KR20180126458A - 동장 적층판 및 그 제조 방법 - Google Patents

동장 적층판 및 그 제조 방법 Download PDF

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Publication number
KR20180126458A
KR20180126458A KR1020187023769A KR20187023769A KR20180126458A KR 20180126458 A KR20180126458 A KR 20180126458A KR 1020187023769 A KR1020187023769 A KR 1020187023769A KR 20187023769 A KR20187023769 A KR 20187023769A KR 20180126458 A KR20180126458 A KR 20180126458A
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KR
South Korea
Prior art keywords
layer
copper
white
laminate
ultraviolet light
Prior art date
Application number
KR1020187023769A
Other languages
English (en)
Korean (ko)
Inventor
야스시 이와이사코
다카히로 오리타
히로유키 오오가미
야스츠구 우에노
고우타로 후루카와
Original Assignee
니혼텅스텐 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 니혼텅스텐 가부시키가이샤 filed Critical 니혼텅스텐 가부시키가이샤
Publication of KR20180126458A publication Critical patent/KR20180126458A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
KR1020187023769A 2016-03-30 2017-02-07 동장 적층판 및 그 제조 방법 KR20180126458A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2016-068946 2016-03-30
JP2016068946 2016-03-30
JPJP-P-2016-244584 2016-12-16
JP2016244584A JP6089144B1 (ja) 2016-03-30 2016-12-16 銅張積層板およびその製造方法
PCT/JP2017/004417 WO2017169138A1 (ja) 2016-03-30 2017-02-07 銅張積層板およびその製造方法

Publications (1)

Publication Number Publication Date
KR20180126458A true KR20180126458A (ko) 2018-11-27

Family

ID=58186059

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187023769A KR20180126458A (ko) 2016-03-30 2017-02-07 동장 적층판 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JP6089144B1 (zh)
KR (1) KR20180126458A (zh)
CN (1) CN108698375A (zh)
TW (1) TWI777939B (zh)
WO (1) WO2017169138A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114762135A (zh) * 2020-01-20 2022-07-15 冈本硝子株式会社 光阻墨水
JP7461177B2 (ja) * 2020-03-13 2024-04-03 日本タングステン株式会社 銅張積層板
CN116390335A (zh) * 2022-10-27 2023-07-04 松山湖材料实验室 低传输损耗铜基复合材料及其制备方法、pcb板以及电子元器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788457B2 (ja) * 2006-04-18 2011-10-05 三菱瓦斯化学株式会社 プリプレグ並びに銅張積層板
KR20120068831A (ko) * 2009-07-17 2012-06-27 덴끼 가가꾸 고교 가부시키가이샤 Ｌｅｄ 칩 접합체, ｌｅｄ 패키지, 및 ｌｅｄ 패키지의 제조 방법
JP5463586B2 (ja) * 2009-12-21 2014-04-09 利昌工業株式会社 プリプレグ、積層板、及び金属箔張り積層板
KR101853598B1 (ko) * 2010-03-23 2018-04-30 가부시키가이샤 아사히 러버 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물
JP2012116003A (ja) * 2010-11-29 2012-06-21 Mitsubishi Plastics Inc 金属積層体、ｌｅｄ搭載用基板及び光源装置
US20140162071A1 (en) * 2011-05-31 2014-06-12 Mitsubishi Gas Chemical Company, Inc. Resin composition, and prepreg and metal foil-clad laminate using the same
CN102891417B (zh) * 2011-07-19 2015-02-04 中国北车集团大同电力机车有限责任公司 导线连接方法和接线端子
JP5851970B2 (ja) * 2012-10-29 2016-02-03 信越化学工業株式会社 シリコーン樹脂組成物、並びにこれを用いたシリコーン積層基板とその製造方法、及びｌｅｄ装置

Also Published As

Publication number Publication date
JP6089144B1 (ja) 2017-03-01
JP2017185780A (ja) 2017-10-12
TW201806755A (zh) 2018-03-01
TWI777939B (zh) 2022-09-21
WO2017169138A1 (ja) 2017-10-05
CN108698375A (zh) 2018-10-23

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