KR20190076811A - Flexible Electroluminescent Display Device - Google Patents

Abstract

A flexible electroluminescent display device includes: a flexible substrate including a display region, and a bending region extended from one side of the display region to be bent; a thin film transistor and a light emitting element positioned on the display region; a touch screen panel positioned on the display region; a touch circuit substrate connected to the touch screen panel, and bent at the outside of the bending region; a polarizing plate positioned on the touch screen panel, and covering a portion of the touch circuit substrate; and a step compensation layer positioned on the touch screen panel, and disposed between the touch circuit substrate and the polarizing plate, thereby capable of minimizing a bezel region.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a flexible electroluminescent display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible electroluminescence display device, and more particularly, to a flexible electroluminescence display device capable of minimizing a region of a bezel of a flexible electroluminescence display device.

As the era of information age approaches, there is a rapid development of a display device field for visually displaying electrical information signals. Researches are continuing to develop performance such as thinning, lightening, and low power consumption for various display devices.

Typical display devices include a liquid crystal display device (LCD), a field emission display device (FED), an electro-wetting display device (EWD), and an organic light- Light Emitting Display Device (OLED), and the like.

An electroluminescent display device including an organic light emitting display device is a self light emitting display device, and unlike a liquid crystal display device, a separate light source is not necessary, so that it can be manufactured in a light and thin shape. In addition, the electroluminescent display device is advantageous in terms of power consumption by low-voltage driving, and has excellent color implementation, response speed, viewing angle, and contrast ratio (CR), and is expected to be utilized in various fields.

An electroluminescent display device has an emissive layer (EML) using an organic material between two electrodes made of an anode and a cathode. When holes in the anode are injected into the light emitting layer and electrons in the cathode are injected into the light emitting layer, excited electrons and holes are recombined to form excitons in the light emitting layer.

A host material and a dopant material are included in the light emitting layer to cause interaction between the two materials. The host generates excitons from electrons and holes and transfers energy to the dopant. The dopant is a dye organic material to which a small amount of dopant is added, and receives energy from the host and converts the light into light.

An electroluminescent display device including a light emitting layer made of an organic material encapsulates an electroluminescence display device with a glass, a metal, or a film so that moisture or oxygen By blocking the flow, the light emitting layer and the electrode are prevented from oxidation and protected from external mechanical or physical impact.

Efforts to reduce the bezel area, which is the outer portion of the active area (A / A), have been continued to increase the effective display screen size in the same area of the display device as the display device has become smaller.

In general, since a wiring and a driving circuit for driving a screen are disposed in a bezel region corresponding to a non-active area (N / A), there is a limit to minimizing the bezel area.

With respect to a flexible electroluminescent display device capable of maintaining the display performance even when bent by applying a flexible substrate of a flexible material such as plastic, which has been recently developed, an area for a wiring and a driving circuit is secured, A technique for minimizing a bezel area by bending a non-display area of a flexible substrate in order to minimize a region has been developed and applied.

A flexible electroluminescent display device using a flexible substrate such as a plastic, etc., can secure flexibility of a substrate, various insulating layers disposed on the substrate, wiring formed of a metal material, and the like, It is necessary to prevent defects such as cracks.

In addition, as a means of inputting a display device, a touch screen panel (Touch Screen Panel) which can input information directly to a screen of a display device by using a finger or a pen instead of an input means such as a mouse or a keyboard, ) Is increasingly used in various fields.

The touch screen panel disposed on the upper portion of the display device converts a contact position directly touching the user's hand or object into an electrical signal, and the instruction content selected at the contact position is received as an input signal and displayed on the screen through the display device.

The touch circuit board disposed in the bezel area, which is a non-display area of the display device, includes a wiring and a touch circuit connected to the touch screen panel for driving the touch screen panel. This has been an obstacle to minimizing the bezel area of the display device.

Therefore, the inventors of the present invention have invented a new structure of an electroluminescent display device capable of minimizing a region of a touch circuit board of a touch screen panel disposed in a bezel region in an electroluminescent display device.

The inventors of the present invention have recognized that a space for arranging wiring is insufficient as the resolution of an electroluminescence display device increases, and realize a new structure of an electroluminescence display device capable of arranging wiring more freely in a limited space Invented.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region and a bending region extending from one side of the display region, a thin film transistor and a light emitting element on the display region, A touch screen panel, a touch screen panel, a touch screen panel bent on the outside of the bending area, a polarizer on the touch screen panel, a polarizer covering a part of the touch circuit board, And a step difference compensation layer for compensating a step difference between the touch circuit boards.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region and a non-display region that surrounds the display region and has a bending region, a thin film transistor and a light emitting element on the display region, A touch panel, a touch screen panel on the touch screen panel, a touch circuit board bent on the outside of the bent bending area, a polarizer plate on the touch screen panel and covering a part of the touch circuit board, A step difference compensating layer for compensating a step difference from an end of the substrate is disposed on the touch screen panel.

The electroluminescent display device according to the embodiment of the present invention minimizes a region occupied by a touch circuit board connected to a touch screen panel disposed on an upper portion of a flexible substrate to minimize a bezel area.

The flexible electroluminescent display device according to the embodiment of the present invention has an effect that the wirings used in the flexible electroluminescent display device can be arranged more freely in a limited space.

The effects of the flexible electroluminescent display device according to the embodiment of the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

The scope of the claims is not limited by the matters described in the description of the specification, as the contents of the description in the problems, the solutions to the problems, and the effects described above do not specify the essential features of the claims.

1 is a block diagram of an electroluminescent display device according to an embodiment of the present invention.
2 is a circuit diagram of a pixel included in an electroluminescent display device according to an embodiment of the present invention.
3A and 3B are plan views of a flexible substrate and a touch screen panel of an electroluminescent display device according to an embodiment of the present invention.
4A and 4B are cross-sectional views illustrating a detailed structure of a display region and a bending region of an electroluminescent display device according to an embodiment of the present invention.
5 is a cross-sectional view of a bending region of a flexible electroluminescent display device according to an embodiment of the present invention.
6A and 6B are a cross-sectional view and a perspective view of a bending region of a flexible electroluminescent display device according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. Like reference numerals refer to like elements throughout the specification. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

The first, second, etc. are used to describe various components, but these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other, partially or wholly, technically various interlocking and driving, and that the embodiments may be practiced independently of each other, It is possible.

1 is a block diagram of an electroluminescent display device according to an embodiment of the present invention.

1, an EL display device 100 according to an embodiment of the present invention includes an image processing unit 110, a timing controller 120, a data driver 130, a gate driver 140, and a display panel 150, .

The image processing unit 110 outputs a data enable signal DE together with a data signal DATA supplied from the outside. The image processing unit 110 may output at least one of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal in addition to the data enable signal DE.

The timing controller 120 receives a data enable signal DE or a data signal DATA in addition to a drive signal including a vertical synchronization signal, a horizontal synchronization signal, and a clock signal from the image processing unit 110. The timing controller 120 generates a gate timing control signal GDC for controlling the operation timing of the gate driver 140 and a data timing control signal DDC for controlling the operation timing of the data driver 130 based on the drive signal. .

The data driver 130 samples and latches the data signal DATA supplied from the timing controller 120 in response to the data timing control signal DDC supplied from the timing controller 120 and converts the sampled data signal into a gamma reference voltage . The data driver 130 outputs the data signal DATA through the data lines DL1 to DLn.

The gate driver 140 outputs a gate signal while shifting the level of the gate voltage in response to the gate timing control signal GDC supplied from the timing controller 120. The gate driver 140 outputs the gate signal through the gate lines GL1 to GLm.

The display panel 150 displays an image while the pixel 160 emits light corresponding to the data signal DATA and the gate signal supplied from the data driver 130 and the gate driver 140. The detailed structure of the pixel 160 will be described in FIG. 2 and FIG.

2 is a circuit diagram of a pixel included in an electroluminescent display device according to an embodiment of the present invention.

2, the pixel of the EL display device 200 includes a switching transistor 240, a driving transistor 250, a compensation circuit 260, and a light emitting element 270.

The light emitting element 270 operates to emit light in accordance with the driving current generated by the driving transistor 250.

The switching transistor 240 performs a switching operation so that a data signal supplied through the data line 230 corresponding to the gate signal supplied through the gate line 220 is stored in the capacitor as a data voltage.

The driving transistor 250 operates so that a constant driving current flows between the high potential power supply line VDD and the low potential power supply line GND in response to the data voltage stored in the capacitor.

The compensation circuit 260 is a circuit for compensating the threshold voltage and the like of the driving transistor 250, and the compensation circuit 260 includes at least one thin film transistor and a capacitor. The configuration of the compensation circuit may vary widely depending on the compensation method.

The pixel of the electroluminescence display device 200 is composed of a 2T (Transistor) 1C (capacitor) structure including a switching transistor 240, a driving transistor 250, a capacitor and a light emitting element 270, 260 can be additionally formed in the present invention, it can be formed into 3T1C, 4T2C, 5T2C, 6T1C, 6T2C, 7T1C, 7T2C and the like.

3A and 3B are plan views of a flexible substrate and a touch screen panel of an electroluminescent display device according to an embodiment of the present invention.

3A shows a state in which the flexible substrate 310 of the flexible electro-luminescence display device 300 is not bent, and FIG. 3B shows a touch screen panel 320 disposed on the flexible substrate 310 in FIG. 3A have.

3A, a flexible electroluminescent display device 300 according to an embodiment of the present invention includes a flexible substrate 310 on which a thin film transistor and a display region And a non-active area (N / A) that surrounds the edges of the display area A / A and the edges of the display area A / A.

A circuit such as a gate driver 390 for driving the flexible electro-luminescent display device 300 and various circuits such as a scan line (S / L) are connected to the non-display area N / A of the flexible substrate 310, Wiring can be arranged. The circuit for driving the flexible electroluminescence display device 300 may be arranged in a GIP (Gate in Panel) on the substrate 310 or a flexible substrate such as TCP (Tape Carrier Package) or COF (Chip on Film) 310, respectively.

A pad 395 is disposed on one side of the substrate 310 of the non-display area N / A. The pad 395 is a metal pattern to which the external module is bonded.

The bending area B / A can be formed by bending a part of the non-display area N / A of the flexible substrate 310 in the bending direction as shown by the arrow. The non-display area N / A of the flexible substrate 310 is not required to be visually recognized on the upper surface of the flexible substrate 310 because the wiring and the drive circuit for driving the screen are disposed and not the area where the image is displayed . Therefore, the bezel area can be minimized while bending a part of the non-display area N / A of the flexible substrate 310 to secure an area for the wiring and the driver circuit.

Various wirings are formed on the flexible substrate 310. The wiring may be formed in the display area A / A of the substrate 310. [ Alternatively, the circuit wiring 370 formed in the non-display area N / A may transmit a signal by connecting a driving circuit, a gate driver, a data driver, or the like.

The circuit wiring 370 is formed of a conductive material and may be formed of a conductive material having excellent ductility to reduce the occurrence of cracks when the substrate 310 is bent. For example, the circuit wiring 370 may be formed of a conductive material having excellent ductility such as gold (Au), silver (Ag), and aluminum (Al) And may be formed of one of molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and an alloy of silver (Ag) Or the like. The circuit wiring 370 may have a multilayer structure including various conductive materials and may have a three-layer structure of, for example, titanium (Ti) / aluminum (Al) / titanium (Ti) But is not limited thereto.

The circuit wiring 370 formed in the bending area B / A is subjected to tensile force when bent. For example, the circuit wiring 370 extending on the flexible substrate 310 in the same direction as the bending direction (indicated by an arrow) is subjected to the greatest tensile force, so that cracks may occur. If the cracks are severe, have. Therefore, instead of forming the circuit wiring 370 so as to extend in the bending direction, at least a part of the circuit wiring 370 arranged including the bending area B / A may be extended in a diagonal direction different from the bending direction The tensile force can be minimized and the occurrence of cracks can be minimized.

The circuit wiring 370 including the bending region B / A may be formed in various shapes and may be formed in various shapes such as a trapezoidal wave shape, a triangular wave shape, a sawtooth wave shape, a sinusoidal wave shape, an omega And may be formed in various shapes such as a rhombic shape.

Referring to FIG. 3B, the touch screen panel 320 is disposed on the flexible substrate 310 described with reference to FIG. 3A.

The touch screen panel 320 surrounds the outer edge of the touch area T / A and the edge of the display area A / A disposed correspondingly on the display area A / A of the flexible substrate 310 Non-touch area (NT / A) corresponding to the non-display area N / A.

The touch electrode 325 is disposed in the touch area T / A of the touch screen panel 320. The touch electrode 325 may be configured to cross a plurality of touch driving electrodes Tx and a plurality of touch sensing electrodes Rx.

The touch screen panel 320 may be a mutual-capacitance type structure including a plurality of touch driving electrodes Tx and a touch electrode 325 configured to cross a plurality of touch sensing electrodes Rx However, the present invention is not limited thereto, and a self-capacitance type may be applied. The self-capacitance type is disposed only by a plurality of touch sensing electrodes Rx. In addition, the touch screen panel 320 may be implemented in various ways such as a resistive type or an electromagnetic type.

The touch pad 330 is disposed in the non-touch area NT / A of the touch screen panel 320 and is disposed corresponding to the non-display area N / A on the flexible substrate 310.

The touch connection wiring 335 serves to electrically connect the touch electrode 325 and the touch pad 330 and is disposed corresponding to the non-touch area NT / A of the touch screen panel 320. [

At the end of the touch screen panel 320, a touch circuit board 340, which is connected to the touch pad 330 and is composed of an insulating film, is disposed.

 The touch circuit board 340 may include a touch sensing circuit for sensing a touch input and various wires for transmitting signals to the touch electrode 325 disposed in the touch area T / (Flexible Printed Circuit Board) (FPCB).

The touch circuit board 340 can be bent and disposed at the outer periphery of the bending area B / A of the flexible substrate 310 described with reference to FIG. 3A, and the detailed structure of the bending area B / .

4A and 4B are cross-sectional views illustrating a detailed structure of a display region and a bending region of an electroluminescent display device according to an embodiment of the present invention.

4A is a sectional view of the detailed structure of the display area A / A described with reference to FIG. 3A.

Referring to FIG. 4A, the substrate 410 supports and protects the elements of the EL display device 400 disposed at the upper portion. In recent years, the substrate 410 may be made of a flexible material having a flexible characteristic, 410 may be a flexible substrate. For example, the flexible substrate may be in the form of a film comprising one of the group consisting of a polyester-based polymer, a silicon-based polymer, an acrylic polymer, a polyolefin-based polymer, and a copolymer thereof.

For example, the substrate 410 may be formed of a material selected from the group consisting of polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polysilane, polysiloxane, polysilazane, polycarbosilane, But are not limited to, polyacrylate, polymethacrylate, polymethylacrylate, polymethylmetacrylate, polyethylacrylate, polyethylmetacrylate, (CO), cyclic olefin polymer (COP), polyethylene (PE), polypropylene (PP), polyimide (PI), polymethylmethacrylate (PMMA), polystyrene (PS), polyacetal (POM), polyetheretherketone (PEEK), polyester sulfone (PES), polytetrafluoroethylene (PTFE), polyvinyl chloride (PVC), polycarbonate (PC), polyvinylidene fluoride Fluoroalkyl polymer (PFA), a styrene acrylic nitro rilko polymer (SAN) to and may be made of at least one among these combinations.

A buffer layer may be further disposed on the substrate 410. The buffer layer prevents penetration of moisture or other impurities through the substrate 410 and can flatten the surface of the substrate 410. The buffer layer is not necessarily required, and may be removed depending on the type of the substrate 410 and the type of the thin film transistor 420 disposed on the substrate 410.

The thin film transistor 420 disposed on the substrate 410 includes a gate electrode 422, a source electrode 424, a drain electrode 426, and a semiconductor layer 428.

The semiconductor layer 428 has a higher mobility than amorphous silicon or amorphous silicon and thus has low energy consumption and excellent reliability and can be applied to polycrystalline silicon ), But is not limited thereto.

The semiconductor layer may be formed of an oxide semiconductor. The oxide semiconductor has characteristics of excellent mobility and uniformity. The oxide semiconductors include indium tin gallium zinc oxide (InSnGaZnO) based materials which are quaternary metal oxides, indium gallium zinc oxide (InGaZnO) based materials which are ternary metal oxides, indium tin zinc oxide (InSnZnO) based materials, indium aluminum zinc oxide ) Based material, tin-gallium zinc oxide (SnGaZnO) -based material, aluminum gallium zinc oxide (AlGaZnO) -base material, tin aluminum zinc oxide (SnAlZnO) -based material, bimetallic metal oxide indium zinc oxide (InZnO) An InGaO 3 -based material, an InGaO 3 -based material, an InGaO 3 -based material, an InGaO 3 -based material, an AlGaN-based material, an SnZnO 3 -based material, an AlZnO 3 -based material, a ZnMgO 3 -based tin magnesium oxide material, The semiconductor layer 428 can be formed of a material selected from the group consisting of indium oxide (InO), tin oxide (SnO 2), and zinc oxide (ZnO) The composition ratio is not limited.

The semiconductor layer 428 may include a source region including a p-type or an n-type impurity, a drain region, and a channel between the source region and the drain region, And may include a lightly doped region between the adjacent source and drain regions.

The source region and the drain region are regions where the impurity is highly doped, and the source electrode 424 and the drain electrode 426 of the thin film transistor 420 are connected, respectively. The p-type impurity may be one of boron (B), aluminum (Al), gallium (Ga), and indium (In), and the n-type impurity may be phosphorus P), arsenic (As) and antimony (Sb).

The semiconductor layer 428 may be doped with an n-type impurity or a p-type impurity depending on the structure of the NMOS or PMOS thin film transistor, and the thin film transistor included in the electroluminescence display according to an embodiment of the present invention may include an NMOS Or a PMOS thin film transistor is applicable.

The first insulating layer 431 is an insulating layer composed of a single layer of silicon oxide (SiOx) or silicon nitride (SiNx) or a multilayer thereof and a current flowing in the semiconductor layer 428 flows into the gate electrode 422 . The silicon oxide is less ductile than the metal, but is superior in ductility to silicon nitride and can be formed into a single layer or a plurality of layers depending on the characteristics.

The gate electrode 422 serves as a switch for turning on or turning off the thin film transistor 420 based on an electric signal transmitted from the outside through the gate line, (Al), molybdenum (Mo), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), and neodymium (Nd) Or multiple layers, but is not limited thereto.

The source electrode 424 and the drain electrode 426 are connected to the data line and electric signals transmitted from the outside are transmitted from the thin film transistor 420 to the light emitting element 440. The source electrode 424 and the drain electrode 426 are formed of a conductive metal such as Cu, Al, Mo, Cr, Au, Ti, Ni, And neodymium (Nd), or an alloy thereof, and may be composed of a single layer or a multilayer, but is not limited thereto.

A second insulating layer 433 composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx) is formed to cover the gate electrode 422, the source electrode 424, and the drain electrode 426, And between the electrode 422 and the source electrode 424 and the drain electrode 426.

A passivation layer composed of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the thin film transistor 420. [ The passivation layer can prevent unnecessary electrical connection between components on the passivation layer and prevent contamination or damage from the outside. The structure of the thin film transistor 420 and the light emitting element 440, It may be omitted depending on the characteristics.

The thin film transistor 420 may be classified into an inverted staggered structure and a coplanar structure depending on the positions of the constituent elements of the thin film transistor 420. In the thin film transistor of the inverted staggered structure, the gate electrode is located on the opposite side of the source electrode and the drain electrode with respect to the semiconductor layer. 4A, the thin film transistor 420 of the coplanar structure has the gate electrode 422 located on the same side of the source electrode 424 and the drain electrode 426 as the semiconductor layer 428 as a reference.

Although the thin film transistor 420 of the coplanar structure is shown in FIG. 4A, the electroluminescent display 400 may include a thin film transistor of an inverted staggered structure.

4A illustrates only the driving thin film transistor among various thin film transistors that may be included in the EL display device 400, and a switching thin film transistor, a capacitor, and the like may be included in the electroluminescence display device 400. FIG. When a signal is applied from the gate line, the switching thin film transistor transfers a signal from the data line to the gate electrode of the driving thin film transistor. The driving thin film transistor transmits a current, which is transmitted through the power supply wiring, to the anode 442 by a signal received from the switching thin film transistor, and controls the light emission by the current transmitted to the anode 442.

The parasitic capacitance generated between the thin film transistor 420 and the gate line and the data line and the light emitting elements 440 is reduced by protecting the thin film transistor 420 and alleviating a step generated by the thin film transistor 420. [ The planarization layers 435 and 437 are disposed on the thin film transistor 420 in order to reduce capacitance.

The planarization layers 435 and 437 may be formed of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, But is not limited to, one or more of Unsaturated Polyesters Resin, Polyphenylene Resin, Polyphenylenesulfides Resin, and Benzocyclobutene.

The electroluminescent display 400 according to the embodiment of the present invention may include a first planarization layer 435 and a second planarization layer 437 which are a plurality of planarization layers 435 and 437 sequentially stacked.

For example, a first planarization layer 435 may be stacked on the thin film transistor 420, and a second planarization layer 437 may be sequentially stacked on the first planarization layer 435.

A buffer layer may be disposed on the first planarization layer 435. The buffer layer is disposed to protect the components disposed on the first planarization layer 435 and may be a single layer of silicon nitride (SiNx) or silicon oxide (SiOx) or a multiple layer of silicon nitride (SiNx) or silicon oxide Layer, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting element 440. [

The intermediate electrode 430 is connected to the thin film transistor 420 through a contact hole formed in the first planarization layer 435. The intermediate electrode 430 is connected to the thin film transistor 420.

The data line may have a structure in which a lower layer made of the same material as the source electrode 424 and the drain electrode 426 and an upper layer made of the same material as the intermediate electrode 430 are connected. Thus, since the data lines can be implemented in a structure in which two layers are connected to each other in parallel, the wiring resistance of the data lines can be reduced.

A passivation layer composed of an inorganic insulating layer such as silicon oxide (SiOx) or silicon nitride (SiNx) may be further disposed on the first planarizing layer 435 and the intermediate electrode 430. [ The passivation layer may prevent unnecessary electrical connection between the components and prevent contamination or damage from the outside, and may be omitted depending on the configuration and characteristics of the thin film transistor 420 and the light emitting device 440.

The light emitting element 440 disposed on the second planarization layer 437 includes an anode 442, a light emitting portion 444, and a cathode 446.

The anode 442 may be disposed on the second planarization layer 437. The anode 442 is an electrode serving to supply holes to the light emitting portion 444 and is connected to the intermediate electrode 430 through a contact hole in the second planarization layer 437, Lt; / RTI >

The anode 442 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), or the like, which is a transparent conductive material, but is not limited thereto.

When the electroluminescent display device 400 is in the top emission mode in which the cathode 446 is disposed, the emitted light is reflected by the anode 442 so that the cathode 446 is arranged more smoothly So that it can be emitted in the upward direction.

For example, the anode 442 may be a two-layer structure in which a transparent conductive layer composed of a transparent conductive material and a reflective layer are sequentially stacked, or a three-layer structure in which a transparent conductive layer, a reflective layer, and a transparent conductive layer are sequentially stacked, Silver (Ag) or an alloy containing silver.

The bank 450 disposed on the anode 442 and the second planarization layer 437 can define a pixel by dividing a region that actually emits light. After the photoresist is formed on the anode 442, the bank 450 is formed by photolithography. A photoresist is a photosensitive resin whose solubility in a developer is changed by the action of light, and a specific pattern can be obtained by exposing and developing the photoresist. The photoresist can be classified into a positive photoresist and a negative photoresist. The positive type photoresist refers to a photoresist whose solubility in a developing solution of the exposed portion is increased by exposure. When the positive type photoresist is developed, a pattern in which the exposed portion is removed is obtained. The negative type photoresist is a photoresist which is greatly reduced in the solubility of the exposed portion in a developing solution upon exposure. When the negative type photoresist is developed, a pattern in which the non-exposed portion is removed is obtained.

A FMM (Fine Metal Mask) which is a deposition mask may be used to form the light emitting portion 444 of the light emitting element 440. In order to prevent damage that may occur in contact with the deposition masks disposed on the banks 450 and to maintain a certain distance between the banks 450 and the deposition masks, (Spacer) 452 made of one of a perovskite-mesoporous, a photoacid, a benzocyclobutene (BCB) may be disposed.

A light emitting portion 444 is disposed between the anode 442 and the cathode 446. The light emitting portion 444 emits light and includes a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer, an electron transport layer (ETL) And an electron injection layer (EIL), and some components of the light emitting portion 444 may be omitted depending on the structure or characteristics of the electroluminescence display device 400. Here, the electroluminescent layer and the inorganic luminescent layer can be applied to the luminescent layer.

The hole injection layer is disposed on the anode 442 and serves to smoothly inject holes. The hole injection layer may be formed by, for example, HAT-CN (dipyrazino [2,3-f: 2 ', 3'-h] quinoxaline-2,3,6,7,10.11-hexacarbonitrile), CuPc NPD (N, N'-bis (naphthalene-1-yl) -N, N'-bis (phenyl) -2,2'-dimethylbenzidine).

The hole transport layer is disposed on the hole injection layer and serves to smoothly transfer holes to the light emitting layer. The hole transporting layer may be formed of, for example, NPD (N, N'-bis (naphthalene-1-yl) -N, N'- TAD (2,2 ', 7,7'-tetrakis (N, N-dimethylamino) -9,9-spirofluorene) - (3-methylphenyl) -N, N'- , And MTDATA (4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenylamino) -triphenylamine).

The light emitting layer is disposed on the hole transporting layer and can emit light of a specific color including a substance capable of emitting light of a specific color. The light emitting material may be formed using a phosphor or a fluorescent material.

When the light emitting layer emits red light, the peak wavelength of emitted light may be in the range of 600 nm to 650 nm, and CBP (4,4'-bis (carbazol-9-yl) biphenyl) or mCP bis (1-phenylisoquinoline) acetylacetonate iridium), PQIr (acac) (bis (1-phenylquinoline) (acetylacetonate) ) iridium, PQIr (tris (1-phenylquinoline) iridium), and PtOEP (octaethylporphyrin platinum). Or a fluorescent material containing PBD: Eu (DBM) 3 (Phen) or Perylene.

Here, the peak wavelength? Max refers to the maximum wavelength of EL (Electroluminescence). The wavelength at which the light emitting layers forming the light emitting portion emit light intrinsically is referred to as PL (Photo Luminescence), and the light that is influenced by the thickness and optical characteristics of the layers constituting the light emitting layers is referred to as emittance. At this time, EL (Electroluminescence) refers to light finally emitted by the electroluminescence display device, and can be expressed by a product of PL (Photo Luminescence) and Emittance.

When the light emitting layer emits green light, the peak emission wavelength may range from 520 nm to 540 nm, including a host material including CBP or mCP, and Ir (ppy) ₃ (tris (2-phenylpyridine) iridium Lt; RTI ID = 0.0 > Ir complex < / RTI > Further, it may be made of a fluorescent material containing Alq ₃ (tris (8-hydroxyquinolino) aluminum).

When the light emitting layer emits blue light, the peak emission wavelength may range from 440 nm to 480 nm, including a host material including CBP or mCP, and FIrPic (bis (3,5-difluoro-2 - (2-pyridyl) phenyl- (2-carboxypyridyl) iridium), and a phosphorescent material containing a dopant material such as spiro-DPVBi (4,4'-Bis -1-yl) biphenyl, DSA (1-4-di- [4- (N, N-di-phenyl) amino] styryl-benzene, PFO, polyphenylenevinylene Or a fluorescent material containing one of them.

An electron transporting layer is disposed on the light emitting layer to smooth the movement of electrons to the light emitting layer. The electron transport layer may be formed of, for example, Liq (8-hydroxyquinolinolato-lithium), PBD (2- (4-biphenyl) -5- (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline) and BAlq (4-biphenyl) (bis (2-methyl-8-quinolinolate) -4- (phenylphenolato) aluminum).

An electron injection layer may further be disposed on the electron transporting layer. The electron injection layer is an organic layer that facilitates the injection of electrons from the cathode 446, and may be omitted depending on the structure and characteristics of the electroluminescence display device 400. The electron injection layer is BaF2, LiF, NaCl, CsF, Li 2 O , and may be a metallic inorganic compound such as BaO, HAT-CN (dipyrazino [ 2,3-f: 2 ', 3'-h] quinoxaline-2, 3,6,7,10.11-hexacarbonitrile), CuPc (phthalocyanine), and NPD (N, N'-bis (naphthalene- , And the like.

An electron blocking layer or a hole blocking layer blocking the flow of holes or electrons is disposed at a position adjacent to the light emitting layer so that electrons move from the light emitting layer to the adjacent hole transporting layer It is possible to prevent the phenomenon that the light is passed through the light emitting layer and passes through the adjacent electron transporting layer when holes are injected into the light emitting layer, thereby improving the light emitting efficiency.

The cathode 446 is disposed on the light emitting portion 444 and serves to supply electrons to the light emitting portion 444. [ The cathode 446 may be formed of a metal material such as magnesium (Mg), silver-magnesium (Ag: Mg) or the like, which is a conductive material having a low work function, and is not limited thereto.

When the electroluminescent display device 400 is a top-mounted type, the cathode 446 may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO) Zinc oxide (ZnO), and tin oxide (TiO 2).

The thin film transistor 420 and the light emitting element 440 which are components of the electroluminescence display device 400 are sealed on the light emitting element 440 with a bag for preventing oxidation or damage due to moisture, A plurality of sealing layers, a foreign material compensation layer, and a plurality of barrier films may be stacked.

The sealing layer is disposed on the upper surface of the thin film transistor 420 and the light emitting device 440 and may be composed of one of silicon nitride (SiNx) or aluminum oxide (AlOz), which is an inorganic material.

An encapsulation layer may be further disposed on the foreign material compensation layer disposed on the encapsulation layer.

The foreign material compensation layer is disposed on the sealing layer and may be an organic material such as silicon oxy carbon (SiOCz), acrylic or epoxy resin, but not limited thereto, When a defect occurs due to a foreign substance or a crack generated by a particle, the foreign substance compensating layer can compensate the foreign substance by covering the foreign object.

A barrier film may be disposed on the sealing layer and the foreign material compensation layer so that the electroluminescent display device 400 can delay the penetration of oxygen and moisture from the outside. The barrier film may be formed of an insulating material selected from the group consisting of olefin series, acrylic series and silicon series, or COP (Cyclolefin A barrier film composed of any one of a polymer, a COC (Cycloolefin Copolymer), and a PC (Polycarbonate) may be further laminated, but the present invention is not limited thereto.

FIG. 4B is a cross-sectional view of the detailed structure of the bending area B / A illustrated in FIG. 3A.

4B is substantially the same as or similar to the components described in FIG. 4A, and a detailed description thereof will be omitted.

The gate signal and the data signal described with reference to FIGS. 1 to 3A are supplied from outside to the pixels (not shown) arranged in the display area A / A via the circuit wiring arranged in the non-display area N / A of the electroluminescence display device 400 So as to emit light.

When wiring arranged in the non-display area N / A including the bending area B / A of the electroluminescence display 400 is formed as a single layer structure, a lot of space is required for disposing the wiring. Since a conductive material is deposited and a conductive material is patterned by a process such as etching in the form of a wiring to be formed, since the fineness of the etching process is limited, a large space is required due to the limit for narrowing the interval between the wirings, The area of the non-display area N / A becomes large, which may cause difficulties in implementation of the narrow bezel.

In addition, when one wiring is used to transmit one signal, if the wiring is cracked, the signal may not be transmitted properly. A crack may be generated in the wiring itself in the process of bending the substrate 410, or a crack may be generated in the other layer, and the crack may be propagated to the wiring. In this way, when a crack is generated in the wiring, a signal to be transmitted may not be transmitted.

Accordingly, the wirings disposed in the bending area B / A of the electroluminescent display device 400 according to the embodiment of the present invention are arranged in the form of a double wiring of the first wirings 462 and the second wirings 464 .

The first wiring 462 and the second wiring 464 are formed of a conductive material and may be formed of a conductive material having excellent ductility to reduce the occurrence of cracks when the flexible substrate 410 is bent. The first wiring 462 and the second wiring 464 may be formed of a conductive material having excellent ductility such as gold (Au), silver (Ag), aluminum (Al) A, Ni, Ni, Nd, Cu, and Ag may be formed as one of the various conductive materials used in the first and second embodiments. And an alloy of magnesium (Mg). The first wiring 462 and the second wiring 464 may be formed of a multilayer structure including various conductive materials. For example, the first wiring 462 and the second wiring 464 may be formed of three layers of titanium (Ti) / aluminum (Al) Layer structure, but is not limited thereto.

A buffer layer made of an inorganic insulating layer may be disposed below the first wirings 462 and the second wirings 464 to protect the first wirings 462 and the second wirings 464, The first wiring 462 and the second wiring 464 are prevented from being corroded by reacting with moisture or the like by forming a passivation layer made of an inorganic insulating layer so as to surround the upper and the side of the second wiring 464 and the second wiring 464 .

The first wiring 462 and the second wiring 464 formed in the bending area B / A are subjected to a tensile force when bent. As described with reference to FIG. 3, wirings extending in the same direction as the bending direction on the substrate 410 are subjected to the greatest tensile force, cracks may occur, and breakage may occur if the cracks are severe. Therefore, instead of forming the wiring to extend in the bending direction, at least a part of the wiring disposed including the bending region B / A is formed to extend in the diagonal direction different from the bending direction, thereby minimizing the tensile force, The occurrence can be reduced. The shape of the wiring can be configured as a rhombic shape, a triangular wave shape, a sinusoidal shape, a trapezoidal shape, and the like, but is not limited thereto.

The first wiring 462 is disposed on the substrate 410 and the first planarization layer 435 is disposed on the first wiring 462. [ A second wiring 464 is disposed on the first planarization layer 435 and a second planarization layer 437 is disposed on the second wiring 464. [

The first planarizing layer 435 and the second planarizing layer 437 may be formed of a resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, And may be formed of one or more of polyimides resin, unsaturated polyester resin, polyphenylene resin, polyphenylenesulfide resin, and benzocyclobutene. But is not limited thereto.

A micro-coating layer 466 is disposed on the second planarization layer 437. Since micro-cracks may be generated due to a tensile force acting on the wiring part disposed on the substrate 410 at the time of bending, the micro-coating layer 466 may be formed by coating resin with a thin thickness at the bent position to protect the wiring Can play a role.

5 is a cross-sectional view of a bending region of a flexible electroluminescent display device according to an embodiment of the present invention.

5 are substantially the same as or similar to those described in Figs. 3A and 3B, and a detailed description thereof will be omitted.

Referring to FIG. 5, a first adhesive layer 530 is disposed on a flexible substrate 510. The first adhesive layer 530 may be an optically cleared resin (OCR) or an optically cleared film (OCA film), but is not limited thereto.

The touch screen panel 520 described with reference to FIG. 3B is disposed on the first adhesive layer 530 and adhered and fixed to the flexible substrate 510 by the first adhesive layer 530. The touch screen panel 520 may be a touch substrate.

The touch screen panel 520 includes a touch area T / A disposed correspondingly on the display area A / A of the flexible substrate 510 and a non-display area A / A surrounding the periphery of the edge of the display area A / And a non-touch area NT / A disposed corresponding to the area N / A.

The touch pad 545 is disposed in the non-touch area NT / A of the touch screen panel 520 and is disposed corresponding to the non-display area N / A on the flexible substrate 520.

At the end of the touch screen panel 520, a touch circuit board 540 formed of an insulating film is connected to the touch pad 545.

 The touch circuit board 540 may include a touch sensing circuit for sensing various types of wires and touch inputs to transmit signals to the touch electrodes disposed in the touch region T / And bends and arranges the outer periphery of the bending region B / A of the flexible substrate 510.

On the touch screen panel 520 and the touch circuit board 540, a polarizing plate 550 is adhered and fixed.

The polarizing plate 550 suppresses the reflection of external light on the display area A / A of the flexible substrate 510. When the display device 500 is used from the outside, external natural light may be reflected by a reflector included in the anode of the electroluminescent element or by an electrode composed of metal disposed under the organic electroluminescent element. The image of the display device 500 may not be visually recognized by the reflected light. The polarizing plate 550 polarizes light incident from the outside in a specific direction and prevents the reflected light from being emitted again to the outside of the display apparatus 500.

The polarizing plate 550 can be arranged to include a region wider than the display region A / A in order to suppress the reflection of external light up to the outer region of the display region A / A of the flexible substrate 510. The polarizing plate 550 included in the electroluminescence display 500 according to the embodiment of the present invention is configured to include the touch screen panel 520 on the display area A / A and the touch circuit board 520 on the non-display area N / 540 are all covered.

Since the touch circuit board 540 and the touch pad 545 have a predetermined thickness, a certain level difference is generated between the touch screen panel 520 and the touch circuit board 540, The polarizing plate 550 which is adhered and fixed while covering one side of the substrate 540 at the same time generates air bubbles due to the step difference generated in the area adjacent to the touch circuit substrate 540. As a result, have. If the polarizing plate 550 is not properly adhered and is excited, the polarizing plate 550 may not function properly, and the image may not be viewed from outside in some areas.

In order to prevent this, in the display area A / A, a stepped area, which is the area where the touch screen panel 520 and the touch circuit board 540 are connected, is formed in the display area A / A so that the above- So that it is difficult to minimize the bezel area of the electroluminescent display device 500. In addition,

The flexible electroluminescent display device 500 according to an exemplary embodiment of the present invention includes a touch circuit board 540 and a second adhesive layer 533 disposed on the touch screen panel 520 and the touch circuit board 540, And the step difference generated in the touch pad 545 can be compensated. Here, the second adhesive 533 may be a step difference compensating layer. In the entire region where the polarizing plate 550 including both the display area A / A and the non-display area N / A is disposed, the polarizing plate 550 disposed on the second adhesive layer 533 is provided with the second adhesive layer 533 to minimize the occurrence of bubbles, thereby preventing lifting of the polarizer 550, thereby preventing the image from being visually recognized from outside in a part of the area generated by lifting.

It is possible to minimize bubbles between the polarizing plate 550 and the touch screen panel 520 and the touch circuit board 540 and to prevent lifting of the polarizer 550, The bezel region of the electroluminescence display device 500 can be minimized because the touch pad 545 can be disposed.

If a second adhesive layer 533 having a flexible characteristic is arranged on the touch screen panel 520 and the touch circuit board 540 at a thickness equal to or thicker than the step difference generated in the touch circuit board 540 and the touch pad 545, The upper surface of the second adhesive layer 533 becomes flat while the second adhesive layer 533 having a flexible property compensates for the difference in level, and the upper polarizer 550, So that it can be bonded.

The second adhesive layer 533 has a relatively thin thickness on the upper surface of the touch circuit board 540 and the touch pad 545 in order to alleviate a step generated in the area adjacent to the touch circuit board 540, And may have a predetermined slope therebetween. [0052] In the present embodiment, as shown in FIG.

Since the polarizer 550 can prevent bump from being generated due to the step difference, the touch circuit substrate 540 can be arranged adjacent to the display area A / A as much as possible, 540 may be minimized.

A back plate 560 is disposed under the flexible substrate 510. In the case where the flexible substrate 510 is made of a plastic material such as polyimide, the manufacturing process of the flexible electroluminescence display device 500 is advanced in a situation where a support substrate made of glass is disposed under the flexible substrate 510, The support substrate can be released and released.

A cover glass (CG) 555 for protecting the outer appearance of the display device 500 may be disposed by adhering a third adhesive layer 536 on the polarizing plate 550.

A back plate 560 for supporting the flexible substrate 510 can be disposed under the flexible substrate 510 because a component for supporting the flexible substrate 510 is required even after the supporting substrate is released.

The back plate 560 may be disposed adjacent to the bending area B / A in another area of the flexible substrate 510 except for the bending area B / A. The back plate 560 may be formed of a plastic film formed of polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, a combination of these polymers, and the like.

A support member 565 may be disposed between the two back plates 560 and the support member 565 may be bonded to the back plate 560. The support member 565 may be formed of a plastic material such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, The strength of the support member 565 formed of such plastic materials may be controlled by adding additives to increase the thickness and strength of the support member 565. [ And, the support member 565 may be formed of glass, ceramic, metal or other rigid materials or combinations of the above-described materials.

A micro-coating layer 570 is disposed on the bending region B / A of the flexible substrate 510.

Since microcracks may be generated due to a tensile force acting on the wiring portion disposed on the flexible substrate 510 at the time of bending, the microcapsule layer 570 may be formed by coating resin with a thin thickness at a bent position to protect the wiring Can play a role.

The micro-coating layer 570 can adjust the neutral plane of the bending area B / A. The neutral plane means a virtual surface that is not stressed because the compressive force and the tensile force applied to the structure are canceled each other when the structure is bent. If two or more structures are stacked, a virtual neutral plane may be formed between the structures. When the entire structure is bent in one direction, the structures arranged in the bending direction with respect to the neutral plane are compressed by the bending, so that they are subjected to the compressive force. On the contrary, the structures arranged in the direction opposite to the bending direction with respect to the neutral plane are stretched by bending, so that they are subjected to a tensile force. And, in general, structures are more susceptible to tensile forces of the same compressive and tensile forces, so they are more likely to crack when subjected to tensile forces.

Since the flexible substrate 510 disposed under the neutral plane is compressed, the compressive force is applied to the flexible substrate 510, and the wirings disposed on the upper side can receive a tensile force, thereby causing a crack due to the tensile force. Therefore, it can be placed on the neutral plane to minimize the tensile force applied to the wiring.

By placing the microcoat layer 570 on the bending region B / A, the neutral plane can be raised in the upward direction, and the neutral plane can be formed at the same position as the wiring or at a higher position than the neutral plane, It is not received or is subjected to a compressive force, so that occurrence of cracks can be suppressed.

The micro-coating layer 570 may be composed of a resin, and may be composed of an acrylic material or urethane acrylate, but is not limited thereto.

An insulating film 580 is connected to an end of the flexible substrate 510. On the insulating film 580, various wirings for transmitting signals to pixels arranged in the display area A / A are formed. The insulating film 580 is formed of a material having flexibility to be bent. A driving device may be mounted on the insulating film 580 and a driving package such as a chip on film (COF) may be formed together with the insulating film 580 and may be formed on the insulating film 580 And supplies driving signals and data to the pixels arranged in the display area A / A.

The circuit board connected to the insulating film 580 may receive a video signal from the outside and apply various signals to pixels arranged in the display area A / A, or may be a printed circuit board.

6A and 6B are a cross-sectional view and a perspective view of a bending region of a flexible electroluminescent display device according to another embodiment of the present invention.

6A and 6B are substantially the same as or similar to those described in Figs. 3A and 3B, and a detailed description thereof will be omitted.

Referring to FIG. 6A, a first adhesive layer 630 is disposed on a flexible substrate 610. The first adhesive layer 630 may be an optically cleared resin (OCR) or an optically cleared film (OCA film), but is not limited thereto.

The touch screen panel 620 described with reference to FIG. 3B is disposed on the first adhesive layer 630 and adhered and fixed to the flexible substrate 610 by the first adhesive layer 630. The touch screen panel 620 may be a touch substrate.

The touch screen panel 620 includes a touch area T / A disposed correspondingly to the display area A / A of the flexible substrate 610 and a non-display area A / A surrounding the periphery of the edge of the display area A / And a non-touch area NT / A disposed corresponding to the area N / A.

A touch pad 645 is disposed in the non-touch area NT / A of the touch screen panel 620 and is disposed correspondingly on the non-display area N / A on the flexible substrate 620.

At the end of the touch screen panel 620, a touch circuit board 640 formed of an insulating film is connected to the touch pad 645.

 The touch circuit board 640 may include a touch sensing circuit for sensing various types of wires and touch inputs to transmit signals to the touch electrodes arranged in the touch area T / A, And bends and arranges the outer periphery of the bending region B / A of the flexible substrate 610.

A barrier layer 632 may be further disposed on the touch screen panel 620 to protect the touch screen panel 620 disposed thereunder from external impact or foreign matter. The barrier layer 632 may be formed of any one of COP (Copolyester Thermoplastic Elastomer), COC (Cycoolefin Copolymer), and PC (Polycarbonate), but is not limited thereto.

5, since the touch circuit board 640 and the touch pad 645 have a certain thickness, a certain level difference is generated between the touch screen panel 620 and the touch circuit board 640. In this case, when the barrier layer 632 for protecting the touch screen panel 620 and the touch circuit board 640 is disposed on the touch screen panel 620, 620 and the touch circuit board 640 may be generated.

The bubbles generated in the region adjacent to the touch circuit substrate 640 can not be properly adhered to the polarizer 650 disposed on the barrier layer 632 and the polarizer 650 may not function properly, The image may not be viewed. In order to prevent this, in the display area A / A, a step area, which is the area where the touch screen panel 620 and the touch circuit board 640 are connected, is formed in the display area A / A so that the above- So that it is difficult to minimize the bezel area of the electroluminescence display device 600. As a result,

The flexible EL display device 600 according to another embodiment of the present invention is configured such that the barrier layer 632 disposed on the touch screen panel 620 is disposed at a predetermined distance And a notch region (N) cut so as to be spaced apart from the substrate (B).

The notch area N has a minimum distance B so that the bezel area can be minimized without the barrier layer 632 and the touch circuit board 640 being mutually influenced and the barrier layer 632 and the touch circuit board 640, The minimum distance B of the substrate 640 may be 50 [mu] m, but is not limited thereto. The notch area N may be cut to a width larger than the width of the touch circuit board 640 so that the barrier layer 632 and the touch circuit board 640 are not affected by each other. In addition, the notch area N may be cut in a shape corresponding to the shape of the touch circuit board 640.

The thickness of the barrier layer 632 may be from 35 탆 to 60 탆, preferably 50 탆. When the thickness of the touch screen panel 620 is equal to the thickness of the touch screen panel 620, the thickness of the touch screen panel 620 is compensated. The touch circuit board 640 is disposed in the notch area N of the barrier layer 632 so as to minimize the bezel area without causing lifting of the polarizer 650 disposed on the touch screen panel 620 .

The notch area N included in the barrier layer 632 will be described in detail with reference to FIG. 6B.

A second adhesive layer 634 composed of a transparent adhesive resin (OCR) or a transparent adhesive film (OCA film) is disposed on the barrier layer 632 and adhered to the polarizing plate 650 disposed on the second adhesive layer 634 And is fixedly disposed.

The polarizing plate 650 suppresses the reflection of external light on the display area A / A of the flexible substrate 610. When the display device 600 is used externally, external natural light may be reflected by a reflector included in the anode of the electroluminescent element or by an electrode formed of metal disposed under the organic electroluminescent element. The image of the display device 600 may not be visually recognized by the reflected light. The polarizing plate 650 polarizes the light incident from the outside in a specific direction, and prevents the reflected light from being emitted to the outside of the display device 600 again.

The polarizing plate 650 can be arranged to include a region wider than the display region A / A in order to suppress reflection of external light up to the outer region of the display region A / A of the flexible substrate 610. The polarizing plate 650 included in the electroluminescence display device 600 according to another embodiment of the present invention may include a touch screen panel 620 on the display area A / A and a touch circuit board 620 on the non-display area N / (640).

A third adhesive layer 636 may be disposed on the polarizing plate 650 so that a cover glass 655 for protecting the appearance of the display device 600 may be adhered and disposed.

A back plate 660 is disposed under the flexible substrate 610. In the case where the flexible substrate 610 is made of a plastic material such as polyimide, the manufacturing process of the flexible electro-luminescent display device 600 proceeds in a situation where a supporting substrate made of glass is disposed under the flexible substrate 610, The support substrate can be released and released. A back plate 660 for supporting the flexible substrate 610 can be disposed under the flexible substrate 610 because a component for supporting the flexible substrate 610 is required even after the supporting substrate is released.

The back plate 660 may be disposed adjacent to the bending area B / A in another area of the flexible substrate 610 except for the bending area B / A. The back plate 660 may be formed of a plastic film formed of polyimide, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, a combination of these polymers, and the like.

A support member 665 is disposed between the two back plates 660 and the support member 665 can be adhered to the back plate 660. The support member 665 may be formed of a plastic material such as polycarbonate (PC), polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polymers, The strength of the support member 665 formed of such plastic materials may be controlled by adding additives to increase the thickness and strength of the support member 665. [ And, the support member 665 may be formed of glass, ceramic, metal or other rigid materials or combinations of the above-described materials.

A micro-coating layer 670 is disposed on the bending area B / A of the flexible substrate 610.

Since microcracks may be generated due to a tensile force acting on the wiring portion disposed on the flexible substrate 610 at the time of bending, the micro coating layer 670 may be formed by coating resin with a thin thickness at a bent position to protect the wiring Can play a role.

The microcoat layer 670 can adjust the neutral plane of the bending area B / A. By placing the microcoat layer 670 on the bending area B / A, the neutral plane can be raised in the upward direction, and the neutral plane can be formed at the same position as the wiring or at a higher position than the neutral plane, It is not received or is subjected to a compressive force, so that occurrence of cracks can be suppressed.

The micro-coating layer 670 may be composed of a resin, and may be composed of an acrylic material or urethane acrylate, but is not limited thereto.

An insulating film 680 is connected to an end of the flexible substrate 610. On the insulating film 680, various wirings for transmitting signals to pixels arranged in the display area A / A are formed. The insulating film 680 is formed of a material having flexibility to be bent. A driving device may be mounted on the insulating film 680 and a driving package such as a chip on film (COF) may be formed together with the insulating film 680 and may be formed on the insulating film 680 And supplies driving signals and data to the pixels arranged in the display area A / A.

The circuit board connected to the insulating film 680 may apply various signals to pixels arranged in the display area A / A by receiving an image signal from the outside, and may be a printed circuit board.

6B, the touch screen panel 620 includes a touch region T / A and a touch region T / A disposed corresponding to the display region A / A of the flexible substrate 610, And a non-touch area NT / A arranged corresponding to the non-display area N / A surrounding the outer area.

A touch pad 645 is disposed in the non-touch area NT / A of the touch screen panel 620 and is disposed correspondingly on the non-display area N / A on the flexible substrate 620. At the end of the touch screen panel 620, a touch circuit board 640 formed of an insulating film is connected to the touch pad 645.

A barrier layer 632 may be further disposed on the touch screen panel 620 to protect the touch screen panel 620 disposed thereunder from external impact or foreign matter.

The barrier layer 632 disposed on the touch screen panel 620 includes a notch region N that is cut away at a minimum distance B in the region where the touch circuit board 640 is disposed .

The notch area N has a minimum distance B so that the bezel area can be minimized without the barrier layer 632 and the touch circuit board 640 being mutually influenced and the barrier layer 632 and the touch circuit board 640, The minimum distance B of the substrate 640 may be 50 [mu] m, but is not limited thereto.

The notch region N irradiates a laser beam to the front stage before the barrier layer 632 is laminated to the electroluminescence display 600 so that the notch region N is aligned with the region where the touch circuit substrate 640 is disposed N may be formed by a punching process and may be laminated to the electroluminescent display device 600.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region and a bending region extending from one side of the display region, a thin film transistor and a light emitting element on the display region, A touch screen panel, a touch screen panel, a touch screen panel bent on the outside of the bending area, a polarizer on the touch screen panel, a polarizer covering a part of the touch circuit board, And a step difference compensation layer for compensating a step difference between the touch circuit boards.

A back plate is disposed on the lower surface of the flexible substrate of the flexible electroluminescence display device according to the embodiment of the present invention.

The back plate of the flexible electroluminescence display device according to the embodiment of the present invention is composed of a plurality of layers.

At least one of the plurality of layers of the back plate of the flexible electroluminescence display device according to the embodiment of the present invention is composed of one of polyimide, polyethylene naphthalate (PEN), and polyethylene terephthalate (PET).

A cover glass is disposed on the polarizing plate of the flexible electroluminescence display device according to the embodiment of the present invention.

An adhesive layer is disposed between the polarizing plate and the cover glass of the flexible electroluminescence display device according to the embodiment of the present invention to bond the polarizing plate and the cover glass.

The flexible electroluminescence display device according to the embodiment further includes an insulation film connected to the flexible substrate, and the insulation film is provided with a circuit driving element.

There is a micro-cover layer on the bending region of the flexible electroluminescent display device according to the embodiment of the present invention.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention is an adhesive layer.

The adhesive layer of the flexible electroluminescence display device according to the embodiment of the present invention is made of an optically cleared resin (OCR) or an optically cleared film (OCA film) material.

The thickness of the level difference compensating layer of the flexible electroluminescence display device according to the embodiment of the present invention has a value larger than the step difference.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention is a barrier layer.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention further includes a notch region in which a region overlapping with the touch circuit substrate is cut out.

The thickness of the level difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention has the same value as the level difference.

A flexible electroluminescent display device according to an embodiment of the present invention includes a flexible substrate including a display region and a non-display region that surrounds the display region and has a bending region, a thin film transistor and a light emitting element on the display region, A touch panel, a touch screen panel on the touch screen panel, a touch circuit board bent on the outside of the bent bending area, a polarizer plate on the touch screen panel and covering a part of the touch circuit board, A step difference compensating layer for compensating a step difference from an end of the substrate is disposed on the touch screen panel.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention is an adhesive layer.

The adhesive layer of the flexible electroluminescence display device according to the embodiment of the present invention is made of an optically cleared resin (OCR) or an optically cleared film (OCA film) material.

The thickness of the level difference compensating layer of the flexible electroluminescence display device according to the embodiment of the present invention has a value larger than the step difference.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention is a barrier layer.

The step difference compensation layer of the flexible electroluminescence display device according to the embodiment of the present invention further includes a notch region in which a region overlapping with the touch circuit substrate is cut out.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of protection of the present invention should be construed according to the claims, and all technical ideas within the scope of equivalents should be interpreted as being included in the scope of the present invention.

100, 200, 300, 400, 500, 600: Electroluminescent display device
110:
120: Timing controller
130: Data driver
140: gate driver
150: Display panel
160: pixel
220: gate line
230: Data line
240: switching transistor
250: driving transistor
260: Compensation circuit
270, 440: Light emitting element
310, 410, 510, 610: flexible substrate
320, 520, 620: touch screen panel
325: touch electrode
330, 545, 645: Touchpad
335: Touch wiring
340, 540, 640: touch circuit board
370: Circuit Wiring
390: Gate driver
395: Pad
420: thin film transistor
422: gate electrode
424: source electrode
426: drain electrode
428: Semiconductor layer
431: first insulating layer
433: second insulating layer
435: first planarization layer
437: second planarization layer
442: anode
444:
446: Cathode
450: Bank
452: Spacer
460:
462: first wiring
464: Second wiring
466, 570, 670: Micro-coating layer
530, 630: first adhesive layer
533, 634: second adhesive layer
536, 636: third adhesive layer
550, 650: polarizer
555, 655: cover glass
560, 660: back plate
565, 665: support member
580, 680: Insulation film
632: barrier layer
A / A: display area N / A: non-display area
B / A: Bending area S / L: Scan line
T / A: Touch area NT / A: Non touch area
N: notch area

Claims (20)

A flexible substrate including a display region and a bending region extending from one side of the display region;
A thin film transistor and a light emitting element on the display region;
A touch screen panel on the display area;
A touch circuit board connected to the touch screen panel and bent at a periphery of the bending area;
A polarizing plate on the touch screen panel and covering a part of the touch circuit board; And
And a level difference compensating layer on the touch screen panel for compensating a level difference between the touch screen panel and the touch circuit board. The method according to claim 1,
And a back plate is disposed on a lower surface of the flexible substrate. 3. The method of claim 2,
Wherein the back plate is composed of a plurality of layers. The method of claim 3,
Wherein at least one of the plurality of layers of the back plate is composed of one of polyimide, polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). The method according to claim 1,
And a cover glass is disposed on the polarizing plate. 6. The method of claim 5,
And an adhesive layer is disposed between the polarizing plate and the cover glass to bond the polarizing plate and the cover glass. The method according to claim 1,
And an insulating film connected to the flexible substrate,
And a circuit driving element is disposed in the insulating film. The method according to claim 1,
And a micro-cover layer on the bending region. The method according to claim 1,
Wherein the step difference compensation layer is an adhesive layer. 10. The method of claim 9,
Wherein the adhesive layer is made of an optically cleared resin (OCR) or an optically cleared film (OCA film) material. 10. The method of claim 9,
Wherein the thickness of the step difference compensation layer has a larger value than the step difference. The method according to claim 1,
Wherein the step difference compensation layer is a barrier layer. 13. The method of claim 12,
Wherein the step difference compensation layer further includes a notch region in which a region overlapping with the touch circuit substrate is cut out. 13. The method of claim 12,
And the thickness of the step difference compensation layer has the same value as the step difference. A flexible substrate including a non-display region having a display region and an outer periphery of the display region and having a bending region;
A thin film transistor and a light emitting element on the display region;
A touch screen panel on the display area;
A touch circuit board connected to the touch screen panel and bent at a periphery of the bent bending region;
A polarizing plate on the touch screen panel and covering a part of the touch circuit board; And
And a level difference compensating layer for compensating a level difference between the touch screen panel and an end of the touch circuit board is disposed on the touch screen panel. 16. The method of claim 15,
Wherein the step difference compensation layer is an adhesive layer. 17. The method of claim 16,
Wherein the adhesive layer is made of an optically cleared resin (OCR) or an optically cleared film (OCA film) material. 17. The method of claim 16,
Wherein the thickness of the step difference compensation layer has a larger value than the step difference. 16. The method of claim 15,
Wherein the step difference compensation layer is a barrier layer. 20. The method of claim 19,
Wherein the step difference compensation layer further includes a notch region in which a region overlapping with the touch circuit substrate is cut out.

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