, as shown in FIG. 5 (F), after the intermediate body of the display panel 110 (see FIG. 5 (E)) is carried into the chamber C1 in a normal temperature state where the pressure is reduced to about 100 Pa, for example, The sealing film 113 is formed on the outer wall surface based on the AD method by ejecting the fine particle aerosol AS from the nozzle N1 onto each outer wall surface of the dam member 116, the element substrate 111, and the counter substrate 112 (Step S17).

  Then, in the chamber C1 in which the internal temperature has been raised to, for example, 100 ° C., the intermediate is continuously heat-treated for a predetermined time, or the intermediate is irradiated with ultraviolet rays for 30 minutes, whereby the filler 117 and the dam member 116 are removed. The main curing is performed (step S18). The curing conditions are appropriately selected according to the materials of the filler 117 and the dam member 116. Thereby, the manufacturing process of the display panel 110 of the organic light emitting display device 100 is completed.

  As described above, according to the organic light-emitting display device 100 of the present embodiment, a narrow bezel is achieved while having excellent shielding properties against oxygen and moisture.

  More specifically, since the shielding property (high water vapor barrier property) is ensured only by the sealing film 113 formed with an extremely small thickness (100 nm to 100 μm), the width of the dam member 116 is significantly larger than that of the conventional device. It becomes possible to make it narrow. Further, since the dam member 116 of the conventional device includes a getter material having a moisture absorbing function, the edge of the display panel 110 becomes cloudy, causing an increase in the non-display area. On the other hand, the organic light emitting display device 100 according to the present embodiment does not need to include a getter material inside the dam material 116 due to the shielding property of the sealing film 113. Therefore, the dam material 116 is formed of only a transparent resin. As a result, enlargement of a transparent display area (narrow bezel) can be achieved.

  Further, since the dam member 116 is formed only of the resin, the adhesive strength between the dam member 116 and the element substrate 111 and the counter substrate 112 can be improved as compared with the case where the dam member 116 includes a getter material. There are advantages too.

The use of the AD method also has the following advantages as compared with a CVD (Chemical Vapor Deposition) method in which a film is formed while rotating a substrate at a high speed in a chamber in a high temperature state (for example, 250 ° C.).
(A) Since the sealing film 113 can be deposited on the outer wall surface (side surface) of the substrate under a normal temperature environment, the cost required for the film forming process can be suppressed.
(B) Unlike the CVD method in which the entire surface of the substrate is formed, a limited sealing film 113 can be formed on a desired portion.

  Furthermore, the structure in which the shielding property (high water vapor barrier property) is ensured only by the sealing film 113 has an advantage that the thickness of the dam member 116 can be reduced. Accordingly, the thickness of the entire display panel 110 is reduced, and there is an advantage that the flexibility of the display panel 110 can be improved.

[Second embodiment]
Next, an organic light emitting diode display 200 according to the present embodiment will be described with reference to FIGS. In addition, the code | symbol common to the code | symbol given in the figure of 1st Embodiment shows the same object. In the following, description of parts common to the first embodiment will be omitted, and the description will focus on configurations and operations different from those of the first embodiment.

  FIG. 6 is a cross-sectional view illustrating the organic light emitting display device 200 according to the present embodiment. The sealing film 118 in the present embodiment is different from the first embodiment in that it is a nanosheet composite film in which nanosheets 118a separated from a layered inorganic compound and organic resin layers 118b are alternately laminated in units of nanometers. I have. The material of the nanosheet 118a is, for example, montmorillonite, bentonite, hectorite, octosilicate, or the like. The aspect ratio of the sealing film 118 is preferably 300: 1 or more, and the oil content is preferably 30% by weight or more. It is preferable that the thickness of the sealing film 118 be 100 nm to 100 μm.

FIG. 7 is an enlarged sectional view of a main part for explaining a shielding structure of the organic light emitting display device 200 in the present embodiment. As shown in FIG. 7, the nanosheets 118a are dispersed inside the sealing film 118, and the surface direction of the nanosheets 118a is provided to be substantially parallel to the surface direction of the sealing film 118 (Z direction in the figure). Have been. In addition, the dashed arrow in the drawing indicates the traveling direction of water (H ₂ O) that has entered the organic resin layer 118b. FIG. 7 shows that oxygen and moisture cannot take the shortest path inside the sealing film 118 and cannot reach the dam member 116 without following a complicated and very long path that is largely deviated from the shortest path. I have. That is, since the sealing film 118 is formed by laminating the nanosheet 118a and the organic resin layer 118b in the X direction or the Y direction in a unit of nanometer, it means that the sealing film 118 has a high shielding property.

  Next, a method for manufacturing the organic light emitting display device 200 according to the present embodiment will be described with reference to FIGS. FIG. 8 is a flowchart illustrating a method for manufacturing the organic light emitting display device 200 according to the present embodiment. FIG. 9 is a diagram illustrating a method for manufacturing the organic light emitting display device 200 according to the present embodiment.

  First, as shown in FIG. 9A, the organic light emitting element layer 114 is formed on the upper surface of the element substrate 111 (Step S21).

  Next, as shown in FIG. 9B, a passivation layer 115 is formed on the upper surface and side surfaces of the organic light emitting element layer 114, and covers the organic light emitting element layer 114 (Step S22).

  Next, as shown in FIG. 9C, a dam member 116, which is an uncured resin, is applied around the organic light emitting element layer 114 and the passivation layer 115 on the element substrate 111 (step S23).

  Next, the dam member 116 is temporarily cured by irradiating the dam member 116 with ultraviolet rays for a predetermined time (step S24).

  Next, as shown in FIG. 9D, a filler 117 is injected into a space surrounded by the element substrate 111, the passivation layer 115, and the dam member 116 (Step S25).

  Next, as shown in FIG. 9E, the opposing substrate 112 is bonded on the dam member 116 and the filler 117 so as to face the element substrate 111 (step S26).

  Next, as shown in FIG. 9 (F), after the intermediate body of the display panel 110 (see FIG. 9 (E)) is carried into the chamber C2, it is adjusted for forming the sealing film 118 from the nozzle N2. The coating liquid is repeatedly applied to the outer wall surfaces of the dam member 116, the element substrate 111, and the counter substrate 112 in the intermediate (Step S27). At this time, the temperature in the chamber C2 may be room temperature. The coating liquid is preferably adjusted by, for example, removing and dispersing a single layer of the nanosheet 118a having an aspect ratio of about 1000: 1 in a solvent and a resin.

  Then, the temperature in the chamber C2 is raised to, for example, 100 ° C., and the intermediate body of the display panel 110 is irradiated with ultraviolet rays for 30 minutes, whereby the filler 117, the dam member 116, and the sealing film 118 are fully cured (step S28). . Thereby, the manufacturing process of the display panel 110 of the organic light emitting display device 200 is completed.

  As described above, according to the organic light-emitting display device 200 of the present embodiment, a narrow bezel is achieved while having excellent shielding properties against oxygen and moisture. Thereby, the same effect as in the above-described first embodiment is obtained.

  Further, unlike the first embodiment described above, after the coating liquid containing the nanosheet 118a is applied to the outer wall surface, the coating liquid is dried under a predetermined temperature condition while irradiating ultraviolet rays in the chamber C2. Since the sealing film 118 can be easily formed only by the above, there is an advantage that the film can be formed in a more limited range than in the case of the first embodiment.

[Modified embodiment]
The preferred embodiments of the present invention have been described above. However, the present invention can be modified into various modes as described below, for example.

  FIG. 10 is a cross-sectional view illustrating an organic light emitting display device 300 according to a modified embodiment. Here, a case is shown in which a hybrid film 119 made of an organic resin and an inorganic resin is formed on the outer wall surface of the dam member 116, and the sealing film 113 is deposited on the hybrid film 119. The hybrid film 119 is, for example, a silane-modified epoxy resin, a POSS (polyhedral oligomeric silsesquioxane) hybrid film, or the like. As described above, when the hybrid film 119 is provided as an intermediate layer on the outer wall surface (side surface) of the element substrate 111, the dam member 15, and the counter substrate 112, the sealing film 113 deposited by the AD method and the outer wall surface are formed. And the strength of the sealing film 113 can be increased.

  In the first and second embodiments described above, for convenience of explanation, the case where the outer wall surfaces of the element substrate 111, the dam member 116, and the counter substrate 112 are aligned in the Z direction has been described. However, a deposition film and a nanosheet composite film based on the AD method can be formed on a desired portion of the display panel 110. Therefore, even when a step is provided at the boundary between the element substrate 111, the dam member 116, and the counter substrate 112, the sealing films 113 and 118 can be formed on each outer wall surface in the same manner as in the above-described embodiment. For example, when the outer wall surfaces of the element substrate 111 and the counter substrate 112 project outside the outer wall surface of the dam member 116, at least the outer wall surface of the dam member 116, the boundary region between the dam member 116 and the element substrate 111, the dam member By providing the sealing films 113 and 118 in the boundary region between the counter 116 and the counter substrate 112, it is possible to suppress entry of oxygen and moisture from directions perpendicular to the outer wall surface (the X direction and the Y direction).

  In addition, the shielding structure described in the first and second embodiments is not limited to the organic light emitting display device, but can be applied to other display devices such as a liquid crystal display device and a plasma display device, a lighting device, and the like. . The lighting device is not particularly limited in its use, and may be used, for example, as indoor lighting, outdoor lighting, or as lighting for electronic devices such as a backlight of a liquid crystal display device.

  Further, in the first and second embodiments described above, the organic light emitting element layer 114 has the R organic compound layer that emits red light, the G organic compound layer that emits green light, and the blue light. Although the configuration including the organic compound layer for B has been exemplified, the display method is not limited to this. For example, the pixel P may have a structure in which a red light emitting element, a green light emitting element, a blue light emitting element, and a white light emitting element are provided. Further, a configuration may be adopted in which all the light emitting elements have the same light emitting color (for example, white or blue), and a necessary color filter is added for each pixel P.

  In the first and second embodiments described above, the internal structure of the display panel 110 has been described based on the schematic drawings. However, the internal structure of the display panel 110 can be arbitrarily changed. FIG. 11 is a cross-sectional view illustrating an organic light-emitting display device 400 according to a modified embodiment. Here, the organic light emitting element layer 114 includes a cathode 114a, a bank 114b, and an organic compound layer 114c. In the layer of the filler 117, a color filter 401 is provided at a position facing the organic light emitting element layer 114 defined by the bank 114b in the Z direction. Thereby, for example, when the light emitting element of the organic compound layer 114c emits white or blue light, RGB color is obtained by color conversion by the color filter 401.

  In FIG. 11, a passivation (Passivation: PAS) layer 402 and an overcoat (Overcoat) layer 403 are sequentially stacked from the bottom between the element substrate 111 and the organic light emitting element layer 114. The passivation layer 402 is formed of an insulating material, for example, an inorganic insulating material such as silicon oxide or silicon nitride, and functions as a protective layer. The passivation layer 402 is formed on the entire upper surface of the element substrate 111. For this reason, the passivation layer 402 can suppress permeation of oxygen and moisture from the element substrate 111 side. Further, the scan driver 120 is provided in the GIP format inside the passivation layer 402.

  On the other hand, the overcoat layer 403 functions as a flattening layer for removing a step generated on the upper surface side of the passivation layer 402 by a thin film transistor (not shown) formed on the element substrate 111 or the like. The overcoat layer 403 is formed from an insulating material, for example, an organic insulating material. As a material for the overcoat layer 403, for example, an olefin polymer (eg, polyethylene or polypropylene), polyethylene terephthalate (PET), an epoxy resin, a fluororesin, a polysiloxane, or the like is used.

  Further, in FIG. 11, the passivation layer 115 is formed so as to cover the upper surface and the side surface of the organic light emitting element layer 114 and the end of the overcoat layer 403, so that the outer peripheral direction of the passivation layer 115 (X direction in the figure). Are formed with a plurality of stepped portions at the end. Further, the dam member 116 is formed on the passivation layer 402 so as to cover an end of the passivation layer 115. That is, unlike FIG. 3, the dam member 116 is not separated from the passivation layer 115, and the dam member 116, the element substrate 111, and the opposing substrate 112 cause the passivation layer 115, the passivation layer 402, and the organic light emitting element layer 114 therein. It is a structure that clamps and fixes the. Therefore, there is an advantage that the impact resistance of the display panel 110 can be further increased. The organic light emitting element layer 114 is protected in the vertical and horizontal directions by the passivation layer 115 and the passivation layer 402. Therefore, there is an advantage that the shielding property of the device can be further improved.

100, 200, 300, 400 Organic light emitting display device 110 Display panel 111 Element substrate 112 Counter substrate 113 Sealing film (ceramic vapor deposition film)
114 Organic light emitting device layer 115 Passivation layer 116 Dam material 117 Filler 118 Sealing film (nano-sheet composite film)
118a Nanosheet 118b Organic resin layer 119 Hybrid film 120 Scan driver 130 Data driver 131 Source drive IC
140 Flexible film 150 Circuit board 160 Timing controller 170 Host system

Claims (10)

An element substrate,
An organic light-emitting element layer provided on the element substrate,
Dam material provided on the element substrate around the organic light emitting element layer,
An opposing substrate provided on the dam material in opposition to the element substrate,
A sealing film provided on an outer wall surface of the dam material,
An organic light emitting display device comprising: The counter substrate, the dam material and the sealing film have transparency,
The counter substrate is located in a light emitting direction of the organic light emitting element layer,
The organic light emitting display device according to claim 1. The sealing film is a deposition film containing at least one of a metal oxide and a metal nitride, and is formed by an aerosol deposition method.
The organic light emitting display device according to claim 1. On the outer wall surface of the dam material, a hybrid film formed from an organic resin and an inorganic resin,
The sealing film is deposited on the hybrid film,
The organic light emitting display device according to claim 3. The sealing film is a composite film in which nanosheets separated from a layered inorganic compound and an organic resin layer are laminated in units of nanometers.
The organic light emitting display device according to claim 1. The nanosheet is dispersed inside the sealing film, and the surface direction of the nanosheet is substantially parallel to the surface direction of the sealing film.
The organic light emitting display device according to claim 5. Transparent, the dam material, the organic light emitting element layer and a filler provided in a region surrounded by the counter substrate,
The organic light emitting display device according to claim 1, further comprising: Providing an organic light emitting element layer on the element substrate,
A step of providing an uncured dam material by applying a coating liquid containing a resin around the organic light emitting element layer on the element substrate,
Providing a counter substrate on the uncured dam material facing the element substrate,
Curing the uncured dam material to form a dam material,
Providing a sealing film on the outer wall surface of the dam material,
A method for manufacturing an organic light emitting display device comprising: The step of providing the sealing film includes a step of spraying a particulate aerosol containing a metal oxide or nitride on the outer wall surface,
A method for manufacturing the organic light emitting display device according to claim 8. The step of providing the sealing film includes a step of laminating a nanosheet separated from the layered inorganic compound and an organic resin layer in units of nanometers.
A method for manufacturing the organic light emitting display device according to claim 8.

Images