JP2007128741A - Organic el device, electronic apparatus, and manufacturing method of organic el device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device having a longer luminescence life, an electronic apparatus, and a manufacturing method of the organic EL device. <P>SOLUTION: This organic EL device 10 is a top emission type organic EL device. An element substrate 1 in which a plurality of light emitting elements L obtained by laminating anodes 5c, 5d, 5f having light transmissibility and a functional layer K containing an organic luminescent layer 7, and a cathode 9 having semi-transmissible reflectivity in order are formed is bonded to a sealed substrate 2 in which respective color elements 12r, 12g, 12b corresponding to a plurality of the light emitting elements L are formed through an adhesive layer 11. A gas barrier layers 16, 17 made of an oxidized silicon nitride having high light transmissibility and low gas permeability are provided on both of the element substrate 1 side facing the adhesive layer 11 and the sealing substrate 2 side. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an organic EL light emitting device having an organic EL (electroluminescence) element, an electronic device including the organic EL light emitting device, and a method for manufacturing the organic EL light emitting device.

Organic E in which electrons and holes are injected and the emission center is excited by their recombination
The L element generates a black spot-like dark spot by adsorbing moisture or an organic solvent component. The light emission lifetime is reduced by the growth of dark spots.

In order to improve such problems, a color filter on a substrate, an organic layer that covers and flattens the color filter, a transparent electrode (hole injection electrode), a functional layer including an organic light emitting layer, and a cathode (electron) An organic EL element having a passivation layer containing silicon nitride between an organic layer and a transparent electrode is known (Patent Document 1).

Such an organic EL element prevents the release of moisture or organic solvent component gas contained in a color filter or an organic layer by providing a passivation layer, and reduces a decrease in light emitting function. .

JP 2002-134268 A

However, in the organic EL element, it is considered that moisture and organic solvent components are adsorbed from the cathode side. Further, in a top emission type organic EL light emitting device in which a sealing substrate on which a color filter is formed and an element substrate on which an organic EL element is formed are bonded, moisture or organic solvent component gas released from the sealing substrate is removed. There exists a subject that it is necessary to shield efficiently and to prevent the fall of the light emission function of the functional layer containing an organic light emitting layer.

The present invention has been made in consideration of the above-described problems, and is an organic E having a longer emission lifetime.
An object of the present invention is to provide a method for manufacturing an L light emitting device, an electronic apparatus, and an organic EL light emitting device.

In the organic EL light emitting device of the present invention, an element substrate on which a plurality of light emitting elements having a functional layer including an organic light emitting layer is formed and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed have an adhesive layer. An organic EL light emitting device bonded via a gas barrier layer is provided on either the element substrate side or the sealing substrate side facing the adhesive layer.

According to this configuration, since the gas barrier layer that is difficult to transmit gas is provided on either the element substrate side or the sealing substrate side facing the adhesive layer that joins the element substrate and the sealing substrate, at least the color It is possible to suppress a reduction in the light emission lifetime of the light emitting element due to adsorption of a plurality of gas molecules of moisture and solvent components contained in the element to the light emitting element formed on the element substrate. Therefore, an organic EL light emitting device having a longer light emission lifetime can be provided.

In another organic EL light emitting device of the present invention, an element substrate on which a plurality of light emitting elements having a functional layer including an organic light emitting layer is formed and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed are bonded. An organic EL light-emitting device bonded through layers, wherein a gas barrier layer is provided on both the element substrate side and the sealing substrate side facing the adhesive layer.

According to this configuration, since the gas barrier layer that faces the adhesive layer that joins the element substrate and the sealing substrate and is difficult to transmit gas is provided on both the element substrate side and the sealing substrate side, at least the color element It is possible to suppress a reduction in the light emission lifetime of the light emitting element due to adsorption of a plurality of gas molecules of moisture and solvent components contained in the light emitting element formed on the element substrate. Therefore, it is possible to provide an organic EL light emitting device having a longer light emission lifetime than when a gas barrier layer is provided on one of the element substrate and the sealing substrate.

In the organic EL light-emitting devices of these inventions, the sealing substrate has a planarizing layer made of an organic film covering the color elements.

According to this configuration, since the flattening layer made of an organic film covering the color element is provided, it is possible to suppress the light emission from the light emitting element from being scattered by the unevenness of the surface of the color element and lowering the luminance. it can. In addition, since the gas barrier layer is provided at least between the planarization layer and the light emitting element, moisture and solvent component gas molecules contained in the planarization layer made of an organic film are adsorbed to the light emitting element formed on the element substrate. Accordingly, it is possible to prevent the light emission lifetime of the light emitting element from being shortened. Therefore, it is possible to provide an organic EL light emitting device having high emission luminance and a longer emission lifetime.

The gas barrier layer is preferably made of silicon oxynitride. According to this, since silicon oxynitride has high gas permeability while having low gas permeability,
It is difficult to change the hue and brightness of light emission of the light-emitting element that passes through the gas barrier layer, and at least prevent moisture molecules and solvent component gas molecules included in the color element from adsorbing to the light-emitting element and shortening the light emission lifetime. it can.

In the gas barrier layer, the ratio of oxygen to the total amount of oxygen and nitrogen contained is
It is preferable that it is 40% or more and less than 80%. Silicon oxynitride tends to increase the light transmittance as a gas barrier layer when the proportion of oxygen increases. However, the gas permeability is increased and the function as a gas barrier layer is lowered. According to this, the ratio of oxygen is 40% or more and 80%.
If it is less than%, a relatively high light transmittance can be obtained while maintaining a low gas transmittance. That is, the function as a gas barrier layer can be maintained without relatively affecting the light emission from the light emitting element.

An electronic apparatus of the present invention includes the organic EL light emitting device of the present invention. According to this, since the organic EL light emitting device having a longer light emission lifetime is provided, it is possible to provide a highly reliable electronic device that can be used for a long time.

The method for manufacturing an organic EL light emitting device of the present invention includes an element substrate on which a plurality of light emitting elements having a functional layer including an organic light emitting layer is formed, and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed. A method of manufacturing an organic EL light emitting device comprising: a step of forming a gas barrier layer so as to cover a surface of an element substrate on which a plurality of light emitting elements are formed or a surface of a sealing substrate on which color elements are formed; And a step of bonding the substrate and the sealing substrate through an adhesive layer.

According to this method, in the step of forming the gas barrier layer, the gas barrier layer is formed so as to cover the surface of the element substrate on which the plurality of light emitting elements are formed or the surface of the sealing substrate on which the color elements are formed. Thereafter, the element substrate and the sealing substrate are bonded via an adhesive layer. Therefore, a gas barrier layer is formed on either the element substrate side or the sealing substrate side facing the adhesive layer. Therefore, it is possible to manufacture an organic EL light emitting device having a long light emission lifetime in which at least water molecules contained in the color element and gas molecules of the solvent component are adsorbed on the light emitting element and the light emission life is shortened.

Another organic EL light emitting device manufacturing method of the present invention includes an element substrate on which a plurality of light emitting elements each having a functional layer including an organic light emitting layer are formed, and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed. A process for forming a first gas barrier layer so as to cover a surface of a sealing substrate on which color elements are formed, and an element substrate on which a plurality of light emitting elements are formed And a step of forming a second gas barrier layer so as to cover the surface of the substrate, and a step of bonding the element substrate and the sealing substrate through an adhesive layer.

According to this method, in the step of forming the first gas barrier layer, the first gas barrier layer is formed on the sealing substrate side so as to cover the color elements. In the step of forming the second gas barrier layer, the second gas barrier layer is formed on the element substrate side so as to cover the light emitting element. Thereafter, the element substrate and the sealing substrate are bonded via an adhesive layer. Therefore, the gas barrier layer is formed on both the element substrate side and the sealing substrate side facing the adhesive layer. Therefore, it is possible to manufacture an organic EL light emitting device having a long light emission lifetime by suppressing the light emission element from adsorbing at least water molecules and gas molecules of a solvent component contained in the color elements to shorten the light emission lifetime.

In these methods for producing an organic EL light emitting device of the present invention, the gas barrier layer or the first
Before the step of forming the gas barrier layer, a step of forming a planarizing layer made of an organic film so as to cover the color element is provided.

According to this method, the gas barrier layer is formed after the planarization layer is formed so as to cover the color element.
It is formed. Therefore, the planarization layer can suppress the light emission from the light emitting element from being scattered by the unevenness of the surface of the color element and lowering the luminance. In addition, since the gas barrier layer or the first gas barrier layer is provided at least between the planarization layer and the light emitting element, a plurality of gas molecules of moisture and solvent components contained in the planarization layer made of an organic film are formed on the element substrate. It is also possible to suppress a reduction in the light emission lifetime of the light emitting element due to adsorption to the light emitting element. Therefore, it is possible to manufacture an organic EL light emitting device having high emission luminance and a longer light emission lifetime.

The gas barrier layer, the first gas barrier layer, and the second gas barrier layer are preferably formed of silicon oxynitride. According to this, since silicon oxynitride has high gas permeability and low gas permeability, it does not easily change the hue or luminance of the light emitting element that transmits the gas barrier layer. It is possible to prevent moisture molecules contained in the element and gas molecules of the solvent component from adsorbing to the light emitting element and shortening the light emission lifetime.
Therefore, the gas barrier layer, the first gas barrier layer, and the second gas barrier layer having an excellent function can be formed.

In the gas barrier layer, the first gas barrier layer, and the second gas barrier layer, the ratio of oxygen to the total amount of oxygen and nitrogen contained is preferably 40% or more and less than 80%. In silicon oxynitride, the light transmittance of the gas barrier layer tends to increase as the proportion of oxygen increases. However, the gas permeability is increased and the function as a gas barrier layer is lowered. According to this, if the ratio of oxygen is 40% or more and less than 80%, a relatively low light transmittance can be obtained while maintaining a low gas permeability. That is, it is possible to form the gas barrier layer, the first gas barrier layer, and the second gas barrier layer that maintain their original functions without relatively affecting the light emission from the light emitting element.

In the embodiment of the present invention, an organic EL light emitting device including an organic EL element as a light emitting element will be described as an example. In addition, each drawing used for description is appropriately enlarged or reduced in order to clarify the configuration.

<Organic EL light emitting device>
FIG. 1 is a schematic cross-sectional view showing an organic EL light emitting device. As shown in FIG. 1, the organic EL light emitting device 10 of the present embodiment includes an element substrate 1 on which a plurality of light emitting elements L are formed, and color elements 12r,
And a sealing substrate 2 on which 12g and 12b are formed. The element substrate 1 and the sealing substrate 2 are
The color elements 12r, 12g, and 12b are bonded via the adhesive layer 11 so as to correspond to the light emitting elements L. A gas barrier layer 16 as a first gas barrier layer is provided on the surface on the sealing substrate 2 side facing the adhesive layer 11, and a gas barrier layer 17 as a second gas barrier layer is provided on the surface on the element substrate 1 side. It has been. That is, the element substrate 1 and the sealing substrate 2 are bonded via the adhesive layer 11 with the two gas barrier layers 16 and 17 facing each other. The color element 12r indicates a red (Red) system, the color element 12g indicates a green (Green) system, and the color element 12b indicates a blue (Blue) system.

The light-emitting elements L corresponding to the color elements 12r, 12g, and 12b each have a reflective layer 3 having light reflectivity.
A light-transmitting anode 5c, 5d, 5f, a functional layer K including the organic light emitting layer 7, and an anode 5
The cathode 9 having transflective properties disposed opposite to c, 5d, and 5f is sequentially laminated on the element substrate 1. An optical resonator is configured between the reflective layer 3 and the cathode 9.
In the organic EL light emitting device 10 provided with such a light emitting element L, the light emission of the light emitting element L is the sealing substrate 2.
The so-called top emission type is emitted from the side.

The sealing substrate 2 can be a transparent glass substrate or a resin substrate such as plastic. The three different color elements 12r, 12g, and 12b are partitioned by the light shielding portion 13, and are formed, for example, by applying a photosensitive resin containing a pigment as a color element material and exposing and developing it. The light shielding portion 13 is formed by overlapping any two of the color elements 12r, 12g, and 12b on a shadow mask made of, for example, Cr or black resin. A flattening layer 14 is formed to cover the color elements 12r, 12g, and 12b and the light-shielding portion 13 and to reduce unevenness on the surface. The planarization layer 14 is an organic film, and for example, a transparent resin material such as acrylic can be used. A region partitioned by the light shielding unit 13 is a region from which light of different emission colors is emitted.

As the element substrate 1, a transparent glass substrate, an opaque ceramic, a silicon substrate, or the like can be used. The element substrate 1 includes a plurality of TFTs (Thin for driving each light emitting element L).
Film transistor) element (not shown) and a plurality of wirings 1 for supplying current to each light emitting element L
5 and each light emitting element L are formed corresponding to regions where light of different emission colors is emitted. One of the plurality of wirings 15 is connected to the anodes 5c, 5d, and 5f, respectively, and the other is connected to the gate electrodes or source electrodes of the plurality of TFT elements.

The reflective layer 3 is made of a material mainly composed of Al. The main component of the material constituting the reflective layer 3 can be selected from Al, Ag, Au, Cr, Ta, Mo, Mg, ITO, and IZO.

Further, it is desirable that the main component of the material constituting the wiring 15 is the same material as that constituting the reflective layer 3. Then, it is possible to form a film in the same process and pattern it into a desired shape.

The anode 5f of the light emitting element L corresponding to the color element 12r is made of transparent ITO (Indium Tin Oxide).
On the protective layer 4 made of a transparent silicon nitride film having a thickness of about 50 nm and covering the reflective layer 3, an ITO film 5 a having a thickness of 30 nm, an ITO film 5 b having a thickness of 35 nm, and an ITO film having a thickness of 30 nm 5c is laminated. As a result, the total film thickness of the anode 5f is 95.
nm.

Similarly, the anode 5d of the light emitting element L corresponding to the color element 12g is formed by laminating the ITO film 5b and the ITO film 5c, and the total film thickness is 65 nm. Light emitting element L corresponding to color element 12b
The thickness of the ITO film 5c as the anode is 30 nm. Hereinafter, this is referred to as an anode 5c.
That is, the anodes 5c, 5d, and 5f are formed with different film thicknesses corresponding to regions where light of different emission colors are emitted. Thereby, the optical distance in the optical resonator of each light emitting element L differs, and the light of the different peak wavelength corresponding to each color element 12r, 12g, 12b of the sealing substrate 2 is radiate | emitted.

The functional layer K is formed by sequentially laminating a hole transport layer 6, an organic light emitting layer 7, and an electron transport layer 8 on each of the anodes 5c, 5d, and 5f. Examples of the forming method include a method of applying a material constituting each layer by a spin coating method or a method of vapor deposition in a vacuum.

As materials for forming the hole transport layer 6, the organic light emitting layer 7, and the electron transport layer 8, known materials may be used. In this case, the organic light emitting layer 7 is formed by laminating a plurality of types of organic light emitting materials that emit different emission colors so that single color (white) light emission is possible.

The cathode 9 is formed to cover the functional layer K with a thickness of about 10 nm so that a part of the light emitted from the functional layer K is transmitted and a part of the light is reflected by an evaporation method using a thin film of Mg / Ag. Yes. That is, the cathode 9 is in a half mirror state having transflective properties.

Each of the gas barrier layers 16 and 17 is made of silicon oxynitride, and is simultaneously sputtered in vacuum using silicon oxide and silicon nitride as targets, thereby providing the element substrate 1.
And formed on the respective surfaces of the sealing substrate 2. Silicon oxynitride combines the high light transmittance of silicon oxide with the low gas permeability of silicon nitride. Therefore, it is possible to suppress the transmission of gas such as moisture and solvent components without attenuating the light emission from the light emitting element L.

In the thin film of silicon oxynitride, the light transmittance increases as the oxygen content increases.
On the other hand, gas permeability will also rise. In this case, the oxygen content in the gas barrier layers 16 and 17 with respect to the total amount of oxygen and nitrogen is 40% or more and less than 80%. Furthermore, about 50% is preferable. According to this, a low gas permeability can be obtained while maintaining a high light transmittance.

Further, the function as the gas barrier layers 16 and 17 naturally depends on the film thickness. However, if the film thickness is too thick, cracks are likely to occur during film formation or after film formation, and the original function cannot be performed. Therefore, the film thickness is preferably 100 nm to less than 800 nm. In this case, the film thickness of the gas barrier layer 16 on the sealing substrate 2 side is approximately 400 nm, and the gas barrier layer 17 on the element substrate 1 side.
The film thickness is about 100 nm. That is, by increasing the film thickness of the gas barrier layer 16 on the sealing substrate 2 side, moisture and solvent component gases diffuse from the color elements 12r, 12g, 12b and the planarization layer 14 formed on the sealing substrate 2. It has a structure that suppresses this more.

For the adhesive layer 11 that joins the element substrate 1 and the sealing substrate 2, for example, a thermosetting transparent epoxy resin adhesive can be used. It is preferable to use an adhesive that cures at room temperature so that the light-emitting element L formed by lamination does not float due to shrinkage during curing.

In such an organic EL light emitting device 10, an optical resonator is formed between the reflective layer 3 and the cathode 9 in each light emitting element L. Accordingly, light having a peak wavelength corresponding to each of the color elements 12r, 12g, and 12b emits light, and light having high color purity is emitted from the sealing substrate 2 side through the color elements 12r, 12g, and 12b. Further, since the gas barrier layers 16 and 17 are provided on the sealing substrate 2 side and the element substrate 1 side and bonded through the adhesive layer 11, moisture and water are removed from the color elements 12 r, 12 g and 12 b and the planarizing layer 14. It is possible to suppress a so-called reduction in light emission lifetime in which the solvent component gas diffuses and is adsorbed on the light emitting element L, and the luminance of light emission decreases with time.

In this embodiment, the gas barrier layers 16 and 17 are provided on both the sealing substrate 2 side and the element substrate 1 side. However, either one of the sealing substrate 2 side or the element substrate 1 side, preferably sealing is performed. The gas barrier layer 16 may be provided only on the substrate 2 side. Further, the color elements 12r, 12g, and 12b formed on the sealing substrate 2 are not limited to three colors, and may have a multicolor configuration. Moreover,
The planarization layer 14 is not always necessary. If the unevenness of the surface of each color element 12r, 12g, 12b is about several tens of nanometers, the gas barrier layer 16 can be formed so as to also serve as the planarizing layer.

<Method for Manufacturing Organic EL Light Emitting Device>
Next, a method for manufacturing the organic EL light emitting device of this embodiment will be described with reference to FIGS. FIG. 2 is a flowchart illustrating a method for manufacturing an organic EL light emitting device, and FIGS. 3A to 3D are schematic cross-sectional views illustrating a method for manufacturing the organic EL light emitting device. Although not shown, the element substrate 1 includes
A TFT element as a drive element for driving the light emitting element L is formed.

In the method for manufacturing the organic EL light emitting device 10 according to the present embodiment, each color element 1 formed on the sealing substrate 2 is used.
As a first gas barrier layer, the step of forming the planarizing layer 14 so as to cover 2r, 12g, 12b (step S1) and the surface of the sealing substrate 2 on which the color elements 12r, 12g, 12b are formed are covered. And a step of forming the gas barrier layer 16 (step S2). Further, a step (step S3) of forming a gas barrier layer 17 as a second gas barrier layer so as to cover the surface of the element substrate 1 on which the plurality of light emitting elements L are formed, and the sealing in which the gas barrier layers 16 and 17 are formed. A substrate bonding step (step S4) for bonding the stop substrate 2 and the element substrate 1 via the adhesive layer 11;

Step S1 in FIG. 2 is a step of forming the planarization layer 14. In step S1, FIG.
As shown to (a), the planarization layer 14 is formed using an acrylic resin material so that each color element 12r, 12g, 12b formed in the sealing substrate 2 may be covered. Examples of the forming method include a method in which an acrylic resin is coated and dried by a spin coating method, a roll coating method, or the like. Further, a method in which a photosensitive acrylic resin is coated and then cured by irradiation with ultraviolet light can be employed. Then, the process proceeds to step S2.

Step S2 in FIG. 2 is a process for forming the gas barrier layer 16. In step S2,
As shown in FIG. 3B, the gas barrier layer 16 is formed so as to cover the surface of the planarization layer 14 formed on the sealing substrate 2. More specifically, the sealing substrate 2 on which the planarization layer 14 is formed is placed in a vacuum chamber, and simultaneously sputtered using two targets of silicon oxide and silicon nitride, whereby the surface of the planarization layer 14 is obtained. Then, a gas barrier layer 16 made of a silicon oxynitride thin film is formed. The film is formed so that the film thickness is about 400 nm. Further, the sputtering rate of each target and the inert gas introduced so that the ratio of oxygen to the total amount of oxygen and nitrogen in the formed silicon oxynitride thin film is 40% or more and less than 80%, preferably about 50%. Adjust the gas partial pressure. Then, the process proceeds to step S3.

Step S3 in FIG. 2 is a process for forming the gas barrier layer 17. In step S3,
As shown in FIG. 3C, the gas barrier layer 17 is formed so as to cover the plurality of light emitting elements L formed on the element substrate 1. The formation method is the same as in step S2. The film thickness in this case is 1
00 nm. Then, the process proceeds to step S4.

Step S4 in FIG. 2 is a substrate bonding step for bonding the substrates 1 and 2 together. In step S4, as shown in FIG. 3 (d), first, an adhesive layer 11 is formed on the surface of the element substrate 1 by applying an adhesive mainly composed of a transparent epoxy resin, and the gas barrier layer 16 is formed thereon. The sealing substrate 2 on which is formed is pressed so as not to generate a gap. Then, each color element 12r, 12g, 12b and each light emitting element L are positioned and cured so as to correspond to each other. Preferably, the element substrate 1 and the sealing substrate 2 are bonded to each other under reduced pressure so that bubbles are not included between the gas barrier layers 16 and 17 and the adhesive layer 11 that are disposed to face each other. The adhesive layer 11 may be a thermosetting epoxy resin, but is more preferably a room temperature curable type that has less thermal shrinkage during curing.

According to such a method for manufacturing the organic EL light emitting device 10, the organic barrier layer 16 and 17 are provided on both the element substrate 1 and the sealing substrate 2, and the organic E has high reliability and high color purity.
The L light emitting device 10 can be manufactured. Note that either the step of forming the gas barrier layer 16 or the step of forming the gas barrier layer 17 may be performed. Preferably, it is better to adopt a process of forming the gas barrier layer 16 on the sealing substrate 2 side. According to this, it is possible to obtain high reliability with a simpler structure.

(Electronics)
Next, an electronic apparatus including the organic EL light emitting device of the present invention will be described with reference to FIG. FIG. 4 is a schematic perspective view showing a mobile phone as an electronic apparatus.

As shown in FIG. 4, the mobile phone 100 as the electronic apparatus of the present embodiment includes numbers, letters,
A main body 101 having an input button 102 capable of inputting symbols and the like, and a display unit 103 attached to the main body 101 in a foldable state are provided. The display unit 103 is equipped with an organic EL light emitting device 10 capable of self-luminous color display having high color purity and a long light emission lifetime.

The effect of the said embodiment is as follows.
(1) In the organic EL light emitting device 10 of the above embodiment, an optical resonator is formed between the reflective layer 3 and the cathode 9 in each light emitting element L, and the sealing substrate 2 side facing the adhesive layer 11 and the element substrate Gas barrier layers 16 and 17 are provided on both sides. Since the gas barrier layers 16 and 17 are made of silicon oxynitride having high light permeability and low gas permeability, the color elements 12r, 12g, and 12b made of an organic film provided on the sealing substrate 2 and a planarizing layer are formed. It is possible to suppress the diffusion of moisture and organic solvent gas molecules from 14. Therefore, it is possible to suppress the moisture and organic solvent molecules from adsorbing to the light emitting element L and shortening the light emission lifetime. That is, the organic EL light emitting device 10 having high color purity and a longer light emission lifetime can be provided.

(2) In the organic EL light emitting device 10 and the manufacturing method thereof according to the above embodiment, the adhesive layer 11
The gas barrier layers 16 and 17 formed on both the sealing substrate 2 side and the element substrate 1 side facing the substrate are made of silicon oxynitride. And since the content rate of oxygen with respect to the total amount of oxygen and nitrogen to be contained is 40% or more and less than 80%, preferably about 50%, low gas permeability can be obtained while having high light transmittance. . That is, it has a gas barrier function that does not attenuate the light emission from the light emitting element L.

(3) The manufacturing method of the organic EL light emitting device 10 of the above embodiment includes the color elements 12r, 12g,
A step of forming a gas barrier layer 16 of silicon oxynitride on the surface of the sealing substrate 2 on which the planarizing layer 14 covering the surface 12b and 12b are formed; and an oxynitriding on the surface of the element substrate 1 on which the plurality of light emitting elements L are formed Forming a silicon gas barrier layer 17. Therefore, each color element 12r, 12 made of an organic film provided on the sealing substrate 2 by the gas barrier layers 16, 17 is provided.
It is possible to prevent moisture and organic solvent molecules from adsorbing to the light emitting element L from g, 12b and the planarizing layer 14 and shortening the light emission lifetime. That is, organic E having a longer emission lifetime
The L light emitting device 10 can be manufactured.

(4) Since the mobile phone 100 of the above embodiment includes the organic EL light emitting device 10 capable of self-luminous color display having high color purity and a long light emission lifetime, the mobile phone 100 having high reliability quality. Can be provided.

Modifications other than the above embodiment are as follows.
(Modification 1) In the organic EL light emitting device 10 of the above embodiment, each light emitting element L is not limited to a structure in which an optical resonator is formed between the reflective layer 3 and the cathode 9. For example, the organic light emitting layer 7 of each functional layer K may emit white (monochrome) light without forming an optical resonator.

(Modification 2) In the organic EL light emitting device 10 of the above embodiment, the gas barrier layers 16 and 17 are used.
Each is not limited to a single layer. For example, a multilayer structure in which a transparent thin film such as ITO is provided between the gas barrier layer 16 and the planarizing layer 14 may be used. According to this, each color element 12
The diffusion of moisture and organic solvent molecules from r, 12g, 12b and the planarizing layer 14 can be further reduced.

(Modification 3) In the organic EL light emitting device 10 and the manufacturing method thereof according to the above embodiment, the arrangement of the adhesive layer 11 is not limited to this. For example, the adhesive layer 11 is arranged in a frame shape so as to surround the plurality of light emitting elements L, and the element substrate 1 and the sealing substrate 2 are arranged so that the gas barrier layers 16 and 17 face each other with a predetermined interval (space). You may join under reduced pressure. According to this, since the bonding is performed under reduced pressure, the bonding is performed in a state where moisture or the like does not exist in the space, and the gas barrier layers 16,
The function of 17 is not impaired.

(Modification 4) The electronic device on which the organic EL light emitting device 10 of the above embodiment is mounted is not limited to the mobile phone 100. For example, portable information devices called PDA (Personal Digital Assistants), portable terminal devices, personal computers, digital still cameras, in-vehicle monitors, digital video cameras, liquid crystal televisions, viewfinder types, monitor direct-view type video tape recorders, cars It can be suitably used as image display means for navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, video phones, POS terminals, and the like.

FIG. 2 is a schematic cross-sectional view showing an organic EL light emitting device. These are flowcharts which show the manufacturing method of an organic electroluminescent light emitting device. (A)-(d) is a schematic sectional drawing which shows the manufacturing method of an organic electroluminescent light emitting device. FIG. 2 is a schematic perspective view showing a mobile phone as an electronic apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Element substrate, 2 ... Sealing substrate, 5c, 5d, 5f ... Anode, 7 ... Organic light emitting layer, 9 ... Cathode,
DESCRIPTION OF SYMBOLS 10 ... Organic EL light-emitting device, 11 ... Adhesion layer, 12r, 12g, 12b ... Color element, 14 ... Planarization layer, 16 ... Gas barrier layer as 1st gas barrier layer, 17 ... Gas barrier layer as 2nd gas barrier layer, 100 A mobile phone as an electronic device, K ... a functional layer, L ... a light emitting element.

Claims (11)

Organic EL light emission in which an element substrate having a plurality of light emitting elements each having a functional layer including an organic light emitting layer and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed are bonded via an adhesive layer A device,
An organic EL light emitting device comprising a gas barrier layer provided on either the element substrate side or the sealing substrate side facing the adhesive layer. Organic EL light emission in which an element substrate having a plurality of light emitting elements each having a functional layer including an organic light emitting layer and a sealing substrate on which color elements corresponding to the plurality of light emitting elements are formed are bonded via an adhesive layer A device,
An organic EL light-emitting device comprising a gas barrier layer on both the element substrate side and the sealing substrate side facing the adhesive layer. The organic EL light-emitting device according to claim 1, wherein the sealing substrate has a planarizing layer made of an organic film that covers the color elements. The organic EL light emitting device according to any one of claims 1 to 3, wherein the gas barrier layer is made of silicon oxynitride. In the gas barrier layer, the ratio of oxygen to the total amount of oxygen and nitrogen contained is 40%.
The organic EL light emitting device according to claim 4, wherein the organic EL light emitting device is less than 80%. An electronic apparatus comprising the organic EL light emitting device according to any one of claims 1 to 5. A method for manufacturing an organic EL light-emitting device, comprising: an element substrate on which a plurality of light-emitting elements each having a functional layer including an organic light-emitting layer are formed; and a sealing substrate on which color elements corresponding to the plurality of light-emitting elements are formed. And
Forming a gas barrier layer so as to cover the surface of the element substrate on which a plurality of the light emitting elements are formed or the surface of the sealing substrate on which the color elements are formed;
And a step of bonding the element substrate and the sealing substrate through an adhesive layer. A method for manufacturing an organic EL light-emitting device, comprising: an element substrate on which a plurality of light-emitting elements each having a functional layer including an organic light-emitting layer are formed; and a sealing substrate on which color elements corresponding to the plurality of light-emitting elements are formed. And
Forming a first gas barrier layer so as to cover the surface of the sealing substrate on which the color elements are formed;
Forming a second gas barrier layer so as to cover a surface of the element substrate on which a plurality of the light emitting elements are formed;
And a step of bonding the element substrate and the sealing substrate through an adhesive layer. 9. A step of forming a planarizing layer made of an organic film so as to cover the color elements before the step of forming the gas barrier layer or the first gas barrier layer is provided.
The manufacturing method of the organic electroluminescent light emitting device of description. 9. The method of manufacturing an organic EL light emitting device according to claim 7, wherein the gas barrier layer, the first gas barrier layer, and the second gas barrier layer are formed of silicon oxynitride. 11. The gas barrier layer, the first gas barrier layer, and the second gas barrier layer are formed so that a ratio of oxygen to a total amount of oxygen and nitrogen contained is 40% or more and less than 80%. The manufacturing method of the organic electroluminescent light emitting device of description.

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