KR20180081609A - Copper alloy plate for heat dissipation parts - Google Patents

Abstract

Provided is a copper alloy plate capable of having sufficient strength and heat radiation performance for a heat-radiating part after manufacturing, when a part of the process for manufacturing the heat-radiating part includes a process for heating to a temperature of 650 ° C or more. , Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass% and P: 0.03 to 0.2 mass%, and the total content of Ni and Fe is defined as [Ni + Fe] and the content of P is defined as [P] Wherein the balance of [Ni + Fe] is 0.25 to 1.0 mass%, [Ni + Fe] / [P] is 2 to 10, and the balance of Cu and inevitable impurities. The copper alloy sheet has a 0.2% proof stress of 100 MPa or more and excellent bending workability, and has 0.2% proof stress of 120 MPa or more after aging treatment after heating at 850 占 폚 for 30 minutes and then water-cooling followed by heating at 500 占 폚 for 2 hours, Is greater than 40% IACS.

Description

Copper alloy plate for heat dissipation parts

The present disclosure relates to a copper alloy plate for a heat-dissipating component used for a heat sink, a heat sink, a heat pipe, and the like for treating heat generated from a CPU, an LED lamp, and the like of a computer. More particularly, the present invention relates to a copper alloy plate for a heat dissipation component, which is used when a process of heating at a high temperature such as brazing, diffusion bonding, and degassing is included as a part of a process for manufacturing a heat dissipation component.

Speed operation and high-density operation of a CPU mounted on a desk-top PC, a notebook PC, and the like have progressed rapidly, and the amount of heat generated from these CPUs is further increased. If the temperature of the CPU rises to a certain level or higher, it causes malfunction, thermal runaway, etc., and effective heat dissipation from a semiconductor device such as a CPU is a serious problem.

A heat sink is used as a heat dissipation component that absorbs heat of a semiconductor device and dissipates it in the atmosphere. Since the heat sink is required to have high thermal conductivity, copper, aluminum or the like having a high thermal conductivity is used as the material. However, convection heat resistance limits the performance of the heat sink, and it is becoming difficult to satisfy the heat dissipation requirement of an advanced electronic component whose heat generation amount is increased.

For this reason, a tubular heat pipe and a planar heat pipe (vapor chamber) having high thermal conductivity and heat transporting ability as heat dissipating parts having higher heat dissipation have been proposed. The heat pipe exhibits a higher heat dissipation characteristic than the heat sink due to evaporation (heat absorption from the CPU) and condensation (release of the absorbed heat) of the refrigerant enclosed in the circulation. It has also been proposed to solve the heat generation problem of the semiconductor device by combining the heat pipe with a heat dissipation component such as a heat sink and a fan.

Plates or pipes made of pure copper (oxygen-free copper: C1020), which are excellent in conductivity and corrosion resistance, have been used as materials for heat dissipation parts used in heat sinks, heat sinks, heat pipes and the like. (O material) and / or 1 / 4H tempering material is used as a material in order to secure molding processability. However, in the manufacturing process of a heat dissipation component to be described later, deformation and scratches are likely to occur, Burrs tend to come out or the punching mold tends to be worn. On the other hand, in Patent Documents 1 and 2, a Fe-P-based copper alloy sheet is described as a material of a heat dissipation component.

The heat sink and the heat sink may be formed by processing a pure copper plate into a predetermined shape by press forming, punching, cutting, drilling, etching or the like and then Ni plating and / or Sn plating if necessary, And the like.

A tubular heat pipe (see Patent Document 3) has a structure in which a copper powder is sintered in a tube to form a wick, followed by heat degassing treatment, one end is brazed and the refrigerant is put in a tube under vacuum or reduced pressure, Is brazed and encapsulated.

The planar heat pipes (see Patent Documents 4 and 5) further improve the heat radiation performance of the tubular heat pipes. As a planar heat pipe, in order to efficiently perform condensation and evaporation of refrigerant, it has been proposed that the inner surface is subjected to surface roughening, grooving, and the like in the same manner as the tubular heat pipe. Two upper and lower pure copper plates subjected to press forming, punching, cutting, etching, and the like are bonded by brazing, diffusion bonding, welding, etc., and the inside is filled with a refrigerant, followed by sealing by brazing or the like . Degassing treatment may be performed in the joining step.

Further, as a planar heat pipe, there has been proposed an outer member and an inner member accommodated in the outer member. The inner member is one or a plurality of inner members disposed inside the outer member for promoting the condensation, evaporation, and transportation of the refrigerant, and various shapes of pins, projections, holes, slits, and the like are processed. Also in this type of planar heat pipe, after the inner member is disposed inside the outer member, the outer member and the inner member are joined and integrated by a method such as brazing, diffusion bonding, etc., .

Japanese Patent Application Laid-Open No. 2003-277853 Japanese Patent Application Laid-Open No. 2014-189816 Japanese Patent Application Laid-Open No. 2008-232563 Japanese Patent Application Laid-Open No. 2007-315745 Japanese Patent Application Laid-Open No. 2014-134347

In the manufacturing process of these heat dissipation parts, the heat sink and the heat sink are heated to about 200 to 700 DEG C in the soldering and brazing process. The tubular heat pipe and the flat heat pipe are heated to 800 to 1000 ° C in processes such as sintering, degassing, brazing using diffusion barrier (BCuP-2, etc.), diffusion bonding, welding,

For example, when a pure copper plate is used as a heat pipe material, softening is severe when heated at a temperature of 650 ° C or higher. In addition, sudden crystal grain coarsening occurs. Therefore, when the heat sink is mounted on the heat sink and the semiconductor device, or when the heat pipe is housed in the PC housing, the manufactured heat pipe is easily deformed, and the structure of the heat pipe is changed. In addition, there is a problem that the unevenness of the surface becomes large, and the desired heat radiation performance can not be exhibited. In order to avoid such deformation, the thickness of the pure copper plate may be increased, but the mass and thickness of the heat pipe are increased. When the thickness is increased, there is a problem that the gap between the inside of the PC housing is reduced and the convective heat transfer performance is deteriorated.

Also, the copper alloy plate (Fe-P type) described in Patent Documents 1 and 2 is softened when heated at a temperature of 650 占 폚 or more, and the conductivity is significantly lowered compared with pure copper. Therefore, when a planar heat pipe is manufactured through sintering, degassing, brazing, diffusion bonding, welding or the like, for example, the planar heat pipe is easily deformed in transportation and handling of the heat pipe, . Further, the electric conductivity is lowered, so that the desired performance as a heat pipe is not obtained.

The present disclosure has been made in view of the above problems in the case where a process for manufacturing a heat dissipation component from pure copper or a copper alloy plate includes a process of heating the substrate to a temperature of 650 ° C or higher. And it is an object of the present invention to provide a copper alloy plate capable of providing sufficient strength and heat radiation performance to a manufactured heat dissipation part.

The precipitation hardening type copper alloy is subjected to aging treatment after the solution treatment, whereby the strength and the electric conductivity are improved. However, in the precipitation hardening type copper alloy, the effect of improving the strength and conductivity by the aging treatment is not satisfactory unless the plating treatment is carried out after the plasticizing treatment is applied in the cold after the solution treatment to introduce the plastic deformation to be the precipitation site into the alloy There is a case where it is low.

In the case of a heat-radiating component such as a vapor chamber manufactured through a heating process such as brazing, diffusion bonding, welding, or the like, the plasticizing process is not applied after the heating process. Therefore, when the heat dissipation component is manufactured from the precipitation hardening type copper alloy sheet, the strength and the electric conductivity may not be sufficiently improved even if the aging treatment is performed after the heating step corresponding to the solution treatment.

On the other hand, the inventors have found that by limiting the composition range of Ni, Fe and P and the ratio of [Ni + Fe] / P in the Cu- (Ni, Fe) -P alloy among the precipitation hardening type copper alloys, It was found that the strength and the electric conductivity of the heat dissipation component can be greatly improved even after the aging treatment without applying the firing process.

The copper alloy plate for a heat dissipation component according to the present disclosure is used as a part of a process for manufacturing a heat dissipation component and is used when a process of heating to 650 DEG C or higher and an aging treatment are included. The copper alloy plate contains 0.2 to 0.95 mass% of Ni, Wherein the total content of Ni and Fe is [Ni + Fe] and the content of P is [P], 0.05 to 0.8 mass%, P: 0.03 to 0.2 mass%, and the balance of Cu and inevitable impurities. Ni + Fe] of 0.2 to 1.0 mass%, [Ni + Fe] / [P] of 2 to 10, 0.2% proof strength of 100 MPa or more, excellent bending workability, The 0.2% proof stress is 120 MPa or more and the conductivity is 40% IACS or more after aging treatment at 500 占 폚 for 2 hours.

The copper alloy sheet for a heat-dissipating component according to the present disclosure may further contain Co in an amount of less than 0.05% by mass as an alloy element, if necessary. The copper alloy sheet for a heat dissipation component according to the present disclosure may further contain one or two kinds of Sn and Mg as an alloy element in an amount of 0.005 to 1.0 mass% of Sn and 0.005 to 0.2 mass% of Mg And / or Zn in an amount of not more than 1.0% by mass. The copper alloy plate for a heat dissipation component according to the present disclosure may further contain one or more elements selected from the group consisting of Si, Al, Mn, Cr, Ti, Zr and Ag as a total of 0.005 to 0.5 mass % ≪ / RTI >

The copper alloy sheet according to the present disclosure is used when a process of heating to 650 DEG C or higher and an aging treatment are included as part of a process for manufacturing a heat dissipation component. That is, the heat-radiating part manufactured using the copper alloy sheet according to the present disclosure is aged after being heated at a high temperature of 650 ° C or higher, and the strength is improved.

The copper alloy sheet according to the present disclosure has 0.2% proof strength of 100 MPa or more and excellent bending workability. The copper alloy sheet according to the present disclosure has a 0.2% proof stress of 120 MPa or more and a conductivity of 40% IACS or more when it is subjected to aging treatment at 850 占 폚 for 30 minutes and then at 500 占 폚 for 2 hours. Since the copper alloy sheet according to the present disclosure has high strength after aging treatment, when a heat dissipating component such as a heat pipe manufactured using the copper alloy sheet is installed in a heat sink and a semiconductor device or incorporated into a PC housing, The heat dissipation component is hardly deformed. Further, the copper alloy sheet according to the present invention can be thinned because the conductivity is lower than that of the pure copper plate, but the strength after the aging treatment is high, so that the decrease in conductivity can be compensated for in terms of heat radiation performance.

Hereinafter, a copper alloy for a heat dissipation component according to an embodiment of the present invention will be described in more detail.

The copper alloy sheet according to the embodiment of the present invention is processed into a predetermined shape by press forming, punching, cutting, etching or the like and is subjected to high temperature heating (degassing, bonding (brazing, diffusion bonding, welding ), Sintering, and the like), and is completed as a heat-dissipating component. [0064] Although the heating conditions for the high-temperature heating are different depending on the type of the heat-dissipating component and the manufacturing method, in the embodiment of the present invention, ° C. The copper alloy sheet according to the embodiment of the present invention is made of a (Ni, Fe) -P-based copper alloy having the composition described below, and when heated to the temperature range described above, At least a part of the (Ni, Fe) -P compound was dissolved and crystal grains were grown to cause softening and deterioration of conductivity.

The copper alloy sheet according to the embodiment of the present invention has a strength (0.2% proof stress) of not less than 120 MPa and an electrical conductivity of 40% IACS after aging treatment at 850 占 폚 for 30 minutes and then water- Or more. Heating at 850 占 폚 for 30 minutes is a heating condition assuming the high-temperature heating process in the production of heat dissipation parts. When the copper alloy sheet according to the embodiment of the present invention is heated at high temperature under these conditions, the (Ni, Fe) -P compound precipitated before heating is solidified and crystal grains grow, resulting in softening and deterioration of conductivity. Subsequently, when the copper alloy sheet is aged, a fine (Ni, Fe) -P compound precipitates. Thereby, the strength and the electric conductivity decreased by the high-temperature heating are remarkably improved.

The aging treatment is carried out in the following manner: (a) maintaining a certain time in a precipitation temperature range during a cooling step after high temperature heating; (b) cooling to room temperature after high temperature heating, After the step a), it can be reheated to the precipitation temperature range and maintained for a certain time.

As the specific aging treatment conditions, conditions for maintaining the temperature within the range of 300 to 600 캜 for 5 minutes to 10 hours may be mentioned. When the enhancement of the strength is prioritized, the temperature-time condition in which the fine (Ni, Fe) -P compound is produced is changed to the temperature-time condition in which the solubility of Ni, Fe, .

The copper alloy plate after the aging treatment has a lower conductivity than the pure copper plate after high temperature heating, but the strength is significantly higher than that of the pure copper plate. In order to obtain this effect, a heat-radiating component such as a heat pipe manufactured using the copper alloy plate according to the embodiment of the present invention is aged after being heated at a high temperature. The aging treatment conditions are as described above. The heat-dissipating component (copper alloy plate) after aging treatment has high strength and can prevent deformation of the heat-dissipating component when the heat-dissipating component is installed in a heat sink and a semiconductor device, or when it is incorporated in a PC housing or the like. In addition, since the copper alloy sheet (after the aging treatment) according to the embodiment of the present invention has a higher strength than the pure copper sheet, it can be thinned (0.1 to 1.0 mm in thickness), thereby improving the heat radiation performance of the heat- It is possible to compensate for the decrease in the electrical conductivity in comparison with the copper plate.

On the other hand, the copper alloy sheet according to the embodiment of the present invention has a 0.2% proof stress of 120 MPa or more and a tensile strength of 40% or more after the aging treatment, even if the temperature for high temperature heating is less than 850 캜 (650 캜 or more) or 850 캜 Conductivity higher than IACS can be achieved.

The copper alloy sheet according to the embodiment of the present invention is processed into a heat dissipating component by press forming, punching, cutting, etching, etc. before being heated to a high temperature of 650 캜 or higher. The copper alloy plate has a strength that is not easily deformed during transportation and handling in the above-described machining, and it is necessary for the machining to have a mechanical characteristic capable of being carried out without interruption. More specifically, the copper alloy sheet according to the embodiment of the present invention has 0.2% proof stress of 100 MPa or more, and excellent bending workability. If the above characteristics are satisfied, the tempering of the copper alloy plate is not a problem. For example, the solution treatment material, the aged material, and the aged material may be cold-rolled.

In the bending process, it is required that no crack occurs at the bent portion. In addition, it is preferable that surface roughness does not occur at the bent line and its vicinity. Even in a copper alloy plate of the same material, the ease of occurrence of cracking due to bending and surface roughness depends on the ratio R / t of the bending radius R and the plate thickness t. When a heat dissipation component such as a vapor chamber is manufactured by using a copper alloy plate, cracking does not occur when the bending workability of the copper alloy plate is generally bending R / t? 2 in both the rolling parallel direction and the perpendicular direction . As the bending workability of the copper alloy plate, it is preferable that cracking does not occur at bending of R / t? 1.5, and it is more preferable that cracks do not occur at bending of R / t? The bending workability of the copper alloy plate is generally tested with a test piece having a width of 10 mm (see the bending workability test of the examples described later). When the copper alloy sheet material is bent, the larger the bending width, the more easily cracks are generated. Therefore, when the bending width is large as a heat dissipating component, it is preferable that cracks do not occur at bending of R / t = 1.0, It is preferable that cracks do not occur in the bending with R / t = 0.5. In order to prevent surface roughening from occurring at the bent line and the vicinity thereof, the average crystal grain size (cutting method) measured in the direction of the width of the copper alloy sheet is preferably 20 탆 or less, more preferably 15 탆 or less.

As described above, the heat-radiating component manufactured by processing the copper alloy plate according to the embodiment of the present invention is softened by heating at a high temperature of 650 占 폚 or higher. It is preferable that the heat dissipation component after high temperature heating further has a strength that can not be easily deformed during transportation and handling when the aging treatment is carried out. For this purpose, it is preferable to have a 0.2% proof stress of 50 MPa or more at the stage of water-cooling after heating at 850 占 폚 for 30 minutes.

The heat dissipation component manufactured by using the copper alloy sheet according to the embodiment of the present invention has an Sn coating layer formed on at least a part of the outer surface thereof for the purpose of improving the corrosion resistance and the solderability as required after the aging treatment . The Sn coating layer includes electroplating, electroless plating, or those formed by heating them at a temperature lower than or equal to the melting point of Sn after plating. The Sn coating layer contains a Sn metal and a Sn alloy. The Sn alloy includes at least one of Bi, Ag, Cu, Ni, In, and Zn as a total of 5 mass% or less as an alloy element in addition to Sn .

Base plating of Ni, Co, Fe or the like can be formed below the Sn coating layer. The underlying plating has a function as a barrier for preventing the diffusion of Cu or an alloy element from the base material and a function for preventing scratches by increasing the surface hardness of the heat dissipation component. A Cu-Sn alloy layer is formed by plating Cu on the undercoating, further plating Sn, and then heating the Sn to a temperature lower than or equal to the melting point of Sn to form a Cu-Sn alloy layer, It may be a three-layer structure. The Cu-Sn alloy layer has a function as a barrier for preventing the diffusion of Cu or alloy elements from the base material and a function of preventing scratches by increasing the surface hardness of the heat dissipation parts.

Further, in the heat-radiating part manufactured using the copper alloy sheet according to the embodiment of the present invention, after the aging treatment, if necessary, an Ni coating layer is formed on at least a part of the outer surface. The Ni coating layer has a barrier for preventing the diffusion of Cu and alloy elements from the base material, a prevention of scratches by increasing the surface hardness of the heat dissipation component, and a function for improving the corrosion resistance.

Next, the composition of the copper alloy sheet according to the embodiment of the present invention will be described.

The copper alloy sheet according to the embodiment of the present invention contains 0.2 to 0.95 mass% of Ni, 0.05 to 0.8 mass% of Fe, and 0.03 to 0.2 mass% of P. The total content [Ni + Fe] of Ni and Fe is in the range of 0.25 to 1.0 mass%.

Ni and Fe generate a P compound with P and improve the strength and stress relaxation property of the copper alloy plate. On the other hand, the P compound is composed of one or more of Ni-P compound, Fe-P compound and Ni-Fe-P compound in which part of Ni is substituted with Fe. In the embodiment of the present invention, this P compound is represented by (Ni, Fe) -P compound. P compound has a high solubilization temperature, and even if the copper alloy sheet is heated to a high temperature (for example, 850 占 폚) of 650 占 폚 or more, a part of the P compound is relatively stably present, thereby preventing coarse crystal grain size. On the other hand, the higher the heating temperature of the copper alloy plate, the higher the freezing vacancy concentration after water cooling, and the nucleation site of the precipitate increases. Therefore, the number of spherical precipitates can be increased by the aging treatment performed subsequently, which contributes to the improvement of the strength after the aging treatment.

When the total content [Ni + Fe] of Ni and Fe is less than 0.25 mass% or the P content is less than 0.03 mass%, the precipitation amount of the P compound is small and the effect of improving the strength and stress relaxation property of the copper alloy plate is small . On the other hand, when [Ni + Fe] exceeds 1.0% by mass or when the P content [P] exceeds 0.2% by mass, coarse oxides, crystallized products, precipitates and the like are generated and the hot workability is lowered, The stress resistance, the stress relaxation resistance and the bending workability are deteriorated. Further, the amount of Ni, Fe and P is increased, and the conductivity of the copper alloy sheet is lowered. Therefore, the content of [Ni + Fe] is 0.25 to 1.0 mass%, and the content of P is 0.03 to 0.2 mass%.

When the individual contents of Ni and Fe are less than 0.2 mass% and less than 0.05 mass%, the effect of improving the strength and stress relaxation resistance of the copper alloy plate is small. Therefore, the lower limit values of the contents of Ni and Fe are set at 0.2 mass% and 0.05 mass%, respectively.

When the content ratio [Ni + Fe] / [P] of the total content [Ni + Fe] and P content [P] of Ni and Fe is less than 2 or more than 10, excess Ni, Fe or P is solved , The conductivity is lowered. Therefore, the content ratio [Ni + Fe] / [P] is 2 to 10. The lower limit of [Ni + Fe] / [P] is preferably 2.2 and the upper limit is preferably 9.5.

Co is added to the Cu matrix as needed because it precipitates alone in the Cu matrix to improve the heat resistance of the copper alloy. Further, Co substitutes a part of Ni or Fe of the (Ni, Fe) -P compound to improve the strength and stress relaxation property of the copper alloy plate. However, since Co is expensive, the Co content is less than 0.05% by mass.

Sn is added to the copper alloy phase as needed because it has an effect of improving the strength of the copper alloy. The addition of Sn is also effective in improving the stress relaxation resistance. When the use environment of the heat-radiating component becomes 80 DEG C or higher, creep deformation occurs and the contact surface with the heat source such as the CPU becomes small and the heat radiation property is lowered. However, this phenomenon can be suppressed by improving the stress relaxation resistance. In order to obtain the effect of improving the strength and the stress relaxation property, the Sn content is set to 0.005 mass% or more, preferably 0.01 mass% or more, and more preferably 0.02 mass% or more. On the other hand, when the Sn content exceeds 1.0% by mass, the bending workability of the copper alloy sheet is lowered and the conductivity after the aging treatment is lowered. Therefore, the Sn content is set to 1.0 mass% or less, preferably 0.6 mass% or less, and more preferably 0.3 mass% or less.

Mg, like Sn, is added to the copper alloy as needed because it has an effect of improving the strength and stress relaxation resistance of the copper alloy dissolved in the parent phase. In order to obtain the effect of improving the strength and stress relaxation resistance, the Mg content is set to 0.005 mass% or more. On the other hand, when the Mg content exceeds 0.2 mass%, the bending workability of the copper alloy sheet is lowered and the conductivity after the aging treatment is lowered. Accordingly, the Mg content is 0.2 mass% or less, preferably 0.15 mass% or less, and more preferably 0.05 mass% or less.

Zn has an effect of improving the strength of the copper alloy sheet and improving the heat-releasability of the solder and the heat-releasability of the Sn plating. Soldering may be required when the heat dissipation component is incorporated into a semiconductor device, and Sn plating may be performed after the heat dissipation component is manufactured to improve corrosion resistance. A copper alloy sheet containing Zn is suitably used for manufacturing such a heat dissipation component. However, when the content of Zn exceeds 1.0% by mass, the solder wettability is lowered, so that the content of Zn is 1.0% by mass or less. The content of Zn is preferably 0.7 mass% or less, more preferably 0.5 mass% or less. On the other hand, if the Zn content is less than 0.01% by mass, it is insufficient to improve the heat peelability, and the content of Zn is preferably 0.01% by mass or more. The Zn content is more preferably 0.05 mass% or more, and more preferably 0.1 mass% or more.

On the other hand, in the case where the copper alloy sheet according to the embodiment of the present invention contains Zn, if heated at a temperature of 500 캜 or more, Zn may be vaporized depending on the heating atmosphere to lower the surface property of the copper alloy plate, There is a case to pollute. From the viewpoint of preventing the vaporization of Zn, the content of Zn is preferably 0.5 mass% or less, more preferably 0.3 mass% or less, and further preferably 0.2 mass% or less.

Since Si, Al, Mn, Cr, Ti, Zr and Ag have an effect of improving the strength and heat resistance of the copper alloy, one or two or more of them are added as needed. When these elements are added, the content of one or more of these elements is limited to 0.5% by mass or less because the conductivity of the copper alloy is lowered when the content is large. On the other hand, in order to obtain the above-mentioned action, the lower limit of the total content of these elements is 0.005 mass% or more. The lower limit is more preferably 0.01 mass%, and still more preferably 0.02 mass%.

Of these, Si, Al and Mn are contained in a small amount to lower the conductivity of the copper alloy. Therefore, the upper limit is preferably set to 0.2 mass% of Si, 0.2 mass% of Al and 0.1 mass% of Mn, respectively. On the other hand, Si, Al and Mn preferably have a lower limit of 0.01% by mass of Si, 0.01% by mass of Al and 0.01% by mass of Mn, respectively. Cr, Ti and Zr easily form inclusions such as oxides and sulfides of about several micrometers to several tens of micrometers, and a gap is formed between the inclusions and the base material by cold rolling. When the inclusions are present on the surface, Deg.] C. Therefore, the upper limit value of Cr, Ti and Zr is preferably set to 0.2% by mass of Cr, 0.1% by mass of Ti and 0.05% by mass of Zr. On the other hand, in order to obtain the above-mentioned action, Cr, Ti and Zr preferably have a lower limit of 0.005 mass% of Cr, 0.01 mass% of Ti and 0.005 mass% of Zr, respectively. The upper limit of Ag is set to 0.5% by mass, and in order to obtain the above-mentioned action, the lower limit is preferably set to 0.01% by mass.

The inevitable impurities H, O, S, Pb, Bi, Sb, Se and As are likely to cause intergranular cracking and grain boundary embrittlement during heating and after heating when the copper alloy sheet is heated for a long time at a temperature of 650 ° C or higher , It is desirable to reduce the content of these elements. H is preferably less than 1.5 ppm (mass ppm, the same shall apply hereinafter), and more preferably less than 1 ppm, because it causes aggregation at the interface of the grain boundary and / or the inclusion and the base material during heating. O is preferably less than 20 ppm, more preferably less than 15 ppm. S, Pb, Bi, Sb, Se and As are preferably less than 30 ppm, more preferably less than 20 ppm in total. Especially for Bi, Sb, Se and As, the total content of these elements is preferably less than 10 ppm, more preferably less than 5 ppm.

The copper alloy sheet according to the embodiment of the present invention is characterized in that the ingot having the above composition is subjected to (1) hot rolling - cold rolling - annealing, (2) hot rolling - cold rolling - annealing - cold rolling, (3) hot rolling - cold rolling - annealing - cold rolling - low temperature annealing. In the above (1) to (3), the cold rolling-annealing step may be performed a plurality of times.

The annealing includes soft annealing, recrystallization annealing, or precipitation annealing (aging treatment). In the case of softening annealing or recrystallization annealing, the heating temperature may be selected from the range of 600 to 950 占 폚, and the heating time may be selected from the range of 5 seconds to 1 hour. When softening annealing or recrystallization annealing also serves as a solution treatment, continuous annealing may be performed by heating at 650 to 950 캜 for 5 seconds to 3 minutes. In the case of precipitation annealing, it may be carried out under the condition that the temperature is maintained at about 300 to 600 DEG C for 0.5 to 10 hours as described above. In the case where softening annealing or recrystallization annealing also serves as a solution treatment, precipitation annealing can be performed in a later step.

The final cold rolling may be selected from the range of 5 to 80% in accordance with the desired 0.2% proof stress and bending workability.

The low-temperature annealing may be performed so that the copper alloy sheet is softened without recrystallization to recover the ductility of the copper alloy sheet. In the case of continuous annealing, the annealing may be performed in an atmosphere of 300 to 650 캜 for 1 second to 5 minutes. In the case of batch annealing, the actual temperature of the copper alloy sheet may be set to be maintained at 250 to 400 占 폚 for 5 minutes to 1 hour.

With the above-described manufacturing method, it is possible to produce a copper alloy plate having 0.2% proof strength of 100 MPa or more and excellent bending workability. The copper alloy sheet has a 0.2% proof stress of 120 MPa or more and a conductivity of 40% IACS or more when the copper alloy sheet is subjected to aging treatment at 850 占 폚 for 30 minutes and then at 500 占 폚 for 2 hours.

The copper alloy sheet according to the embodiment of the present invention is preferably manufactured by a step of recrystallization treatment, cold rolling and aging treatment accompanied by cold rolling and solution treatment after the ingot is cracked and hot rolled. After the recrystallization treatment accompanied by the solution treatment, the aging treatment may be performed without cold rolling, followed by cold rolling. Under this manufacturing method, the copper alloy sheet produced using the copper alloy of the above composition under the following conditions has 0.2% proof stress of 300 MPa or more and excellent bending workability.

The dissolution and casting can be carried out by a conventional method such as continuous casting, semi-continuous casting and the like. On the other hand, as the copper dissolution raw material, it is preferable to use one having a small content of S, Pb, Bi, Se and As. It is also desirable to reduce O and H by paying attention to deterioration (removal of water) of charcoal coated on the copper alloy molten metal, ground metal, scrap material, cylinder, mold drying, deoxidation of the molten metal,

It is preferable that the homogenization treatment is performed for 30 minutes or longer after the temperature inside the ingot reaches 800 占 폚 or higher. The holding time of the homogenizing treatment is more preferably 1 hour or more, and more preferably 2 hours or more.

After the homogenization treatment, hot rolling is started at a temperature of 800 캜 or higher. The hot rolling is preferably terminated at a temperature of 600 ° C or more so that coarse (Ni, Fe) -P precipitates are not formed in the hot rolled material, and the temperature is preferably quenched by water cooling or the like. If the quenching start temperature after hot rolling is lower than 600 캜, coarse (Ni, Fe) -P precipitates are formed, the structure tends to be uneven, and the strength of the copper alloy plate (product plate) is lowered. The end temperature of the hot rolling is preferably 650 DEG C or higher, more preferably 700 DEG C or higher. On the other hand, the structure of the hot rolled material quenched after hot rolling becomes a recrystallized structure. The recrystallization treatment accompanied by the solution treatment to be described later can also be performed by quenching after hot rolling.

By subjecting the copper alloy sheet to a certain deformation by cold rolling after hot rolling, a copper alloy sheet having a desired recrystallized structure (fine recrystallized structure) is obtained after the subsequent recrystallization treatment.

The recrystallization treatment accompanied by the solution treatment is carried out at a temperature of 650 to 950 deg. C, preferably 670 to 900 deg. C for 3 minutes or less. When the content of Ni, Fe and P in the copper alloy is small, it is preferable that the content of Ni, Fe and P is larger in the lower temperature region within the above temperature range, and in the higher temperature region within the above temperature range. By this recrystallization treatment, Ni, Fe and P are solidified in the copper alloy base material, and a recrystallized structure (crystal grain size of 1 to 20 m) in which bending workability is improved can be formed. When the temperature of this recrystallization treatment is lower than 650 占 폚, the amount of Ni, Fe and P is decreased, and the strength is lowered. On the other hand, when the temperature of the recrystallization treatment exceeds 950 DEG C or the treatment time exceeds 3 minutes, the recrystallized grains become coarse.

(C) cold rolling - aging treatment - cold rolling - low temperature annealing, (d) aging treatment, and (c) cold rolling. The recrystallization treatment is followed by (a) cold rolling and aging treatment, (b) cold rolling and aging treatment, (E) Aging treatment - Cold rolling - Low temperature annealing can be selected.

The aging treatment (precipitation annealing) is carried out under the condition of holding at a heating temperature of about 300 to 600 DEG C for 0.5 to 10 hours. If the heating temperature is less than 300 ° C, the precipitation amount is small. If the heating temperature is more than 600 ° C, the precipitate is liable to be coarsened. The lower limit of the heating temperature is preferably 350 占 폚, and the upper limit is preferably 580 占 폚, more preferably 560 占 폚. The retention time of the aging treatment is appropriately selected according to the heating temperature, and is performed within a range of 0.5 to 10 hours. If the holding time is less than 0.5 hour, the precipitation becomes insufficient, and if the holding time exceeds 10 hours, the precipitation amount becomes saturated and the productivity is lowered. The lower limit of the holding time is preferably 1 hour, more preferably 2 hours.

Example 1

A copper alloy having the composition shown in Tables 1 and 2 was cast to produce ingots each having a thickness of 45 mm, a length of 85 mm, and a width of 200 mm. In this copper alloy, H, which is an unavoidable impurity, was less than 1 ppm, O was less than 15 ppm, and S, Pb, Bi, Sb, Se and As were in total less than 20 ppm.

Each ingot was subjected to a cracking treatment at 965 占 폚 for 3 hours, followed by hot rolling to obtain a hot rolled material having a thickness of 15 mm and quenching (water-cooling) from a temperature of 650 占 폚 or higher. Recrystallization treatment (cold rolling) of both sides of hot rolled steel after quenching for 1 mm each, cold rolling to a target plate thickness of 0.6 mm and holding at 650 to 950 ° C for 10 to 60 seconds ). Subsequently, after aging treatment (precipitation annealing) at 500 캜 for 2 hours, finishing cold rolling of 50% was carried out to produce a copper alloy plate having a thickness of 0.3 mm.

On the other hand, with respect to Examples 4, 7 and 10 and Comparative Examples 1 and 5 shown in Tables 1 and 2, a part (length 2000 mm) of a copper alloy plate (thickness 0.6 mm) after cold- And [Example 4].

The obtained copper alloy plate was used as a specimen, and each measurement test of conductivity, mechanical properties, bending workability and solder wettability was carried out in the following manner. The results are shown in Tables 3 and 4.

The obtained copper alloy plate was heated at 850 占 폚 for 30 minutes and then cooled to water and subjected to an aging treatment (precipitation treatment) for heating at 500 占 폚 for another 2 hours. Each of the specimens was subjected to measurement tests of electrical conductivity and mechanical properties . The results are shown in Tables 3 and 4.

(Measurement of conductivity)

The conductivity was measured according to the non-ferrous metal conductivity measurement method prescribed in JIS-H0505 by the division method using a double bridge.

(Mechanical Properties)

A tensile test specimen of JIS No. 5 was cut out from the specimen so that the longitudinal direction thereof was parallel to the rolling direction, and a tensile test was carried out in accordance with JIS-Z2241, and the proof stress and elongation were measured. The tensile strength is equivalent to 0.2% of the permanent elongation.

(Bending workability)

The measurement of the bending workability was carried out according to the W bending test method prescribed by Shin Dong Association Standard JBMA-T307. Test pieces having a width of 10 mm and a length of 30 mm were cut out from each of the specimens and a GW (Good Way (bending axis perpendicular to the rolling direction)) and BW (Bad Way Parallel to the rolling direction). Next, the presence or absence of cracks in the bent portion was visually observed by an optical microscope at a magnification of 100, and it was found that cracks were not observed in both of GW and BW, and that cracks occurred in either GW or BW Was evaluated as " (failed) ".

(Solder wettability)

A short test piece was taken from each test piece, immersed in an inert flux for 1 second, and measured for solder wetting time by a meniscope method. The solder was Sn-3 mass% Ag-0.5 mass% Cu maintained at 260 ± 5 ° C under the test conditions of immersion speed of 25 mm / sec, immersion depth of 5 mm and immersion time of 5 sec. The solder wettability was evaluated to be excellent when the solder wetting time was 2 seconds or less. On the other hand, except for Comparative Example 6, the solder wetting time was 2 seconds or less.

The copper alloy sheets of Examples 1 to 24 shown in Tables 1 and 3 were prepared by the same method as in Example 1 except that the alloy composition satisfied the requirements of the present disclosure and the strength (0.2% proof stress) after the aging treatment at 850 캜 for 30 minutes was 120 MPa or more , And the conductivity is 40% IACS or more. In addition, the characteristics of the copper alloy plate before heating at 850 占 폚 are that the strength (0.2% proof stress) is 300 MPa or more, and the bending workability and the solder wettability are excellent.

On the other hand, the copper alloy plates of Comparative Examples 1 to 10 shown in Tables 2 and 4 are inferior in certain characteristics as shown below.

In Comparative Example 1, since the Ni content is not included and the total content of Ni and Fe [Ni + Fe] is small, the strength after aging treatment is low.

In Comparative Example 2, since the P content was excessive, cracking occurred during hot rolling, and the process could not proceed to the step after hot rolling.

In Comparative Example 3, the Ni content was small, and the Ni / Fe total content [Ni + Fe] was small and the P content was small, so that the strength after the aging treatment was low.

In Comparative Examples 4 and 5, the content of Sn or Mg is excessive, and the conductivity after the aging treatment is low.

In Comparative Example 6, the Zn content was excessive, and the solder wettability was inferior as described above.

In Comparative Example 7, the total of the elements other than the main elements (Al, Mn, etc.) was excessive and exceeded 0.5% by mass, so that the conductivity after the aging treatment was low.

In Comparative Example 8, since the Fe content is not contained and the total content [Ni + Fe] of Ni and Fe is small, the strength after aging treatment is low.

In Comparative Example 9, the total Ni + Fe content [Ni + Fe] and P content were excessive, causing cracking during hot rolling, and the process could not proceed to the step after hot rolling.

In Comparative Example 10, the Ni content was small and the proof stress after the aging treatment was low.

Example  2

(Typical examples 4, 7 and 10 and comparative examples 1 and 5 shown in Tables 1 and 2) of the copper alloy plate (plate thickness 0.3 mm) prepared in [Example 1] were heated at 1000 캜 for 30 minutes The copper alloy sheet was heated at 500 ° C for 2 hours (aging treatment), and the copper alloy sheet was used as a test material to conduct measurement tests for electrical conductivity and mechanical properties by the method described in [Example 1]. The results are shown in Table 5.

As shown in Table 5, Examples 4, 7 and 10 had a strength (0.2% proof stress) of 120 MPa or more and a conductivity of 40% IACS or more after being heated at 1000 占 폚 for 30 minutes and then aging treatment. There is no significant difference in the numerical values when the values shown in Table 5 (proof stress and conductivity after the aging treatment) are compared with the measurement results after heating for 30 minutes at 850 占 폚 and subsequent aging treatment (see Table 3).

On the other hand, Comparative Examples 1 and 5 did not reach the standard strength (0.2% proof stress of 120 MPa or more, conductivity of 40% IACS or more) after heating at 1000 占 폚 for 30 minutes and then aging treatment.

Example 3

The copper alloy plates (0.6 mm in thickness) after cold rough rolling prepared in [Example 1] were used for Examples 4, 7 and 10 and Comparative Examples 1 and 5 shown in Tables 1 and 2, % To obtain a copper alloy sheet having a thickness of 0.3 mm. Subsequently, this copper alloy plate was subjected to a recrystallization treatment (involving solubilization) in which the temperature was kept at 650 to 825 DEG C for 10 to 60 seconds.

The obtained copper alloy plate was used as a specimen and each measurement test of conductivity, mechanical properties and bending workability was carried out by the method described in [Example 1]. The obtained copper alloy plate was heated at 850 占 폚 for 30 minutes, cooled with water, and again subjected to aging treatment (precipitation treatment) at 500 占 폚 for 2 hours, and then subjected to measurement of electrical conductivity and mechanical properties The test was conducted. The results are shown in Table 6. In Table 6, the compositions of Examples 4A, 7A and 10A are the same as those of Examples 4, 7 and 10 of Table 1, and the compositions of Comparative Examples 1A and 5A are the compositions of Comparative Examples 1 and 5 of Table 2 same.

The copper alloy plates of Examples 4A, 7A, and 10A shown in Table 6 had strengths (0.2% proof stress) of 120 MPa or more after the alloying composition satisfied the requirements of this disclosure and were heated at 850 캜 for 30 minutes and then subjected to aging treatment , And the conductivity is 40% IACS or more. In addition, the characteristics of the copper alloy plate before heating at 850 占 폚 are 100 MPa or more in strength (0.2% proof stress) and excellent in bending workability.

On the other hand, the copper alloy sheet of Comparative Example 1A had a low strength after the aging treatment, and the copper alloy of Comparative Example 5A had a low conductivity after the aging treatment.

Example  4

A cold-rolled copper alloy plate (thickness: 0.6 mm) prepared in [Example 1] was used for Examples 4, 7 and 10 and Comparative Examples 1 and 5 shown in Tables 1 and 2, Rolled to obtain a plate thickness of 0.32 mm. Subsequently, a recrystallization treatment (involving solution formation) was performed at 650 to 825 캜 for 10 to 60 seconds, and then subjected to finish cold rolling to produce a copper alloy plate having a thickness of 0.3 mm.

The obtained copper alloy plate was used as a specimen and each measurement test of conductivity, mechanical properties and bending workability was carried out by the method described in Example 1 above. The obtained copper alloy plate was heated at 850 占 폚 for 30 minutes, cooled with water, and again subjected to aging treatment (precipitation treatment) at 500 占 폚 for 2 hours, and then subjected to measurement of electrical conductivity and mechanical properties The test was conducted. The results are shown in Table 7. In Table 7, the compositions of Examples 4B, 7B and 10B are the same as those of Examples 4, 7 and 10 of Table 1, and the compositions of Comparative Examples 1B and 5B are the same as those of Comparative Examples 1 and 5 of Table 2 same.

The copper alloy plates of Examples 4B, 7B and 10B shown in Table 7 had a strength (0.2% proof stress) of 120 MPa or more after the alloying composition satisfied the requirements of this disclosure and were heated at 850 캜 for 30 minutes and then subjected to aging treatment , And the conductivity is 40% IACS or more. In addition, the characteristics of the copper alloy plate before heating at 850 占 폚 are 100 MPa or more in strength (0.2% proof stress) and excellent in bending workability.

On the other hand, the copper alloy sheet of Comparative Example 1B had a low strength after the aging treatment, and the copper alloy of Comparative Example 5B had a low conductivity after the aging treatment.

The disclosure of the present specification includes the following aspects.

Sun 1:

, Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass% and P: 0.03 to 0.2 mass%, the balance being Cu and inevitable impurities, and the total content of Ni and Fe to [Ni + Fe] And the P content is [P], 0.25 to 1.0 mass% of [Ni + Fe], 2 to 10 of [Ni + Fe] / [P], 0.2% proof stress of 100 MPa or more and excellent bending workability 0.2% proof strength of 120 MPa or more and electric conductivity of 40% IACS or more after being aged by heating at 850 占 폚 for 30 minutes and then water-cooling at 500 占 폚 for 2 hours, and 650 Lt; RTI ID = 0.0 > C < / RTI > and an aging treatment.

Sun 2:

The copper alloy for a heat dissipation component according to claim 1, further comprising Co in a range of less than 0.05 mass%.

Sun 3:

The copper alloy sheet for a heat dissipation component according to claim 1, wherein one or both of Sn and Mg is contained in an amount of 0.005 to 1.0 mass% of Sn and 0.005 to 0.2 mass% of Mg.

Sun 4:

The copper alloy plate for a heat-dissipating component according to any one of (1) to (3), further comprising at least one of the following elements to satisfy (i) or (ii)

(i) 1.0% by mass or less of Zn

(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr,

Sun 5:

, Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass% and P: 0.03 to 0.2 mass%, the balance being Cu and inevitable impurities, and the total content of Ni and Fe to [Ni + Fe] (Ni, Fe) of 0.2 to 1.0 mass% and [Ni + Fe] / [P] of 2 to 10 when the content of P is taken as [P] -P compound is precipitated and has a 0.2% proof stress of 120 MPa or more and a conductivity of 40% IACS or more.

Sun 6:

The heat dissipation component according to Claim 5, wherein the copper alloy sheet further contains Co in a range of less than 0.05 mass%.

Sun 7:

The heat dissipation component according to Claim 5 or 6, wherein the copper alloy sheet further contains one or both of Sn and Mg in an amount of 0.005 to 1.0 mass% of Sn and 0.005 to 0.2 mass% of Mg.

Sun 8:

The heat-dissipating component according to any one of claims 5 to 7, further comprising another element so as to satisfy at least the following (i) or (ii).

(i) 1.0% by mass or less of Zn

(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr,

Sun 9:

The heat dissipation component according to any one of claims 5 to 8, wherein at least one of an Sn coating layer and an Ni coating layer is formed on at least a part of the outer surface.

Sun 10:

A copper alloy sheet for a heat dissipation component described in any one of Sun 1 to 4 was processed into a predetermined shape and then subjected to a process of heating at 650 ° C or higher and subsequently subjected to an aging treatment to obtain a sheet having a 0.2% proof stress of 110 MPa or more and 40% Wherein the heat dissipation component is a heat dissipation component.

Sun 11:

Wherein at least one of the Sn coating layer and the Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the aging treatment.

This application is related to Japanese Patent Application with application date of December 25, 2015, Japanese Patent Application No. 2015-254645, and Priority Claim with Japanese Patent Application No. 2016-175464 filed on September 8, 2016, do. Sections 2015-254645 and 2016-175464 are hereby incorporated by reference.

Claims (19)

, Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass% and P: 0.03 to 0.2 mass%, the balance being Cu and inevitable impurities, and the total content of Ni and Fe to [Ni + Fe] And the P content is [P], 0.25 to 1.0 mass% of [Ni + Fe], 2 to 10 of [Ni + Fe] / [P], 0.2% proof stress of 100 MPa or more and excellent bending workability 0.2% proof strength of 120 MPa or more and electric conductivity of 40% IACS or more after being aged by heating at 850 占 폚 for 30 minutes and then water-cooling at 500 占 폚 for 2 hours, and 650 Lt; RTI ID = 0.0 > C < / RTI > and an aging treatment. The method according to claim 1,
The copper alloy for a heat dissipation component according to claim 1, further comprising Co in a range of less than 0.05 mass%. The method according to claim 1,
Further comprising at least one of Sn and Mg in an amount of 0.005 to 1.0% by mass of Sn and 0.005 to 0.2% by mass of Mg. 3. The method of claim 2,
Further comprising at least one of Sn and Mg in an amount of 0.005 to 1.0% by mass of Sn and 0.005 to 0.2% by mass of Mg. The method according to claim 1,
The copper alloy plate for a heat-dissipating component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 3. The method of claim 2,
The copper alloy plate for a heat-dissipating component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, The method of claim 3,
The copper alloy plate for a heat-dissipating component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 5. The method of claim 4,
The copper alloy plate for a heat-dissipating component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, , Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass% and P: 0.03 to 0.2 mass%, the balance being Cu and inevitable impurities, and the total content of Ni and Fe to [Ni + Fe] (Ni, Fe) of 0.2 to 1.0 mass% and [Ni + Fe] / [P] of 2 to 10 when the content of P is taken as [P] -P compound is precipitated and has a 0.2% proof stress of 120 MPa or more and a conductivity of 40% IACS or more. 10. The method of claim 9,
Wherein the copper alloy sheet further contains Co in a range of less than 0.05 mass%. 10. The method of claim 9,
Wherein the copper alloy sheet further contains one or both of Sn and Mg in an amount of 0.005 to 1.0 mass% of Sn and 0.005 to 0.2 mass% of Mg. 11. The method of claim 10,
Wherein the copper alloy sheet further contains one or both of Sn and Mg in an amount of 0.005 to 1.0 mass% of Sn and 0.005 to 0.2 mass% of Mg. 10. The method of claim 9,
The heat dissipation component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 11. The method of claim 10,
The heat dissipation component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 12. The method of claim 11,
The heat dissipation component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 13. The method of claim 12,
The heat dissipation component according to claim 1, further comprising another element so as to satisfy at least the following (i) or (ii).
(i) 1.0% by mass or less of Zn
(ii) 0.005 to 0.5 mass% of a total of one or more of Si, Al, Mn, Cr, Ti, Zr, 17. The method according to any one of claims 9 to 16,
And at least one of an Sn coating layer and an Ni coating layer is formed on at least a part of the outer surface. A process for heating a copper alloy sheet for a heat dissipation component according to any one of claims 1 to 8 into a predetermined shape and then heating at a temperature of 650 ° C or higher is carried out and then subjected to an aging treatment to obtain a 0.2% And a heat dissipation component having an electrical conductivity of 40% IACS or more is obtained. 19. The method of claim 18,
Wherein at least one of an Sn coating layer and an Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component after the aging treatment.