JP2010033734A - Organic electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device structured to prevent a light leakage and to suppress the damage of a sealing film. <P>SOLUTION: The organic EL device includes an element substrate 20A having a plurality of light-emitting elements 21 forming a display region, and a thin-film sealing layer F formed covering the plurality of light-emitting elements 21; a counter substrate 30A facing and stuck to the element substrate 20A; and a sealing layer 33 provided along the peripheral edge part of the facing region of the element substrate 20A and counter substrate 30A. The counter substrate 30A has a support substrate 31, a cushioning layer 34 deformable under applied stress, and a color filter layer 32 deformable following the deformation of the cushioning layer 34. The color filter layer 32 and the cushioning layer 34 are deformed following the surface shape of the thin-film sealing layer F based on the stress that sticks the element substrate 20A and counter substrate 30A to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an organic electroluminescence device.

  With the diversification of information equipment, the need for flat display devices that consume less power and are lighter is increasing. As one of such flat display devices, an organic electroluminescence device (hereinafter referred to as “organic EL device”) having an organic light emitting layer is known.

  The organic EL device includes a plurality of organic light emitting elements (organic EL elements) having a structure in which an organic light emitting layer (light emitting layer) and a functional layer such as an electron injection layer are sandwiched between an anode and a cathode. Among these, the cathode and the electron injection layer are formed of a material having a characteristic of easily emitting electrons, and thus easily react with moisture present in the atmosphere and deteriorate. When these deteriorate, a non-light-emitting region called a dark spot is formed. Therefore, in the organic EL device, a sealing structure that blocks moisture in the atmosphere from the organic light emitting element is important.

  In recent years, it has become possible to shield the organic light emitting element from the external atmosphere using a thin sealing film having a thickness of several μm. When such a sealing technique is used, a complete solid structure can be realized without a hollow structure for enclosing gas or liquid inside. An organic EL device having a solid structure can be significantly reduced in thickness and weight, and can be expected to be an organic EL device with higher functionality and quality.

  By the way, the light emission method of the organic EL device is opposite to the so-called bottom emission method in which the organic EL element is taken out from the substrate side through the substrate and the light emitted from the organic EL element is opposite to the substrate side on which the element is formed. There are two types of light emission methods, the so-called top emission method, which is taken out from the side. Comparing these two types of light emission methods, the top emission type organic EL device has a structure that is easy to increase the pixel aperture ratio and is advantageous for high definition and high image quality of the display screen. When combined with a color filter that performs color conversion, a high-performance organic EL device that takes full advantage of the top emission structure and is capable of full color display can be obtained.

  On the other hand, a top emission type organic EL device usually has a drive element for driving an organic EL element on a substrate, a plurality of organic EL elements, and a partition wall formed in a region between the organic EL elements, Etc. are laminated. For this reason, when the surface of the organic EL element is covered with the above-described sealing film, the surface of the sealing film reflects the base shape caused by the constituent elements and becomes an uneven shape. When a color filter is laminated and bonded to a sealing film having such a concavo-convex shape, a gap derived from the concavo-convex shape on the surface of the sealing film may be generated on the surface where both are bonded. Such a gap refracts and scatters the transmitted light, so that the display quality deteriorates.

  Moreover, the above-mentioned thin sealing film is easily damaged by stress such as external pressure or thermal shock. For this reason, if a foreign substance is sandwiched between the color filter and the organic EL device, the sealing film may be damaged and the sealing performance may be reduced. Furthermore, it is conceivable that stress applied in the bonding operation damages the sealing layer and the organic EL element. Once the sealing film is broken, moisture continuously enters from the broken portion, and the light emitting element continues to deteriorate. Then, not only a dark spot is generated in the damaged portion of the sealing film, but also the dark spot grows around the damaged portion and spreads the non-light emitting portion to the periphery, so that the product life is remarkably shortened.

  For such a problem, for example, techniques listed in Patent Documents 1 to 3 have been proposed. In Patent Document 1, an organic EL light emitting layer and a color filter layer are bonded together via an elastic stress relaxation layer in addition to an adhesive. With this configuration, stress due to bonding or environmental change is alleviated, and damage to the organic EL light emitting layer is suppressed.

  In Patent Document 2, an overcoat layer using a forming material having a different Young's modulus is provided on the bonding surface of the organic EL light emitting layer and the color filter layer, and the surface of the organic EL light emitting layer is bonded to each other. The unevenness of the surface is filled, and the generation of gaps is suppressed. Further, the overcoat layer having a low Young's modulus relieves stress due to bonding or changes in the environment, and suppresses damage to the organic EL light emitting layer.

In Patent Document 3, the distance between the organic EL element and the color filter is wider than the size of the foreign matter (40 μm or more), and an adhesive is filled between the organic EL element and the color filter. With this configuration, foreign matter to be sandwiched is buried in the adhesive to prevent damage to the element.
JP 2003-282259 A JP 2003-282261 A JP 2004-214155 A

  In any of the above methods, a layer such as an adhesive layer or an overcoat layer is sandwiched between the organic light emitting layer and the color filter. These layers have sufficient thickness to achieve the purpose of filling the irregularities on the surface of the organic light emitting layer and burying foreign matter in the layer, and the organic light emitting layer and the color filter are usually separated by 10 μm or more. Have a distance. In order to achieve the above object, it is effective that the separation distance is wide (the adhesive layer or the overcoat layer is thick).

  However, when the separation distance increases, the light emitted from the organic EL element not only enters the colored layer of the corresponding color filter but also irradiates in a direction other than the colored layer (oblique direction). Is likely to occur.

  When light leakage occurs, for example, when only a specific organic EL element emits light and a corresponding color filter color (for example, red) is displayed, light also enters adjacent color filters (for example, green). And mixed colors. In order to prevent color mixing, it is necessary to widen the adjacent pixels so that light from the adjacent organic EL elements does not enter, so high definition display cannot be performed. Further, when light leaks from the region where the organic EL element is disposed to the peripheral portion, the light is reflected by a casing or the like covering the outside, and the display quality at the periphery of the display portion is deteriorated.

  The present invention has been made in view of such circumstances, and the organic EL device has a structure in which the separation distance between the sealing film and the color filter layer is reduced to prevent light leakage and further, the sealing film is not damaged. An object is to provide an EL device.

  In order to solve the above problems, a first organic electroluminescence device of the present invention includes an element having a plurality of light emitting elements forming a display region and a sealing layer formed to cover the plurality of light emitting elements. A substrate, a counter substrate facing the element substrate and bonded to the element substrate, and a peripheral edge of a region where the element substrate and the counter substrate oppose each other, and the element substrate and the counter substrate are A sealing layer for fixing, the counter substrate is provided with a support substrate, a cushion layer provided at least in a region facing the display region on the support substrate, and capable of being deformed against an applied stress, and A color filter layer provided on at least a region facing the display region on the cushion layer and deformable following the deformation of the cushion layer, and the color filter And the cushion layer, based on the stress to be bonded and the counter substrate and the element substrate, characterized in that it deforms to follow the surface shape of the sealing layer.

  According to this configuration, the cushion layer and the color filter layer are deformed into a shape reflecting the surface shape of the sealing layer, and the concave and convex shapes on the surface of the sealing layer are filled and adhered. For this reason, a gap at the interface that becomes a scattering source does not occur, and deterioration of display quality can be prevented. In addition, since the separation distance between the color filter layer and the light emitting element can be reduced, light leakage can be prevented.

  Furthermore, even when a foreign object is sandwiched when bonding is performed, the cushion layer and the color filter layer are deformed according to the shape of the foreign object, and the foreign object can be buried. Therefore, the foreign substance does not damage the sealing layer and the light emitting element, and a highly reliable organic EL device can be obtained.

  In order to solve the above problems, a second organic electroluminescence device of the present invention includes a plurality of light emitting elements that form a display region, and a sealing layer that covers the plurality of light emitting elements. An element substrate, a counter substrate facing and bonded to the element substrate, and a peripheral portion of a region where the element substrate and the counter substrate are opposed to each other, the element substrate and the counter substrate And the counter substrate includes a support substrate, a cushion layer provided in a region facing at least the display region on the support substrate, and at least the display region on the cushion layer. A color filter layer provided in a region opposed to the color filter layer, and the color filter side surface of the color filter layer and the cushion layer has a surface shape of the sealing layer Characterized in that it has a follow form.

  According to this configuration, since the color filter layer and the cushion layer follow the surface shape of the sealing layer, the color filter layer is on the surface of the sealing layer at the interface between the color filter layer and the sealing layer. Closes the uneven shape and adheres. Therefore, a gap serving as a scattering source does not occur at the interface, and an organic EL device with high display quality can be obtained.

  In order to solve the above problems, a third organic electroluminescence device of the present invention includes a plurality of light emitting elements that form a display region, and a sealing layer that covers the plurality of light emitting elements. An element substrate, a counter substrate facing and bonded to the element substrate, and a peripheral portion of a region where the element substrate and the counter substrate are opposed to each other, the element substrate and the counter substrate The counter substrate includes a support substrate, and a cushion layer provided at least in a region facing the display region on the support substrate and capable of being deformed with respect to applied stress. A color filter layer provided on at least a region facing the display region on the cushion layer, the color filter layer being deformable following the deformation of the cushion layer, and the sealing layer The color filter layer is bonded through an adhesive layer having a thickness of 0.05 μm or more and 3 μm or less, and the color filter layer and the cushion layer are stresses for bonding the element substrate and the counter substrate. Based on the above, it is deformed following the surface shape of the sealing layer.

  According to this configuration, similarly to the first organic electroluminescence device of the present invention, it is possible to maintain display quality without generating a gap at the interface serving as a scattering source. Further, the thickness of the formed adhesive layer is 0.05 μm or more and 3 μm or less, and is sufficiently thin as compared with the distance between the normal color filter layer and the light emitting element. Therefore, while the color filter layer and the sealing layer are bonded, the separation distance is sufficiently thin and light leakage can be prevented. In addition, in the case where a foreign substance is sandwiched when bonding is performed, the cushion layer is deformed and the foreign substance is buried, and damage to the sealing layer and the light emitting element is suppressed. Therefore, a highly reliable organic EL device can be obtained.

In the present invention, the cushion layer preferably has a water absorption of 1% or less.
When the water absorption is higher than 1%, the moisture absorbed by the cushion layer is detached from the cushion layer when exposed to a high-temperature environment during the manufacturing process of the organic EL device or after manufacturing, and the color filter layer and the sealing layer There is a risk of dew condensation at the abutting interface. The moisture thus condensed causes a reduction in display quality. However, according to the said structure, since the water absorption rate of a cushion layer is low, there is little carrying in of the water | moisture content in an organic electroluminescent apparatus, and it can suppress a quality fall. In the present invention, the water absorption is, for example, a value measured by a method defined in JIS-K7209 “Plastics—Determination of water absorption”.

In the present invention, it is desirable that the cushion layer has a Young's modulus of 1 GPa or less.
According to this configuration, since the cushion layer can be flexibly deformed, it is possible to absorb thermal stress and suppress damage to the sealing layer. Therefore, a highly reliable organic EL device can be obtained.

In the present invention, it is desirable that the color filter layer has a Young's modulus of 1 GPa or less.
According to this configuration, since the color filter layer can also be flexibly deformed, it is possible to absorb thermal stress in cooperation with the cushion layer and suppress damage to the sealing layer. Therefore, a more reliable organic EL device can be obtained.

In the present invention, the cushion layer, the color filter layer, and the adhesive layer preferably have a Young's modulus of 1 GPa or less.
According to this configuration, since the cushion layer, the color filter layer, and the adhesive layer that bonds and fixes these layers and the sealing layer can be flexibly deformed, the thermal stress is absorbed in cooperation, Breakage of the sealing layer can be suppressed. Therefore, a highly reliable organic EL device can be obtained.

In the present invention, it is desirable that the material for forming the cushion layer is an elastomer.
According to this configuration, since the cushion layer is formed of an elastomer material that can be flexibly deformed, the cushion layer is favorably deformed at the time of bonding, and generation of a gap due to the surface shape of the sealing layer can be prevented. Further, even when a foreign object is sandwiched, the foreign object can be satisfactorily buried and damage to the sealing layer can be suppressed.

In the present invention, it is desirable that the cushion layer is formed thicker than the color filter layer.
According to this configuration, the main body of deformation becomes the cushion layer, and by deforming following the shape of the surface of the sealing layer, irregularities on the surface of the sealing layer can be absorbed.

In the present invention, the color filter layer includes a plurality of colored layers facing each of the plurality of light emitting elements, and a light shielding layer provided around the plurality of colored layers. It is desirable that it is formed to extend to the end of the cushion layer.
According to this configuration, even if there is light emitted obliquely toward the outside of the display area, the light-shielding layer extending to the end of the cushion layer can effectively shield the periphery of the display area. Light leakage can be prevented, and a high-quality organic EL device can be obtained.

An electronic apparatus according to the present invention includes the above-described organic electroluminescence device.
According to this configuration, a high-quality image display is possible and an electronic device with high reliability can be obtained.

[First Embodiment]
Hereinafter, an organic electroluminescence device (organic EL device) according to a first embodiment of the present invention will be described with reference to FIGS. In all the drawings below, the film thicknesses and dimensional ratios of the constituent elements are appropriately changed in order to make the drawings easy to see.

  FIG. 1 is a cross-sectional view schematically showing the organic EL device 1. The organic EL device in the present invention is a so-called “top emission type” organic EL device. In the top emission method, light is extracted from the opposite substrate side instead of the substrate side where the organic EL elements are arranged, so the emission area is not affected by the size of various circuits arranged on the element substrate, and a wide emission area is secured. There is an effect that can be done. Therefore, luminance can be secured while suppressing voltage and current, and the lifetime of the light-emitting element can be maintained long.

  The organic EL device 1 includes an element substrate 20A in which a plurality of light emitting elements 21 are disposed on a substrate body 20, and a counter substrate 30A having a color filter layer 32 on a support substrate 31. The element substrate 20 </ b> A is provided with a thin film sealing layer (sealing layer) F in which the electrode protective layer 17, the organic buffer layer 18, and the gas barrier layer 19 are stacked to cover the plurality of light emitting elements 21. It has been. The counter substrate 30 </ b> A is provided with a cushion layer 34 having a low Young's modulus between the support substrate 31 and the color filter layer 32. The element substrate 20A and the counter substrate 30A are bonded to each other through the seal layer 33 in a state where the thin film sealing layer F and the color filter layer 32 are in close contact with each other.

(Element board)
As the substrate body 20 provided in the element substrate 20A, either a transparent substrate or an opaque substrate can be used. Examples of opaque substrates include ceramics such as alumina, metal sheets such as stainless steel that have been subjected to insulation treatment such as surface oxidation, thermosetting resins and thermoplastic resins, and films thereof (plastic films). It is done. Examples of the transparent substrate include inorganic materials such as glass and silicon nitride, organic polymers (resins) such as acrylic resins and polycarbonate resins, and materials having optical transparency such as composite materials thereof.

  Formed on the substrate body 20 is an element layer 14 including a driving element such as a driving TFT 123, a wiring such as a scanning line and a common line, and an inorganic or organic insulating film that electrically insulates these. ing. Various wirings and driving elements can be appropriately formed by patterning by photolithography and then etching, and the insulating film can be appropriately formed by a generally known method such as vapor deposition or sputtering. The insulating film of the element layer 14 is made of, for example, silicon oxynitride.

  On the element layer 14, the planarization layer 16 for relaxing the unevenness of the surface derived from the wiring and TFT elements provided in the element layer 14, and the light emitted from the light emitting element 21 disposed on the planarization layer 16. Are formed on the support substrate 31 side. The planarizing layer 16 is formed of an insulating resin material, and photolithography is used as a forming method. Therefore, for example, a photosensitive acrylic resin or a cyclic olefin resin is used as the material.

  The metal reflector 15 is made of, for example, a metal such as aluminum or copper, and has a property of reflecting light. In this embodiment, it is made of aluminum. The metal reflecting plate 15 is disposed so as to overlap the light emitting element 21 in a plane between a light emitting element 21 described later and the substrate body 20.

  A light emitting element 21 is disposed on the planarizing layer 16 in a region overlapping the metal reflector 15 in a plane, and between the adjacent light emitting elements 21 and between the light emitting element 21 and the end of the substrate body 20. A partition wall 13 is formed between them. In other words, the light emitting element 21 is partitioned by the partition walls. The partition wall 13 is formed of an insulating resin material similarly to the planarization layer 16, and a photolithography method is used for the formation method. For example, a photosensitive acrylic resin or a cyclic olefin resin is used as the material. The partition wall 13 has a function of preventing “light leakage” in which light is emitted obliquely from the light emitting element 21 and allowing light to enter a corresponding color filter. In order to prevent light leakage from the adjacent light emitting elements 21, the partition wall 13 has a height of about 2 μm from the surface of the planarization layer 16.

  The light emitting element 21 is configured by sandwiching a light emitting layer 12 between an anode 10 and a cathode 11, and is provided on a planarizing layer 16 surrounded by a partition wall 13. The thickness of the light emitting element 21 is about 500 nm. The top surface of the light emitting element 21 and the top of the partition wall 13 have a thickness (height) difference of 1 μm or more, and in the region where the plurality of light emitting elements 21 are arranged, an uneven shape having undulations of 1 μm or more is formed. It is formed continuously.

  The anode 10 is formed on the planarizing layer 16 and connected to the driving TFT provided in the element substrate 20A. A material having a high hole injection effect having a work function of 5 eV or more is preferably used for the anode 10. Examples of such a material having a high hole injection effect include metal oxides such as ITO (Indium Thin Oxide). In this embodiment, ITO is used as the anode. Note that the anode 10 does not necessarily have light transmittance, and may be a metal electrode such as aluminum that does not transmit light. In that case, since the anode 10 reflects light and has the function of the metal reflector 15 described above, the metal reflector 15 need not be provided.

  The light emitting layer 12 employs a white light emitting layer that emits white light. In this embodiment, the white light emitting layer is formed using a low molecular weight light emitting material by a vacuum deposition method. As a white light emitting material, white light is emitted by simultaneously emitting a layer (blue) doped with an anthracene dopant in a stiltylamine luminescent layer and a layer (yellow) doped with a rubrene dopant in a stiltylamine luminescent layer. The light emitting material which implement | achieves can be mentioned. Although a low molecular light emitting material is used here, a light emitting layer may be formed using a polymer light emitting material. It is also possible to change the configuration of each layer to have a three-layer structure in which white light is extracted by simultaneously emitting red, green, and blue colors. The light emitting layer 12 may include a red light emitting layer that emits red light, a green light emitting layer that emits green light, and a blue light emitting layer that emits blue light.

  A triarylamine multimer (ATP) layer (hole injection layer), a triphenyldiamine derivative (TPD) layer (hole transport layer), the light emitting layer 12 and the cathode are provided between the anode 10 and the light emitting layer 12. It is preferable that an aluminum quinolinol (Alq3) layer (electron injection layer) and LiF (electron injection buffer layer) are respectively formed between the electrodes 11 and 11 to facilitate injection of electrons and holes from each electrode. .

  The cathode 11 covers the surfaces of the light emitting layer 12 and the partition wall 13 and extends to at least the top of the partition wall 13 disposed on the outermost side (the side closer to the outer peripheral portion of the element substrate 20A). Yes. As a material for forming the cathode 11, a material having a large electron injection effect (a work function of 4 eV or less) is preferably used. For example, calcium, magnesium, sodium, lithium metal, or a metal compound thereof. Examples of the metal compound include metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, and organometallic complexes such as acetylacetonato calcium. When these materials are used, the cathode 11 is formed using a high-density plasma film forming method such as a vacuum deposition method for a metal material and an ECR plasma sputtering method, an ion plating method, or a counter target sputtering method for a metal compound. Can do.

  In addition, these materials alone have high electrical resistance and do not function as electrodes, so patterning a metal layer such as aluminum, gold, silver, or copper to avoid the light emitting part, or transparent metals such as ITO or tin oxide You may use it as a laminated body in combination with an oxide conductive layer. In the present embodiment, a magnesium-silver alloy (MgAg) is used by adjusting the film thickness to 20 nm or less so that transparency can be obtained. The thickness of the cathode 11 is about 10 nm.

  A cathode wiring 22A is formed on the element substrate 20A in a region where the planarizing layer 16 is not formed near the outer periphery of the element substrate 20A. The cathode wiring 22A and the cathode 11 are connected by the auxiliary cathode wiring 24. Connected and conducting.

  The cathode wiring 22A is formed for the purpose of energizing the cathode 11 to a power source (not shown), and is mainly provided near the outer peripheral portion of the element substrate 20A. As a material for forming the cathode wiring 22A, an aluminum-silicon alloy, a metal such as titanium, tungsten, or tantalum is used, and those formed by laminating these materials in a single layer or multiple layers are used. In addition, ITO, which is the same material as the anode 10, is formed on the outermost layer of the cathode wiring 22A. Simultaneously with the formation of the anode 10, by forming ITO on the outermost layer of the cathode wiring 22A, corrosion of the cathode wiring 22A in the photolithography process in the manufacturing process can be prevented.

  The auxiliary cathode wiring 24 is provided at the end of the cathode 11 for the purpose of assisting the energization between the cathode 11 and the cathode wiring 22A. As a material for forming the auxiliary cathode wiring 24, a highly conductive metal such as aluminum is used, and the auxiliary cathode wiring 24 is formed by vacuum deposition or sputtering through a mask.

(Thin film sealing layer)
A thin film sealing layer F is formed on the element substrate 20A so as to cover the light emitting element 21 and have a plurality of protective layers laminated on the entire surface. As the thin film sealing layer F, the organic EL device 1 of this embodiment includes an electrode protective layer 17, an organic buffer layer 18, and a gas barrier layer 19.

  On the element substrate 20A, an electrode protection layer 17 is formed on the entire surface of the element substrate 20A so as to cover the end face of the cathode wiring 22A and the surfaces of the cathode wiring 22A, the auxiliary cathode wiring 24, and the cathode 11. The electrode protective layer 17 can suppress damage to the cathode 11 and the light emitting layer 12 therebelow, which are very thin as 20 nm or less. Further, it also has a function as a gas barrier layer that prevents moisture from entering the light emitting element 21.

  The electrode protective layer 17 can be formed using a high-density plasma film forming method such as an ECR sputtering method or an ion plating method. Before the formation, it is preferable to improve the adhesion of the film formed by oxygen plasma treatment.

  The electrode protective layer 17 is preferably composed of a silicon compound such as silicon oxynitride or silicon nitride in consideration of transparency, adhesion, water resistance, insulation, and gas barrier properties. Among these, silicon oxynitride is preferable because it can be a colorless and transparent film having desired moisture permeability by changing the ratio of oxygen and nitrogen contained therein. In this embodiment, the electrode protective layer 17 is formed using silicon oxynitride.

  The film thickness of the electrode protective layer 17 is preferably 100 nm or more, and the upper limit of the film thickness is preferably set to 200 nm or less in order to prevent generation of cracks due to stress generated by covering the partition wall 13. In the present embodiment, the electrode protective layer 17 is formed as a single layer, but may be stacked as a plurality of layers. For example, the electrode protective layer 17 may be composed of a low elastic modulus lower layer and a high water resistance upper layer.

  On the electrode protective layer 17, an organic buffer layer 18 is formed inside the electrode protective layer 17. The organic buffer layer 18 is disposed so as to fill the uneven portions of the electrode protection layer 17 formed in an uneven shape due to the shape of the partition wall 13 and to relax the undulations. The organic buffer layer 18 has a function of relieving stress generated by warping or volume expansion of the element substrate 20A and preventing the electrode protective layer 17 from peeling from the partition wall 13. Further, since the undulations on the surface of the electrode protective layer 17 are relaxed on the upper surface of the organic buffer layer 18, there is no portion where stress is concentrated in the gas barrier layer 19 described later, and the generation of cracks can be prevented.

  The organic buffer layer 18 is preferably formed of an organic compound material that is excellent in fluidity and has no solvent or volatile component, and is a raw material for the polymer skeleton, and has an epoxy group as such a forming material. Epoxy monomers / oligomers having a molecular weight of 3000 or less can be suitably used. Here, a raw material having a molecular weight of less than 1000 is a monomer, and a raw material having a molecular weight of 1000 to 3000 is an oligomer. For example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, polyethylene glycol diglycidyl ether, alkyl glycidyl ether, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, There are ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, and these may be used alone or in combination.

  Further, the forming material of the organic buffer layer 18 includes a curing agent that reacts with the epoxy monomer / oligomer. As such a curing agent, an agent that forms a cured film having excellent electrical insulation and adhesiveness, high hardness, toughness and excellent heat resistance is suitably used, and it has excellent transparency and little variation in curing. The polymerization type is preferred. For example, 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzene Acid anhydride curing agents such as tetracarboxylic dianhydride and 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride are preferred. The material for forming the organic buffer layer 18 to which these curing agents are added behaves as an excellent thermosetting resin.

  Furthermore, low-temperature curing is facilitated by adding trace amounts of amine compounds such as alcohols and aminophenols that have a high molecular weight and are difficult to volatilize such as 1,6-hexanediol as reaction accelerators that promote the reaction (ring opening) of acid anhydrides. Become. These curing is performed by heating in the range of 60 to 100 ° C., and the cured film becomes a polymer having an ester bond.

  In addition, a cation-releasing photopolymerization initiator often used to shorten the curing time may be used, but it is preferable that the reaction is slow so that the curing shrinkage does not rapidly progress, and the viscosity decreases due to heating after coating. It is preferable to finally form a cured product using thermosetting so as to promote flattening. Furthermore, a silane coupling agent that improves the adhesion to the cathode 11 and the gas barrier layer 19 and a water capturing agent such as an isocyanate compound may be mixed therein.

  The viscosity of each raw material is preferably 1000 mPa · s (room temperature: 25 ° C.) or more. This is because it does not penetrate into the light emitting layer 12 immediately after the application and does not generate a non-light emitting region called a dark spot. Further, the viscosity of the buffer layer forming material obtained by mixing these raw materials is preferably 500 to 20000 mPa · s, particularly preferably 2000 mPa · s to 10,000 mPa · s (room temperature). Moreover, it is preferable that the water content is a material adjusted to 1000 ppm or less.

  The optimum film thickness of the organic buffer layer 18 is preferably 2 μm or more and 5 μm or less. When the organic buffer layer 18 is thicker, it is easier to prevent the gas barrier layer 19 from being damaged when foreign matter is mixed in. However, when the combined thickness of the organic buffer layer 18 exceeds 5 m, a colored layer 32a and a light emitting layer 12 described later are used. This is because the light that escapes to the side surface increases as the distance increases, and the light extraction efficiency decreases.

  A gas barrier layer 19 is formed on the electrode protective layer 17 so as to cover the entire surface including the end portion of the organic buffer layer 18 and cover substantially the entire surface of the electrode protective layer 17. The gas barrier layer 19 has a function of preventing oxygen and moisture from entering the light-emitting element 21, thereby suppressing deterioration of the light-emitting element 21 due to oxygen and moisture. In consideration of transparency, gas barrier properties, and water resistance, the gas barrier layer 19 is preferably formed using a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like. In this embodiment, the gas barrier layer 19 is formed using silicon oxynitride.

  The gas barrier layer 19 can be formed using a high-density plasma film forming method such as an ECR sputtering method or an ion plating method. Before the formation, it is preferable to improve the adhesion of a film formed by performing oxygen plasma treatment on the formation surface. The film thickness of the gas barrier layer 19 is preferably 100 nm or more in order to prevent the gas barrier layer 19 from being damaged and to ensure gas barrier properties. Further, it is preferably 800 nm or less in order to prevent cracks when covering the end portions of the organic buffer layer 18 and the uneven portions such as the cathode wiring 22A. In the present embodiment, the gas barrier layer 19 is formed as a single layer, but may be stacked as a plurality of layers.

(Opposite substrate)
The counter substrate 30 </ b> A includes a color filter layer 32 and a cushion layer 34 formed on the support substrate 31.

  The support substrate 31 is a substrate having a light transmission property for transmitting light emitted from the light emitting element 21 and a strength for protecting the thin film sealing layer F. For example, an inorganic material such as glass, quartz glass, silicon nitride, It can be formed using an organic polymer (resin) having light transmissivity, such as polyethylene terephthalate resin, acrylic resin, polycarbonate resin, and polyolefin resin. In addition, a composite material formed by laminating or mixing the above materials can be used as long as it has optical transparency. Among them, a glass substrate is particularly preferably used because of its high transparency and low moisture permeability. Further, a layer that blocks or absorbs ultraviolet rays, a functional layer such as a light reflection preventing film or a heat dissipation layer may be formed.

A cushion layer 34 is formed on the element substrate 20 </ b> A side of the support substrate 31. The cushion layer 34 is preferably made of a material having light permeability and high flexibility, a Young's modulus of 1 GPa or less (preferably 0.001 or more and 0.1 GPa or less), and a density of 1.8 g / cm ³ or less (preferably). Is preferably 0.8 g / cm ³ or more and 1.4 g / cm ³ or less). In this embodiment, an elastomer material is used as the cushion layer 34.

  As an elastomer that can be used as a material for forming the cushion layer 34 of the present embodiment, silicone rubber, fluorine rubber, urethane rubber, styrene rubber, acrylic rubber, natural rubber, and the like that are three-dimensionally crosslinked at 80 to 150 ° C. Rubbers that are curable by heating, thermoplastics that soften by heating at 80 to 150 ° C., such as low density polyethylene (LDPE), EAA (ethylene-acrylic acid copolymer) and EVA (ethylene-vinyl acetate copolymer) Mention may be made of elastomeric resins. Further, even a urethane sponge having fine bubbles needs only to satisfy transparency, Young's modulus, and density.

  A color filter layer 32 is formed on the cushion layer 34. In the color filter layer 32, a colored layer 32a that modulates transmitted light into any one of red (R), green (G), and blue (B) is arranged in a matrix. The colored layer 32a is formed by mixing a pigment or dye showing red, green, and blue in a resin layer such as an acrylic resin. Moreover, it is good also as providing colored layers 32a, such as light blue, light cyan, and white, as needed.

  Each of the colored layers 32a is disposed to face the light emitting element 21 that emits white light. Thereby, the light emitted from the light emitting element 21 passes through each of the colored layers 32a and is emitted to the viewer side as red light, green light, and blue light to perform color display.

  A black matrix layer 32b that prevents light leakage and improves visibility is formed between the adjacent colored layers 32a and around the colored layer 32a. The black matrix layer 32b is also formed of a resin colored black.

  The color filter layer 32 is adjusted to a thickness suitable for each color in the range where the colored layer 32a is 0.5 μm or more and 2 μm or less. The black matrix layer 32b has a thickness of about 1 μm. Further, the cushion layer 34 is formed to be thicker than the colored layer 32a or the black matrix layer 32b, and is preferably 3 μm or more and 20 μm or less. Since the cushion layer 34 is thick like this, it can be deformed following the unevenness generated at the joint between the colored layer 32a and the black matrix layer 32b and the unevenness on the surface of the thin film sealing layer F, and absorbs the unevenness. be able to.

  The color filter layer 32 is bonded in contact with the thin film sealing layer F of the element substrate 20A. Here, the Young's modulus of the color filter layer 32 is 3 GPa or less, preferably 1 GPa or less. As a result, the surface of the color filter layer 32 can be deformed following the surface shape of the thin film sealing layer F, and the two are in close contact with each other without a gap. As the color filter layer 32 is deformed, the cushion layer 34 is also deformed.

(Seal layer)
The element substrate 20A and the counter substrate 30A have a seal layer 33 disposed in the vicinity of the outer peripheral portion of the element substrate 20A in a state where the surface of the color filter layer 32 is deformed and adhered following the surface shape of the thin film sealing layer F. Are pasted together.

  The seal layer 33 has a function of preventing moisture from entering the inside of the apparatus and a function of fixing a bonding position between the element substrate 20A and the counter substrate 30A. Further, by bonding the element substrate 20A and the counter substrate 30A, the cushion layer 34 absorbs a deformed portion that deforms in the substrate surface direction, and maintains the adhesion between the color filter layer 32 and the thin film sealing layer F. Also has.

  The forming material of the sealing layer 33 is made of a resin material that is cured by ultraviolet rays and has an improved viscosity. Preferably, an epoxy monomer / oligomer having an epoxy group and having a molecular weight of 3000 or less is used. Here, monomers having a molecular weight of less than 1000 are monomers, and those having a molecular weight of 1000 to 3000 are oligomers. Examples of such a forming material include bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, ε- There are caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, and these are used alone or in combination.

    Further, the forming material of the seal layer 33 includes a curing agent that reacts with the epoxy monomer / oligomer. Depending on the type of curing agent to be added, the epoxy resin can be either a thermosetting type or a photocurable type. Here, a photoreactive initiator that causes a cationic polymerization reaction mainly by ultraviolet irradiation, such as a diazonium salt, diphenyliodonium salt, trifellsulfonium salt, sulfonate ester, iron arene complex, silanol / aluminum complex, is suitable. Used. The material for forming the seal layer 33 to which these curing agents are added behaves as a light (ultraviolet) curable resin.

  The viscosity at the time of applying the forming material of the seal layer 33 is preferably 10 Pa · s or more and 200 Pa · s or less (room temperature). In addition, when an additive called a cation hold agent is used so that the viscosity gradually increases after ultraviolet irradiation, the light irradiation step after bonding can be eliminated, and the forming material of the seal layer 33 hardly flows. Therefore, the bonding process is facilitated. Further, even a narrow seal width of 1 mm or less is preferable because the seal layer 33 can be prevented from being ruptured and the filler after sticking can be prevented from sticking out. Moreover, it is preferable that the water content is a material adjusted to 1000 ppm or less.

  Usually, the material for forming the seal layer 33 is a spherical particle (spacer) having a predetermined particle diameter for controlling the distance between the substrates, or a scaly or massive inorganic material (inorganic filler) for adjusting the viscosity. Etc.) are often mixed. However, since these fillers may damage the gas barrier layer 19 at the time of bonding and pressure bonding, in this embodiment, a seal layer forming material in which these fillers are not mixed is used.

In the organic EL device 1, a plurality of light emitting elements 21 form a display region H, and a peripheral portion of the display region H is a frame portion G that is a non-light emitting portion. The frame part G is, for example, between the top of the partition wall 13 provided on the outermost part on the element substrate 20A and the end of the element substrate 20A. The cushion layer 34 is formed up to a region overlapping with the frame portion G, and the end portion of the black matrix layer 32 b extends to the frame portion G.
The organic EL device 1 of the present embodiment has the above configuration.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device 1 according to this embodiment will be described with reference to FIGS. 2 is a process diagram for forming the thin film sealing layer F on the element substrate 20A of the organic EL device 1, FIG. 3 is a process diagram for forming the counter substrate 30A, and FIG. 4 is a process diagram for facing the element substrate 20A. It is process drawing until it bonds to the board | substrate 30A and is set as the organic EL apparatus 1. FIG.

  First, as shown in FIG. 2A, the electrode protective layer 17 is formed on the element substrate 20A on which the cathode 11 is laminated. For example, as described above, silicon nitride, silicon oxynitride, or the like is formed by a high-density plasma film formation method such as an ECR sputtering method or an ion plating method. Note that the electrode protective layer 17 may be formed by laminating an inorganic oxide such as silicon oxide as a transparent inorganic material or an alkali halide such as LiF or MgF by a vacuum deposition method or a high-density plasma film formation method.

  Next, as shown in FIG. 2B, the organic buffer layer 18 is formed on the electrode protective layer 17. Specifically, first, a material for forming the organic buffer layer 18 is disposed by a screen printing method in a reduced pressure atmosphere. By disposing the forming material of the organic buffer layer 18 in a reduced pressure atmosphere, volatile impurities and moisture contained in the forming material of the organic buffer layer 18 and the screen mesh can be removed as much as possible. Further, in the screen printing method, the surface of the material disposed by the squeegee friction is forcibly flattened, so that the material surface can be flattened as compared with other material placement methods.

  The viscosity of the forming material of the organic buffer layer 18 is preferably 3000 mPa · s or more and 7000 mPa · s (room temperature) or less in consideration of the ease of application by the screen printing method and the film forming accuracy. In this embodiment, the viscosity of the material for forming the organic buffer layer 18 is 5000 mPa · s. Moreover, it is preferable to adjust the water content to 1000 ppm or less in advance because foaming under a reduced pressure environment is suppressed and the operation becomes easy.

  Subsequently, the formed material of the organic buffer layer 18 is cured by heating in the range of 60 to 100 ° C. This heat curing is performed in a nitrogen atmosphere in which moisture at atmospheric pressure is controlled to 10 ppm or less. At this time, since the viscosity of the forming material of the organic buffer layer 18 temporarily decreases immediately after the heating until the reaction is started, the forming material passes through the electrode protective layer 17 and the cathode 11 to transmit the light emitting layer 12. There is a risk of infiltrating into and generating dark spots. Therefore, it is preferable to cure at a low temperature of 60 to 80 ° C. until the curing proceeds to some extent, and raise the temperature to 80 ° C. or higher when the reaction proceeds to a certain extent and the viscosity is increased.

  When the organic buffer layer 18 is formed in this manner, the surface of the organic buffer layer 18 has some unevenness due to curing shrinkage of the forming material of the organic buffer layer 18, flow due to a viscosity change at the time of curing, and the like. Arise. The irregularities are formed so as to be highly bulged at a portion overlapping the partition wall 13 in a planar manner and to be recessed low at a portion overlapping the light emitting element 21 in a planar manner.

  Next, as shown in FIG. 2C, the gas barrier layer 19 is provided on the organic buffer layer 18 to form the element substrate 20A. Specifically, it is formed by a high density plasma film forming method such as an ECR sputtering method or an ion plating method. Note that before the formation, it is preferable to improve adhesion by oxygen plasma treatment because reliability is improved. Further, when the gas barrier layer 19 and the electrode protective layer 17 are formed using the same material and a common mask in the manufacturing process, the manufacturing process and the manufacturing apparatus can be simplified. The surface of the gas barrier layer 19 reflects the surface shape of the organic buffer layer 18 having irregularities and is formed in a state having irregularities.

  As described above, the unevenness caused by the shape of the partition wall 13 and the light emitting element 21 has undulations of 1 μm or more. However, by laminating a plurality of layers, the surface of the gas barrier layer 19 (the thin film sealing layer F) The unevenness of the (surface) is relaxed to about several tens of nanometers. In the drawing, the illustration is emphasized for the sake of easy understanding.

  On the other hand, on the counter substrate 30A side, a cushion layer 34 is first formed on the support substrate 31 as shown in FIG.

  When the rubber is used as the forming material, the cushion layer 34 is formed by dissolving the forming material using a solvent or emulsifying the forming material using a surfactant, and applying it by roll coating or printing. Can do. When emulsifying the forming material, it is preferable to select a surfactant having a refractive index that is not different from the refractive index of the forming material of the cushion layer 34. Alternatively, it is possible to select a light with a refractive index difference that is small enough that the quality of the light transmitted through the cushion layer 34 is not affected. In the case of a thermoplastic elastomer, a coating method such as an extrusion coating method or a curtain coating method by extrusion molding using a slit die can be used.

  Next, as shown in FIG. 3B, the color filter layer 32 is provided on the flat portion of the surface of the formed cushion layer 34 to form the counter substrate 30A. The color filter layer 32 is formed by transferring a color filter layer previously formed on another support onto the cushion layer 34, or printing on the cushion layer 34 by a printing method such as a droplet discharge method or a flexographic printing method. It can be formed by using various printing methods such as direct formation. When forming by the printing method, a solvent that dissolves the forming material of the color filter layer 32 is selected so as not to dissolve the cushion layer 34. Alternatively, it is desirable to select a type that does not easily impregnate the cushion layer 34. When the cushion layer 34 is slightly impregnated with the solvent to be used, it is preferable to reduce the residual amount of the solvent in the cushion layer 34 by sufficiently drying after the color filter layer 32 is formed.

  Next, as shown in FIG. 3C, a material for forming the seal layer 33 is disposed around the counter substrate 30A, and a material layer 33a is provided. Specifically, the material for forming the seal layer 33 described above is applied around the support substrate 31 by a needle dispensing method. Note that this printing method may be a screen printing method. The viscosity at the time of application | coating of the forming material of the sealing layer 33 which concerns on this embodiment is 50 Pa.s (room temperature). The water content is adjusted in advance to 1000 ppm or less.

  Subsequently, as shown in FIG. 4A, alignment work between the substrates is performed, and the thin film sealing layer F of the element substrate 20A and the color filter layer 32 of the counter substrate 30A are opposed to each other and pressure bonded. Do. Bonding is performed under a reduced pressure atmosphere.

  By the pressure bonding, the cushion layer 34 is deformed, and the color filter layer 32 (the colored layer 32a and the black matrix layer 32b) is deformed following the irregularities on the surface of the thin film sealing layer F. Although the cushion layer 34 spreads in the substrate surface direction, the material layer 33a disposed around the cushion layer 34 is uncured at the time of deformation, and therefore does not hinder the deformation of the cushion layer 34. Therefore, the deformation of the cushion layer 34 overlaps with the material layer 33a in a plan view and is absorbed by the material layer 33a. In addition, since this bonding is performed in a reduced pressure atmosphere, the color filter layer 32 and the thin film sealing layer F are in close contact with each other without entering bubbles or moisture.

  Curing of the material layer 33a (forming material of the seal layer 33) is started by irradiation with ultraviolet rays. The irradiation timing of ultraviolet rays is selected according to the curing speed of the forming material of the seal layer 33 to be used. In the case of a forming material having a high curing rate, ultraviolet irradiation is performed after bonding. In the case of a forming material having a slow curing rate, irradiation is performed in advance before bonding, and a curing reaction is started.

  Next, as shown in FIG. 4B, after pressure-bonding and bonding, heating (post-baking) is performed in the air to complete the curing of the forming material of the seal layer 33. From the above, the organic EL device 1 in the present embodiment can be obtained.

  According to the organic EL device 1 having the above-described configuration, the cushion layer 34 and the color filter layer 32 are deformed into a shape reflecting the surface shape of the thin film sealing layer F in accordance with the pressure, and are in close contact with the unevenness. To do. For this reason, a gap that becomes a scattering source does not occur, and display quality can be maintained. In addition, since a layer that increases the distance from the light emitting element 21 is not interposed between the color filter layer 32 and the thin film sealing layer F, the color filter layer 32 can be brought closer to the light emitting element 21 to prevent light leakage. . Furthermore, since the cushion layer and the color filter layer can be deformed even when a foreign substance is sandwiched during bonding, the foreign substance does not damage the sealing layer and the light emitting element, and the organic layer is highly reliable. It can be an EL device.

  In the present embodiment, the cushion layer 34 is formed using an epoxy resin having a water absorption rate of 1% or less. If the water absorption rate of the cushion layer 34 is higher than 1%, the moisture absorbed by the cushion layer 34 may be desorbed and dew condensation may occur at the interface between the color filter layer 32 and the thin film sealing layer F. Such moisture causes a reduction in display quality. However, according to the configuration of the present embodiment, since the water absorption rate of the cushion layer 34 is low, moisture is not brought into the organic EL device 1 and deterioration in quality can be suppressed.

  In the present embodiment, the material for forming the cushion layer 34 is an elastomer. Therefore, the cushion layer 34 can be flexibly deformed along the surface shape of the thin film sealing layer F when the element substrate 20A and the counter substrate 30A are bonded to each other. Moreover, even if it is a case where a foreign material is inserted | pinched, a foreign material can be favorably embedded and damage to the thin film sealing layer F can be suppressed.

  In the present embodiment, the cushion layer 34 is formed thicker than the color filter layer 32. Therefore, unevenness on the surface of the thin film sealing layer F can be absorbed by deforming following the shape of the surface of the thin film sealing layer F.

  In the present embodiment, the color filter layer 32 and the cushion layer 34 are deformed into a shape reflecting the surface shape of the thin film sealing layer F according to the pressure, but the surfaces of the color filter layer 32 and the cushion layer 34 are used. The shape itself may have a shape that follows the surface shape of the thin-film sealing layer F without applying pressure. Even in such a case, since the color filter layer 32 is in close contact with the concavo-convex shape of the thin film sealing layer F, a gap that becomes a scattering source does not occur, and display quality can be maintained.

(Modification)
The arrangement shape of the black matrix layer 32b is not limited to that of the present embodiment. FIG. 5 is a cross-sectional view of an organic EL device 2 according to a modification of the present invention, and corresponds to FIG. In the organic EL device 2, the black matrix layer 32 b is formed to extend until it covers the end of the cushion layer 34 and comes into contact with the support substrate 31.

  When the black matrix layer 32 b having such a shape is provided, the black matrix layer 32 b partially shields the arrangement region of the seal layer 33 and inhibits the photocuring reaction of the forming material of the seal layer 33. Therefore, it is preferable to form a seal layer 33 by adding a curing agent that causes a thermosetting reaction to the material for forming the seal layer 33 and performing thermosetting.

  In the organic EL device 2 including the black matrix layer 32b that is widely formed in this way, even if there is light emitted obliquely toward the frame portion G, it extends to the end portion of the cushion layer 34. Since the black matrix layer 32b shields well, light leakage around the display area can be prevented.

[Second Embodiment]
6 to 8 are explanatory diagrams of an organic EL device according to the second embodiment of the present invention. The organic EL of this embodiment is partially in common with the organic EL device of the first embodiment. The difference is that an adhesive layer is provided between the color filter layer and the thin film sealing layer. Therefore, in this embodiment, the same code | symbol is attached | subjected about the component which is common in 1st Embodiment, and detailed description is abbreviate | omitted.

  FIG. 6 is a cross-sectional view schematically showing the organic EL device 3, and corresponds to FIG. 1 of the first embodiment. In the organic EL device 3 of the present embodiment, an adhesive layer 36 is provided between the color filter layer 32 and the thin film sealing layer F to adhere them. The adhesive layer 36 is intended to improve adhesion so that the thin film sealing layer F and the color filter layer 32 do not peel off due to thermal shock or the like.

  The material for forming the adhesive layer 36 may be an elastomer material such as the cushion layer 34, but may also be a material that is applied with a liquid adhesive such as an epoxy adhesive and thermally cured after bonding.

  In the case of a liquid adhesive, since the film thickness needs to prevent light leakage, it is thinner than the cushion layer 34 and is preferably in the range of 0.05 μm to 3 μm. From the viewpoint of preventing light leakage, it is preferable to form an adhesive layer that is as thin as possible. However, it is difficult to form an adhesive layer that is thinner than 0.05 μm, and productivity is reduced. An adhesive layer larger than 3 μm is unsuitable because the risk of light leakage increases. From the balance between productivity and light leakage suppression, the thickness of the adhesive layer is more preferably about 0.1 μm or more and 1 μm or less. The “film thickness” of the adhesive layer 36 refers to the thickness of the adhesive layer 36 sandwiched between the colored layer 32 a of the color filter layer 32 and the thin film sealing layer F.

  The material for forming the liquid adhesive layer 36 is preferably an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less as a main component. For example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, ε-caprolactone modified 3,4-epoxycyclohexyl Examples thereof include methyl 3 ′, 4′-epoxycyclohexanecarboxylate, and these are used alone or in combination.

  The material for forming the adhesive layer 36 includes a curing agent that reacts with the epoxy monomer / oligomer. Examples of the curing agent include 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2 , 4,5-benzenetetracarboxylic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride and other acid anhydride curing agents, aromatic amines, aminophenols, aminoamides, etc. The material for forming the adhesive layer 36 to which these curing agents can be used which can use an amine curing agent behaves as a thermosetting resin. Furthermore, additives such as a silane coupling agent may be mixed. It is preferable that the adhesive layer 36 after these are cured has a Young's modulus of 1 GPa or less because it can be deformed flexibly, so that it can absorb thermal stress and suppress damage to the sealing layer.

  The material for forming the adhesive layer 36 is filled with a spacer for controlling the distance between the substrates and a flake-like or massive inorganic filler for adjusting the viscosity, like the material for forming the sealing layer 33. A forming material that is not mixed with materials is used.

  Next, a method for manufacturing the organic EL device 3 in the present embodiment will be described with reference to FIGS. Here, the description will focus on the step of forming the adhesive layer 36, and the steps similar to those of the first embodiment will be omitted.

  As shown in FIG. 7A, the cushion layer 34 and the color filter layer 32 are formed on the support substrate 31 by the method shown in the first embodiment to obtain the counter substrate 30A. The figure corresponds to FIG. 3B of the first embodiment.

  Next, as shown in FIG. 7B, a material layer 36 a that is a layer made of a material for forming an adhesive layer is formed so as to cover the color filter layer 32. The material layer 36a is formed as follows, for example. First, the above-described forming material is dissolved in a solvent to prepare a solution having a solid content concentration of 20% by weight, and the solution is reduced to 5 μm by using a slit coating method, a roll coating method, a screen printing method, a dispensing method, or the like. Apply to. Thereafter, by evaporating the solvent, a material layer 36a having a thickness of 1 μm can be obtained.

  Next, as shown in FIG. 7C, a material for forming the seal layer 33 is disposed on the peripheral portion and the peripheral portion of the material layer 36a to form a material layer 33a. The application method and conditions are the same as those in the manufacturing method of the first embodiment, and the same method as in FIG. 3C can be used.

  Subsequently, as shown in FIG. 8A, alignment work between the substrates is performed, and the thin film sealing layer F of the element substrate 20A and the color filter layer 32 of the counter substrate 30A are opposed to each other by pressure bonding. Do. Bonding is performed under a reduced pressure atmosphere. The application method and conditions are the same as those in the manufacturing method of the first embodiment, and the same method as in FIG. 4A can be used. At the time of bonding, depending on the material for forming the adhesive layer (the material for forming the material layer 36a), the material layer 36a may be spread and spread in the substrate surface direction, but is buried in the surrounding material layer 33a. There is no leakage to the outside.

Next, as shown in FIG. 8B, the material layer 36 a is thermally cured to form the adhesive layer 36 by heating in the air after being bonded by pressure bonding. At the same time, curing of the material for forming the seal layer 33 is completed. The material layer 36a is cured by heating in a temperature range of 80 to 120 ° C., and the cured film becomes a polymer having an ester bond that is excellent in adhesion to silicon oxynitride.
From the above, the organic EL device 3 in the present embodiment can be obtained.

  According to the organic EL device 3 having the above-described configuration, a gap serving as a scattering source does not occur and display quality can be maintained. Further, since the thickness of the adhesive layer 36 to be formed is sufficiently thin such as 0.05 μm or more and 3 μm or less, the adhesive layer 36 is filled at the interface between the color filter layer 32 and the thin film sealing layer F, and both are bonded. While bonding, the separation distance can be made sufficiently thin, and light leakage can be prevented. In addition, when a foreign substance is sandwiched when the bonding is performed, the cushion layer 34, not the adhesive layer 36, is deformed to suppress damage to the thin film sealing layer F and the light emitting element 21. Therefore, the organic EL device 3 with high reliability can be obtained.

  In the present embodiment as well, as in the first embodiment, the black matrix layer 32b may be formed to extend until it covers the end of the cushion layer 34 and comes into contact with the support substrate 31. In this way, light leakage around the display area can be prevented as in the first embodiment.

  In this embodiment, the material for forming the seal layer 33 is disposed after the material layer 36a is formed. However, the material layer 36a may be formed after the material for forming the seal layer 33 is disposed. Absent.

  In that case, the forming material of the seal layer 33 has a bank function that prevents absorption of the deformed portion of the material layer 36a and prevents spreading of the material layer 36a, so that the viscosity at the time of application is 10 Pa · s to 200 Pa · s ( Room temperature). Further, when the forming material of the seal layer 33 is arranged in a narrow width of 1 mm or less in order to achieve a narrow frame width, a forming material having a slow curing rate is used, and ultraviolet irradiation is performed in advance before bonding to increase the viscosity. And good. This is preferable because a bank function can be satisfactorily exhibited even with a narrow seal layer.

  The material for forming the adhesive layer 36 should have a low viscosity in order to improve the filling property without biting bubbles during application, but it is not preferable because the peripheral seal is likely to be cut if it is too low. Therefore, the thing of the range of 100 mPa * s or more and 1000 mPa * s or less (room temperature) is preferable.

[Electronics]
Next, an embodiment of the electronic device of the present invention will be described. FIG. 9 shows an example of an electronic apparatus using the organic EL device of the present invention. FIG. 9 (a) is a perspective view showing a mobile phone, and FIG. 9 (b) is a perspective view showing a television receiver. It is. FIG. 9A shows an example in which the organic EL device of the present invention is applied to a small panel such as a mobile phone display unit, and FIG. 9B shows the display of the organic EL device of the present invention on a thin TV. This is an example of application to a large panel such as a part.

  A cellular phone 1300 illustrated in FIG. 9A includes the organic EL device of the present invention as a small-sized display portion 1301 and includes a plurality of operation buttons 1302, an earpiece 1303, and a mouthpiece 1304. . Thereby, it is possible to provide a mobile phone 1300 provided with a display unit that is configured by the organic EL device of the present invention and has excellent display quality.

  A television receiver 1400 illustrated in FIG. 9B includes a receiver main body (housing) 1402, an audio output unit 1404 such as a speaker, and a display unit 1406 using the organic EL device 1 described above. Accordingly, a lightweight thin large-screen television 1400 that includes the high-quality display portion 1406 can be provided.

  Since these electronic devices include the organic EL device of the present invention, high-quality image display is possible and electronic devices with high reliability can be obtained.

  The organic EL device of the present invention is not limited to the above-described electronic device, but an electronic book, a projector, a personal computer, a digital still camera, a television receiver, a viewfinder type or a monitor direct-view type video tape recorder, a car navigation device, It can be suitably used as image display means for pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals, touch panel-equipped devices, etc., and such a configuration provides high display quality and reliability. It is possible to provide an electronic device provided with a display portion that is excellent in the above.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

1 is a cross-sectional view schematically showing an organic EL device according to a first embodiment. It is process drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 1st Embodiment. It is process drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 1st Embodiment. It is process drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 1st Embodiment. It is sectional drawing of the organic electroluminescent apparatus which concerns on the modification of this invention. It is sectional drawing which shows typically the organic electroluminescent apparatus concerning 2nd Embodiment. It is process drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 2nd Embodiment. It is process drawing which shows the manufacturing method of the organic electroluminescent apparatus concerning 2nd Embodiment. It is a perspective view which shows the example of the electronic device of this invention.

Explanation of symbols

  1, 2, 3 ... Organic EL device (organic electroluminescence device), 20A ... element substrate, 21 ... light emitting element, 30A ... counter substrate, 31 ... support substrate, 32 ... color filter layer, 32a ... colored layer, 32b ... black Matrix layer (light-shielding layer), 33 ... sealing layer, 34 ... cushion layer, 36 ... adhesive layer, 1300 ... mobile phone (electronic device), 1400 ... television receiver (electronic device), F ... thin film sealing layer (sealing) Stop layer), H ... Display area

Claims (11)

An element substrate having a plurality of light emitting elements forming a display region, and a sealing layer formed to cover the plurality of light emitting elements;
A counter substrate facing the element substrate and bonded to the element substrate;
A seal layer provided along a peripheral portion of a region where the element substrate and the counter substrate face each other, and fixing the element substrate and the counter substrate;
The counter substrate includes a support substrate,
A cushion layer provided at least in a region facing the display region on the support substrate and capable of being deformed by applied stress;
A color filter layer provided in at least a region facing the display region on the cushion layer and deformable following the deformation of the cushion layer;
The organic electroluminescence device, wherein the color filter layer and the cushion layer are deformed following the surface shape of the sealing layer based on a stress for bonding the element substrate and the counter substrate. apparatus. An element substrate having a plurality of light emitting elements forming a display region, and a sealing layer formed to cover the plurality of light emitting elements;
A counter substrate facing the element substrate and bonded to the element substrate;
A seal layer provided along a peripheral portion of a region where the element substrate and the counter substrate face each other, and fixing the element substrate and the counter substrate;
The counter substrate includes a support substrate,
A cushion layer provided in a region facing at least the display region on the support substrate;
A color filter layer provided in an area facing at least the display area on the cushion layer,
The surface of the color filter side of the color filter layer and the cushion layer has a shape that follows the surface shape of the sealing layer. An element substrate having a plurality of light emitting elements forming a display region, and a sealing layer formed to cover the plurality of light emitting elements;
A counter substrate facing the element substrate and bonded to the element substrate;
A seal layer provided along a peripheral portion of a region where the element substrate and the counter substrate face each other, and fixing the element substrate and the counter substrate;
The counter substrate includes a support substrate,
A cushion layer provided at least in a region facing the display region on the support substrate and capable of being deformed by applied stress;
A color filter layer provided in at least a region facing the display region on the cushion layer and deformable following the deformation of the cushion layer;
The sealing layer and the color filter layer are bonded via an adhesive layer having a thickness of 0.05 μm or more and 3 μm or less,
The organic electroluminescence device, wherein the color filter layer and the cushion layer are deformed following the surface shape of the sealing layer based on a stress for bonding the element substrate and the counter substrate. apparatus.   The organic electroluminescence device according to any one of claims 1 to 3, wherein the cushion layer has a water absorption rate of 1% or less.   The organic electroluminescence device according to any one of claims 1 to 4, wherein the cushion layer has a Young's modulus of 1 GPa or less.   6. The organic electroluminescent device according to claim 5, wherein the color filter layer has a Young's modulus of 1 GPa or less.   The organic electroluminescence device according to claim 3, wherein the cushion layer, the color filter layer, and the adhesive layer have a Young's modulus of 1 GPa or less.   The organic electroluminescence device according to any one of claims 1 to 7, wherein a material for forming the cushion layer is an elastomer.   The organic electroluminescence device according to claim 1, wherein the cushion layer is formed thicker than the color filter layer. The color filter layer has a plurality of colored layers facing each of the plurality of light emitting elements, and a light shielding layer provided around the plurality of colored layers,
The organic electroluminescence device according to claim 1, wherein the light shielding layer is formed to extend to an end portion of the cushion layer.   An electronic apparatus comprising the organic electroluminescence device according to claim 1.

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