TWI697652B - Copper alloy plate for heat dissipation parts, heat dissipation parts, and method for manufacturing heat dissipation parts - Google Patents

Abstract

The present invention provides a copper alloy plate, which can make the manufactured heat-dissipating parts have sufficient strength and heat-dissipating performance when part of the process of manufacturing heat-dissipating parts includes a process of heating to a temperature above 650°C.

This copper alloy plate contains Ni: 0.2~0.95 mass%, Fe: 0.05~0.8 mass%, and P: 0.03~0.2 mass%. The total content of Ni and Fe is set to [Ni+Fe] and the content of P is set to [ For P], [Ni+Fe] is 0.25 to 1.0% by mass and [Ni+Fe]/[P] is 2 to 10, and the rest is Cu and unavoidable impurities. The 0.2% yield strength of this copper alloy sheet is more than 100MPa and has excellent bending workability; it is heated at 850℃ for 30 minutes and then water cooled, and then heated at 500℃ for 2 hours. The 0.2% yield strength after aging treatment is 120MPa Above, the conductivity is above 40%IACS.

Description

Copper alloy plate for heat dissipation parts, heat dissipation parts, and manufacturing method of heat dissipation parts

The present invention relates to a copper alloy plate for heat dissipation parts. The copper alloy plate for heat dissipation parts is used in heat sinks, heat sinks, heat pipes, etc., for processing heat generated from computer CPUs, LED lights, etc. The present invention particularly relates to a copper alloy plate for heat dissipating parts that is used as part of the manufacturing process of heat dissipating parts, including brazing, diffusion bonding, degassing and other heating processes at high temperatures.

The CPUs mounted on disc-type PCs, notebook PCs, etc. are rapidly moving toward higher speeds and higher densities. Therefore, the amount of heat generated by these CPUs has increased. If the temperature of the CPU rises above a certain temperature, it will be the cause of malfunction, thermal runaway, etc. Therefore, effective heat dissipation from semiconductor devices such as the CPU has become an urgent problem.

As a heat sink that absorbs the heat of the semiconductor device and releases it to the atmosphere, a heat sink is used. Since the heat sink is required to have high thermal conductivity, copper and aluminum with high thermal conductivity are used as its materials. However, the convective thermal resistance limits the performance of the heat sink, making it difficult to meet the requirements so far Heat dissipation requirements of high-performance electronic parts with increased heat generation.

For this reason, as a heat dissipation component with higher heat dissipation, the industry proposes a tubular heat pipe and a flat heat pipe (soaking plate) with high heat conductivity and heat transfer capability. The heat pipe circulates through the evaporation (heat absorption from the CPU) and condensation (release of the absorbed heat) of the enclosed refrigerant, thereby exhibiting higher heat dissipation characteristics than the heat sink. In addition, there is another proposal to solve the heat generation problem of semiconductor devices by combining heat pipes with heat dissipation components such as heat sinks and fans.

As a material for heat dissipation parts such as heat sinks, heat sinks, heat pipes, etc., plates or tubes made of pure copper (oxygen-free copper: C1020) with excellent electrical conductivity and corrosion resistance are often used. In order to ensure the forming processability, soft annealed materials (O materials) and/or 1/4H quenched and tempered materials are used as materials. However, in the manufacturing steps of heat dissipation parts described below, deformation and defects are prone to occur and punching. It is prone to problems such as burrs and easy wear of the blanking die. On the other hand, Patent Documents 1 and 2 describe Fe-P-based copper alloy plates as materials for heat dissipation components.

The heat sink and heat sink are formed by pressing, punching, cutting, drilling, etching, etc., of a pure copper plate into a specific shape, and then plating Ni and/or Sn as necessary, then soldering, Brazing materials, adhesives, etc. are bonded to semiconductor devices such as CPUs.

Tubular heat pipes (see Patent Document 3) are formed by sintering copper powder in the pipe to form a core. After heating and degassing, one end of the heat pipe is brazed and sealed, and the refrigerant is placed in the pipe under vacuum or reduced pressure. , And then the other end is made by brazing and sealing.

Planar heat pipes (see Patent Documents 4 and 5) are those that further improve the heat dissipation performance of tubular heat pipes. As a flat heat pipe, in order to efficiently condense and evaporate the refrigerant, similar to the tubular heat pipe, the industry has proposed a method of roughening the inner surface, groove processing, etc. Join the two pure copper plates that have been processed by pressing, punching, cutting, etching, etc., using brazing, diffusion bonding, welding, etc., and then placing a refrigerant inside, and then brazing. Method for sealing. In the joining step, degassing may be performed.

In addition, as a flat heat pipe, there has been a proposal consisting of an outer member and an inner member housed inside the outer member. In order to promote the condensation, evaporation and transportation of the refrigerant, the internal components are arranged in one or more inside the external components, and processed to form various shapes of fins, protrusions, holes, slots, etc. This type of flat heat pipe is also the same. After the internal components are arranged inside the external components, the external components and the internal components are integrated by brazing, diffusion bonding, etc., and after the refrigerant is placed , To be sealed by brazing and other methods.

[Prior technical literature] 〔Patent Literature〕

[Patent Document 1] JP 2003-277853 A

[Patent Document 2] JP 2014-189816 A

[Patent Document 3] JP 2008-232563 A

[Patent Document 4] JP 2007-315745 A

[Patent Document 5] JP 2014-134347 A

In the manufacturing steps of these heat-dissipating parts, the heat-dissipating plate and the heat-dissipating fins are heated to about 200~700℃ during the soldering and brazing steps. Tubular heat pipes and flat heat pipes are heated to about 800~1000℃ in the steps of sintering, degassing, brazing using phosphor copper brazing material (BCuP-2, etc.), diffusion bonding, and welding.

For example, in the case of using a pure copper plate as the material of the heat pipe, the softening is severe when heated at a temperature above 650℃. In addition, rapid coarsening of crystal grains may occur. Therefore, when installing heat sinks and semiconductor devices, or assembling a PC case, the manufactured heat pipe is easily deformed, and the internal structure of the heat pipe changes. In addition, the unevenness of the surface will increase, and there is a problem that the desired heat dissipation performance cannot be achieved. In addition, in order to avoid such deformation, although the thickness of the pure copper plate can be increased, if so, the quality and thickness of the heat pipe increase. When the thickness increases, the gap inside the PC case becomes smaller, and there is a problem of low convective heat transfer performance.

The same applies to the copper alloy plates (Fe-P series) described in Patent Documents 1 and 2. When heated at a temperature of 650° C. or higher, they soften, and the electrical conductivity is significantly lower than that of pure copper. Therefore, when a flat heat pipe is manufactured through steps such as sintering, degassing, brazing, diffusion bonding, welding, etc., the heat pipe is easily deformed due to the transportation and handling of the heat pipe, the steps of assembling the substrate, and the like. In addition, due to the decrease in electrical conductivity, the desired performance as a heat pipe does not appear.

The present invention was created based on the above-mentioned problems when a part of the process of manufacturing heat dissipation parts from pure copper or copper alloy plates includes a process of heating to a temperature above 650°C, and its purpose is to provide a method for heating to The heat-dissipating parts manufactured by the process at a temperature above 650℃ can provide copper alloy plates with sufficient strength and heat dissipation performance.

Precipitation hardening copper alloy, through aging treatment after solution treatment, its strength and conductivity are improved. However, for precipitation hardening copper alloys, after solution treatment, if cold plastic working is not applied to introduce plastic strain that becomes the precipitation site into the alloy and then aging treatment is performed, the strength and conductivity brought by the aging treatment Situations where the lifting effect is not high.

In the case of heat dissipating parts such as a soaking plate manufactured through heating steps such as brazing, diffusion bonding, and welding, plastic processing is not performed after the heating step. Therefore, if the heat dissipation component is made of a precipitation-strengthened copper alloy sheet material, after the heating step equivalent to the solution treatment, even if the aging treatment is performed, the strength and conductivity may not be sufficiently improved.

On the other hand, the inventors discovered that in the Cu-(Ni,Fe)-P series alloy among the precipitation hardening copper alloys, the composition range of Ni, Fe, and P and the ratio of [Ni+Fe]/P Even if the aging treatment is performed without plastic working after the above heating step, the strength and electrical conductivity of the heat-dissipating parts are still greatly improved, and the invention is finally achieved.

The copper alloy plate for heat dissipation parts related to the present invention is used for As part of the process of manufacturing heat-dissipating parts, including heating to above 650℃ and aging treatment, it contains Ni: 0.2~0.95 mass%, Fe: 0.05~0.8 mass%, and P: 0.03~0.2 mass%, The rest is Cu and unavoidable impurities; when the total content of Ni and Fe is set to [Ni+Fe] and the content of P is set to [P], [Ni+Fe] is 0.25~1.0% by mass, [Ni+Fe ]/〔P〕 is 2~10, 0.2% yield strength is more than 100MPa and has excellent bending workability; it is 0.2% after heating at 850℃ for 30 minutes and then water cooling, and then heating at 500℃ for 2 hours after aging treatment % Yield strength is above 120MPa, conductivity is above 40%IACS

The copper alloy plate for heat dissipation parts related to the present invention may further contain Co in the range of less than 0.05% by mass as an alloy element if necessary. In addition, the copper alloy plate for heat dissipation parts related to the present invention may further contain one or two types of Sn and Mg in the range of Sn: 0.005 to 1.0 mass% and Mg: 0.005 to 0.2 mass% as alloy elements as necessary. Or/and contain Zn in the range of 1.0% by mass or less. In addition, the copper alloy plate for heat dissipation parts related to the present invention may further contain one or two of Si, Al, Mn, Cr, Ti, Zr, and Ag in a total of 0.005 to 0.5 mass% as an alloy element as necessary. More than species.

The copper alloy plate related to the present invention is used as a part of the process of manufacturing heat dissipation parts, including the process of heating to above 650°C and the aging treatment. In other words, using the copper alloy plate related to the present invention The manufactured heat-dissipating parts are subjected to aging treatment after being heated to a high temperature above 650°C, and the strength is improved.

The copper alloy plate related to the present invention has a 0.2% yield strength of 100 MPa or more, and has excellent bending workability. Moreover, the copper alloy sheet related to the present invention is heated at 850°C for 30 minutes, and then heated at 500°C for 2 hours after aging treatment, the 0.2% yield strength is 120MPa or more, and the conductivity is 40% IACS or more. The copper alloy plate related to the present invention has high strength after aging treatment. Therefore, when heat dissipation parts such as heat pipes made of the copper alloy plate are installed on heat sinks and semiconductor devices, or assembled into PC casings, the heat dissipation The parts are not easily deformed. In addition, although the conductivity of the copper alloy plate related to the present invention is lower than that of the pure copper plate, the strength after aging treatment is higher, so the wall can be thinned, and from the perspective of heat dissipation performance, the reduced conductivity can be compensated.

Hereinafter, the copper alloy plate for heat dissipation parts related to the embodiment of the present invention will be described in more detail.

The copper alloy plate related to the embodiment of the present invention is heated into a specific shape by press forming, punching, cutting, etching, etc., and then heated at high temperature (for degassing, bonding (brazing, diffusion bonding, welding) (TIG, MIG, laser, etc.), sintering, etc.), which are finally processed into heat-dissipating parts. Depending on the type and manufacturing method of heat-dissipating parts, the heating conditions of the above-mentioned high-temperature heating are different, but in the implementation of the present invention In the method, it is assumed that the above-mentioned high temperature heating is performed at about 650℃~1050℃ situation. The copper alloy plate related to the embodiment of the present invention includes the (Ni, Fe)-P copper alloy of the composition described later. If heated in the above temperature range, at least of the (Ni, Fe)-P compound precipitated from the base material A part of it will solid-dissolve and crystal grains will grow, resulting in softening and a decrease in conductivity.

The copper alloy plate related to the embodiment of the present invention is heated at 850°C for 30 minutes, then cooled with water, and then heated at 500°C for 2 hours. The strength (0.2% yield strength) after aging treatment is 120MPa or more, conductive The rate is above 40% IACS. Heating at 850°C for 30 minutes is the heating condition of the above-mentioned high-temperature heating program when the heat sink is manufactured. If the copper alloy plate related to the embodiment of the present invention is heated at a high temperature under this condition, the precipitated (Ni, Fe)-P compound will be solid-dissolved and crystal grains will grow, resulting in softening and a decrease in conductivity. Then, if the above-mentioned copper alloy plate is aged, fine (Ni, Fe)-P compounds are precipitated. Thereby, the strength and conductivity that are reduced by the above-mentioned high-temperature heating are significantly improved.

The above-mentioned aging treatment can be used (a) to maintain the precipitation temperature range for a certain period of time in the cooling step after high temperature heating, (b) to cool to room temperature after high temperature heating, and then heat to maintain the precipitation temperature range for a certain period of time, (c) After the step (a) above, heating is performed in the precipitation temperature range for a certain period of time.

As specific aging treatment conditions, a temperature range of 300 to 600°C for 5 minutes to 10 hours can be mentioned. When the improvement of strength is the priority, the temperature-time conditions for the formation of fine (Ni,Fe)-P compounds are appropriately selected. When the improvement of the conductivity is the priority, the solid solution is appropriately selected The temperature-time conditions of the over-aging treatment to reduce Ni, Fe and P are sufficient.

The copper alloy plate after the aging treatment has lower conductivity than the pure copper plate after high temperature heating, but the strength is significantly higher than that of the pure copper plate. In order to achieve this effect, heat-radiating parts such as heat pipes manufactured using the copper alloy plate related to the embodiment of the present invention are subjected to aging treatment after being heated at a high temperature. The aging treatment conditions are as described above. The heat-dissipating parts (copper alloy plate) after aging treatment have high strength, which can prevent the heat-dissipating parts from deforming when they are installed on heat sinks and semiconductor devices, or assembled into PC cases. In addition, the copper alloy plate (after aging treatment) related to the embodiment of the present invention has higher strength than pure copper plate, so it can be thinner (0.1~1.0mm thick), thereby improving the heat dissipation performance of the heat dissipation component , Which can compensate for the reduced conductivity when compared with pure copper plate.

In addition, the copper alloy plate related to the embodiment of the present invention, even if the high temperature heating temperature does not reach 850°C (above 650°C) or exceeds 850°C (above 1050°C), after aging treatment, it can still achieve 0.2% above 120MPa Yield strength and conductivity above 40%IACS.

The copper alloy plate related to the embodiment of the present invention is processed into heat-dissipating parts by pressing, punching, cutting, etching, etc., before being heated to a temperature above 650°C. The copper alloy plate must have the strength that is not easily deformed during the transportation and handling of the above-mentioned processing, and the mechanical properties that can be performed without hindrance. More specifically, the copper alloy sheet related to the embodiment of the present invention has a yield strength of 0.2% above 100 MPa and excellent bending workability. If it can meet the above characteristics, the quenching and tempering of copper alloy plate will not be a problem. Such as solution treatment materials, aging Any one can be used if the finished material is cold rolled after the aging treatment.

In the bending process, it is required that the bending part does not break. Furthermore, it is preferable that no wrinkles occur in the bending line and its vicinity. Even for copper alloy plates of the same material, the susceptibility to cracks and wrinkles due to bending depends on the ratio R/t of the bending radius R to the plate thickness t. In the case of using copper alloy plates to manufacture heat-dissipating parts such as soaking plates, as the bending workability of copper alloy plates, it is usually required that the rolling parallel direction and the right-angle direction are both bent at R/t≦2 There is no rupture underneath. As for the bending workability of the copper alloy sheet, it is preferable that no crack occurs under the bending of R/t≦1.5, and it is more preferable that no crack occurs under the bending of R/t≦1.0. The bending workability of the copper alloy plate is generally tested with a test piece with a plate width of 10 mm (see the bending workability test of the examples described later). In the case of bending the copper alloy sheet, the larger the bending width, the more likely it is to break. Therefore, as a heat dissipation part, especially when the bending width is large, it is better not to break under the bending of R/t=1.0 , It is better not to break under the bending of R/t=0.5. In order to prevent wrinkles from occurring at the bending line and its vicinity, it is preferable that the average crystal grain size measured in the width direction of the copper alloy plate (cutting method) is 20 μm or less, more preferably 15 μm or less.

As mentioned above, the heat dissipation parts manufactured by processing the copper alloy plate related to the embodiment of the present invention will soften if heated to a temperature above 650°C. The heat-dissipating parts after high-temperature heating preferably have a strength that is not easy to deform during transportation and handling during aging treatment. For this reason, it is preferable to have a yield strength of 0.2% above 50MPa at the stage of water cooling after heating at 850°C for 30 minutes.

After receiving the aging treatment, the heat dissipating parts manufactured by using the copper alloy plate related to the embodiment of the present invention can form a Sn coating layer on at least a part of its outer surface for the main purpose of improving corrosion resistance and weldability if necessary. The Sn coating layer includes electroplating, electroless electroplating, or those formed by heating below or above the melting point of Sn after electroplating. The Sn coating layer contains Sn metal and Sn alloy. As the Sn alloy, there can be mentioned one or more of Bi, Ag, Cu, Ni, In, and Zn as alloying elements in a total amount of 5% or less other than Sn .

Under the Sn coating layer, an underplating layer of Ni, Co, Fe, etc. can be formed. These underplating layers have the function of preventing the diffusion of Cu or alloying elements from the base material as a barrier, and the function of preventing damage by increasing the surface hardness of the heat sink. It is also possible to plate Cu on the above-mentioned underplating layer, and then after plating Sn, heat treatment to be heated below or above the melting point of Sn to form a Cu-Sn alloy layer, thereby forming an underplating layer, Cu-Sn alloy layer and Sn Three layers of coating layer. The Cu-Sn alloy layer has the function of preventing the diffusion of Cu or alloy elements from the base material as a barrier, and the function of preventing damage by increasing the surface hardness of the heat sink.

In addition, the heat dissipation component manufactured using the copper alloy plate related to the embodiment of the present invention, after receiving the aging treatment, can form a Ni coating layer on at least a part of its outer surface as necessary. The Ni coating layer has the function of preventing the diffusion of Cu or alloy elements from the base material as a barrier, the function of preventing damage by increasing the surface hardness of the heat sink, and the function of improving corrosion resistance.

Secondly, the copper alloy related to the embodiment of the present invention The composition of the board is explained.

The copper alloy plate related to the embodiment of the present invention contains Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass%, and P: 0.03 to 0.2 mass%. The total content of Ni and Fe [Ni+Fe] is set within the range of 0.25 to 1.0% by mass.

P compound is formed between Ni and Fe, and P to improve the strength and stress relaxation resistance of the copper alloy plate. In addition, this P compound includes one or more of Ni-P compounds, Fe-P compounds, and Ni-Fe-P compounds in which part of Ni is replaced by Fe. In the embodiment of the present invention, this one-P compound is referred to as (Ni, Fe)-P compound. The P compound has a high solid solution temperature. Even if the copper alloy plate is heated to a high temperature above 650°C (for example, 850°C), a part of it is relatively stable and prevents the coarsening of the crystal grain size. On the other hand, the higher the heating temperature of the copper alloy plate, the higher the concentration of frozen pores after water cooling, which increases the nucleation sites of precipitates. Therefore, the subsequent aging treatment can increase the number density of the spherical precipitates, which contributes to the improvement of the strength after the aging treatment.

When the total content of Ni and Fe [Ni+Fe] is less than 0.25% by mass, or the content of P is less than 0.03% by mass, the amount of precipitation of P compounds is small, which reduces the effect of improving the strength and stress relaxation characteristics of the copper alloy plate . On the other hand, if [Ni+Fe] exceeds 1.0% by mass or the content of P [P] exceeds 0.2% by mass, coarse oxides, crystallization products, precipitates, etc. are formed, resulting in reduced hot workability, and the copper alloy plate Its strength, stress relaxation resistance and bending workability are reduced. In addition, the solid solution amount of Ni, Fe and P increases, and the conductivity of the copper alloy plate decreases. Therefore, [Ni+Fe] is set to 0.25 to 1.0% by mass, and the P content is set to 0.03 to 0.2% by mass.

In addition, if the individual contents of Ni and Fe are less than 0.2% by mass and less than 0.05% by mass, respectively, the effect of improving the strength and stress relaxation resistance of the copper alloy sheet is small. Therefore, the lower limit of the content of Ni and Fe is set to 0.2% by mass and 0.05% by mass, respectively.

The ratio of the total content of Ni and Fe [Ni+Fe] to the content of P [P] [Ni+Fe]/[P], in the case of less than 2 or more than 10, becomes excessive Ni, Fe or P. Solid solution reduces conductivity. Therefore, the content ratio [Ni+Fe]/[P] is set to 2-10. The lower limit of [Ni+Fe]/[P] is preferably 2.2, and the upper limit is preferably 9.5.

Co precipitates separately as Co in the Cu matrix to improve the heat resistance of the copper alloy, so it can be added as necessary. In addition, Co will replace a part of Ni or Fe in the (Ni, Fe)-P compound to improve the strength and stress relaxation resistance of the copper alloy plate. However, due to the high price of Co, the Co content is set to be less than 0.05% by mass.

Sn will dissolve in the mother phase of the copper alloy to increase the strength of the copper alloy. It can be added as necessary. Moreover, the addition of Sn is also effective for improving the stress relaxation resistance. If the use environment of the heat sink is 80°C or above, creep deformation will cause the contact surface with CPU and other heat sources to decrease, and the heat dissipation will decrease. However, this phenomenon can be suppressed by improving the stress relaxation resistance. In order to obtain the effect of improving the strength and the stress relaxation resistance, the Sn content is set to 0.005% by mass or more, preferably 0.01% by mass or more, and more preferably 0.02% by mass or more. On the other hand, if the Sn content exceeds 1.0% by mass, the bending workability of the copper alloy sheet will decrease. And will reduce the conductivity after aging treatment. Therefore, the Sn content is set to 1.0% by mass or less, preferably 0.6% by mass or less, and more preferably 0.3% by mass or less.

Like Sn, Mg will dissolve in the mother phase of the copper alloy to improve the strength and stress relaxation properties of the copper alloy, so it can be added as necessary. In order to obtain the effect of improving the strength and resistance to stress relaxation properties, the Mg content is set to 0.005% by mass or more. On the other hand, if the Mg content exceeds 0.2% by mass, the bending workability of the copper alloy sheet will be reduced, and the conductivity after the aging treatment will be reduced. Therefore, the Mg content is set to 0.2% by mass or less, preferably 0.15% by mass or less, and more preferably 0.05% by mass or less.

Zn has the function of increasing the strength of the copper alloy plate, and improving the heat-resistant peeling resistance of the solder and the heat-resistant peeling resistance of the Sn coating, and can be added as necessary. When assembling the heat dissipating parts into the semiconductor device, soldering may be necessary, and after the heat dissipating parts are manufactured, Sn plating may be used to improve the corrosion resistance. In the manufacture of such heat-dissipating parts, copper alloy plates containing Zn can be suitably used. However, if the content of Zn exceeds 1.0% by mass, solder wettability is reduced, so the content of Zn is made 1.0% by mass or less. The content of Zn is preferably 0.7% by mass or less, and more preferably 0.5% by mass or less. On the other hand, if the Zn content is less than 0.01% by mass, the improvement in heat-resistant peeling resistance is insufficient, and the Zn content is preferably 0.01% by mass or more. The Zn content is more preferably 0.05% by mass or more, and even more preferably 0.1% by mass or more.

In addition, the copper alloy sheet related to the embodiment of the present invention contains Zn Next, if heating at a temperature above 500°C, Zn will vaporize due to the heating atmosphere, which may deteriorate the surface properties of the copper alloy plate or contaminate the heating furnace. From the viewpoint of preventing the vaporization of Zn, the content of Zn is preferably 0.5% by mass or less, more preferably 0.3% by mass or less, and even more preferably 0.2% by mass or less.

Si, Al, Mn, Cr, Ti, Zr and Ag have the effect of improving the strength and heat resistance of copper alloys, so one or more of them can be added as necessary. If these elements are added, if the content is too large, the conductivity of the copper alloy will decrease. Therefore, the total content of one or more of these elements is limited to 0.5% by mass or less. On the other hand, in order to obtain the above effect, the lower limit of the total content of these elements is set to 0.005 mass% or more. The lower limit is preferably 0.01% by mass, more preferably 0.02% by mass.

Among them, even if Si, Al, and Mn are contained in a small amount, the conductivity of the copper alloy is lowered. Therefore, the respective upper limits are preferably set to Si: 0.2% by mass, Al: 0.2% by mass, and Mn: 0.1% by mass. On the other hand, in order to obtain the above-mentioned effects, the respective lower limits of Si, Al, and Mn are preferably set to Si: 0.01% by mass, Al: 0.01% by mass, and Mn: 0.01% by mass. Cr, Ti, and Zr easily form oxide-based and sulfide-based inclusions of several μm to several tens of μm. The cold rolling creates gaps between the inclusions and the base material, and the inclusions are present on the surface When, it will reduce the corrosion resistance of the copper alloy. Therefore, the upper limit of Cr, Ti, and Zr is preferably set to Cr: 0.2% by mass, Ti: 0.1% by mass, and Zr: 0.05% by mass. On the other hand, in order to obtain the above effects, the lower limit of Cr, Ti, and Zr should be set to Cr: 0.005 mass%, Ti: 0.01 mass%, and Zr: 0.005 mass%. The upper limit of Ag is set to 0.5% by mass, and in order to obtain the above effects, the lower limit is preferably set to 0.01% by mass.

H, O, S, Pb, Bi, Sb, Se and As, which are inevitable impurities, will accumulate in the grain boundary when the copper alloy plate is heated at a temperature above 650℃ for a long time, causing heating and heating The subsequent possibility of grain boundary cracking and grain boundary embrittlement, so the content of these elements should be reduced. H will accumulate at the grain boundary and/or the interface between the inclusions and the base material during heating, and cause expansion. Therefore, it is better to set it to less than 1.5 ppm (mass ppm, the same below), and more preferably less than 1ppm. O should be less than 20 ppm, and more preferably less than 15 ppm. The total content of S, Pb, Bi, Sb, Se, and As is preferably set to less than 30 ppm, and more preferably set to less than 20 ppm. In particular, regarding Bi, Sb, Se, and As, the total content of these elements is preferably less than 10 ppm, and more preferably less than 5 ppm.

The copper alloy sheet related to the embodiment of the present invention can be processed by (1) hot rolling-cold rolling-annealing, (2) hot rolling-cold rolling-annealing-cold rolling after soaking the ingot with the above composition , (3) Hot rolling-cold rolling-annealing-cold rolling-low temperature annealing and other steps to manufacture. In the above (1) to (3), the step of cold rolling-annealing may be performed multiple times.

The above annealing includes softening annealing, recrystallization annealing, or precipitation annealing (aging treatment). In the case of softening annealing or recrystallization annealing, the heating temperature can be selected from the range of 600~950℃, and the heating time is selected from the range of 5 seconds to 1 hour. When softening annealing or recrystallization annealing is also used as solution treatment Next, perform continuous annealing at 650~950℃ for 5 seconds to 3 minutes. In the case of precipitation annealing, as mentioned above, it can be carried out at a temperature range of about 300 to 600°C for 0.5 to 10 hours. When softening annealing or recrystallization annealing is used as solution treatment, precipitation annealing can be performed in a subsequent step.

For the final cold rolling, the target 0.2% yield strength and bending workability can be selected from the range of 5~80% processing rate.

Low-temperature annealing is to restore the ductility of the copper alloy sheet and soften the copper alloy sheet without crystallization. In the case of continuous annealing, it is set to keep at 300~650℃ for about 1 second to 5 minutes. can. In addition, in the case of batch annealing, the physical temperature of the copper alloy sheet should be set at 250°C to 400°C for 5 minutes to 1 hour.

According to the above manufacturing method, a copper alloy sheet with a 0.2% yield strength of 100MPa or more and excellent bending workability can be manufactured. Furthermore, when this copper alloy plate is heated at 850°C for 30 minutes and then subjected to aging treatment at 500°C for 2 hours, it has a yield strength of 0.2% above 120MPa and a conductivity above 40% IACS.

The copper alloy sheet related to the embodiment of the present invention is preferably manufactured by the steps of cold rolling, recrystallization treatment with solution, cold rolling, and aging treatment after soaking and hot rolling of the ingot. After the recrystallization treatment accompanied by solutionization, the aging treatment can also be carried out without cold rolling, and then cold rolling can be carried out later. As mentioned earlier in this manufacturing method, using the copper alloy with the above composition, the copper alloy plate manufactured under the following conditions has a 0.2% yield strength of 300 MPa or more, and has excellent bending workability.

Melting and casting can be performed by general methods such as continuous casting and semi-continuous casting. Moreover, as a copper melting raw material, it is preferable to use the one with a small content of S, Pb, Bi, Se, and As. In addition, it is better to pay attention to the red heating (moisture removal) of the charcoal coated in the copper alloy melt, the raw metal, the corner raw materials, the guide groove, the drying of the mold, and the deoxidation of the melt to reduce O and H.

The homogenization treatment should be maintained for more than 30 minutes after the temperature inside the ingot reaches a temperature above 800°C. The retention time of the homogenization treatment is more preferably 1 hour or more, and even more preferably 2 hours or more.

After the homogenization treatment, the hot rolling is started at a temperature above 800°C. In order to prevent the formation of coarse (Ni, Fe)-P precipitates in the hot-rolled material, it is preferable to finish the hot-rolling at a temperature of 600° C. or higher, and to perform rapid cooling from this temperature by water cooling or the like. If the rapid cooling start temperature after hot rolling is lower than 600°C, coarse (Ni, Fe)-P precipitates are formed, and the structure is likely to become uneven, resulting in a decrease in the strength of the copper alloy plate (product plate). The temperature at the end of the hot rolling should preferably be a temperature above 650°C, more preferably a temperature above 700°C. In addition, the structure of the hot-rolled material rapidly cooled after hot rolling becomes a recrystallized structure. The recrystallization treatment accompanied by solutionization described later can be performed by a combination of rapid cooling after hot rolling.

By cold rolling after hot rolling, a certain strain is applied to the copper alloy sheet, and after the subsequent recrystallization treatment, a copper alloy sheet having the desired recrystallized structure (fine recrystallized structure) can be obtained.

The recrystallization treatment accompanied by solutionization is carried out at 650~950°C, preferably 670~900°C for 3 minutes or less. When the content of Ni, Fe and P in the copper alloy is small, in the above temperature range If the content of Ni, Fe, and P is high in the lower temperature region, it should be carried out in the higher temperature region within the above temperature range. Through this recrystallization treatment, in addition to solid dissolving of Ni, Fe and P in the copper alloy base material, it can also form a recrystallized structure with good bending workability (crystal grain size 1-20μm). If the temperature of this recrystallization treatment is lower than 650°C, the solid solution amount of Ni, Fe, and P will decrease and the strength will decrease. On the other hand, if the temperature of the recrystallization treatment exceeds 950°C or the treatment time exceeds 3 minutes, the recrystallized grains become coarse.

After the recrystallization treatment with solution, you can choose (a) cold rolling-aging treatment, (b) cold rolling-aging treatment-cold rolling, (c) cold rolling-aging treatment-cold rolling-low temperature annealing, ( d) Any step of aging treatment-cold rolling, (e) aging treatment-cold rolling-low temperature annealing.

The aging treatment (precipitation annealing) is carried out under the condition that the heating temperature is about 300~600℃ for 0.5~10 hours. If this heating temperature is less than 300°C, the amount of precipitation is small, and if it exceeds 600°C, the precipitate is likely to be coarsened. The lower limit of the heating temperature is preferably 350°C, the upper limit is preferably 580°C, and more preferably 560°C. The holding time of the aging treatment is appropriately selected according to the heating temperature, and it is carried out in the range of 0.5 to 10 hours. If this retention time is 0.5 hours or less, the precipitation becomes insufficient, and even if it exceeds 10 hours, the precipitation amount is still saturated and productivity is reduced. The lower limit of the holding time is preferably 1 hour, more preferably 2 hours.

[Example 1]

Cast copper alloys with the composition shown in Tables 1 and 2 and make them separately Ingots with thickness of 45mm, length of 85mm and width of 200mm. In this copper alloy, the inevitable impurities of H are less than 1ppm, O is less than 15ppm, and the total content of S, Pb, Bi, Sb, Se and As is less than 20ppm.

Each ingot is subjected to soaking treatment at 965°C for 3 hours, and then hot-rolled to form a hot-rolled material with a plate thickness of 15mm, and then quenched (water-cooled) from a temperature above 650°C. After quenching, the two sides of the hot-rolled material are ground (surface cutting) by 1mm successively, and then rough-rolled to the target thickness of 0.6mm, and then recrystallized (with solution) maintained at 650~950℃ for 10~60 seconds化). Next, after aging treatment (precipitation annealing) at 500°C for 2 hours, 50% finish cold rolling is performed to produce a copper alloy sheet with a thickness of 0.3 mm.

In addition, in Examples 4, 7 and 10 and Comparative Examples 1 and 5 shown in Tables 1 and 2, a part (length 2000mm) of a copper alloy sheet (thickness 0.6mm) after cold rough rolling was used in the following [implementation] Example 3] and [Example 4].

In addition, the unit of each element content shown in Table 1 and Table 2 is mass %.

Using the obtained copper alloy plate as a sample to be tested, various measurement tests of electrical conductivity, mechanical properties, bending workability, and solder wettability were performed according to the following procedures. The results are shown in Tables 3 and 4.

In addition, the obtained copper alloy plate was heated at 850°C for 30 minutes and then water-cooled, and then subjected to aging treatment (precipitation treatment) heated at 500°C for 2 hours, respectively, as samples to be tested for conductivity and Each measurement test of mechanical properties. The results are shown in Tables 3 and 4.

(Measurement of conductivity)

The electrical conductivity is measured according to the electrical conductivity measurement method of non-ferrous metal materials specified in JIS-H0505, using a double bridge type four-terminal method.

(Mechanical characteristics)

From the sample to be tested, a JIS No. 5 tensile test piece was cut out so that the length direction became parallel to the rolling direction, and a tensile test was performed according to JIS-A2241 to measure the yield strength and elongation. Yield strength is the tensile strength equivalent to 0.2% permanent elongation.

(Bending workability)

The measurement of bending workability is carried out according to the W bending test method specified in the Standard JBMA-T307 of the Copper Wire Drawing Association. A test piece with a width of 10mm and a length of 30mm was cut from each sample to be tested. Using a jig with R/t=0.5, GW (Good Way (bending axis perpendicular to the rolling direction)) and BW (Bad Way (bending axis and roll) The rolling direction is parallel)) bending. Next, visually observe whether the bending part is broken with a 100 times optical microscope. If neither GW nor BW has occurred, it is considered as ○ (passed), and if either or both of GW and BW has broken, it is considered as × (unqualified). ) For evaluation.

(Solder wettability)

A strip test piece was taken from each sample to be tested, and the inactive flux was dipped and coated for 1 second, and then the solder wetting time was measured by the wetting balance method. The solder was implemented using Sn-3 mass% Ag-0.5 mass% Cu maintained at 260±5°C under test conditions of an immersion speed of 25mm/sec, an immersion depth of 5mm, and an immersion time of 5sec. A solder wetting time of 2 seconds or less is evaluated as excellent solder wettability. In addition, other than Comparative Example 6, the solder wetting time was 2 seconds or less.

The copper alloy plates of Examples 1-24 shown in Tables 1 and 3, the alloy composition meets the requirements of the present invention, heated at 850°C for 30 minutes, and then subjected to aging treatment, the strength (0.2% yield strength) is 120 MPa or more, and the conductivity is more than 40%IACS. In addition, the characteristics of the copper alloy plate before heating at 850°C, the strength (0.2% yield strength) is 300 MPa or more, and the bending workability and solder wettability are excellent.

In contrast, the copper alloy plates of Comparative Examples 1 to 10 shown in Tables 2 and 4 are inferior in any characteristics as shown below.

Comparative Example 1 does not contain Ni, and the total content of Ni and Fe [Ni+Fe] is small, so the strength after aging treatment is low.

In Comparative Example 2, the P content was excessive, so cracks occurred during hot rolling, and it was impossible to proceed to the step after hot rolling.

In Comparative Example 3, the Ni content is small, the total content of Ni and Fe [Ni+Fe] is small, and the P content is small, so the strength after aging treatment is low.

In Comparative Examples 4 and 5, the respective Sn or Mg content is excessive, and the conductivity after aging treatment is low.

In Comparative Example 6, the Zn content was excessive, and as described earlier, the solder wettability was poor.

In Comparative Example 7, the total content of elements (Al, Mn, etc.) other than the main elements was excessive and exceeded 0.5% by mass, and the conductivity after aging treatment was low.

Comparative Example 8 does not contain Fe, and the total content of Ni and Fe [Ni+Fe] is small, so the strength after aging treatment is low.

In Comparative Example 9, the total content of Ni and Fe [Ni+Fe] and the P content were excessive, cracks occurred during hot rolling, and it was impossible to proceed to the step after hot rolling.

In Comparative Example 10, the Ni content is small, and the yield strength after aging treatment is low.

[Example 2]

For the representative copper alloy plates (plate thickness 0.3mm) produced in [Example 1] (Examples 4, 7 and 10 and Comparative Examples 1 and 5 shown in Tables 1 and 2), the temperature was set at 1000°C After heating for 30 minutes, it was cooled in water, and then heated at 500°C for 2 hours (aging treatment). The copper alloy plate was used as the sample to be tested, and various electrical conductivity and mechanical properties were measured according to the method described in [Example 1] . The results are shown in Table 5.

As shown in Table 5, Examples 4, 7 and 10 were heated at 1000°C for 30 minutes, and then subjected to aging treatment. The strength (0.2% yield strength) was 120 MPa or more, and the conductivity was 40% IACS or more. Compare the values shown in Table 5 (yield strength and conductivity after aging treatment) with the measurement results after heating at 850°C for 30 minutes and then aging treatment (see Table 3). There is no significant value s difference.

On the other hand, in Comparative Examples 1 and 5, the strength or conductivity after heating at 1000°C for 30 minutes, and then aging treatment did not reach the benchmark (0.2% yield strength is 120MPa or more, and conductivity is 40% IACS or more) .

[Example 3]

For Examples 4, 7 and 10 shown in Tables 1 and 2 and Comparative Examples 1 and 5, the cold rough-rolled copper alloy plate (thickness 0.6mm) manufactured in [Example 1] was used, and the result was further implemented 50 % Cold-rolled to manufacture copper alloy plates with a thickness of 0.3mm. Secondly, the copper alloy plate is subjected to recrystallization treatment (with solution) at 650 to 825°C for 10 to 60 seconds.

Using the obtained copper alloy plate as a test sample, various measurement tests of electrical conductivity, mechanical properties, and bending workability were performed according to the method described in [Example 1] above. In addition, the obtained copper alloy plate was heated at 850°C for 30 minutes and then water-cooled, and then heated at 500°C for 2 hours for aging treatment (precipitation treatment), respectively, as samples to be tested, and the conductivity and mechanical properties were the same. Various measurement tests of characteristics. The results are shown in Table 6. In Table 6, the compositions of Examples 4A, 7A, and 10A are the same as those of Examples 4, 7 and 10 in Table 1, and the compositions of Comparative Examples 1A and 5A are the same as those of Comparative Examples 1 and 5 in Table 2.

The copper alloy plates of Examples 4A, 7A and 10A shown in Table 6, whose alloy composition meets the requirements of the present invention, are heated at 850°C for 30 minutes, and then subjected to aging treatment. The strength (0.2% yield strength) is Above 120MPa, and the conductivity is above 40%IACS. In addition, in terms of the characteristics of the copper alloy sheet before heating at 850°C, the strength (0.2% yield strength) is 100 MPa or more, and the bending workability is also excellent.

In contrast, the copper alloy sheet of Comparative Example 1A has low strength after aging treatment, and the copper alloy of Comparative Example 5A has low electrical conductivity after aging treatment.

[Example 4]

For Examples 4, 7 and 10 shown in Tables 1 and 2 and Comparative Examples 1 and 5, the cold rough-rolled copper alloy plate (thickness 0.6mm) manufactured in [Example 1] was used, and further cold Roll to form a thickness of 0.32mm. Next, after performing a recrystallization treatment (with solution) held at 650 to 825°C for 10 to 60 seconds, finishing cold rolling is performed to produce a copper alloy sheet with a thickness of 0.3 mm.

Using the obtained copper alloy plate as a test sample, various measurement tests of electrical conductivity, mechanical properties, and bending workability were performed according to the method described in Example 1 above. In addition, the obtained copper alloy plate was heated at 850°C for 30 minutes and then water-cooled, and then subjected to aging treatment (precipitation treatment) heated at 500°C for 2 hours, respectively, as samples to be tested, and the conductivity and mechanical properties were the same. Various measurement tests of characteristics. The results are shown in Table 7. In Table 7, the compositions of Examples 4B, 7B, and 10B are the same as those of Examples 4, 7 and 10 in Table 1, and the compositions of Comparative Examples 1B and 5B are the same as those of Comparative Examples 1 and 5 in Table 2.

The copper alloy plates of Examples 4B, 7B, and 10B shown in Table 7, whose alloy composition meets the requirements of the present invention, are heated at 850°C for 30 minutes, and then subjected to aging treatment. The strength (0.2% yield strength) is above 120MPa , And the conductivity is above 40%IACS. In addition, in terms of the characteristics of the copper alloy sheet before heating at 850°C, the strength (0.2% yield strength) is 100 MPa or more, and the bending workability is also excellent.

In contrast, the copper alloy plate of Comparative Example 1B has low strength after aging treatment, and the copper alloy of Comparative Example 5B has low electrical conductivity after aging treatment.

The invention content of this specification includes the following forms.

Type 1: A copper alloy plate for heat dissipation parts, characterized in that it contains Ni: 0.2~0.95 mass%, Fe: 0.05~0.8 mass%, and P: 0.03~0.2 mass%, and the rest is Cu and unavoidable impurities; Ni; When the total content of Fe and Fe is set to [Ni+Fe] and the content of P is set to [P], [Ni+Fe] is 0.25~1.0% by mass, and [Ni+Fe]/[P] is 2~10, 0.2 % Yield strength is more than 100MPa and has excellent bending workability; after heating at 850°C for 30 minutes, water cooling, and then heating at 500°C for 2 hours, the 0.2% yield strength is 120MPa or more, The conductivity is above 40% IACS; and part of the process of manufacturing heat dissipation parts includes the process of heating above 650°C and the aging treatment.

Type 2: For example, the copper alloy plate for heat dissipation parts of Type 1 further contains Co in the range of less than 0.05% by mass.

Type 3: For example, the copper alloy plate for heat dissipating parts of type 1 or 2, which further contains one or two types of Sn and Mg in the range of Sn: 0.005~1.0% by mass and Mg: 0.005~0.2% by mass.

Type 4: For example, a copper alloy plate for heat dissipation parts of any of the types 1 to 3, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) One or more of Si, Al, Mn, Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass.

Type 5: A heat dissipation component, characterized in that it comprises a copper alloy plate, the copper alloy plate contains Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.8 mass%, and P: 0.03 to 0.2 mass%, and the rest is Cu and non-volatile Impurities to avoid; when the total content of Ni and Fe is set to [Ni+Fe] and the content of P is set to [P], [Ni+Fe] is 0.25~1.0% by mass, and [Ni+Fe]/[P] is 2~10; And (Ni,Fe)-P compound is precipitated, with 0.2% yield strength above 120MPa and conductivity above 40% IACS.

Type 6: As the heat dissipating part of Type 5, the copper alloy plate further contains Co less than 0.05% by mass.

Type 7: Such as type 5 or 6, wherein the copper alloy plate further contains one or two types of Sn and Mg in the range of Sn: 0.005~1.0% by mass and Mg: 0.005~0.2% by mass.

Type 8: Such as the heat dissipation part of any of the types 5 to 7, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less ( ii) One or more of Si, Al, Mn, Cr, Ti, Zr, Ag, the total is 0.005 to 0.5% by mass.

Type 9: For a heat dissipating component of any of Types 5 to 8, at least one of the Sn coating layer and the Ni coating layer is formed on at least a part of the outer surface.

Type 10: A method for manufacturing heat-dissipating parts, which is characterized by processing heat-dissipating parts of any of Types 1 to 4 with a copper alloy plate into a specific shape, and then heat it to a temperature above 650°C. Then, the aging treatment is carried out to obtain heat dissipation parts with a yield strength of more than 110MPa and a yield strength of 0.2% and a conductivity of more than 40% IACS.

Type 11: The manufacturing method of heat-dissipating parts as type 10, in which aging treatment Then, at least one of the Sn coating layer and the Ni coating layer is formed on at least a part of the outer surface of the heat dissipation component.

This application is accompanied by Japanese Invention Patent Application No. 2015-254645 with an application date of December 25, 2015, and Japanese Invention Patent Application No. 2016-175464 with an application date of September 8, 2016 as The priority claim of the basic application. Japanese Patent No. 2015-254645 and Japanese Patent No. 2016-175464 are incorporated into this specification based on reference.

Claims (19)

A copper alloy plate for heat dissipation parts, characterized in that it contains Ni: 0.2~0.95 mass%, Fe: 0.05~0.45 mass%, and P: 0.03~0.2 mass%, and the rest is Cu and inevitable impurities; Ni; When the total content of Fe and Fe is set to [Ni+Fe] and the content of P is set to [P], [Ni+Fe] is 0.25~1.0% by mass, and [Ni+Fe]/[P] is 2~10, 0.2 % Yield strength is more than 100MPa and has excellent bending workability; after heating at 850°C for 30 minutes, water cooling, and then heating at 500°C for 2 hours, the 0.2% yield strength is more than 120MPa and electrical conductivity is 40 %IACS or more; and part of the process of manufacturing heat-dissipating parts includes heating to above 650℃ and aging treatment. For example, the copper alloy plate for heat dissipation parts in the first item of the scope of patent application, which further contains Co in the range of less than 0.05% by mass. For example, the copper alloy plate for heat-dissipating parts in the first item of the scope of patent application, which further contains one or two of Sn and Mg in the range of Sn: 0.005~1.0% by mass and Mg: 0.005~0.2% by mass. For example, the copper alloy plate for heat-dissipating parts in the second item of the scope of the patent application further contains one or two of Sn and Mg in the range of Sn: 0.005~1.0% by mass and Mg: 0.005~0.2% by mass. For example, the copper alloy plate for heat dissipation parts in the first item of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, One or two of Al, Mn, Cr, Ti, Zr, Ag Above, the total is 0.005 to 0.5% by mass. For example, the copper alloy plate for heat dissipation parts in the second item of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, One or more of Al, Mn, Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the copper alloy plate for heat dissipation parts in the third item of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, One or more of Al, Mn, Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the copper alloy plate for heat dissipation parts in the fourth item of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, One or more of Al, Mn, Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. A heat dissipation component, characterized in that it comprises a copper alloy plate, the copper alloy plate contains Ni: 0.2 to 0.95 mass%, Fe: 0.05 to 0.45 mass%, and P: 0.03 to 0.2 mass%, and the rest is Cu and non Impurities to avoid; when the total content of Ni and Fe is set to [Ni+Fe] and the content of P is set to [P], [Ni+Fe] is 0.25~1.0 mass%, [ Ni+Fe]/[P] is 2~10; and (Ni,Fe)-P compound is precipitated, with 0.2% yield strength above 120MPa and conductivity above 40%IACS. For example, the heat dissipating part of the 9th patent application, wherein the copper alloy plate further contains Co in the range of less than 0.05 mass%. For example, the heat dissipating part of item 9 of the scope of patent application, wherein the above-mentioned copper alloy plate further contains one or two types of Sn and Mg in the range of Sn: 0.005~1.0 mass% and Mg: 0.005~0.2 mass%. For example, the heat dissipating part in the 10th item of the patent application, wherein the above-mentioned copper alloy further contains one or two of Sn and Mg in the range of Sn: 0.005~1.0% by mass and Mg: 0.005~0.2% by mass. For example, the heat-dissipating component of item 9 of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, Al, Mn, One or more of Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the heat-dissipating part of item 10 of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, Al, Mn, One or more of Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the heat dissipating part of item 11 in the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) One or more of Si, Al, Mn, Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the heat dissipating part of item 12 of the scope of patent application, which further contains other elements in a manner that at least meets the following (i) or (ii): (i) Zn is 1.0% by mass or less (ii) Si, Al, Mn, One or more of Cr, Ti, Zr, and Ag, the total is 0.005 to 0.5% by mass. For example, the heat dissipating component of any one of items 9 to 16 in the scope of the patent application has at least one of a Sn coating layer and a Ni coating layer formed on at least a part of its outer surface. A method for manufacturing heat-dissipating parts, which is characterized in that the heat-dissipating parts, such as any one of items 1 to 8 of the scope of the patent application, are processed into a specific shape with a copper alloy plate, and then heated to a temperature above 650°C. After aging treatment, heat dissipation parts with 0.2% yield strength above 110MPa and conductivity above 40% IACS are obtained. For example, the method for manufacturing a heat dissipating component in the scope of the patent application, wherein after the aging treatment, at least one of a Sn coating layer and a Ni coating layer is formed on at least a part of the outer surface of the heat dissipating component.