KR20170108317A - Plating apparatus - Google Patents

Abstract

A plating device is disclosed. According to the present invention, the plating device comprises: a first rotation unit supporting an object to be plated and having a cathode electrode electrically connected to the object to be plated; and a second rotation unit having an anode electrode disposed to face the object to be plated. Rotations of the first rotation unit and the second rotation unit are synchronized.

Description

[0001]

The present invention relates to a plating apparatus.

With the development of electronic devices, there is an increasing demand for high density substrates in which minute circuits are implemented. Accordingly, there is a growing need for a plating apparatus capable of forming a precise and uniform circuit pattern on a large, high-density substrate.

Published Patent Application No. 10-2010-0091774

According to an aspect of the present invention, there is provided a plasma processing apparatus including a first rotating portion supporting a object to be plated and having a cathode electrode electrically connected to a plating object, and a second rotating portion having an anode electrode facing the object to be plated, And the rotation of the second rotation part are synchronized with each other.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a plating apparatus according to an embodiment of the present invention.
2 is a detailed view of a first rotating part of a plating apparatus according to an embodiment of the present invention.
3 is a view illustrating a plating solution receiving wall of a plating apparatus according to an embodiment of the present invention.
4 is a detailed view of a second rotating part of a plating apparatus according to an embodiment of the present invention.
5 is a view illustrating an anode electrode and a shielding portion of a plating apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, an embodiment of a plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings, wherein like or corresponding elements are denoted by the same reference numerals, .

It is also to be understood that the terms first, second, etc. used hereinafter are merely reference numerals for distinguishing between identical or corresponding components, and the same or corresponding components are defined by terms such as first, second, no.

In addition, the term " coupled " is used not only in the case of direct physical contact between the respective constituent elements in the contact relation between the constituent elements, but also means that other constituent elements are interposed between the constituent elements, Use them as a concept to cover each contact.

1 is a view illustrating a plating apparatus according to an embodiment of the present invention. A plating unit according to an embodiment of the present invention includes a first rotating unit 100 having a cathode electrode 120 and a second rotating unit 200 having anode electrodes 210 and 220, The rotation of the first rotating part 100 and the rotation of the second rotating part 200 are synchronized.

The first rotary part 100 supports the object to be plated while rotating and has a cathode electrode 120 connected to the object to be plated so that a cathode can be attached to the object to be plated.

2 is a detailed view of a first rotating part 100 of a plating apparatus according to an embodiment of the present invention. Specifically, FIG. 1 is an enlarged view of the area A in FIG. 1 and 2, a plating apparatus according to the present embodiment is an apparatus for plating a circuit pattern on a substrate 1, in which a substrate 1 is supported by a first rotating portion 100 and is rotated by a first rotating portion 100 . The first rotary part 100 may include a table 110 having a flat support surface for supporting the substrate 1 and a motor 150 for rotating the table 110. When the first rotary part 100 rotates, the plating liquid around the substrate 1 flows out to the outside of the substrate 1 by the rotation. Thus, the plating liquid consumed in the plating flows out of the substrate 1, and the plating liquid which has not yet been used for plating can be quickly supplied to the substrate 1. [

The first rotary part 100 may further include a plating solution receiving wall 160 to receive a predetermined amount of plating solution during plating. The plating liquid receiving wall 160 is installed in the first rotating part 100 so as to surround the object to be plated.

3 is a view illustrating a plating solution receiving wall 160 of a plating apparatus according to an embodiment of the present invention. 3 is a top view of the plating solution receiving wall 160 and the table 110. As shown in FIG. 1 to 3, the plating liquid receiving wall 160 may be formed in the shape of a cylinder that encloses the inside of the first rotary part 100 along the periphery of the table 110. A plating object such as the substrate 1 may be disposed in a space formed inside the plating liquid receiving wall 160. Accordingly, the plating liquid can be filled in the inner space formed by the plating liquid receiving wall 160 so that the plating object can be immersed in the plating liquid at the time of plating.

The plating liquid receiving wall 160 is provided to be spaced from the first rotating part 100 and the gap may be used as a discharge port 165 for disposing the plating liquid. 2 and 3, the plating liquid receiving wall 160 may be installed in the table 110 of the first rotary part 100 by a plurality of fins 162 arranged at predetermined intervals. At this time, a member 165 such as a spacer is inserted between the bottom surface of the plating solution receiving wall 160 and the table 110 so that the plating solution receiving wall 160 can be installed to stand out from the table 110 . Accordingly, when the plating liquid is supplied to the table 110 provided with the plating liquid receiving wall 160, a certain amount of the plating liquid is discharged to the outside. Particularly, since the table 110 of the first rotary part 100 rotates, the plating solution, that is, the consumed plating solution flows toward the lower part of the plating solution receiving wall 160 around the substrate 1 by the centrifugal force, And can be discharged out through an outlet 165 formed between the receiving wall 160 and the table 110. Therefore, if a new plating liquid corresponding to the discharged liquid is supplied, a certain amount of plating liquid can be maintained in the plating liquid receiving wall 160, and the plating liquid can be circulated continuously to keep the quality of the plating liquid constant. On the other hand, the discharged plating liquid can be collected in the plating liquid collection receptacle 242 disposed under the second rotary part 200 and sent to the storage tank.

The first rotary part 100 may further include fixing means 130 for fixing the object to be plated to the support surface of the table 110. The securing means 130 includes a variety of known devices, such as a jig, that secure the object to the table 110.

Referring to Fig. 2, the fixing means 130 of the present embodiment illustrates a method of pressing and fixing the substrate 1 using air pressure. The fixing means 130 of the present embodiment includes a pressing member 132, seal members 134 and 135, and an air discharging portion 136. Here, the pressing member 132 is installed upright on the table 110 and extends to the top of the substrate 1, which is the object to be plated. The seal members 134 and 135 seal the space between the pressing member 132 and the table 110 and a part of the seal member 134 is disposed between the pressing member 132 and the substrate 1. The air discharging portion 136 discharges air in a space between the table 110 and the pressing member 132. When the air is discharged from the space between the table 110 and the pressing member 132 at the air discharging portion 136, a negative pressure is formed. A pressure for pushing the pressing member 132 toward the table 110 is generated by the atmospheric pressure and the seal member 134 disposed between the pressing member 132 and the substrate 1 is pressed from the pressing member 132 The substrate 1 can be pressed and fixed. The air discharge unit 136 may include an air passage formed in the table 110 and an air pump connected to the air passage.

On the other hand, it is possible to stably maintain the connection between the cathode electrode 120 and the object to be plated by using the fixing means 130. Referring to Fig. 2, the energizing member 140 can be coupled to the fixing means 130. Fig. When one side and the other side of the energizing member 140 are brought into contact with the cathode electrode 120 and the substrate 1 and the energizing member 140 is coupled with the fixing means 130, The energizing member 140 can be stably held by the fixing means 130. [ The cathode electrode 120 may be connected to the plating power source 230 through an anode power line 235 provided inside the table 110 and passing through the central axis of the second rotary part 200.

4 is a detailed view of a second rotating part 200 of a plating apparatus according to an embodiment of the present invention.

The second rotary part 200 is configured to rotate with the anode electrodes 210 and 220 facing the object to be plated. The second rotary part 200 is disposed inside the plating liquid receiving wall 160 to immerse the anode electrodes 210 and 220 in the plating liquid during plating. The anode electrodes 210 and 220 may be disposed facing the object to be plated to supply a current necessary for plating. Particularly, the rotation of the second rotary part 200 of this embodiment is synchronized with the rotation of the first rotary part 100. In other words, the rotation of the first rotation part 100 and the rotation of the second rotation part 200 are matched so that the relative positions of the anode electrodes 210 and 220 with respect to the object to be plated are kept constant. Accordingly, even when the second rotating part 200 supporting the object to be plated is rotated, the arrangement of the corresponding anode electrodes 210 and 220 can be kept constant in accordance with the shape and characteristics of the object to be plated.

1, the first rotating part 100 and the second rotating part 200 rotate about the same rotational axis, and the table 110 of the first rotating part 100 is supported by a supporting surface Lt; / RTI > Accordingly, even when the object to be plated fixed to the table 110 is rotated when the first rotary part 100 and the second rotary part 200 rotate in the same direction and speed, the anode electrode 210 And 220, respectively. The second rotation part 200 can be rotated by the motor 250.

5 is a view illustrating the anode electrodes 210 and 220 and the shielding unit 215 of the plating apparatus according to an embodiment of the present invention. 3 and 5, when the object to be plated is a rectangular substrate 1, it is preferable that the anode electrodes 210 and 220 have a rectangular shape corresponding to the rectangular substrate 1 for uniform plating, The positions where the anode electrodes 210 and 220 and the rectangular substrate 1 face each other must be kept constant. If the positions of the rectangular anode electrodes 210 and 220 matched with the rectangular substrate 1 are shifted, there is a fear that uniform plating is not formed. Since the rotation of the first rotating part 100 and the second rotating part 200 of this embodiment is synchronized and the relative positions of the anode electrodes 210 and 220 with respect to the object to be plated are kept constant, Can be made uniform.

The second rotary part 200 may be provided with a plating liquid supply part 240 for supplying a plating liquid as a plating object. Referring to FIG. 1, the plating liquid supply unit 240 is disposed at a position facing the substrate 1, which is an object to be plated, and is capable of discharging the plating liquid toward the substrate 1. The plating liquid stored in the storage tank may be supplied to the plating liquid supply unit 240 via the filter 246 by the pump 245. [

The second rotation unit 200 may further include an anode case 260 that receives the anode electrodes 210 and 220 and the plating liquid supply unit 240. The anode case 260 is open toward the object to be plated, and the porous rectifying plate 270 covering the anode case 260 may be provided. Referring to FIG. 4, the plating liquid discharged from the plating liquid supply unit 240 at the plating time fills the anode case 260, and when the plating liquid is further supplied to the filled anode case 260, the pressure inside the anode case 260 rises . When the pressure rises, the plating liquid is discharged by the porous rectifying plate 270 coupled to the lower portion of the anode case 260. Numerous fine holes are formed in the porous rectifying plate 270, and the plating liquid passing through the fine holes forms a uniform flow. At this time, the plating liquid supply unit 240 can remove bubbles attached to the porous rectifying plate 270 by spraying the plating liquid directly toward the porous rectifying plate 270. The removed bubbles can be discharged to the outside through the gas exhaust pipe 265 formed in the upper part of the anode case 260.

In addition, the porous rectifying plate 270 may have a convex shape in its center portion as compared with the peripheral portion. The convex porous rectifying plate 270 can more uniformly coat the entire object surface of the object to be plated. The reaction gas or bubbles do not stagnate on the lower surface of the porous rectifying plate 270 but can be quickly discharged by inclination of the convex surface. Therefore, the plating apparatus can be designed without requiring a complicated mechanism for preventing adhesion of bubbles.

The second rotation unit 200 may include a plurality of anode electrodes 210 and 220. In particular, at the time of plating, a high electric current can be applied to the anode electrode 210 which faces the center of the object to be plated among the plurality of anode electrodes 210 and 220.

Referring to FIGS. 4 and 5, a plurality of anode electrodes 210 and 220 arranged in a rectangular shape corresponding to the rectangular substrate 1 as a plating object are used in this embodiment. For example, a first anode electrode 210 having a small square corresponding to the central portion is disposed on the rectangular substrate 1, and a second anode electrode 220 corresponding to the peripheral portion of the substrate 1 is disposed on the first anode electrode 210, respectively. At this time, separate positive power lines 232 and 234 are connected to the first anode electrode 210 and the second anode electrode 220, respectively, so that respective currents can be controlled. In general, when the same current is applied, since the outside of the substrate 1 is formed thicker than the central portion, it is preferable to supply a large amount of current to the first anode electrode 210 disposed at the center for uniform plating thickness.

A shielding portion 215 may be provided between the plurality of anode electrodes 210 and 220 to block current flow so that interference between the corresponding regions of the plurality of anode electrodes 210 and 220 is prevented . Referring to FIG. 5, the shield 215 of the present embodiment may include a plurality of shield members 216. For example, a plurality of shielding members 216 continuously arranged along the boundary between the first anode electrode 210 and the second anode electrode 220 can form the shielding portion 215. At this time, the plating liquid can freely pass through the plurality of shield members 216, so that the plating liquid discharged from the plating liquid supply unit 240 is evenly distributed. In addition, each shielding member 216 may have a plane formed obliquely to the line on which the shielding member 216 is arranged. The shielding member 216 having such a sloped surface can form a path through which the plating liquid flows smoothly on the inclined surfaces, and the gap between the shielding members 216 can be narrowed. Thus, the shielding of the current can be efficiently performed while facilitating the passage of the plating liquid.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

100:
110: Table
120: cathode electrode
130: Fixing means
132: pressing member
134, 135:
136:
140:
160: plating solution receiving wall
165: Outlet
200: second rotating part
210 and 220: anode electrode
215:
216: shield member
230: Plating power source
240: Plating solution supply part
260: anode case
270: Porous rectifying plate

Claims (13)

A first rotating part supporting the object to be plated and having a cathode electrode electrically connected to the object to be plated;
And a second rotating part having an anode electrode facing the object to be plated,
And the rotation of the first rotation part and the rotation of the second rotation part are synchronized.
The method according to claim 1,
Wherein the rotation of the first rotation part and the rotation of the second rotation part are synchronized so that the relative position of the anode electrode with respect to the object to be plated is kept constant.
3. The method of claim 2,
Wherein the first rotation part and the second rotation part rotate about the same rotation axis,
Wherein the first rotating portion further comprises a table having a support surface perpendicular to the rotation axis.
The method according to claim 1,
And a plating liquid supply unit that is provided in the second rotation unit and supplies the plating liquid to the object to be plated.
5. The method of claim 4,
The second rotating portion
An anode case accommodating the anode electrode and the plating liquid supply unit and opened toward the object to be plated, and a porous rectifying plate covering the anode case.
5. The method of claim 4,
Further comprising a plating liquid receiving wall which is provided in the first rotating portion so as to surround the object to be plated and forms a discharge port for discharging the plating liquid by using the gap with the first rotating portion.
The method according to claim 1,
A plurality of the anode electrodes are provided,
Wherein a high electric current is applied to the anode electrode facing the central portion of the object to be plated among the plurality of anode electrodes.
8. The method of claim 7,
And a shielding portion for shielding current flow between the plurality of anode electrodes.
9. The method of claim 8,
Wherein the shield comprises a plurality of shielding members arranged in series,
Wherein the plating liquid passes between the plurality of shield members.
10. The method of claim 9,
Wherein the shielding member has a surface inclined obliquely with respect to a line on which the shielding member is arranged.
The method of claim 3,
The first rotating part
And a fixing means for fixing the object to be plated to the support surface of the table.
12. The method of claim 11,
Wherein,
A pressing member spaced apart from the table;
A seal member which seals a space between the table and the pressing member and is disposed between the pressing member and the object to be plated; And
And an air discharging portion for discharging air in a space between the table and the pressing member.
12. The method of claim 11,
A fixing means coupled to the fixing means,
Further comprising a conductive member for connecting the plating object to the cathode electrode.

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