KR20180002689A - 파라미터의 데이터 구조 및 반도체 장치의 제조 장치 - Google Patents
파라미터의 데이터 구조 및 반도체 장치의 제조 장치 Download PDFInfo
- Publication number
- KR20180002689A KR20180002689A KR1020177033047A KR20177033047A KR20180002689A KR 20180002689 A KR20180002689 A KR 20180002689A KR 1020177033047 A KR1020177033047 A KR 1020177033047A KR 20177033047 A KR20177033047 A KR 20177033047A KR 20180002689 A KR20180002689 A KR 20180002689A
- Authority
- KR
- South Korea
- Prior art keywords
- parameters
- data
- parameter
- varieties
- group
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 106
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000012545 processing Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 42
- 230000008859 change Effects 0.000 claims description 38
- 238000003860 storage Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 description 75
- 239000011347 resin Substances 0.000 description 75
- 239000000758 substrate Substances 0.000 description 51
- 238000000465 moulding Methods 0.000 description 48
- 239000000047 product Substances 0.000 description 38
- 230000006870 function Effects 0.000 description 30
- 238000010586 diagram Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 24
- 238000007789 sealing Methods 0.000 description 18
- 238000012546 transfer Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 6
- 238000012805 post-processing Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- General Factory Administration (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015097924A JP2016213396A (ja) | 2015-05-13 | 2015-05-13 | パラメータのデータ構造および半導体装置の製造装置 |
JPJP-P-2015-097924 | 2015-05-13 | ||
PCT/JP2016/050303 WO2016181662A1 (ja) | 2015-05-13 | 2016-01-07 | パラメータのデータ構造および半導体装置の製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20180002689A true KR20180002689A (ko) | 2018-01-08 |
Family
ID=57248005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020177033047A KR20180002689A (ko) | 2015-05-13 | 2016-01-07 | 파라미터의 데이터 구조 및 반도체 장치의 제조 장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2016213396A (ja) |
KR (1) | KR20180002689A (ja) |
CN (1) | CN107533954A (ja) |
TW (1) | TWI625760B (ja) |
WO (1) | WO2016181662A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220018553A (ko) * | 2020-07-01 | 2022-02-15 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 제조 설비의 진단 지원 장치 |
JP7472186B2 (ja) | 2022-03-28 | 2024-04-22 | アンリツ株式会社 | 移動端末試験システム及び移動端末試験方法 |
JP7381811B1 (ja) * | 2023-05-09 | 2023-11-16 | ファナック株式会社 | 加工情報表示装置 |
JP7415094B1 (ja) | 2023-05-09 | 2024-01-16 | ファナック株式会社 | 加工情報表示装置 |
JP7381810B1 (ja) * | 2023-05-09 | 2023-11-16 | ファナック株式会社 | 加工情報表示装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08195407A (ja) * | 1995-01-12 | 1996-07-30 | Toshiba Corp | 半導体装置生産における品質管理システム |
JP2002202806A (ja) * | 2000-12-28 | 2002-07-19 | Mitsubishi Electric Corp | 工程管理システム及び物品の製造方法 |
JP2005190031A (ja) * | 2003-12-25 | 2005-07-14 | Renesas Technology Corp | 半導体デバイス製造におけるボトルネック発生回避方法およびシステム |
JP5696194B2 (ja) * | 2013-10-11 | 2015-04-08 | 株式会社キーエンス | プログラム作成支援装置及び画像処理装置 |
-
2015
- 2015-05-13 JP JP2015097924A patent/JP2016213396A/ja active Pending
-
2016
- 2016-01-07 WO PCT/JP2016/050303 patent/WO2016181662A1/ja active Application Filing
- 2016-01-07 CN CN201680027831.5A patent/CN107533954A/zh active Pending
- 2016-01-07 KR KR1020177033047A patent/KR20180002689A/ko active Search and Examination
- 2016-01-20 TW TW105101657A patent/TWI625760B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN107533954A (zh) | 2018-01-02 |
JP2016213396A (ja) | 2016-12-15 |
TWI625760B (zh) | 2018-06-01 |
WO2016181662A1 (ja) | 2016-11-17 |
TW201709260A (zh) | 2017-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20180002689A (ko) | 파라미터의 데이터 구조 및 반도체 장치의 제조 장치 | |
TWI352302B (en) | Integrated configuration, flow and execution syste | |
US5841660A (en) | Method and apparatus for modeling process control | |
JP6312379B2 (ja) | リソグラフィ装置、リソグラフィ方法、リソグラフィシステム、プログラム、物品の製造方法 | |
CN104708814A (zh) | 立体打印装置 | |
CN111761058A (zh) | 激光沉积制造技术分段式成形方法、系统及终端设备 | |
KR101870009B1 (ko) | 리소그래피 장치, 리소그래피 방법, 리소그래피 시스템, 저장 매체 및 제품 제조 방법 | |
CN114282413A (zh) | 一种印制电路板压合成型过程的仿真方法及系统 | |
JP2019012782A (ja) | ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 | |
JP2017091438A (ja) | 品質データ管理システム | |
US8275478B2 (en) | Method and apparatus for routing wafer pods to allow parallel processing | |
US20080109096A1 (en) | Independent, Self-Contained, Risk Isolated, Sectional CIM Design For Extremely Large Scale Factory Operation | |
US8412368B2 (en) | Method and apparatus for routing dispatching and routing reticles | |
CN104102174B (zh) | 一种半导体设备软件重启后状态恢复的方法 | |
KR100915556B1 (ko) | 사출 금형을 성형하기 위한 기초몰드의 그라파이트 전극 제조방법 | |
CN1855358A (zh) | 计算机可实现的晶片预约分批的方法及系统 | |
CN110625871B (zh) | 树脂成形装置及树脂成形品的制造方法 | |
US20240005128A1 (en) | Prediction method, information processing apparatus, film forming apparatus, article manufacturing method and non-transitory storage medium | |
JPH03218029A (ja) | 半導体素子の組立装置 | |
JPH09180980A (ja) | 半導体装置の製造システム | |
JPWO2010116547A1 (ja) | 装置設計製造支援システム | |
Lichtveld et al. | A new architecture for equipment and clusters for backend processes | |
US10394683B2 (en) | Data transmission method, non-transitory storage medium, data transmission device, lithography apparatus, and method of manufacturing product | |
US20130079912A1 (en) | Methods and systems for semiconductor fabrication with local reticle management | |
TWI615912B (zh) | 自動化晶圓交換系統以及其流程外的晶圓置換方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination |