KR20190032208A - 임프린트 장치, 임프린트 방법 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품 제조 방법 Download PDF

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Publication number
KR20190032208A
KR20190032208A KR1020180107756A KR20180107756A KR20190032208A KR 20190032208 A KR20190032208 A KR 20190032208A KR 1020180107756 A KR1020180107756 A KR 1020180107756A KR 20180107756 A KR20180107756 A KR 20180107756A KR 20190032208 A KR20190032208 A KR 20190032208A
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KR
South Korea
Prior art keywords
imprint material
substrate
light
shot area
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020180107756A
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English (en)
Korean (ko)
Inventor
나오키 무라사토
겐 미노다
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20190032208A publication Critical patent/KR20190032208A/ko
Priority to KR1020210153591A priority Critical patent/KR102459131B1/ko
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0961—Lens arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020180107756A 2017-09-19 2018-09-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법 Abandoned KR20190032208A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210153591A KR102459131B1 (ko) 2017-09-19 2021-11-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017179008A JP6936672B2 (ja) 2017-09-19 2017-09-19 インプリント装置、インプリント方法および物品製造方法
JPJP-P-2017-179008 2017-09-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210153591A Division KR102459131B1 (ko) 2017-09-19 2021-11-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Publications (1)

Publication Number Publication Date
KR20190032208A true KR20190032208A (ko) 2019-03-27

Family

ID=65719221

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020180107756A Abandoned KR20190032208A (ko) 2017-09-19 2018-09-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법
KR1020210153591A Active KR102459131B1 (ko) 2017-09-19 2021-11-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Family Applications After (1)

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KR1020210153591A Active KR102459131B1 (ko) 2017-09-19 2021-11-10 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US11187977B2 (enExample)
JP (1) JP6936672B2 (enExample)
KR (2) KR20190032208A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7292479B2 (ja) * 2018-12-20 2023-06-16 キヤノン株式会社 インプリント装置および物品製造方法
JP7358192B2 (ja) * 2019-10-25 2023-10-10 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP7486335B2 (ja) * 2020-03-30 2024-05-17 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法
JP7769515B2 (ja) * 2021-11-04 2025-11-13 キヤノン株式会社 インプリント装置
JP2024090242A (ja) * 2022-12-22 2024-07-04 キヤノン株式会社 インプリント装置、インプリント方法、および物品製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2073798A (en) * 1933-12-08 1937-03-16 Hillman Albert George Production of cinematographic effects in color and means therefor
US4712910A (en) * 1984-01-05 1987-12-15 Nippon Kogaku K.K. Exposure method and apparatus for semiconductor fabrication equipment
JPH09204050A (ja) * 1995-11-24 1997-08-05 Sanei Denki Seisakusho:Kk 光照射装置
JPH11233423A (ja) * 1998-02-06 1999-08-27 Canon Inc 露光用シャッタおよび露光装置ならびにディバイス製造方法
JP4481698B2 (ja) * 2004-03-29 2010-06-16 キヤノン株式会社 加工装置
US8202075B2 (en) * 2005-08-12 2012-06-19 Canon Kabushiki Kaisha Imprint apparatus and imprint method
JP5002211B2 (ja) * 2005-08-12 2012-08-15 キヤノン株式会社 インプリント装置およびインプリント方法
JP4799575B2 (ja) * 2008-03-06 2011-10-26 株式会社東芝 インプリント方法
JP5127875B2 (ja) * 2010-04-28 2013-01-23 キヤノン株式会社 リソグラフィ装置及び物品の製造方法
WO2013008410A1 (ja) * 2011-07-08 2013-01-17 東洋製罐株式会社 熱可塑性樹脂製品の成形方法及びその成形装置
JP6200135B2 (ja) 2012-07-24 2017-09-20 キヤノン株式会社 インプリント装置、インプリント方法、および、物品製造方法
JP2015144193A (ja) * 2014-01-31 2015-08-06 株式会社東芝 インプリント方法、テンプレートおよびインプリント装置
JP6415057B2 (ja) * 2014-02-07 2018-10-31 キヤノン株式会社 露光装置、および物品の製造方法
JP5773024B2 (ja) * 2014-04-25 2015-09-02 大日本印刷株式会社 ナノインプリントによるパターン形成装置
JP6632270B2 (ja) * 2014-09-08 2020-01-22 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
US10406725B2 (en) * 2016-05-26 2019-09-10 Holonix International Co., Ltd. Light source apparatus for resin curing

Also Published As

Publication number Publication date
JP6936672B2 (ja) 2021-09-22
US20190086796A1 (en) 2019-03-21
JP2019054212A (ja) 2019-04-04
KR102459131B1 (ko) 2022-10-27
US11187977B2 (en) 2021-11-30
KR20210138531A (ko) 2021-11-19

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