JP6446007B2 - 放熱部品用銅合金板 - Google Patents

放熱部品用銅合金板 Download PDF

Info

Publication number
JP6446007B2
JP6446007B2 JP2016175464A JP2016175464A JP6446007B2 JP 6446007 B2 JP6446007 B2 JP 6446007B2 JP 2016175464 A JP2016175464 A JP 2016175464A JP 2016175464 A JP2016175464 A JP 2016175464A JP 6446007 B2 JP6446007 B2 JP 6446007B2
Authority
JP
Japan
Prior art keywords
mass
copper alloy
heat
alloy plate
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016175464A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017119909A (ja
Inventor
大輔 橋本
大輔 橋本
昌泰 西村
昌泰 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to CN201680071395.1A priority Critical patent/CN108368566B/zh
Priority to KR1020187017439A priority patent/KR20180081609A/ko
Priority to PCT/JP2016/087840 priority patent/WO2017110759A1/ja
Priority to TW107122550A priority patent/TWI697652B/zh
Priority to TW105142777A priority patent/TW201736611A/zh
Publication of JP2017119909A publication Critical patent/JP2017119909A/ja
Application granted granted Critical
Publication of JP6446007B2 publication Critical patent/JP6446007B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016175464A 2015-12-25 2016-09-08 放熱部品用銅合金板 Expired - Fee Related JP6446007B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201680071395.1A CN108368566B (zh) 2015-12-25 2016-12-19 散热元件用铜合金板
KR1020187017439A KR20180081609A (ko) 2015-12-25 2016-12-19 방열 부품용 구리 합금판
PCT/JP2016/087840 WO2017110759A1 (ja) 2015-12-25 2016-12-19 放熱部品用銅合金板
TW107122550A TWI697652B (zh) 2015-12-25 2016-12-22 散熱零件用銅合金板、散熱零件，以及散熱零件的製造方法
TW105142777A TW201736611A (zh) 2015-12-25 2016-12-22 散熱零件用銅合金板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015254645 2015-12-25
JP2015254645 2015-12-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018098407A Division JP6732840B2 (ja) 2015-12-25 2018-05-23 ベーパーチャンバー用銅合金板

Publications (2)

Publication Number Publication Date
JP2017119909A JP2017119909A (ja) 2017-07-06
JP6446007B2 true JP6446007B2 (ja) 2018-12-26

Family

ID=59271698

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016175464A Expired - Fee Related JP6446007B2 (ja) 2015-12-25 2016-09-08 放熱部品用銅合金板
JP2018098407A Expired - Fee Related JP6732840B2 (ja) 2015-12-25 2018-05-23 ベーパーチャンバー用銅合金板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018098407A Expired - Fee Related JP6732840B2 (ja) 2015-12-25 2018-05-23 ベーパーチャンバー用銅合金板

Country Status (4)

Country Link
JP (2) JP6446007B2 (zh)
KR (1) KR20180081609A (zh)
CN (1) CN108368566B (zh)
TW (2) TWI697652B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210036289A (ko) 2019-09-25 2021-04-02 제이엑스금속주식회사 베이퍼 챔버용 티타늄 구리 합금판 및 베이퍼 챔버
KR20210036290A (ko) 2019-09-25 2021-04-02 제이엑스금속주식회사 베이퍼 챔버용 티타늄 구리 합금판 및 베이퍼 챔버

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018180920A1 (ja) * 2017-03-30 2019-12-12 Ｊｘ金属株式会社 圧延銅箔

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS602638A (ja) * 1983-06-21 1985-01-08 Mitsui Mining & Smelting Co Ltd 耐軟化高伝導性銅合金
JPH06177289A (ja) * 1992-12-10 1994-06-24 Showa Alum Corp プレートフィン型放熱器
JPH093571A (ja) * 1995-06-14 1997-01-07 Mitsubishi Shindoh Co Ltd ヒートシンク
JP2001050682A (ja) * 1999-08-05 2001-02-23 Showa Alum Corp パネル型熱交換器およびその製造方法
JP3465108B2 (ja) * 2000-05-25 2003-11-10 株式会社神戸製鋼所 電気・電子部品用銅合金
JP2003277853A (ja) 2002-03-26 2003-10-02 Dowa Mining Co Ltd ヒートスプレッダ用銅合金
JP4112602B2 (ja) 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ
JP4950584B2 (ja) * 2006-07-28 2012-06-13 株式会社神戸製鋼所 高強度および耐熱性を備えた銅合金
JP4878317B2 (ja) 2007-03-22 2012-02-15 株式会社コベルコ マテリアル銅管 銅または銅合金からなる銅管
JP2013231224A (ja) * 2012-05-01 2013-11-14 Sh Copper Products Co Ltd 曲げ加工性に優れた電気・電子部品用銅合金材
JP6176433B2 (ja) 2013-01-10 2017-08-09 株式会社Ｗｅｌｃｏｎ ベーパチャンバ
JP5467163B1 (ja) 2013-03-26 2014-04-09 Ｊｘ日鉱日石金属株式会社 銅合金板、それを備える放熱用電子部品および、銅合金板の製造方法
JP5960672B2 (ja) * 2013-11-25 2016-08-02 株式会社神戸製鋼所 高強度銅合金管
WO2016152648A1 (ja) * 2015-03-23 2016-09-29 株式会社神戸製鋼所 放熱部品用銅合金板及び放熱部品
JP6081513B2 (ja) * 2015-03-30 2017-02-15 株式会社神戸製鋼所 放熱部品用銅合金板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210036289A (ko) 2019-09-25 2021-04-02 제이엑스금속주식회사 베이퍼 챔버용 티타늄 구리 합금판 및 베이퍼 챔버
KR20210036290A (ko) 2019-09-25 2021-04-02 제이엑스금속주식회사 베이퍼 챔버용 티타늄 구리 합금판 및 베이퍼 챔버

Also Published As

Publication number Publication date
KR20180081609A (ko) 2018-07-16
JP2017119909A (ja) 2017-07-06
JP2018168470A (ja) 2018-11-01
TW201736611A (zh) 2017-10-16
TWI697652B (zh) 2020-07-01
CN108368566A (zh) 2018-08-03
CN108368566B (zh) 2021-03-09
JP6732840B2 (ja) 2020-07-29
TW201907134A (zh) 2019-02-16

Similar Documents

Publication Publication Date Title
JP6031549B2 (ja) 放熱部品用銅合金板
JP6031548B2 (ja) 放熱部品用銅合金板
JP6151813B1 (ja) ベーパチャンバーの製造方法
KR101979533B1 (ko) 방열 부품용 구리 합금판 및 방열 부품
JP6850233B2 (ja) 放熱部品用銅合金板
JP6031576B2 (ja) 放熱部品用銅合金板
JP6446011B2 (ja) 放熱部品用銅合金板及び放熱部品
WO2016152648A1 (ja) 放熱部品用銅合金板及び放熱部品
JP6446010B2 (ja) 放熱部品用銅合金板
JP6732840B2 (ja) ベーパーチャンバー用銅合金板
JP2018162518A (ja) ベーパーチャンバー用銅合金板及びベーパーチャンバー
WO2017110759A1 (ja) 放熱部品用銅合金板

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170801

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170816

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180206

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180406

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180523

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20181002

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20181027

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181130

R150 Certificate of patent or registration of utility model

Ref document number: 6446007

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees