KR20180019221A - 반도체 장치의 방열 구조 - Google Patents

반도체 장치의 방열 구조 Download PDF

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Publication number
KR20180019221A
KR20180019221A KR1020187001995A KR20187001995A KR20180019221A KR 20180019221 A KR20180019221 A KR 20180019221A KR 1020187001995 A KR1020187001995 A KR 1020187001995A KR 20187001995 A KR20187001995 A KR 20187001995A KR 20180019221 A KR20180019221 A KR 20180019221A
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KR
South Korea
Prior art keywords
semiconductor device
heat
conductive
heat dissipation
dissipation structure
Prior art date
Application number
KR1020187001995A
Other languages
English (en)
Korean (ko)
Inventor
타케오 니시카와
타카요시 타와라기
에이이치 오므라
Original Assignee
오므론 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 오므론 가부시키가이샤 filed Critical 오므론 가부시키가이샤
Publication of KR20180019221A publication Critical patent/KR20180019221A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020187001995A 2016-04-15 2017-01-25 반도체 장치의 방열 구조 KR20180019221A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-081963 2016-04-15
JP2016081963A JP6790432B2 (ja) 2016-04-15 2016-04-15 半導体装置の放熱構造
PCT/JP2017/002440 WO2017179264A1 (ja) 2016-04-15 2017-01-25 半導体装置の放熱構造

Publications (1)

Publication Number Publication Date
KR20180019221A true KR20180019221A (ko) 2018-02-23

Family

ID=60041590

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187001995A KR20180019221A (ko) 2016-04-15 2017-01-25 반도체 장치의 방열 구조

Country Status (5)

Country Link
US (1) US10304754B2 (de)
EP (1) EP3327768B1 (de)
JP (1) JP6790432B2 (de)
KR (1) KR20180019221A (de)
WO (1) WO2017179264A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109637988A (zh) * 2019-01-29 2019-04-16 西安微电子技术研究所 一种低热阻压力可控式散热盒体结构
EP3951863A1 (de) * 2020-08-07 2022-02-09 Siemens Aktiengesellschaft Kontaktsystem mit zuverlässiger isolierung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05183076A (ja) * 1992-01-07 1993-07-23 Fujitsu Ltd 半導体パッケージ
JP3451979B2 (ja) 1999-04-28 2003-09-29 株式会社日立製作所 半導体装置
JP4555057B2 (ja) 2004-11-19 2010-09-29 ホシザキ電機株式会社 冷却貯蔵庫の運転制御装置
JP2007258448A (ja) * 2006-03-23 2007-10-04 Fujitsu Ltd 半導体装置
JP2008300476A (ja) * 2007-05-30 2008-12-11 Sumitomo Electric Ind Ltd パワーモジュール
JP2009283768A (ja) * 2008-05-23 2009-12-03 Yokogawa Electric Corp 冷却シールド装置
JP5647912B2 (ja) * 2011-02-02 2015-01-07 新電元工業株式会社 電子回路装置及びその製造方法
US9085719B2 (en) * 2013-03-18 2015-07-21 International Business Machines Corporation Thermally reversible thermal interface materials with improved moisture resistance
JP6075218B2 (ja) 2013-06-11 2017-02-08 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
EP3327768A1 (de) 2018-05-30
JP2017191903A (ja) 2017-10-19
EP3327768A4 (de) 2019-05-01
US10304754B2 (en) 2019-05-28
JP6790432B2 (ja) 2020-11-25
US20190027421A1 (en) 2019-01-24
WO2017179264A1 (ja) 2017-10-19
EP3327768B1 (de) 2021-01-06

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E701 Decision to grant or registration of patent right