JP5228513B2 - Organic EL device - Google Patents

Description

  The present invention relates to an organic EL device and a method for manufacturing the same.

2. Description of the Related Art Conventionally, an organic electroluminescence device (hereinafter, referred to as an organic EL device) including a plurality of light emitting elements in which an organic light emitting layer is sandwiched between a pair of electrodes is known. The organic EL device includes an element substrate including a sealing layer that covers the plurality of light emitting elements, a sealing substrate that is disposed to face the element substrate and is bonded to the element substrate via an adhesive layer, And a frame-shaped sealing layer that adheres the peripheral portion of the substrate (see, for example, Patent Document 1).
JP 2003-173868 A

  However, in the conventional organic EL device, an uncured sealing layer material is arranged in a frame shape on one substrate, and after a liquid adhesive layer material is arranged on the inside thereof, the other substrate is arranged on the substrate on which the sealing material is arranged. It is formed by arranging the substrates facing each other and bonding them. Therefore, the adhesive layer material is compressed between the two substrates and pushed out to the outer peripheral side of both the substrates, which may damage the uncured seal layer material. When the sealing layer material is damaged, there is a problem that the adhesive layer material leaks outside the frame-shaped sealing layer.

  Therefore, the present invention provides an organic EL device capable of preventing the adhesive layer material from leaking to the outside when the element substrate and the sealing substrate are bonded via the adhesive layer material, and a method for manufacturing the same. .

In order to solve the above-described problems, an organic EL device of the present invention includes a plurality of light-emitting elements each having a functional layer having at least an organic light-emitting layer between a pair of electrodes, and a sealing covering the plurality of light-emitting elements. And a sealing substrate disposed opposite to the element substrate and bonded to the element substrate via an adhesive layer, and outside the display region in which the plurality of light emitting elements are disposed In addition, a groove-shaped peripheral recess that accommodates a peripheral portion of the adhesive layer and defines an outer edge of the adhesive layer is formed surrounding the display region.
In order to solve the above-described problems, an organic EL device according to the present invention includes a plurality of light-emitting elements each having a light-emitting layer between a pair of electrodes, and an element substrate provided with a sealing layer that covers the plurality of light-emitting elements. An organic EL device in which a colored layer and a sealing substrate provided with a coating layer covering the colored layer are bonded so that the light emitting element and the colored layer are opposed to each other by an adhesive layer, The layer is provided with a peripheral recess on the outer side of the colored layer so as to surround the display area in which the plurality of light emitting elements are disposed, and a peripheral edge of the adhesive layer is disposed in the peripheral recess, An outer edge of the adhesive layer is defined by a peripheral recess.
In order to solve the above-described problems, an organic EL device according to the present invention includes a plurality of light-emitting elements each having a light-emitting layer between a pair of electrodes, and an element substrate provided with a sealing layer that covers the plurality of light-emitting elements. An organic EL device in which a colored layer and a sealing substrate provided with a coating layer covering the colored layer are bonded so that the light emitting element and the colored layer are opposed to each other by an adhesive layer, The layer is provided with a peripheral recess on the outside of the colored layer so as to surround the display region in which the plurality of light emitting elements are arranged, and the adhesion provided between the sealing layer and the covering layer The layer is not in contact with the peripheral edge of the sealing layer, the peripheral edge of the adhesive layer is disposed in the peripheral recess, and the peripheral recess defines the outer edge of the adhesive layer It is characterized by being.

  With this configuration, when the element substrate and the sealing substrate are bonded, an uncured adhesive layer material is disposed in the display region between the two substrates, and the adhesive layer material is sandwiched between the substrates and pressed. The adhesive layer material is compressed between the two substrates and pushed out of the display area to the outer peripheral side of the two substrates. At this time, the peripheral edge portion of the adhesive layer material pushed out from the display area inside the peripheral concave portion to the outer peripheral side of both substrates flows into and is accommodated in the peripheral concave portion. This prevents the peripheral edge portion of the adhesive layer material from being pushed out to the outer peripheral side of both substrates beyond the peripheral recess. Therefore, the adhesive layer material can be prevented from leaking to the outside, and the outer edge of the adhesive layer after the adhesive layer material is cured can be defined by the peripheral recess.

In the organic EL device of the present invention, the peripheral recess is formed on a surface of the sealing substrate facing the element substrate.
The organic EL device of the present invention is characterized in that the adhesive layer does not have a portion in contact with the element substrate.
Further, the organic EL device of the present invention is characterized in that a seal layer is provided outside the peripheral recess, and there is no portion in contact with the seal layer and the adhesive layer.
In the organic EL device of the present invention, the sealing substrate and the adhesive layer are formed of a light-transmitting material, and a light-shielding layer that partitions the colored layer is formed between the colored layer and the peripheral recess. It is provided between them.
The organic EL device of the present invention is characterized in that the coating layer between the peripheral recess and the seal layer has liquid repellency.
Further, in the organic EL device of the present invention, a seal layer is provided outside the peripheral recess, and the seal layer does not have a portion in contact with the adhesive layer. It is provided so that it may extend to the outer side of the said sealing layer.
In the organic EL device of the present invention, the sealing substrate and the adhesive layer are formed of a light-transmitting material, and the light-shielding layer that partitions the colored layer in plan view is the same as the colored layer. Provided between the peripheral recesses, the adhesive layer and the colored layer do not have a portion in contact with each other, and the adhesive layer and the light shielding layer are in contact with each other at the peripheral recess. It is characterized by.

  By comprising in this way, the peripheral part of the material of the adhesive layer extruded from the display area inside the peripheral concave part to the outer peripheral side of both substrates is accommodated by flowing into the peripheral concave part of the sealing substrate. The material can be prevented from leaking outside.

  In the organic EL device of the present invention, the sealing substrate includes a sealing substrate main body and a coating layer formed on a surface of the sealing substrate main body facing the element substrate, and the peripheral recess is It is formed in the said coating layer, It is characterized by the above-mentioned.

  By comprising in this way, the surrounding recessed part can be formed in a sealing substrate by patterning the coating layer formed in the surface of the sealing substrate main body.

  In the organic EL device of the present invention, the sealing substrate body and the adhesive layer are each formed of a light-transmitting material, and the sealing substrate is formed in the display area on the sealing substrate. A plurality of colored layers and a light shielding layer that partitions the colored layers, and the covering layer is formed to cover the colored layer and the light shielding layer.

  By comprising in this way, a peripheral recessed part is formed in the coating layer with a comparatively large film thickness which covers the coloring layer and light shielding layer which were formed on the sealing substrate main body, the capacity | capacitance of a peripheral recessed part was expanded, and an adhesive layer The capacity of the material can be improved, and leakage of the adhesive layer material to the outside can be prevented more effectively.

  The organic EL device of the present invention is characterized in that the surface of the sealing substrate on the element substrate side, which is closer to the outer periphery of the sealing substrate than the peripheral recess, is made liquid repellent.

  With this configuration, when the peripheral concave portion is filled with the adhesive layer material and the adhesive layer material is about to overflow to the outer peripheral side of the sealing substrate from the peripheral concave portion, the sealing substrate is more than the peripheral concave portion. The adhesive layer material is bounced by the surface on the element substrate side of the sealing substrate on the outer peripheral side and is retained in the peripheral recess. Therefore, leakage of the adhesive layer material to the outside can be more effectively prevented.

  In the organic EL device of the present invention, a seal layer for bonding the peripheral portion of the element substrate and the peripheral portion of the sealing substrate is formed outside the region surrounded by the peripheral recess. And

  With such a configuration, the two substrates can be sealed with the sealing layer, and moisture and the like can be prevented from entering to prevent the light emitting element from deteriorating.

  Moreover, the organic EL device of the present invention is characterized in that the seal layer is disposed apart from the peripheral recess in the outer peripheral direction of the sealing substrate.

  With this configuration, a space is formed between the seal layer and the peripheral recess. As a result, when the element substrate and the sealing substrate are bonded, it is possible to more reliably prevent the sealing layer from being damaged by the adhesive layer material extruded to the outer peripheral side of both substrates, and to leak the adhesive layer material to the outside. Can be prevented more effectively.

  In addition, the method for manufacturing an organic EL device of the present invention includes a step of forming a plurality of light emitting elements having a functional layer having at least an organic light emitting layer between a pair of electrodes in a display region on an element substrate, Forming a sealing layer covering the plurality of light emitting elements on the substrate; and a groove-like shape surrounding the display region on a surface of the sealing substrate opposed to the element substrate facing the element substrate A step of forming a peripheral recess, a step of disposing a liquid adhesive layer material inside the peripheral recess of a surface of the sealing substrate facing the element substrate, and the sealing layer of the element substrate being formed And an adhesion step of bonding the element substrate and the sealing substrate through the adhesive layer material, with the surface facing the surface on which the adhesive layer material of the sealing substrate is disposed, In the bonding step, the outer peripheral side of the sealing substrate is pressed. Said adhesive layer material issued housed in the peripheral recess, characterized in that it defines the outer edge of the adhesive layer material by said peripheral recess.

  By manufacturing in this way, when bonding the element substrate and the sealing substrate, placing an uncured adhesive layer material in the display area between the two substrates and pressing the adhesive layer material between both substrates and pressing The adhesive layer material is compressed between the two substrates and pushed out of the display area to the outer peripheral side of the two substrates. At this time, the peripheral edge portion of the adhesive layer material pushed out from the display area inside the peripheral concave portion to the outer peripheral side of both substrates flows into and is accommodated in the peripheral concave portion. This prevents the peripheral edge portion of the adhesive layer material from being pushed out to the outer peripheral side of both substrates beyond the peripheral recess. Therefore, the adhesive layer material can be prevented from leaking to the outside, and the outer edge of the adhesive layer after the adhesive layer material is cured can be defined by the peripheral recess.

  Moreover, the manufacturing method of the organic EL device of the present invention includes a step of lyophobic the surface of the covering layer on the element substrate side, which is closer to the outer periphery of the sealing substrate than the peripheral recesses, before the bonding step. It is characterized by having.

  By manufacturing in this way, the adhesive layer material flows into the peripheral recesses in the bonding process, the peripheral recesses are filled with the adhesive layer material, and the adhesive layer material overflows from the peripheral recesses to the outer peripheral side of the sealing substrate. In this case, the adhesive layer material is repelled by the surface on the element substrate side of the sealing substrate on the outer peripheral side of the sealing substrate relative to the peripheral recess, and is retained in the peripheral recess. Therefore, leakage of the adhesive layer material to the outside can be more effectively prevented.

  Further, the method for manufacturing an organic EL device of the present invention includes a step of disposing a seal layer material in a region on the element substrate corresponding to a region outside the region surrounded by the peripheral recesses before the bonding step. And in the bonding step, the peripheral portion of the element substrate and the peripheral portion of the sealing substrate are bonded via the seal layer material.

  By manufacturing in this way, it is possible to collectively bond the element substrate and the sealing substrate by the adhesive layer and seal between the two substrates by the sealing layer in the bonding step. Further, since the adhesive layer material extruded to the outer peripheral side of both substrates in the bonding process can be accommodated in the peripheral recess and the outer edge can be defined, the uncured seal layer material is damaged by the extruded adhesive layer material. Is prevented, and the adhesive layer material is prevented from flowing out.

  In the organic EL device manufacturing method of the present invention, when the sealing layer material is bonded to the element substrate and the sealing substrate, the sealing layer material moves from the peripheral recess to the outer peripheral direction of the sealing substrate. It arrange | positions so that it may space apart.

  By manufacturing in this way, a space is formed between the sealing layer and the peripheral recess when the element substrate and the sealing substrate are bonded. Therefore, even if the adhesive layer material extruded to the outer peripheral side of both substrates gets over the peripheral recesses and overflows to the outer peripheral side of both substrates, the adhesive layer material overflowing by the space is received. can do. Therefore, it is possible to more reliably prevent the sealing layer from being damaged by the adhesive layer material, and more effectively prevent leakage of the adhesive layer material to the outside.

  Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, the scale is appropriately changed for each layer and each member so that each layer and each member can be recognized on the drawing.

  FIG. 1 is a schematic diagram showing a wiring structure of the organic EL device of this embodiment. The organic EL device 1 is of an active matrix type using thin film transistors (hereinafter referred to as TFTs) as switching elements, and has a plurality of scanning lines 101 and a direction that intersects each scanning line 101 at a right angle. A wiring configuration including a plurality of signal lines 102 extending and a plurality of power supply lines 103 extending in parallel to each signal line 102, and sub-pixels X are formed in the vicinity of each intersection of the scanning line 101 and the signal line 102 It is.

  A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, each of the sub-pixels X includes a switching TFT (switching element) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101, and a pixel shared from the signal line 102 via the switching TFT 112. A holding capacitor 113 for holding a signal, a driving TFT (switching element) 123 to which a pixel signal held by the holding capacitor 113 is supplied to the gate electrode, and the power supply line 103 through the driving TFT 123 are electrically connected. An anode 10 into which a drive current flows from the power supply line 103 when connected, and a light emitting layer (organic light emitting layer) 12 sandwiched between the anode 10 and the cathode 11 are provided.

  According to the organic EL device 1, when the scanning line 101 is driven and the switching TFT 112 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor 113, and according to the state of the holding capacitor 113. The on / off state of the driving TFT 123 is determined. Then, current flows from the power supply line 103 to the anode 10 through the channel of the driving TFT 123, and further current flows to the cathode 11 through the light emitting layer 12. The light emitting layer 12 emits light according to the amount of current flowing through it.

  Next, specific modes of the organic EL device 1 of the present embodiment will be described with reference to FIGS. Here, FIG. 2 is a plan view schematically showing the configuration of the organic EL device 1. FIG. 3 is a cross-sectional view schematically showing the organic EL device 1. FIG. 4 is a view showing a main part (A part) of FIG.

As shown in FIG. 2, the organic EL device 1 includes a TFT element substrate (hereinafter referred to as “element substrate”) that causes the light emitting layer 12 to emit light by the above-described various wirings, TFTs, and various circuits formed on the element substrate body 21. ) 20. Although not shown in FIG. 2, the sealing substrate 30 is disposed so as to face the element substrate 20.
The element substrate 20 and the sealing substrate 30 include a display area 4 (area in a frame indicated by a two-dot chain line in the center portion) corresponding to an area where a plurality of light emitting elements and a colored layer, which will be described later, are formed. A dummy region 5 (a region between a one-dot chain line and a two-dot chain line) arranged around is provided.

  In the display area 4, a plurality of pixel areas R, G, and B are arranged in a matrix. Each of the pixel regions R, G, and B includes an anode 10, a light emitting layer 12, and a cathode 11 included in the subpixel X of FIG. 1 as light emitting elements. Then, the light emitted from the light emitting element is transmitted through the colored layers of the pixel regions R, G, and B, so that the R (red), G (green), and B ( (Blue) light can be extracted.

  In addition, each of the pixel regions R, G, and B is arranged in the same color in the vertical direction of the paper, and forms a so-called stripe arrangement. The pixel regions R, G, and B are combined into one display unit pixel, and the display unit pixel performs full color display by mixing the light emission of R, G, and B. .

  Scanning line driving circuits 80 are arranged on both sides of the display area 4 on the element substrate 20 in FIG. 2 and on the lower layer side of the dummy area 5. Further, an inspection circuit 90 is arranged on the upper side in FIG. 2 of the display region 4 on the element substrate 20 and on the lower layer side of the dummy region 5. This inspection circuit 90 is a circuit for inspecting the operating state of the organic EL device 1, and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and the organic EL during production or at the time of shipment. The apparatus 1 is configured to be able to inspect the quality and defects.

  As shown in FIG. 3, the organic EL device 1 of the present embodiment is a so-called “top emission structure” organic EL device. Since the top emission structure extracts light not from the element substrate 20 side but from the sealing substrate 30 side, there is an effect that a wide light emitting area can be secured without being affected by the size of various circuits arranged on the element substrate 20. Therefore, luminance can be ensured while suppressing voltage and current, and the lifetime of the light emitting element 22 can be maintained long.

As shown in FIG. 3, the organic EL device 1 according to the present embodiment includes an element substrate 20, a seal that is disposed to face the element substrate 20 and is bonded to the element substrate 20 via an adhesive layer 34 and a seal layer 35. A stop substrate 30 is provided.
On the element substrate 20, a plurality of light emitting elements 22 are formed with a functional layer including a light emitting layer (organic light emitting layer) 12 interposed between the anode 10 and the cathode 11. And the sealing layer 23 is formed so that these light emitting elements 22 may be covered. Hereinafter, these configurations will be described in more detail.

  The element substrate 20 includes an element substrate main body 21 and an inorganic insulating layer 14 that covers a surface of the element substrate main body 21 on the sealing substrate 30 side. The element substrate main body 21 is formed of, for example, silicon, and the inorganic insulating layer 14 is formed of silicon nitride or the like. On the element substrate body 21, the driving TFT 123 and other various wirings shown in FIG. 1 (not shown in FIG. 3) are formed, and the inorganic insulating layer 14 is formed so as to cover them.

  On the inorganic insulating layer 14, a planarizing layer 16 is formed in which a metal reflector 15 made of an aluminum alloy or the like is housed. The planarizing layer 16 is formed of an insulating resin material, for example, a photosensitive acrylic resin or a cyclic olefin resin.

  The anode 10 of the light emitting element 22 is formed in a region overlapping the metal reflector 15 on the planarizing layer 16 in a plane. The anode 10 is made of, for example, a metal oxide such as ITO (Indium Thin Oxide) having a high hole injection layer having a work function of 5 eV or more. The anode 10 is connected to the driving TFT 123 on the element substrate body 21 through a contact hole that penetrates the planarization layer 16 and the inorganic insulating layer 14.

  An insulating pixel partition wall 13 that partitions the light emitting element 22 is formed on the planarizing layer 16. The pixel partition wall 13 includes a plurality of openings that expose the upper portion of the anode 10.

  A light emitting layer 12 is formed so as to cover the upper surface of the pixel partition wall 13 and the anode 10 along the uneven shape formed by the opening and the pixel partition wall 13. As the light emitting layer 12, for example, a layer in which an anthracene-based dopant is doped in a stiltylamine-based luminescent layer (blue) and a layer in which a stiltylamine-based luminescent layer is doped with a rubrene-based dopant (yellow) are allowed to emit light simultaneously. A light-emitting material that can emit light can be used.

  Although illustration is omitted, in the present embodiment, a triarylamine multimer (ATP) layer (hole injection layer), a triphenyldiamine derivative (TPD) layer (between the anode 10 and the light emitting layer 12 ( A hole transport layer), an aluminum quinolinol (Alq3) layer (electron injection layer) and a LiF (electron injection buffer layer) are formed between the light emitting layer 12 and the cathode 11, respectively. The structure facilitates injection. In this embodiment, the hole injection layer, the hole transport layer, the light emitting layer 12, the electron injection layer, and the electron injection buffer layer constitute a functional layer.

  A cathode 11 is formed on the light emitting layer 12 so as to cover the light emitting layer 12 along the uneven shape of the light emitting layer 12. In the organic EL device 1 having a top emission structure, the cathode 11 needs to be formed of a light transmissive material. Therefore, as the material of the cathode 11, for example, ITO, an indium oxide / zinc oxide based amorphous conductive film (Indium Zinc Oxide: IZO / IZET O (registered trademark)), or the like can be used.

For the cathode 11, a material having a large electron injection effect (a work function of 4 eV or less) is preferably used. For example, calcium, magnesium, sodium, lithium metal, or a metal compound thereof. Examples of the metal compound include metal fluorides such as calcium fluoride, metal oxides such as lithium oxide, and organometallic complexes such as acetylacetonato calcium. In addition, these materials alone have a large electric resistance and the performance as an electrode is lowered, so that a metal layer such as aluminum, gold, silver, or copper is patterned so as to avoid a light emitting portion, or ITO, tin oxide, or the like is formed. You may use in combination with the laminated body with the metal oxide conductive layer which has translucency.
In the present embodiment, a laminate of lithium fluoride, a magnesium-silver alloy, and ITO is used as the material of the cathode 11 so as to have a film thickness that can provide translucency.

  In addition, an electrode protective layer 17 is formed on the element substrate 20 so as to cover the inorganic insulating layer 14, the planarization layer 16, and the cathode 11 of the light emitting element 22. The electrode protective layer 17 is made of, for example, a silicon compound such as silicon oxynitride.

  An organic buffer layer 18 is formed on the electrode protective layer 17 so as to cover the electrode protective layer 17. The organic buffer layer 18 is formed so as to fill the uneven shape formed by the pixel partition wall 13 and the opening thereof, and the element substrate 20 is planarized.

  The organic buffer layer 18 is composed of a light-transmitting material, and as a raw material main component, it is excellent in fluidity and free from any solvent or volatile component because it is formed by a screen printing method under a reduced pressure atmosphere. It is necessary to be an organic compound material used as a raw material for the polymer skeleton, and preferably an epoxy monomer / oligomer having an epoxy group and a molecular weight of 3000 or less is used (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000). ). For example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, polyethylene glycol diglycidyl ether, alkyl glycidyl ether, 3,4-epoxycyclohexenylmethyl-3 ′, 4′-epoxycyclohexene carboxylate, There are ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, and these are used alone or in combination.

Further, as the curing agent that reacts with the epoxy monomer / oligomer, one that forms a cured film having excellent electrical insulation and adhesiveness, high hardness, toughness and excellent heat resistance, excellent translucency, and curing. An addition polymerization type with little variation in the size is preferred. For example, 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzene Acid anhydride curing agents such as tetracarboxylic dianhydride and 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride are preferred. Furthermore, low-temperature curing is facilitated by adding trace amounts of amine compounds such as alcohols and aminophenols that have a high molecular weight and are difficult to volatilize such as 1,6-hexanediol as reaction accelerators that promote the reaction (ring opening) of acid anhydrides. Become. These curings are performed by heating in the range of 60 to 100 ° C., and the cured film becomes a polymer having an ester bond.
In addition, a cation-releasing type polymerization initiator often used for shortening the curing time may be used. However, a slow reaction may be used so that curing shrinkage does not rapidly advance, and the viscosity is reduced by heating after coating. What forms a hardened | cured material finally using thermosetting so that planarization may be advanced is preferable.

A gas barrier layer 19 is formed on the organic buffer layer 18 so as to cover the organic buffer layer 18 and further to the terminal portion of the electrode protective layer 17. The gas barrier layer 19 is formed of, for example, a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like in consideration of translucency, gas barrier properties, and water resistance. In the present embodiment, the gas barrier layer 19 has a light transmittance in the visible light region of, for example, 80% or more by appropriately adjusting the material and film thickness.
In the present embodiment, a sealing layer 23 that covers the light emitting element 22 is formed by the gas barrier layer 19, the electrode protective layer 17, and the organic buffer layer 18 described above.

  On the surface of the element substrate 20 on which the gas barrier layer 19 is formed, the sealing substrate 30 is disposed so as to face the surface. The sealing substrate 30 is bonded to the gas barrier layer 19 on the element substrate 20 via the adhesive layer 34 and the seal layer 35. The sealing substrate 30 includes a sealing substrate body 31 made of a light-transmitting material such as glass or transparent plastic (polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, etc.).

  A red colored layer 37R, a green colored layer 37G, and a blue colored layer 37B are arranged in a matrix on the surface of the sealing substrate body 31 facing the element substrate 20 as the colored layer 37. Further, a black matrix layer (light-shielding layer) 32 that partitions each colored layer 37 is formed around each colored layer 37. The coloring layer 37 and the black matrix layer 32 are formed so as to be disposed in the display region 4 shown in FIG. 2 when the sealing substrate 30 is aligned with the element substrate 20 and bonded. The film thickness of the colored layer 37 is adjusted to about 0.1 to 1.5 μm, for example. The width is set to about 10 to 15 μm.

  Each of the colored layers 37 is disposed so as to overlap the white light emitting layer 12 formed on the anode 10 in a planar manner. Thereby, the light emitted from the light emitting layer 12 is transmitted through each of the colored layers 37 and is emitted to the observer side as each color light of red light, green light, and blue light.

  An overcoat layer (covering layer) 33 that covers the colored layer 37 and the black matrix layer 32 formed in the display region 4 is formed on the sealing substrate body 31. The overcoat layer 33 extends from the inside of the display area 4 to the formation area of the seal layer 35 outside the display area 4. The overcoat layer 33 is made of, for example, a resin material such as acrylic or polyimide, and has a thickness of about 2 to 4 μm.

  A groove-shaped peripheral recess 33 a is formed in a portion of the overcoat layer 33 that extends outside the display region 4. In the present embodiment, the peripheral recess 33a is provided adjacent to the outer edge of the black matrix layer 32 formed outside the display area 4, as shown in FIG. The peripheral recess 33 a is provided so as to accommodate the peripheral edge of the adhesive layer 34 and define the outer edge 34 e of the adhesive layer 34. The surface 33s on the element substrate 20 side of the sealing substrate 30 on the outer peripheral side of the sealing substrate 30 with respect to the peripheral concave portion 33a is subjected to a liquid repellent treatment to impart liquid repellency. Further, as shown in FIG. 2, the peripheral concave portion 33 a is continuously formed so as to surround the display region 4.

  A seal layer 35 is provided on the periphery between the element substrate 20 and the sealing substrate 30. The seal layer 35 is formed outside the region surrounded by the peripheral recess 33 a and bonds the peripheral portion of the element substrate 20 and the peripheral portion of the sealing substrate 30. The seal layer 35 is disposed away from the peripheral recess 33 a in the outer peripheral direction of the sealing substrate 30, and a space is formed between the adhesive layer 34 and the seal layer 35.

  The seal layer 35 is made of an epoxy material that is cured by ultraviolet rays to improve the viscosity, and for example, the same material as the organic buffer layer 18 is used. In addition, as a curing agent that reacts with the epoxy monomer / oligomer of the seal layer 35, cationic polymerization reaction such as diazonium salt, diphenyliodonium salt, triphenylsulfonium salt, sulfonic acid ester, iron arene complex, silanol / aluminum complex, etc. A photoreactive initiator that wakes up is used.

  Further, the adhesive layer 34 needs to be an organic compound material that has excellent fluidity and does not have a volatile component such as a solvent as a raw material main component before curing, and is similar to the seal layer 35 and the organic buffer layer 18. These materials are used. The same material as the organic buffer layer 18 is used as a curing agent that reacts with the epoxy monomer / oligomer of the adhesive layer.

  The peripheral portion of the organic EL device 1 is a frame portion (non-light emitting portion) D. The frame portion D is a non-light-emitting portion of the organic EL device 1 and has a width from the pixel partition wall 13 provided at the outermost end on the element substrate 20 to the end portion of the element substrate 20, for example. The frame portion D is formed, for example, at 2 mm, and the width d of the peripheral seal layer is formed, for example, at about 1 mm.

  Next, a method for manufacturing the organic EL device 1 of the present embodiment will be described with reference to FIGS. 5A to 5C are process diagrams showing the manufacturing process on the element substrate 20 side. 6A to 6D are process diagrams showing a manufacturing process on the sealing substrate 30 side. 7A and 7B are process diagrams showing an adhesion process between the element substrate 20 and the sealing substrate 30. FIG.

First, as shown in FIG. 5A, various wirings, TFTs, various circuits, an inorganic insulating layer 14, a planarizing layer 16, a metal reflector 15, and a light emitting element 22 are formed on the element substrate body 21 by a known manufacturing method. And the pixel partition wall 13 is formed, and the electrode protective layer 17 is formed so as to cover them.
The electrode protective layer 17 is formed, for example, by forming a silicon compound containing nitrogen, that is, silicon nitride, silicon oxynitride, or the like by a high-density plasma film forming method such as an ECR sputtering method or an ion plating method.

Next, as shown in FIG. 5B, the organic buffer layer 18 is formed on the electrode protective layer 17.
Specifically, the organic buffer layer 18 that has been screen-printed in a reduced-pressure atmosphere is cured by heating in the range of 60 to 100 ° C. At this time, until the organic buffer layer 18 is cured to some extent in order to prevent the formation of dark spots by transmitting the electrode protective layer 17 and the cathode 11 and penetrating into the light emitting layer 12 such as Alp3. Allow to stand at low temperature and raise the temperature to a certain degree when it has increased to some degree of viscosity.

Next, as shown in FIG. 5C, a gas barrier layer 19 is formed on the organic buffer layer 18.
Specifically, it is formed by a high density plasma film forming method such as an ECR sputtering method or an ion plating method. In addition, reliability is improved by improving the adhesion by oxygen plasma treatment before the formation.
Through the above steps, an element substrate 20 that includes a plurality of light-emitting elements 22 and that is covered with a sealing layer 23 including an electrode protective layer 17, an organic buffer layer 18, and a gas barrier layer 19 is manufactured.

  On the other hand, as shown in FIG. 6A, a colored layer 37 and a black matrix layer 32 are formed on the sealing substrate body 31. As the colored layer 37, a red colored layer 37R, a green colored layer 37G, and a blue colored layer 37B are formed in a matrix corresponding to the display area 4, and each colored layer 37R, 37G, 37B is provided around each colored layer 37R, 37G, 37B. A black matrix layer 32 that partitions 37R, 37G, and 37B is formed.

Specifically, the colored layers 37R, 37G, and 37B are formed so as to face the white light emitting layer 12 formed on the anode 10. The thickness of the colored layer 37 is preferably as thin as possible in consideration of light transmittance, and the red colored layer 37R, the green colored layer 37G, and the blue colored layer 37B are respectively formed with the above-described thicknesses of about 0.1 to 1.5 μm. .
The black matrix layer 32 is formed with a film thickness similar to or greater than that of the colored layer 37.
Specifically, a pattern is formed by a printing method such as a photolithography method or an ink jet method, and the film thickness is appropriately adjusted while adjusting the coating amount in accordance with the material to be used.

Next, as shown in FIG. 6B, an overcoat layer 33 is formed so as to cover the colored layer 37 and the black matrix layer 32 and extend from the inside to the outside of the display region 4.
Specifically, the resin material described above is diluted with a raw material component or an organic solvent, and is applied with a pattern using a flexographic printing method, a gravure printing method, a slit coating method, a screen printing method, etc. Curing is performed.
Thereby, the colored layer 37 and the black matrix layer 32 are formed on the sealing substrate main body 31, and the sealing substrate 30 provided with the overcoat layer covering these is manufactured.

  Next, as shown in FIG. 6C, the display area shown in FIG. 2 is formed on the portion of the overcoat layer 33 that extends outside the display area 4 by, for example, photolithography or etching. A continuous groove-shaped peripheral recess 33 a is formed so as to surround 4. In the present embodiment, the peripheral recess 33a is formed adjacent to the outer edge of the black matrix layer 32 formed outside the display region 4.

  Next, the surface 33 s of the overcoat layer 33 facing the element substrate 20 on the outer peripheral side of the sealing substrate 30 with respect to the peripheral recess 33 a is made liquid repellent to reduce wettability. Specifically, by performing plasma treatment using CF 4 as a reaction gas under atmospheric pressure (CF 4 plasma treatment), and then cooling the sealing substrate 30 heated for the plasma treatment to room temperature, The surface 33 s of the overcoat layer 33 facing the element substrate 20 on the outer peripheral side of the sealing substrate 30 with respect to the peripheral recess 33 a is made liquid repellent to reduce wettability.

  Next, as shown in FIG. 6D, a liquid adhesive layer material 340 is disposed on the overcoat layer 33 inside the peripheral recess 33a (a region inside the peripheral recess 33a indicated by a broken line in FIG. 2). To do. Specifically, for example, the above-described thermosetting resin material is applied by a jet dispensing method.

Next, as shown in FIG. 7A, a seal layer material 350 is disposed on the periphery of the gas barrier layer 19 formed on the element substrate 20. The sealing layer material 350 is disposed in a region on the gas barrier layer 19 corresponding to the outside of the region (see FIG. 2) surrounded by the peripheral recess 33a formed in the sealing substrate 30. Further, the sealing layer material 350 has an inner edge of the sealing layer material 350 so that the sealing layer 35 is separated from the peripheral recess 33a in the outer peripheral direction of the sealing substrate 30 when the element substrate 20 and the sealing substrate 30 are bonded. Are arranged so as to be located on the outer peripheral side of the element substrate 20 with respect to the outer edge of the peripheral recess 33a of the sealing substrate 30 arranged to face each other.
Specifically, the above-described ultraviolet curable resin material is applied around the sealing substrate 30 by a needle dispensing method. Note that this printing method may use a screen printing method.

Next, the element substrate 20 coated with the seal layer material 350 is irradiated with ultraviolet rays.
Specifically, for example, the element substrate 20 is irradiated with ultraviolet rays having an illuminance of 30 mW / cm 2 and a light amount of 500 mJ / cm 2 for the purpose of starting the curing reaction of the seal layer material 350. At this time, only the seal layer material 350, which is an ultraviolet curable resin, reacts and the viscosity is gradually improved.

  Next, the surface of the element substrate 20 on which the sealing layer 23 is formed and the surface of the sealing substrate 30 on which the adhesive layer material 340 is disposed are opposed to each other, and as shown in FIG. The element substrate 20 and the sealing substrate 30 are bonded to each other through the 340 and the seal layer material 350. At this time, both the element substrate 20 and the sealing substrate 30 are brought closer to each other while finely adjusting the alignment position between the bonded element substrate 20 and the sealing substrate 30.

  Specifically, the element substrate 20 and the sealing substrate 30 are relatively moved in the plane direction (parallel direction), and the facing position between the light emitting element 22 and the coloring layer 37 is adjusted. For example, the positional deviation between the light emitting element 22 and the colored layer 37 is adjusted to be 2 μm or less. In this way, final alignment (correction) is performed.

At this time, the adhesive layer material 340 pressed between the sealing substrate 30 and the element substrate 20 and pushed to the outer peripheral side of the sealing substrate 30 is accommodated in the peripheral recess 33a, and the adhesive layer material is formed by the peripheral recess 33a. 340 outer edges are defined.
As described above, the outer edge of the adhesive layer material 340 is defined by the peripheral concave portion 33a while adjusting the alignment position accuracy, and, for example, held in a vacuum atmosphere with a vacuum degree of 1 Pa at a pressure of 600 N for 200 seconds for pressure bonding.

Next, the element substrate 20 and the sealing substrate 30 bonded by pressure bonding are heated in an air atmosphere. Specifically, in the state where the element substrate 20 side and the sealing substrate 30 side are bonded together, by heating at about 60 to 100 ° C. in the atmosphere, the sealing layer material 350 in which the above-described curing reaction has started, The adhesive layer material 340 is thermally cured to form the seal layer 35 and the adhesive layer 34. The adhesive layer 34 also has a role of protecting the gas barrier layer 19. If the liquid layer is left in a liquid state, the liquid layer may convect and damage the gas barrier layer 19 when left in a place where the temperature becomes high. Therefore, the adhesive layer 34 must be solidified.
As described above, the organic EL device 1 according to the present embodiment described above can be manufactured.

Next, the operation of this embodiment will be described.
In the present embodiment, a groove-shaped peripheral recess 33 a that accommodates the peripheral portion of the adhesive layer 34 and defines the outer edge 34 e of the adhesive layer 34 is formed outside the display region 4 so as to surround the display region 4. For this reason, when the element substrate 20 and the sealing substrate 30 are joined, as described above, the uncured adhesive layer material 340 is disposed in the display region 4 between the two substrates, and the adhesive layer material 340 is formed by both substrates. Is pressed between the two substrates, the adhesive layer material 340 is compressed between the two substrates and pushed out from the display area 4 to the outer peripheral side of the two substrates.

  At this time, the peripheral edge portion of the adhesive layer material 340 pushed out from the display area 4 inside the peripheral concave portion 33a to the outer peripheral side of both substrates flows into and is accommodated in the peripheral concave portion 33a. Thus, the peripheral edge portion of the adhesive layer material 340 is prevented from being pushed out to the outer peripheral side of both substrates beyond the peripheral concave portion 33a. Therefore, the adhesive layer material 340 can be prevented from leaking to the outside, and the outer edge 34e of the adhesive layer 34 after the adhesive layer material 340 is cured can be defined by the peripheral recess 33a.

  In the present embodiment, the peripheral recess 33 a is formed in the overcoat layer 33 that covers the colored layer 37 and the black matrix layer 32. Therefore, the peripheral recess 33a can be easily formed by patterning the overcoat layer 33. In addition, a peripheral recess 33a is formed in the overcoat layer 33 having a relatively large thickness, and the capacity of the peripheral recess 33a is increased to improve the capacity of the adhesive layer material 340, thereby preventing leakage of the adhesive layer material 340 to the outside. It can be prevented more effectively.

  Further, since the surface 33s on the element substrate 20 side of the sealing substrate 30 on the outer peripheral side of the sealing substrate 30 with respect to the peripheral recesses is made liquid-repellent, the peripheral recesses 33a are filled with the adhesive layer material 340 and bonded. When the layer material 340 overflows to the outer peripheral side of the sealing substrate 30 from the peripheral concave portion 33a, the surface on the element substrate 20 side of the sealing substrate 30 on the outer peripheral side of the sealing substrate 30 relative to the peripheral concave portion 33a. By 33s, the adhesive layer material 340 is bounced and retained in the peripheral recess 33a. Therefore, leakage of the adhesive layer material 340 to the outside can be more effectively prevented.

Thus, in this embodiment, the light emitting element 22 on the element substrate 20 is covered and sealed with the sealing layer 23, and the element substrate 20 and the sealing substrate 30 are bonded via the adhesive layer 34. Leakage of the adhesive layer material 340 to the outside is prevented by the peripheral recess 33 a formed in the sealing substrate 30. Therefore, the adhesive function between the element substrate 20 and the sealing substrate and the sealing function of the light emitting element 22 that are conventionally required for the sealing layer 35 can be performed by the adhesive layer 34 and the sealing layer 23. 35 can be omitted or reduced.
Therefore, when the seal layer 35 is omitted or reduced, the manufacturing process of the seal layer 35 can be omitted or simplified, and the cost of the seal layer material 350 can be reduced.

  However, as in the present embodiment, the sealing layer 35 is intentionally formed, so that the sealing performance of the organic EL device 1 can be improved, the penetration of moisture and the like can be prevented, and the light emitting element 22 can be prevented from deteriorating. . Further, the peripheral concave portion 33a prevents the uncured sealing layer material 350 from being damaged by the adhesive layer material 340 extruded to the outer peripheral sides of the two substrates when the element substrate 20 and the sealing substrate 30 are joined. Leakage of the adhesive layer material 340 to the outside can be more effectively prevented.

  In the present embodiment, since the seal layer 35 is disposed away from the peripheral recess 33a in the outer peripheral direction of the sealing substrate 30, a space is formed between the seal layer 35 and the peripheral recess 33a. Therefore, even if the adhesive layer material 340 extruded to the outer peripheral side of both substrates overflows the peripheral recess 33a and overflows to the outer peripheral side of both substrates, the adhesive layer material overflowed by the space 340 can be accepted. Therefore, when the element substrate 20 and the sealing substrate 30 are bonded, the uncured sealing layer material 350 is more reliably prevented from being damaged by the adhesive layer material 340 extruded to the outer peripheral sides of both substrates. Leakage of the adhesive layer material 340 to the outside can be more effectively prevented.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, the present invention may be applied not only to a top emission type organic EL device but also to a bottom emission type organic EL device.
The peripheral recess may be formed not on the sealing substrate side but on the element substrate side, or on both the sealing substrate and the element substrate. Further, the peripheral recess may be formed directly on the sealing substrate body instead of being formed on the overcoat layer.

It is a schematic diagram which shows the wiring structure of the organic electroluminescent apparatus in embodiment of this invention. It is a top view which shows typically the structure of the organic electroluminescent apparatus in embodiment of this invention. It is sectional drawing which shows typically the structure of the organic electroluminescent apparatus in embodiment of this invention. It is an expanded sectional view of the A section of FIG. It is process drawing which shows the manufacturing process of the organic electroluminescent apparatus in embodiment of this invention. It is process drawing which shows the manufacturing process of the organic electroluminescent apparatus in embodiment of this invention. It is process drawing which shows the manufacturing process of the organic electroluminescent apparatus in embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Organic EL apparatus, 4 Display area, 10 Anode (a pair of electrodes), 11 Cathode (a pair of electrodes), 12 Light emitting layer (organic light emitting layer), 17 Electrode protective layer (sealing layer), 18 Organic buffer layer (sealing) Stop layer), 19 gas barrier layer (sealing layer), 20 element substrate, 21 element substrate body, 22 light emitting element, 23 sealing layer, 30 sealing substrate, 32 black matrix layer (light shielding layer), 33 overcoat layer ( Coating layer), 33a peripheral recess, 33s face, 34 adhesive layer, 34e outer edge, 35 sealing layer, 37 colored layer, 37B blue colored layer (colored layer), 37G green colored layer (colored layer), 37R red colored layer (colored) Layer), 340 adhesive layer material

Claims (5)

A plurality of light-emitting elements each having a light-emitting layer between a pair of electrodes, an element substrate provided with a sealing layer covering the plurality of light-emitting elements, and a sealing layer provided with a colored layer and a coating layer covering the colored layer An organic EL device bonded to the stop substrate with an adhesive layer so that the light emitting element and the colored layer face each other,
In the covering layer, a peripheral concave portion is provided outside the colored layer so as to surround a display area in which the plurality of light emitting elements are arranged,
The adhesive layer provided between the sealing layer and the covering layer is not in contact with the peripheral edge of the sealing layer,
Periphery of the adhesive layer is disposed in the peripheral recess,
An organic EL device , wherein an outer edge of the adhesive layer is defined by the peripheral recess.   The organic EL device according to claim 1, wherein the adhesive layer does not have a portion in contact with the element substrate. A seal layer is provided outside the peripheral recess,
Not have a portion in contact and the adhesive layer and the sealing layer,
The organic EL device according to claim 1 , wherein the sealing layer is provided so as to extend to the outside of the sealing layer . The sealing substrate and the adhesive layer are made of a light transmissive material,
In plan view, the light-shielding layer for partitioning the colored layer is provided between the peripheral recess and the colored layer,
The adhesive layer and the colored layer do not have a portion in contact with each other,
The organic EL device according to claim 1, wherein the adhesive layer and the light shielding layer are in contact with each other at the peripheral recess .   The organic EL device according to claim 1, wherein the coating layer between the peripheral recess and the seal layer has liquid repellency.

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