KR20180081609A - 방열 부품용 구리 합금판 - Google Patents
방열 부품용 구리 합금판 Download PDFInfo
- Publication number
- KR20180081609A KR20180081609A KR1020187017439A KR20187017439A KR20180081609A KR 20180081609 A KR20180081609 A KR 20180081609A KR 1020187017439 A KR1020187017439 A KR 1020187017439A KR 20187017439 A KR20187017439 A KR 20187017439A KR 20180081609 A KR20180081609 A KR 20180081609A
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- copper alloy
- heat
- heat dissipation
- less
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2015-254645 | 2015-12-25 | ||
JP2015254645 | 2015-12-25 | ||
JPJP-P-2016-175464 | 2016-09-08 | ||
JP2016175464A JP6446007B2 (ja) | 2015-12-25 | 2016-09-08 | 放熱部品用銅合金板 |
PCT/JP2016/087840 WO2017110759A1 (ja) | 2015-12-25 | 2016-12-19 | 放熱部品用銅合金板 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180081609A true KR20180081609A (ko) | 2018-07-16 |
Family
ID=59271698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187017439A KR20180081609A (ko) | 2015-12-25 | 2016-12-19 | 방열 부품용 구리 합금판 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6446007B2 (zh) |
KR (1) | KR20180081609A (zh) |
CN (1) | CN108368566B (zh) |
TW (2) | TWI697652B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110475883A (zh) * | 2017-03-30 | 2019-11-19 | Jx金属株式会社 | 轧制铜箔 |
JP6907282B2 (ja) | 2019-09-25 | 2021-07-21 | Jx金属株式会社 | ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー |
JP6878541B2 (ja) | 2019-09-25 | 2021-05-26 | Jx金属株式会社 | ベーパーチャンバー用チタン銅合金板及びベーパーチャンバー |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003277853A (ja) | 2002-03-26 | 2003-10-02 | Dowa Mining Co Ltd | ヒートスプレッダ用銅合金 |
JP2007315745A (ja) | 2005-09-01 | 2007-12-06 | Fuchigami Micro:Kk | ヒートパイプ及びその製造方法 |
JP2008232563A (ja) | 2007-03-22 | 2008-10-02 | Kobelco & Materials Copper Tube Inc | 銅または銅合金からなる銅管 |
JP2014134347A (ja) | 2013-01-10 | 2014-07-24 | Welcon:Kk | ベーパチャンバ |
JP2014189816A (ja) | 2013-03-26 | 2014-10-06 | Jx Nippon Mining & Metals Corp | 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS602638A (ja) * | 1983-06-21 | 1985-01-08 | Mitsui Mining & Smelting Co Ltd | 耐軟化高伝導性銅合金 |
JPH06177289A (ja) * | 1992-12-10 | 1994-06-24 | Showa Alum Corp | プレートフィン型放熱器 |
JPH093571A (ja) * | 1995-06-14 | 1997-01-07 | Mitsubishi Shindoh Co Ltd | ヒートシンク |
JP2001050682A (ja) * | 1999-08-05 | 2001-02-23 | Showa Alum Corp | パネル型熱交換器およびその製造方法 |
JP3465108B2 (ja) * | 2000-05-25 | 2003-11-10 | 株式会社神戸製鋼所 | 電気・電子部品用銅合金 |
JP4950584B2 (ja) * | 2006-07-28 | 2012-06-13 | 株式会社神戸製鋼所 | 高強度および耐熱性を備えた銅合金 |
JP2013231224A (ja) * | 2012-05-01 | 2013-11-14 | Sh Copper Products Co Ltd | 曲げ加工性に優れた電気・電子部品用銅合金材 |
JP5960672B2 (ja) * | 2013-11-25 | 2016-08-02 | 株式会社神戸製鋼所 | 高強度銅合金管 |
WO2016152648A1 (ja) * | 2015-03-23 | 2016-09-29 | 株式会社神戸製鋼所 | 放熱部品用銅合金板及び放熱部品 |
JP6081513B2 (ja) * | 2015-03-30 | 2017-02-15 | 株式会社神戸製鋼所 | 放熱部品用銅合金板 |
-
2016
- 2016-09-08 JP JP2016175464A patent/JP6446007B2/ja not_active Expired - Fee Related
- 2016-12-19 KR KR1020187017439A patent/KR20180081609A/ko not_active Application Discontinuation
- 2016-12-19 CN CN201680071395.1A patent/CN108368566B/zh not_active Expired - Fee Related
- 2016-12-22 TW TW107122550A patent/TWI697652B/zh not_active IP Right Cessation
- 2016-12-22 TW TW105142777A patent/TW201736611A/zh unknown
-
2018
- 2018-05-23 JP JP2018098407A patent/JP6732840B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003277853A (ja) | 2002-03-26 | 2003-10-02 | Dowa Mining Co Ltd | ヒートスプレッダ用銅合金 |
JP2007315745A (ja) | 2005-09-01 | 2007-12-06 | Fuchigami Micro:Kk | ヒートパイプ及びその製造方法 |
JP2008232563A (ja) | 2007-03-22 | 2008-10-02 | Kobelco & Materials Copper Tube Inc | 銅または銅合金からなる銅管 |
JP2014134347A (ja) | 2013-01-10 | 2014-07-24 | Welcon:Kk | ベーパチャンバ |
JP2014189816A (ja) | 2013-03-26 | 2014-10-06 | Jx Nippon Mining & Metals Corp | 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2017119909A (ja) | 2017-07-06 |
TW201736611A (zh) | 2017-10-16 |
JP2018168470A (ja) | 2018-11-01 |
CN108368566B (zh) | 2021-03-09 |
TWI697652B (zh) | 2020-07-01 |
JP6732840B2 (ja) | 2020-07-29 |
JP6446007B2 (ja) | 2018-12-26 |
TW201907134A (zh) | 2019-02-16 |
CN108368566A (zh) | 2018-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |