JP2007042367A - Electro-optic device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optic device manufacturable by a manufacturing method for integrally forming a luminescent layer common to all luminescent elements on a main substrate, and capable of preventing the luminescent layer in the luminescent element from being peeled off or floating when bonding a sealing substrate while adopting full-surface sealing. <P>SOLUTION: This organic EL panel 10 is equipped with the main substrate 11, a luminescence contributing layer 13 which can be formed by deposition, is common to all organic EL elements P on the main substrate 11, and contains the luminescent layer of the organic EL element P, an inorganic sealing film 16 which covers all organic EL elements and seals all organic EL elements P by co-operating with the main substrate 11, a protective film 17 which is formed of a thermosetting resin and covers all organic EL elements P, the sealing substrate 18 which covers all organic EL elements P and seals all organic EL elements P by co-operating with the main substrate 11, and an adhesive 19 fully filled between the seal substrate 18 and the main substrate 11 to bond the both of them. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electro-optical device whose optical characteristics change according to an electrical action, and a manufacturing method thereof.

  There is an organic EL (Electro luminescent) panel as an electro-optical device. In an organic EL panel, a plurality of organic EL elements are arranged on a main substrate as a plurality of light emitting elements whose light emission characteristics are changed by electric energy. In some organic EL panels, all organic EL elements on the main substrate emit light of the same color. In this organic EL panel, the organic EL material forming the light emitting layer is common to all the organic EL elements on the main substrate. Therefore, it is possible to adopt a manufacturing method in which a light emitting layer common to all light emitting elements on the main substrate is formed by uniformly adhering the organic EL material on the main substrate. In this manufacturing method, the light emitting layers of all the organic EL elements on the main substrate are collectively formed.

On the other hand, in the organic EL panel, it is necessary to isolate the organic EL element from the outside air, particularly moisture and oxygen, and to suppress the deterioration. The sealing method of the organic EL element is roughly classified into a method not using a sealing substrate and a method using it. As a sealing method without using a sealing substrate, a method of forming an inorganic amorphous film containing C or Si so as to cover the organic EL element (see Patent Document 1), or a SiO film so as to cover the organic EL element Furthermore, there is a method for forming a thermoplastic polymer film (see Patent Document 2). Methods using a sealing substrate include can sealing (cap sealing) and solid sealing (film sealing). Can sealing is a sealing method in which a part of one surface of the sealing substrate is bonded to form a thin cavity between the sealing substrate and the main substrate. Solid sealing is between the sealing substrate and the main substrate. Is a sealing method in which an adhesive is filled with no gap and the entire surface of the sealing substrate is adhered.
JP-A-7-161474 (FIG. 1) JP-A-7-282975 (FIG. 1)

  Conventionally, there has been a demand for higher definition and larger screens for organic EL panels. To meet this demand, considering the mass productivity and cost, the light emitting layer is formed by emitting light from all the organic EL elements on the main substrate, rather than the manufacturing method in which each organic EL element is formed by coating different materials. It is better to adopt a manufacturing method in which the layers are formed in a lump.

  Moreover, high sealing performance is required for the organic EL panel. Therefore, it is desirable to adopt a method using a sealing substrate rather than a sealing method not using a sealing substrate. Methods using a sealing substrate include can sealing and solid sealing. However, in order to meet the demand for an increase in panel size and substrate size, it is desirable to use solid sealing. When can sealing is adopted, a thin cavity should be widened while maintaining its thinness, and the thinner the cavity, the more difficult it is to maintain the thinness. If the thinness of the cavity is not maintained, can sealing can be adopted. However, in that case, the organic EL panel becomes thick, and there is a possibility that inconvenience may occur in an apparatus using the organic EL panel.

  From the above, a combination of a manufacturing method for collectively forming the light emitting layers of all the organic EL elements on the main substrate and solid sealing is desirable. However, with this combination, the light emitting layer is likely to peel off or float when the sealing substrate is bonded. The cause of this problem will be specifically described below. The term “adhesion” refers to, for example, when an adhesive is applied on the main substrate, when the sealing substrate is bonded to the main substrate using this adhesive, and when the adhesive is cured.

  Organic EL materials are roughly classified into low molecular weight materials and high molecular weight materials. A low molecular organic EL material is generally deposited to form a light emitting layer. Since the adhesion of the light emitting layer is relatively low, there is a relatively high possibility that the light emitting layer is peeled off or floated due to the stress generated by the adhesion of the sealing substrate. The peeling or floating of the light emitting layer in the organic EL element leads to uneven brightness and poor light emission, and should be prevented from occurring.

  In the case of adopting a manufacturing method in which a light emitting layer is formed for each organic EL element, the stress that leads to film peeling or floating of the light emitting layer in one organic EL element is limited to the stress generated in the organic EL element. Therefore, even if solid sealing is adopted as well as can sealing, the possibility that the light emitting layer is peeled off or floated in the sealing step can be kept low.

  On the other hand, in the case of adopting a manufacturing method in which the light emitting layers of all the organic EL elements on the main substrate are formed at once, the light emitting layer spreads in common for all the organic EL elements, so If it stops, it will become easy to produce film peeling and a float of a light emitting layer at the time of adhesion | attachment of a sealing substrate. This tendency becomes more prominent as the panel size and the substrate size increase.

  The present invention has been made in view of the above-described circumstances, and can be manufactured by a manufacturing method in which a light emitting layer common to all light emitting elements on a main substrate is formed by vapor deposition, and employs solid sealing. However, an object of the present invention is to provide an electro-optical device and a method for manufacturing the same that can prevent film peeling and floating of the light-emitting layer in the light-emitting element when the sealing substrate is bonded.

  The present invention provides a main substrate on which a plurality of light emitting elements are arranged, a light emitting layer that can be formed by vapor deposition and is disposed on the main substrate and is common to all the light emitting elements on the main substrate, An inorganic sealing film disposed on all the light emitting elements, covering all the light emitting elements, and sealing all the light emitting elements in cooperation with the main substrate; and the inorganic sealing film formed from a resin. A protective film disposed on and covering and protecting all the light emitting elements; and disposed on the protective film, covering all the light emitting elements and sealing all the light emitting elements in cooperation with the main substrate. There is provided an electro-optical device comprising: a sealing substrate to be stopped; and an adhesive that is filled between the sealing substrate and the main substrate without any gap and adheres to each other.

  In this electro-optical device, the light emitting layer is common to all the light emitting elements on the main substrate. Furthermore, so-called solid sealing is employed. Furthermore, since all the light emitting elements are covered with the protective film, the force from the adhesive side to the light emitting layer is transmitted through the protective film, and the stress generated in the light emitting layer can be sufficiently reduced. Therefore, according to this electro-optical device, it can be manufactured by a manufacturing method in which light emitting layers common to all the light emitting elements on the main substrate are collectively formed by vapor deposition. It is possible to prevent film peeling and floating of the light emitting layer in the light emitting element when the substrate is bonded.

In this electro-optical device, the protective film does not contact the sealing substrate. In other words, the rigid body with which the resin contacts when forming the protective film is only the member on the main substrate side. Therefore, compared with the aspect in which the resin also contacts the sealing substrate when forming the protective film, the stress generated in the member is reduced. Therefore, according to this electro-optical device, it is possible to sufficiently reduce the stress generated in the light emitting layer when forming the protective film, and to prevent the light emitting layer from peeling or floating in the light emitting element.
Further, this electro-optical device has excellent sealing properties because all the light emitting elements on the main substrate are sealed with an inorganic sealing film.

  In the electro-optical device, the protective film may be formed of a thermosetting resin that is irreversibly cured by heating or a two-component mixed adhesive. Other materials that can form the protective film include a photocurable resin. Generally, the shrinkage stress of the thermosetting resin and the two-component mixed adhesive is smaller than that of the photocurable resin. Therefore, by forming the protective film from a thermosetting resin or a two-component mixed adhesive, the stress generated in the light emitting layer at the time of curing can be further reduced.

  According to the present invention, a light-emitting layer common to all the light-emitting elements arranged on the main substrate is collectively formed on the main substrate by vapor deposition, and all the light-emitting elements cooperate with the main substrate. An inorganic sealing film that seals elements is formed on the light emitting layer, and all the light emitting elements are protected by applying and curing a resin so as to cover all the light emitting elements on the inorganic sealing film. An electro-optical device manufacturing method is provided, in which a protective film is formed, and then an adhesive is filled between the sealing substrate and the main substrate without any gap, and the both are bonded.

  In this manufacturing method, the light emitting layer common to all the light emitting elements on the main substrate is collectively formed by vapor deposition. Further, solid sealing is adopted. Furthermore, since the solid sealing is performed after forming a protective film that covers and protects all the light emitting elements, the force from the adhesive side to the light emitting layer is transmitted through the protective film, and is generated in the light emitting layer. The stress can be made sufficiently small. Furthermore, since the force from the adhesive side is transmitted to the light emitting layer in the light emitting element through the protective film, the stress generated in the light emitting layer can be sufficiently reduced. Therefore, according to this manufacturing method, an electro-optical device can be manufactured by a manufacturing method in which a light emitting layer common to all the light emitting elements on the main substrate is formed by vapor deposition, while adopting solid sealing. Further, it is possible to prevent the light emitting layer in the light emitting element from peeling off or floating when the sealing substrate is bonded.

In this manufacturing method, the protective film does not contact the sealing substrate. In other words, the rigid body with which the resin contacts when forming the protective film is only the member on the main substrate side. Therefore, compared with the manufacturing method in which the resin also contacts the sealing substrate when forming the protective film, the stress generated in the member is reduced. Therefore, according to this manufacturing method, the stress generated in the light emitting layer when the protective film is formed can be sufficiently reduced, and the light emitting layer in the light emitting element can be prevented from peeling or floating.
Further, in this manufacturing method, since all the light emitting elements on the main substrate are sealed with the inorganic sealing film, an electro-optical device having excellent sealing properties can be manufactured.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings. In the drawings, the ratio of dimensions of each part is appropriately changed from the actual one.

[Organic EL panel]
FIG. 1 is a cross-sectional view of an organic EL panel 10 according to an embodiment of the present invention. The organic EL panel 10 is a kind of electro-optical device and constitutes an image display device. The image display device displays an image corresponding to given image data by optical action, and is a kind of electro-optical device. In addition, the organic EL panel 10 includes a main substrate 11 on which a light emitting element whose light emission characteristics are changed by applied electric energy is formed. The organic EL panel 10 is a top emission type, and irradiates light that has traveled from the light emitting element without passing through the main substrate 11 to the outside.

  The main substrate 11 is a flat plate having a certain degree of rigidity, and is preferably formed of glass or plastic. The light emitting element formed on the main substrate 11 is an organic EL element P. In the main substrate 11, the organic EL elements P are arranged in a lattice pattern. Note that the present embodiment may be modified so that the plurality of organic EL elements P are arranged in an appropriate pattern that is not in a lattice shape.

  The organic EL element P is an element that emits white light having an intensity corresponding to applied electric energy, and includes an anode 12, a light emission contributing layer 13 formed thereon, and a cathode layer formed thereon. 14 The anode 12 is formed from, for example, a laminated film of ITO and aluminum. The light emission contributing layer 13 is a layer that directly contributes to light emission of the organic EL element P, and includes at least a light emitting layer. The light emitting layer is formed by vapor-depositing a low molecular organic EL material. In addition, as another layer contained in the light emission contribution layer 13, there exists a hole injection layer, for example. The cathode layer 14 includes a LiF (lithium fluoride) layer and a cathode, and the cathode is made of, for example, ITO (Indium Tin Oxide).

  As shown in the figure, the anode 12 is arranged separately for each organic EL element P. A partition wall 15 is disposed between the anodes 12 to prevent the anode and the cathode from short-circuiting due to a step of ITO. The partition wall 15 is formed of an insulating material such as polyimide, and covers the outer periphery of the anode 12 with a gentle taper. A light emission contributing layer 13 is disposed on the main substrate 11, the anode 12 and the partition 15. The light emission contributing layer 13 is common to all the organic EL elements P on the main substrate 11. The cathode layer 14 is common to all organic EL elements P on the main substrate 11. The concave portion and the organic EL element P have a one-to-one correspondence, and one organic EL element P is composed of an anode 12 that forms the bottom of the corresponding concave portion, a light emission contribution layer 13 in the concave portion, and a cathode layer 14 in the concave portion. It is configured.

  An inorganic sealing film 16 that seals all the organic EL elements P on the main substrate 11 in cooperation with the main substrate 11 is disposed on all the organic EL elements P on the main substrate 11. The inorganic sealing film 16 is a film having excellent gas barrier properties and covers all the organic EL elements P on the main substrate 11. In the present embodiment, not only these organic EL elements P but also the light emission contributing layer 13 and the cathode layer 14 are covered. Examples of the inorganic sealing film 16 include a silicon nitride film and a silicon oxynitride film.

  On the inorganic sealing film 16, the protective film 17 which protects all the organic EL elements P is arrange | positioned. The protective film 17 is formed of a light-transmitting thermosetting resin that is irreversibly cured when heated, more specifically, a light-transmitting epoxy resin. The light-emitting contribution layer 13, the cathode layer 14, and the inorganic sealing layer The membrane 16 is covered.

  A sealing substrate 18 that seals all the organic EL elements P on the main substrate 11 in cooperation with the main substrate 11 is disposed on the protective film 17 and the main substrate 11. The sealing substrate 18 is a flat plate having a certain degree of rigidity, and can be formed of, for example, glass or light transmissive plastic. The sealing substrate 18 is bonded to the main substrate 11 and the protective film 17 so as to cover all the organic EL elements P on the main substrate 11. This adhesion is performed by filling a light-transmitting adhesive 19 between the sealing substrate 18 and the main substrate 11 without any gap, and is covered with a color filter group 20 described later on one surface of the sealing substrate 18. All the parts that are not in contact with the adhesive 19. The adhesive 19 is, for example, a thermosetting adhesive or a two-component curable adhesive.

  The image display device including the organic EL panel 10 can display a color image, and a color filter group 20 is attached to the bonding surface side of the sealing substrate 18. The entire color filter group 20 is in contact with the adhesive 19 except the surface on the sealing substrate 18 side. The color filter group 20 is formed by repeatedly arranging a set of three color filters 20R, 20G, and 20B arranged close to each other. The color filters 20R, 20G, and 20B selectively transmit only the red component, the green component, and the blue component of incident light, respectively. The color filters constituting the color filter group 20 have a one-to-one correspondence with all the organic EL elements P on the main substrate 11 so that the light from the organic EL elements P is incident only on the corresponding color filters. The positional relationship between the color filter group 20 and all the organic EL elements P on the main substrate 11 is determined.

  Although not shown, wiring for supplying electric energy to the organic EL element P is provided on the main substrate 11. This wiring connects an external power source and the anodes 12 of all the organic EL elements P on the main substrate 11. An external power supply may be provided in an image display device including the organic EL panel 10. Further, on the main substrate 11, a circuit and a wiring for receiving a control signal from the image display device and controlling the supply of electric energy to each organic EL element P are provided.

[Method for manufacturing organic EL panel]
Next, a procedure for manufacturing the organic EL panel 10 will be described.
First, the above-described wiring (and circuit) is formed on the main substrate 11. Next, as shown in FIG. 2, the anode 12 is formed on the main substrate 11 by using, for example, a laminated film of ITO / aluminum, and the partition wall 15 is formed by depositing an insulating material such as photosensitive polyimide between the anodes 12. The anodes 12 are formed so that the number and arrangement of the anodes 12 coincide with the number and arrangement of the organic EL elements P to be formed. Accordingly, on the main substrate 11, recesses having the exposed surface of the anode 12 as the bottom and the partition walls 15 as walls are located at positions where these organic EL elements P are formed by the number of organic EL elements P to be formed. Will be formed. In addition, the formation method of the anode 12 and the partition 15 may be any known method.

  Next, as shown in FIG. 3, the light emission contribution layer 13 is formed so as to cover all the anodes 12 and the partition walls 15. In this formation, the light emitting layer is formed by evaporating a low molecular organic EL material. This vapor deposition is performed without using a mask. That is, the light emitting layers of all the organic EL elements P are collectively formed. Next, as shown in FIG. 4, the cathode layer 14 is formed of, for example, lithium fluoride and aluminum.

  Next, as shown in FIG. 5, an inorganic sealing film 16 is formed so as to cover all the organic EL elements P on the main substrate 11 and preferably cover the light emission contributing layer 13 and the cathode layer 14. For this film formation, a known method such as a plasma vapor deposition method, a vacuum vapor deposition method, a plasma coating method, a sputtering method, or a CVD method can be used.

  Next, as shown in FIG. 6, a protective film 17 is preferably formed so as to cover all the organic EL elements P on the main substrate 11 and preferably cover the light emission contributing layer 13, the cathode layer 14, and the inorganic sealing film 16. Form. This formation is performed by applying a light-transmitting epoxy resin by screen printing and curing it by heating. This heating is performed, for example, by placing the main substrate 11 on a hot plate. Note that the sealing performance may be improved by applying the epoxy resin in a nitrogen atmosphere in which the dew point is controlled or under reduced pressure. Moreover, the application method of an epoxy resin is not restricted to screen printing. For example, other known methods such as dispenser drawing, slit coater, and flexographic printing can be employed.

  Next, as shown in FIG. 7, the sealing substrate 18 to which the color filter group 20 is attached is arranged on the color filter group 20 and the main substrate 11. All the organic EL elements P are arranged so as to correctly correspond one-to-one. Prior to this, the color filter group 20 is attached to the sealing substrate 18.

  Next, as shown in FIG. 1, the sealing substrate 18 to which the color filter group 20 is attached is bonded to the main substrate 11 while maintaining this correspondence. Specifically, the main substrate 11 and the sealing substrate 18 are relatively brought close to each other so that the color filter and the organic EL element P are in the above-described positional relationship, and the adhesive 19 is filled between the two without any gap and cured. Let This curing is performed by a method (for example, heating, ultraviolet irradiation, etc.) according to the type of the adhesive 19. Thus, the organic EL panel 10 is manufactured.

  Note that a plurality of organic EL panels 10 may be manufactured using one main substrate. In this case, the plurality of organic EL panels 10 can be obtained by bonding the plurality of sealing substrates 18 to the main substrate and then cutting (scribing) the main substrate.

[effect]
As described above, in the organic EL panel 10, the light emitting layer is formed in a lump by vapor deposition. Moreover, solid sealing is adopted. Therefore, it is easy to meet the demand for larger organic EL panels and higher definition. Moreover, since all the organic EL elements P on the main substrate 11 are covered with the protective film 17, the force from the adhesive 19 side to the organic EL element P is transmitted through the protective film 17. The stress generated in the light emitting layer in the element P can be sufficiently reduced.

  Further, the protective film 17 does not contact the sealing substrate 18. That is, only the main substrate 11 and the inorganic sealing film 16 are in contact with the thermosetting resin when the protective film 17 is formed. Therefore, the stress generated in the main substrate 11 and the inorganic sealing film 16 is reduced as compared with a mode in which the thermosetting resin is also in contact with the sealing substrate 18 when the protective film 17 is formed, and the light emitting layer in the organic EL element P is reduced. The stress generated in is reduced.

  In summary, according to the organic EL panel 10, the organic EL panel 10 can be manufactured by the above-described manufacturing method in which the light emitting layers common to all the organic EL elements P on the main substrate 11 are collectively formed, and solid sealing is employed. In addition, it is possible to prevent the light emitting layer from peeling off or floating in the organic EL element P when the sealing substrate 18 is bonded. Therefore, the possibility of uneven brightness and poor light emission is reduced.

  By the way, due to the low adhesion of the light-emitting layer that can be formed by vapor deposition of a low-molecular organic EL material, there has conventionally been a problem even when the sealing substrate is not adhered. For example, film peeling of the light emitting layer has occurred due to air blow that ejects air from an air gun to remove dust, warpage change due to vacuum suction for fixing the main substrate, re-attachment of a protective tape, peeling test, and the like. On the other hand, according to the organic EL panel 10, the light emitting layers in all the organic EL elements P on the main substrate 11 are covered with the protective film 17, and the adhesion to the main substrate 11 is sufficiently high. Therefore, such film peeling can also be prevented. That is, according to the organic EL panel 10, not only when the sealing substrate 18 is adhered, but also the light emitting layer in the organic EL element P can be prevented from peeling off or floating.

In the organic EL panel 10, all the organic EL elements P on the main substrate 11 are covered and sealed with the inorganic sealing film 16. Therefore, the sealing property is excellent as compared with an embodiment in which the inorganic sealing film 16 is not used.
In the organic EL panel 10, the light emitting layer is entirely covered with the protective film 17. Therefore, the stress generated in the light emitting layer in the organic EL element P when the sealing substrate 18 is bonded is further reduced.

  Further, in the organic EL panel 10, the protective film 17 is formed from a thermosetting resin. In general, the shrinkage stress of a thermosetting resin is smaller than the shrinkage stress of a photocurable resin (for example, an ultraviolet curable resin) that changes from a liquid to a solid by the action of light, or a composite type curable resin of light and heat. Therefore, according to the organic EL panel 10, the stress generated in the light emitting layer when the protective film 17 is formed can be further reduced.

  In the organic EL panel 10, an epoxy resin is used as the resin for forming the protective film 17. Epoxy resins have low water permeability compared to other resins such as acrylic resins and polyimide resins. Therefore, the organic EL panel 10 has higher sealing performance.

  Moreover, the organic EL panel 10 is a top emission type, and can be manufactured practically with sufficient performance. The reason for this will be described. In the case of bottom emission, the light that has traveled through the main substrate from the organic EL element is radiated to the outside, so when displaying a color image by combining a plurality of light emitting elements that emit white light and a color filter. The color filter must be placed below the anode. As the position below the anode, a position on the main substrate and a position below the main substrate are conceivable. However, it is difficult to dispose a color filter because various wirings and circuits are provided on the main substrate. If a color filter is disposed under the main substrate, the distance between the light emitting layer and the color filter is large. Therefore, there is a high possibility that light from the organic EL element P is incident on an inappropriate color filter. That is, in reality, it is difficult to manufacture, or even if manufactured, sufficient performance is not achieved. On the other hand, in the organic EL panel 10, the color filter may be disposed on the sealing substrate 18 side where only the adhesive 19 is present, and since the solid sealing is adopted, the distance between the light emitting layer and the color filter is increased. It can be made sufficiently short.

  By the way, when using a color filter, it is common to form a black matrix between the color filters in order to prevent light from the organic EL element from entering the inappropriate color filter. This formation is performed so that the black matrix runs on the edge of the color filter at the end far from the sealing substrate. Therefore, unevenness is generated on the portion where these end portions are connected, that is, on the side far from the sealing substrate of the color filter group. Prior to sealing with the sealing substrate, the color filter group is covered and protected by the acrylic layer, but the acrylic layer is also uneven. The unevenness of the acrylic layer causes refraction and scattering of light from the organic EL element in the case of can sealing. In the case of can sealing, air comes into contact with the acrylic layer, and the light traveling in the air enters the color filter through the acrylic layer, but the refractive index of acrylic (1.5) and the air Since the refractive index (1.0) differs greatly, the above refraction and scattering occur at the interface between the two. On the other hand, in the case of solid sealing, it is not air but resin (adhesive) that contacts the acrylic layer. If this resin has the same refractive index as that of acrylic, the above refraction and scattering can be avoided. Since solid sealing is employed in the present embodiment, the above-described refraction and scattering can be avoided only by using a suitable resin such as an epoxy resin as the adhesive 19.

[Image display device]
Next, an image display device including the organic EL panel 10 will be described. This image display device includes a wiring for supplying electric energy and a control signal to the organic EL panel 10, and a control signal for causing the organic EL panel 10 to form a light image according to image data given from an external device. Is provided. Although the image display device including the organic EL panel 10 can take various forms, two examples will be described here.

  FIG. 8 shows a configuration of a personal computer using the organic EL panel 10 as the display unit 31. The personal computer 30 includes a display unit 31 and a main body unit 32 as display units. The main body portion 32 is provided with a power switch 33 and a keyboard 34. According to the personal computer 30, since the organic EL panel 10 is used as the display unit 31, an image can be displayed with sufficiently high quality even in response to a demand for higher definition and a larger screen.

  FIG. 9 shows a configuration of a mobile phone using the organic EL panel 10 as the display unit 41. The cellular phone 40 includes a plurality of operation buttons 42, a scroll button 43, and a display unit 41 as a display unit. By operating the scroll button 43, the screen displayed on the display unit 41 is scrolled. According to the mobile phone 40, since the organic EL panel 10 is used as the display unit 41, an image can be displayed with sufficiently high quality even in response to a request for higher definition and a larger screen.

[Modification]
In addition, although the epoxy resin was illustrated as resin which forms a protective film, if sealing performance may fall to some extent, it will not restrict to this. For example, an acrylic resin or a polyimide resin may be used. However, as a result of experiments, it has been found that the resin forming the protective film 17 is preferably composed of an organic material.

  Moreover, although thermosetting resin was illustrated as resin which forms a protective film, you may use curable resin which is a 2 liquid mixing type adhesive agent. If a certain amount of shrinkage stress is allowed, a photocurable resin or a mixed type curable resin may be used. That is, any resin can be used for forming the protective film as long as it is a curable resin having a shrinkage stress that does not cause film peeling or floating of the light emitting layer in the organic EL element.

  Further, when no color image is displayed, it is not necessary to provide a color filter, so that a bottom emission type may be used. In the case of the bottom emission type, the anode and the main substrate must transmit light, for example, an anode made of ITO (Indium Tin Oxide), a main substrate made of glass or light-transmitting plastic Will be used. Of course, materials that do not transmit light may be used as materials for the cathode, the inorganic sealing film, the protective film, the adhesive, and the sealing substrate. Examples of such a cathode material include aluminum, and examples of such a sealing substrate material include ceramic and metal.

  In the above-described embodiment, a color image can be displayed by combining a plurality of light emitting elements that emit white light and a color filter, but a color conversion layer that converts the color of light is used instead of the color filter. You may do it. In this case, the light emitting element may emit light of a color other than white.

  Moreover, you may comprise an illuminating device using the organic electroluminescent panel 10. FIG. An illuminating device is a type of electro-optical device because it emits light in accordance with applied electric energy. Of course, you may make it comprise an illuminating device using what removed the circuit which controls the supply of the electrical energy to the color filter and the organic EL element P from the organic EL panel 10 instead of the organic EL panel 10 itself.

It is sectional drawing of the organic electroluminescent panel 10 which concerns on embodiment of this invention. FIG. 4 is a diagram showing a manufacturing process of the organic EL panel 10. FIG. 3 is a diagram showing a step subsequent to FIG. 2. FIG. 4 is a diagram showing a step subsequent to FIG. 3. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. It is a figure which shows the next process of FIG. 1 is a diagram showing an image display device provided with an organic EL panel 10. FIG. FIG. 4 is a diagram showing another image display device including an organic EL panel 10.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Organic EL panel (electro-optical device), 11 ... Main substrate, 12 ... Anode, 13 ... Light emission contribution layer (including light emission layer), 14 ... Cathode layer, 15 ... Partition, 16 ... Inorganic sealing film, 17 ... Protective film, 18 ... sealing substrate, 19 ... adhesive, 20 ... color filter group, 30, 40 ... image display device (electro-optical device), P ... organic EL element (light emitting element).

Claims (3)

A main substrate on which a plurality of light emitting elements are arranged;
A light emitting layer that can be formed by vapor deposition and is disposed on the main substrate and is common to all the light emitting elements on the main substrate;
An inorganic sealing film disposed on all the light-emitting elements, covering all the light-emitting elements, and sealing all the light-emitting elements in cooperation with the main substrate;
A protective film formed from a resin, disposed on the inorganic sealing film, covering and protecting all the light emitting elements;
A sealing substrate that is disposed on the protective film, covers all the light emitting elements, and seals all the light emitting elements in cooperation with the main substrate;
An adhesive that is filled without a gap between the sealing substrate and the main substrate and bonds them together,
An electro-optical device. The electro-optical device according to claim 1, wherein the protective film is formed of a thermosetting resin that is irreversibly cured by heating or a two-component mixed adhesive. A light emitting layer common to all the light emitting elements arranged on the main substrate is collectively formed on the main substrate by vapor deposition,
Forming an inorganic sealing film on the light emitting layer to seal all the light emitting elements in cooperation with the main substrate,
Forming a protective film for protecting all the light emitting elements by applying and curing a resin so as to cover all the light emitting elements on the inorganic sealing film,
Next, an adhesive is filled between the sealing substrate and the main substrate without any gap, and the two are bonded together.
Manufacturing method of electro-optical device.

Images