US20120199474A1 - Prevention of substrate edge plating in a fountain plating process - Google Patents
Prevention of substrate edge plating in a fountain plating process Download PDFInfo
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- US20120199474A1 US20120199474A1 US13/440,878 US201213440878A US2012199474A1 US 20120199474 A1 US20120199474 A1 US 20120199474A1 US 201213440878 A US201213440878 A US 201213440878A US 2012199474 A1 US2012199474 A1 US 2012199474A1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
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- Embodiments of the present invention are in the field of electroplating and, in particular, prevention of substrate edge plating in fountain plating processes.
- Electroplating is an electrochemical process in which current flow through an electrolytic solution from a positively charged electrode (anode) to a work-piece deposits a thin layer or plating of metal thereon.
- a conventional fountain-type electroplating apparatus for plating planar work-pieces, such as semiconductor substrates, is shown schematically in FIG. 1 .
- an apparatus 100 generally includes an inner plating tank or cup 102 containing an electrolytic solution (the motion of which is indicated by the arrows), an electrolyte inlet 104 and an electroplating power supply 108 .
- Electroplating power supply 108 is electrically coupled to an anode 110 in plating tank 102 and, via conductive supports 112 , to a work-piece or substrate 114 supported above plating tank 102 .
- Apparatus 100 may be positioned above an overflow tray for catching effluent from plating tank 102 , and further above an electrolyte recirculation system or pump (not shown).
- a positive charge is applied to anode 110 and a negative charge is applied to substrate 114 , which serves as the cathode, through conducting supports 112 .
- the source of the material to be deposited may be a consumable anode 110 , or a non-consumable anode with a source attached thereto.
- the metal ions come from an external source, such as an anode bag attached to the anode. In fountain plating, if a non-consumable anode is used, the anode bag may rest on the non-consumable anode.
- While the above-described fountain-type electroplating apparatus provides a relatively rapid and economical approach to providing substantially uniform plating on a surface of semiconductor substrate, it does have a number of disadvantages or drawbacks.
- One potential drawback associated with conventional electroplating apparatuses and methods is the generally undesirable plating that occurs on a radial side or edge 116 of substrate 114 and which can, under certain circumstances, even extend to a top surface 118 thereof.
- Past attempts to eliminate this undesirable edge coat have focused on the use of a thick or extensive edge protection coating formed on the edge or top surface of the substrate prior to electroplating.
- These solutions have also not been wholly satisfactory for a number of reasons.
- the additional processing operations needed to deposit, pattern, develop and then strip the edge coating material, such as a photo-resist edge coating material, after electroplating can add significantly to the fabrication cost or time.
- Embodiments of the present invention include prevention of substrate edge plating in fountain plating processes.
- a plating apparatus is provided along with a method for plating a surface of a semiconductor substrate that substantially eliminates the need for a protective edge coating.
- the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup.
- the inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.
- a plurality of supports position the substrate at a predetermined location proximal to the outlet of the inner cup such that the plating solution flowing from the outlet into the plenum passes over and plates the surface thereof.
- An air-knife including one or more gas outlets directs a plurality of streams of gas past the edge of the substrate and towards the plenum to substantially prevent any plating occurring on a peripheral edge or opposing surface of the substrate.
- the outlets and the plurality of streams of gas are configured to provide an adjustable and substantially uniform curtain of gas around the entire periphery of the substrate.
- the inner cup further includes an outer surface near the outlet, facing the outer cup that is shaped to substantially reduce accumulation of plating solution near the edge of the substrate.
- the outer surface near the outlet of the inner cup has a beveled edge sloping towards the outlet to form a larger cavity or opening in the plenum.
- the outer surface near the outlet of the inner cup has an undercut rim to control flow of plating solution into the plenum through surface tension.
- the apparatus may further include a plurality of ports or outlets located and oriented to direct streams of gas towards the plenum, redirecting plating solution away from the edge of the substrate, thereby further reducing plating on the edge or a top surface of the substrate.
- the ports or outlets are preferably configured to provide an adjustable and substantially uniform flow of gas towards the plenum around the entire periphery of the substrate.
- the invention is directed to a Bernoulli gripper for use with a plating apparatus for plating a surface of a semiconductor substrate that substantially eliminates the need for a protective edge coating.
- FIG. 1 illustrates a schematic block diagram in cross-sectional side view of a conventional fountain plating apparatus for plating a surface of a substrate.
- FIG. 2A illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention.
- FIG. 2B illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention.
- FIG. 2C illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention.
- FIG. 3 illustrates a schematic block diagram in cross-sectional side view of a portion of a fountain plating apparatus having an undercut rim on an inner cup and a two portion outer cup to control chemistry at a substrate edge, in accordance with an embodiment of the present invention.
- FIG. 4 illustrates a schematic block diagram in cross-sectional side view of a portion of a fountain plating apparatus having a Bernoulli gripper for holding a substrate undergoing plating, in accordance with an embodiment of the present invention.
- the apparatus may include a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup.
- the inner cup includes an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.
- a plurality of supports for supporting the substrate at a predetermined position proximal to the outlet of the inner cup such that the plating solution flowing from the outlet into the plenum passes over and uniformly plates the surface of the substrate.
- an air-knife is included to provide a plurality of streams of gas directed to flow past a peripheral edge of the substrate positioned on the plurality of supports and towards the plenum to substantially prevent any plating occurring on the edge and top surface of the substrate.
- a fountain-type electroplating apparatus and method of using the same that provides substantially uniform plating across a surface of a substrate while substantially eliminating the need for edge coating. It is further desirable that the apparatus and method does not require additional processing operations that may increase fabrication cost or time.
- the present invention may provide a solution to these and other problems, and may offer further advantages over conventional electroplating apparatuses and methods.
- a substrate is a thin, planar slice or wafer of material on which microelectronic or micromechanical devices can be formed. It is to be understood that the substrate may include any known semiconductor, dielectric or conductive material, and can have any regular, symmetrical or irregular geometry including, circular, notched, polygonal, square, semi-square or rounded square. In one embodiment, the substrate is a semi-square or rounded square semiconductor substrate, such as is used in the fabrication of photovoltaic solar cells.
- FIGS. 2A , 2 B and 2 C A simplified, schematic diagram covering an embodiment of the fountain-type plating apparatus of the present invention is shown in FIGS. 2A , 2 B and 2 C, in accordance with an embodiment of the present invention.
- the apparatus generally includes a double wall plating vessel 200 including an inner cup 202 and an outer cup 204 peripherally surrounding and spaced apart from inner cup 202 .
- Inner cup 202 has an inlet 205 for receiving a plating solution from a reservoir or source, such as a pump 207 , and an outlet 206 from which the plating solution overflows into a plenum 208 defined between inner and outer cups 202 and 204 .
- double wall plating vessel 200 is positioned in or above an overflow tank or tray 209 for catching effluent from plenum 208 .
- overflow tank or tray 209 for catching effluent from plenum 208 .
- the overflow is typically much larger than the double wall plating vessel, and thus a plating system or tool may include multiple plating vessels 200 positioned within a single tray.
- the plating vessel 200 further includes a plurality of supports 210 (only two of which are shown) to support a substrate 212 at a predetermined position near outlet 206 of inner cup 204 such that the plating solution flowing from outlet 206 into plenum 208 passes over and uniformly plates a lower surface 214 of substrate 212 .
- Supports 210 can be attached to and extend from inner cup 202 or outer cup 204 (as shown), or can be attached to and extend from mounts (not shown) outside both inner and outer cups 202 and 204 . In an embodiment, attachment to external mounts or to outer cup 204 aids to reduce plating on supports 210 .
- an air-knife 299 A (as shown directing air approximately vertically downward in FIG. 2A ) or 299 B (as shown directing air outward in FIG. 2B ) or 299 C (as shown providing clearance for substrate 212 ) including one or more outlets directs a plurality of streams of fluid, such as a stream of gas 216 past a peripheral edge 218 of substrate 212 towards plenum 208 at a flow rate selected to substantially prevent any plating occurring on the edge or a top surface 220 of substrate 212 .
- Suitable fluids include any liquid or gas, such as air or nitrogen (N 2 ), that will not contaminate substrate 212 being processed or interfere with the plating process.
- the outlets and the plurality of streams of gas 216 in air-knife 299 A or 299 B or 299 C are configured to provide an adjustable and substantially uniform curtain of gas around the entire periphery of substrate 212 .
- the plating apparatus further includes a structure or mechanism for centering substrate 212 relative to air-knife 299 A or 299 B or 299 C.
- outer cup 204 or 304 peripherally surrounds and serves as a centering mechanism for substrate 212 or 312 .
- air-knife 299 A or 299 B or 299 C further includes a plurality of point jets, in addition to those outlets configured to provide a uniform curtain around the periphery of substrate 212 , to change the gas flow in a vicinity of supports 210 .
- Such an arrangement may accommodate any detrimental effects of supports 210 on gas flow from air-knife 299 A or 299 B or 299 C.
- the plating apparatus is an electroplating apparatus in which inner cup 202 is electrically insulated or made of a non-conducting material, and further includes an electrical power supply 222 having a first, positive terminal electrically coupled to an electrode or anode 224 positioned with the plating solution in the inner cup.
- a second terminal is electrically coupled to substrate 212 , which serves as a cathode of the electroplating cell.
- the second terminal is electrically coupled to substrate 212 through one or more electrically conducting supports 210 .
- supports 210 are not electrically conducting and the electroplating apparatus includes a plurality of separate electrical contacts to contact substrate 212 .
- electrical contact to substrate 212 is made through a chuck, platen or gripper to which the edge or a top surface 220 of substrate 212 is held.
- the plating solution is an electrolytic solution that facilitates the transfer of metal ions to the lower surface 214 of substrate 212 .
- the source of the metal ions which may include, but is not limited to, tin, nickel, titanium, tantalum, aluminum, chromium, gold, silver, copper, or alloys thereof, may be from a consumable anode, or a non-consumable anode with a source attached thereto.
- a non-consumable anode is used and the metal ions come from an external source, such as an anode bag 225 attached to or resting on anode 224 .
- an outer surface 326 of an inner cup 302 includes an undercut rim near an outlet 306 to control flow of plating solution into a plenum 308 through surface tension.
- both a lip above the undercut outer surface 326 and the surface itself form a continuous smooth surface, as depicted in FIG. 3 .
- the apparatus further includes a plurality of ports located and oriented to direct streams of fluid, such as a stream of gas 328 , towards plenum 308 .
- the streams of gas redirect plating solution away from the edge 318 of substrate 312 , thereby further reducing plating on the edge 318 and top surface 320 of substrate 312 .
- an air-knife (represented by flow 316 ) directs suitable fluids, such as but not limited to a liquid or gas (such as air or N 2 ), which will not contaminate substrate 312 being processed or interfere with the plating process.
- the stream of fluid may include the same electrolytic solution as introduced into inner cup 302 .
- outer cup 304 includes two or more portions, including a lower outer cup 304 a and an upper outer cup 304 b , and the mating surfaces between the lower and an upper outer cup portions are configured to define the plurality of ports 330 located and oriented to direct streams of gas 328 towards plenum 308 .
- the apparatus further includes a Bernoulli gripper, which uses the lower pressure created by a fluid, such as air or gas, moving across a surface of the substrate to hold it against a mounting surface of the gripper in a predetermined position near the outlet or surface of a plating vessel.
- a fluid such as air or gas
- the mounting surface of the Bernoulli gripper is further designed to provide an adjustable and substantially uniform flow of gas around the entire periphery of the substrate in order to substantially prevent any plating occurring on the edge or on a top surface of the substrate.
- a Bernoulli gripper 440 generally includes a planar surface 442 to which an upper surface 420 of a substrate 412 is held.
- the one or more gas outlets 444 in the planar surface 442 are arranged to direct a gas flow onto of the upper surface 420 of substrate 412 causing the gas to flow outwardly to a peripheral edge 418 of substrate 412 .
- this arrangement creates a pressure above substrate 412 that is less than the pressure below substrate 412 .
- the pressure difference is applied to hold substrate 412 in a steady position.
- the planar surface 442 is a recess in Bernoulli gripper 440 including interior side surfaces 446 that serve to center substrate 412 .
- the recess is used to redirect gas flowing from between substrate 412 and the planar surface downward across the periphery or peripheral edge 418 of substrate 412 . In an embodiment, this arrangement substantially prevents any plating occurring on the edge 418 or top surface 420 of substrate 412 .
- Bernoulli gripper 440 can be used with a double wall plating vessel having an inner cup and an outer cup, as described above with respect to FIGS. 2A , 2 B, 2 C and 3 , or with a conventional, single wall or cup fountain plating apparatus as shown in FIG. 4 .
- a conventional, single wall or cup fountain plating apparatus as shown in FIG. 4 .
- Bernoulli gripper 440 can further include a plurality of additional gas ports or outlets 448 , located near the peripheral edge 418 of substrate 412 , and positioned and oriented to provide the desired flow of gas across the periphery or peripheral edge.
- Bernoulli gripper 440 can hold substrate 412 substantially without physically contacting substrate 412 .
- the apparatus can further include flexible electrical conductors (not shown) adapted to electrically couple to a substrate held on Bernoulli gripper 440 when substrate 412 is held in the predetermined position proximal to inner cup 402 or plating vessel 400 .
- Such flexible electrical conductors can be mounted to extend upward from an inner or outer cup of the plating apparatus, or can descend from Bernoulli gripper 440 .
- the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup.
- the inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.
- a plurality of supports support the substrate at a predetermined position proximal to the outlet of the inner cup so that the plating solution flowing from the outlet into the plenum passes over and plates the surface thereof.
- an air-knife directs streams of gas past the edge of the substrate and towards the plenum to substantially prevent any plating occurring on a peripheral edge or opposing surface of the substrate.
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Abstract
A plating apparatus and method for plating a surface of a substrate are described. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups.
Description
- This application is a divisional of U.S. patent application Ser. No. 12/323,157 filed Nov. 25, 2008, which claims the benefit of U.S. Provisional Application No. 61/004,323, filed Nov. 26, 2007, the entire contents of which are hereby incorporated by reference herein.
- Embodiments of the present invention are in the field of electroplating and, in particular, prevention of substrate edge plating in fountain plating processes.
- Electroplating is an electrochemical process in which current flow through an electrolytic solution from a positively charged electrode (anode) to a work-piece deposits a thin layer or plating of metal thereon. A conventional fountain-type electroplating apparatus for plating planar work-pieces, such as semiconductor substrates, is shown schematically in
FIG. 1 . Referring toFIG. 1 , anapparatus 100 generally includes an inner plating tank orcup 102 containing an electrolytic solution (the motion of which is indicated by the arrows), anelectrolyte inlet 104 and anelectroplating power supply 108.Electroplating power supply 108 is electrically coupled to ananode 110 inplating tank 102 and, viaconductive supports 112, to a work-piece orsubstrate 114 supported aboveplating tank 102.Apparatus 100 may be positioned above an overflow tray for catching effluent fromplating tank 102, and further above an electrolyte recirculation system or pump (not shown). - In operation, a positive charge is applied to
anode 110 and a negative charge is applied tosubstrate 114, which serves as the cathode, through conductingsupports 112. As the electrolytic solution is circulated pastanode 110 towardsubstrate 114 by a recirculation pump, metal ions dissolved in the solution plate out onsubstrate 114. The source of the material to be deposited (metal ions) may be aconsumable anode 110, or a non-consumable anode with a source attached thereto. Generally, when a non-consumable anode is used the metal ions come from an external source, such as an anode bag attached to the anode. In fountain plating, if a non-consumable anode is used, the anode bag may rest on the non-consumable anode. - While the above-described fountain-type electroplating apparatus provides a relatively rapid and economical approach to providing substantially uniform plating on a surface of semiconductor substrate, it does have a number of disadvantages or drawbacks. One potential drawback associated with conventional electroplating apparatuses and methods is the generally undesirable plating that occurs on a radial side or
edge 116 ofsubstrate 114 and which can, under certain circumstances, even extend to atop surface 118 thereof. Past attempts to eliminate this undesirable edge coat have focused on the use of a thick or extensive edge protection coating formed on the edge or top surface of the substrate prior to electroplating. These solutions have also not been wholly satisfactory for a number of reasons. In particular, the additional processing operations needed to deposit, pattern, develop and then strip the edge coating material, such as a photo-resist edge coating material, after electroplating can add significantly to the fabrication cost or time. - Embodiments of the present invention include prevention of substrate edge plating in fountain plating processes. In an embodiment, a plating apparatus is provided along with a method for plating a surface of a semiconductor substrate that substantially eliminates the need for a protective edge coating. Generally, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups. A plurality of supports position the substrate at a predetermined location proximal to the outlet of the inner cup such that the plating solution flowing from the outlet into the plenum passes over and plates the surface thereof. An air-knife including one or more gas outlets directs a plurality of streams of gas past the edge of the substrate and towards the plenum to substantially prevent any plating occurring on a peripheral edge or opposing surface of the substrate. Preferably, the outlets and the plurality of streams of gas are configured to provide an adjustable and substantially uniform curtain of gas around the entire periphery of the substrate. In a specific embodiment, the inner cup further includes an outer surface near the outlet, facing the outer cup that is shaped to substantially reduce accumulation of plating solution near the edge of the substrate. In one embodiment, the outer surface near the outlet of the inner cup has a beveled edge sloping towards the outlet to form a larger cavity or opening in the plenum. In another embodiment, the outer surface near the outlet of the inner cup has an undercut rim to control flow of plating solution into the plenum through surface tension.
- Optionally, the apparatus may further include a plurality of ports or outlets located and oriented to direct streams of gas towards the plenum, redirecting plating solution away from the edge of the substrate, thereby further reducing plating on the edge or a top surface of the substrate. As with the air-knife, the ports or outlets are preferably configured to provide an adjustable and substantially uniform flow of gas towards the plenum around the entire periphery of the substrate. In another aspect, the invention is directed to a Bernoulli gripper for use with a plating apparatus for plating a surface of a semiconductor substrate that substantially eliminates the need for a protective edge coating.
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FIG. 1 illustrates a schematic block diagram in cross-sectional side view of a conventional fountain plating apparatus for plating a surface of a substrate. -
FIG. 2A illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention. -
FIG. 2B illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention. -
FIG. 2C illustrates a schematic block diagram in cross-sectional side view of inner and outer cups of a fountain plating apparatus for plating a surface of a substrate, in accordance with an embodiment of the present invention. -
FIG. 3 illustrates a schematic block diagram in cross-sectional side view of a portion of a fountain plating apparatus having an undercut rim on an inner cup and a two portion outer cup to control chemistry at a substrate edge, in accordance with an embodiment of the present invention. -
FIG. 4 illustrates a schematic block diagram in cross-sectional side view of a portion of a fountain plating apparatus having a Bernoulli gripper for holding a substrate undergoing plating, in accordance with an embodiment of the present invention. - An apparatus and method for prevention of substrate edge plating in fountain plating processes are described herein. In the following description, numerous specific details are set forth, such as process tool configurations, in order to provide a thorough understanding of the present invention. It will be apparent to one skilled in the art that embodiments of the present invention may be practiced without these specific details. In other instances, well-known fabrication regimes, such as plating chemical regimes, are not described in detail in order to not unnecessarily obscure embodiments of the present invention. Furthermore, it is to be understood that the various embodiments shown in the Figures are illustrative representations and are not necessarily drawn to scale.
- Disclosed herein is an apparatus for plating the surface of a substrate. The apparatus may include a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. In an embodiment, the inner cup includes an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups. Also included is a plurality of supports for supporting the substrate at a predetermined position proximal to the outlet of the inner cup such that the plating solution flowing from the outlet into the plenum passes over and uniformly plates the surface of the substrate. In one embodiment, an air-knife is included to provide a plurality of streams of gas directed to flow past a peripheral edge of the substrate positioned on the plurality of supports and towards the plenum to substantially prevent any plating occurring on the edge and top surface of the substrate.
- In accordance with an embodiment of the present invention, there is a need for a fountain-type electroplating apparatus and method of using the same that provides substantially uniform plating across a surface of a substrate while substantially eliminating the need for edge coating. It is further desirable that the apparatus and method does not require additional processing operations that may increase fabrication cost or time. The present invention may provide a solution to these and other problems, and may offer further advantages over conventional electroplating apparatuses and methods.
- Electroplating apparatuses and methods for using the same to plate a surface of a substrate are described in association with
FIGS. 2-4 , in accordance with embodiments of the present invention. For purposes of clarity, many of the details of electroplating in general, and electroplating of substrates in particular, that are widely known have been omitted from the following description. In accordance with an embodiment of the present invention, a substrate is a thin, planar slice or wafer of material on which microelectronic or micromechanical devices can be formed. It is to be understood that the substrate may include any known semiconductor, dielectric or conductive material, and can have any regular, symmetrical or irregular geometry including, circular, notched, polygonal, square, semi-square or rounded square. In one embodiment, the substrate is a semi-square or rounded square semiconductor substrate, such as is used in the fabrication of photovoltaic solar cells. - A simplified, schematic diagram covering an embodiment of the fountain-type plating apparatus of the present invention is shown in
FIGS. 2A , 2B and 2C, in accordance with an embodiment of the present invention. Referring toFIGS. 2A , 2B and 2C, the apparatus generally includes a doublewall plating vessel 200 including aninner cup 202 and anouter cup 204 peripherally surrounding and spaced apart frominner cup 202.Inner cup 202 has aninlet 205 for receiving a plating solution from a reservoir or source, such as apump 207, and anoutlet 206 from which the plating solution overflows into aplenum 208 defined between inner andouter cups wall plating vessel 200 is positioned in or above an overflow tank ortray 209 for catching effluent fromplenum 208. Although shown as asingle plating vessel 200 positioned within asingle tray 209, it will be appreciated that the overflow is typically much larger than the double wall plating vessel, and thus a plating system or tool may includemultiple plating vessels 200 positioned within a single tray. - Generally, the
plating vessel 200 further includes a plurality of supports 210 (only two of which are shown) to support asubstrate 212 at a predetermined position nearoutlet 206 ofinner cup 204 such that the plating solution flowing fromoutlet 206 intoplenum 208 passes over and uniformly plates alower surface 214 ofsubstrate 212.Supports 210 can be attached to and extend frominner cup 202 or outer cup 204 (as shown), or can be attached to and extend from mounts (not shown) outside both inner andouter cups outer cup 204 aids to reduce plating on supports 210. - In one aspect of the invention, an air-
knife 299A (as shown directing air approximately vertically downward inFIG. 2A ) or 299B (as shown directing air outward inFIG. 2B ) or 299C (as shown providing clearance for substrate 212) including one or more outlets directs a plurality of streams of fluid, such as a stream ofgas 216 past aperipheral edge 218 ofsubstrate 212 towardsplenum 208 at a flow rate selected to substantially prevent any plating occurring on the edge or atop surface 220 ofsubstrate 212. Suitable fluids include any liquid or gas, such as air or nitrogen (N2), that will not contaminatesubstrate 212 being processed or interfere with the plating process. - In accordance with an embodiment of the present invention, the outlets and the plurality of streams of
gas 216 in air-knife substrate 212. In one embodiment, the plating apparatus further includes a structure or mechanism for centeringsubstrate 212 relative to air-knife FIGS. 2A , 2B, 2C and 3,outer cup 204 or 304 peripherally surrounds and serves as a centering mechanism forsubstrate non-centered substrate 212 would impair the effectiveness of air-knife knife substrate 212, to change the gas flow in a vicinity ofsupports 210. Such an arrangement may accommodate any detrimental effects ofsupports 210 on gas flow from air-knife - In one embodiment, as is depicted in
FIGS. 2A , 2B and 2C, the plating apparatus is an electroplating apparatus in whichinner cup 202 is electrically insulated or made of a non-conducting material, and further includes anelectrical power supply 222 having a first, positive terminal electrically coupled to an electrode oranode 224 positioned with the plating solution in the inner cup. A second terminal is electrically coupled tosubstrate 212, which serves as a cathode of the electroplating cell. In certain embodiments, such as the embodiment depicted, the second terminal is electrically coupled tosubstrate 212 through one or more electrically conducting supports 210. In an alternative embodiment, supports 210 are not electrically conducting and the electroplating apparatus includes a plurality of separate electrical contacts to contactsubstrate 212. For example, in a specific embodiment, electrical contact tosubstrate 212 is made through a chuck, platen or gripper to which the edge or atop surface 220 ofsubstrate 212 is held. - In embodiments for which the plating apparatus is an electroplating apparatus, the plating solution is an electrolytic solution that facilitates the transfer of metal ions to the
lower surface 214 ofsubstrate 212. The source of the metal ions, which may include, but is not limited to, tin, nickel, titanium, tantalum, aluminum, chromium, gold, silver, copper, or alloys thereof, may be from a consumable anode, or a non-consumable anode with a source attached thereto. For example, in an embodiment, a non-consumable anode is used and the metal ions come from an external source, such as ananode bag 225 attached to or resting onanode 224. - In another aspect of the invention,
inner cup 202 further includes anouter surface 226 or portion of the outer surface nearoutlet 206 facingouter cup 204 that is shaped to substantially reduce accumulation of plating solution near theedge 218 ofsubstrate 212. This arrangement may further reduce plating on theedge 218 or thetop surface 220 ofsubstrate 212. In one embodiment, as shown inFIGS. 2A , 2B and 2C, thisouter surface 226 includes a beveled edge sloping towardsoutlet 206 to create a larger cavity or opening inplenum 208. - In another embodiment, shown in
FIG. 3 , anouter surface 326 of aninner cup 302 includes an undercut rim near anoutlet 306 to control flow of plating solution into aplenum 308 through surface tension. In one embodiment, in order to enhance the effect of surface tension, both a lip above the undercutouter surface 326 and the surface itself form a continuous smooth surface, as depicted inFIG. 3 . - Referring again to
FIG. 3 , in yet another aspect of the invention, the apparatus further includes a plurality of ports located and oriented to direct streams of fluid, such as a stream ofgas 328, towardsplenum 308. In an embodiment, the streams of gas redirect plating solution away from theedge 318 ofsubstrate 312, thereby further reducing plating on theedge 318 andtop surface 320 ofsubstrate 312. In an embodiment, an air-knife (represented by flow 316) directs suitable fluids, such as but not limited to a liquid or gas (such as air or N2), which will not contaminatesubstrate 312 being processed or interfere with the plating process. In one version of this embodiment, the stream of fluid may include the same electrolytic solution as introduced intoinner cup 302. In certain embodiments, as shown, outer cup 304 includes two or more portions, including a lower outer cup 304 a and an upper outer cup 304 b, and the mating surfaces between the lower and an upper outer cup portions are configured to define the plurality ofports 330 located and oriented to direct streams ofgas 328 towardsplenum 308. - In another aspect of the invention, the apparatus further includes a Bernoulli gripper, which uses the lower pressure created by a fluid, such as air or gas, moving across a surface of the substrate to hold it against a mounting surface of the gripper in a predetermined position near the outlet or surface of a plating vessel. In the present invention, the mounting surface of the Bernoulli gripper is further designed to provide an adjustable and substantially uniform flow of gas around the entire periphery of the substrate in order to substantially prevent any plating occurring on the edge or on a top surface of the substrate.
- One such embodiment of a Bernoulli gripper is shown schematically in
FIG. 4 , in accordance with an embodiment of the present invention. Referring toFIG. 4 , aBernoulli gripper 440 generally includes aplanar surface 442 to which anupper surface 420 of asubstrate 412 is held. The one ormore gas outlets 444 in theplanar surface 442 are arranged to direct a gas flow onto of theupper surface 420 ofsubstrate 412 causing the gas to flow outwardly to aperipheral edge 418 ofsubstrate 412. In an embodiment, this arrangement creates a pressure abovesubstrate 412 that is less than the pressure belowsubstrate 412. In one embodiment, the pressure difference is applied to holdsubstrate 412 in a steady position. In an embodiment, as shown, theplanar surface 442 is a recess inBernoulli gripper 440 including interior side surfaces 446 that serve to centersubstrate 412. In a specific embodiment, the recess is used to redirect gas flowing from betweensubstrate 412 and the planar surface downward across the periphery orperipheral edge 418 ofsubstrate 412. In an embodiment, this arrangement substantially prevents any plating occurring on theedge 418 ortop surface 420 ofsubstrate 412. - It will be appreciated that
Bernoulli gripper 440 can be used with a double wall plating vessel having an inner cup and an outer cup, as described above with respect toFIGS. 2A , 2B, 2C and 3, or with a conventional, single wall or cup fountain plating apparatus as shown inFIG. 4 . By maintaining a sufficient and uniform flow of gas across the periphery orperipheral edge 418 ofsubstrate 412, plating occurring on theedge 418 ortop surface 420 ofsubstrate 412 is substantially eliminated. Optionally,Bernoulli gripper 440 can further include a plurality of additional gas ports oroutlets 448, located near theperipheral edge 418 ofsubstrate 412, and positioned and oriented to provide the desired flow of gas across the periphery or peripheral edge. - It will further be appreciated that
Bernoulli gripper 440 can holdsubstrate 412 substantially without physically contactingsubstrate 412. Thus, in embodiments in which the plating apparatus is an electroplating apparatus or in which it is desirable to electrically couple tosubstrate 412, the apparatus can further include flexible electrical conductors (not shown) adapted to electrically couple to a substrate held onBernoulli gripper 440 whensubstrate 412 is held in the predetermined position proximal toinner cup 402 or plating vessel 400. Such flexible electrical conductors can be mounted to extend upward from an inner or outer cup of the plating apparatus, or can descend fromBernoulli gripper 440. - Thus, a plating apparatus and method for plating a surface of a substrate have been disclosed. In accordance with an embodiment of the present invention, the apparatus includes a double wall plating vessel having an inner cup and an outer cup peripherally surrounding and spaced apart from the inner cup. The inner cup has an inlet for receiving a plating solution and an outlet from which the plating solution overflows into a plenum defined between the inner and outer cups. A plurality of supports support the substrate at a predetermined position proximal to the outlet of the inner cup so that the plating solution flowing from the outlet into the plenum passes over and plates the surface thereof. In one embodiment, an air-knife directs streams of gas past the edge of the substrate and towards the plenum to substantially prevent any plating occurring on a peripheral edge or opposing surface of the substrate.
Claims (20)
1. A plating apparatus for plating a surface of a substrate, the plating apparatus comprising:
a plating vessel including a cup having an inlet for receiving a plating solution and an outlet from which the plating solution overflows the cup; and
a Bernoulli gripper having a planar surface with one or more gas outlets therein, the gas outlets arranged to direct a gas to flow onto an upper surface of the substrate opposite the surface to be plated, to cause the gas to flow outwardly to a peripheral edge of the substrate creating a pressure above the substrate that is less than the pressure below the substrate to hold the substrate to the planar surface, and to flow outward around substantially the entire periphery of the substrate to substantially prevent any plating occurring on the upper surface or a peripheral edge of the substrate when the substrate is held in a predetermined position proximal to the outlet of the cup so that the plating solution flowing from the outlet passes over and plates the surface of the substrate.
2. An apparatus according to claim 1 , wherein the planar surface further comprises a recess in which the substrate is held, and wherein the recess comprises interior side surfaces that peripherally surround and serve to center the substrate on the planar surface.
3. An apparatus according to claim 1 , wherein the Bernoulli gripper further comprises a plurality of additional gas outlets located near the peripheral edge of the substrate to provide a flow of gas across the peripheral edge to substantially prevent any plating occurring thereon.
4. An apparatus according to claim 1 , wherein the plating vessel is a double wall plating vessel, and the cup is an inner cup of the double wall plating vessel.
5. An apparatus according to claim 4 , further comprising:
a plenum defined between the inner cup and an outer cup of the double wall plating vessel, wherein the plating solution overflows from the outlet of the inner cup and into the plenum.
6. An apparatus according to claim 5 , further comprising:
a plurality of outlets located and oriented to direct streams of gas into the plenum, redirecting plating solution away from the edge of the substrate.
7. An apparatus according to claim 4 , wherein the apparatus is an electroplating apparatus and further comprises an electrical power supply having a first terminal electrically coupled to an electrode positioned within the plating solution in the inner cup and a second terminal electrically coupled to the substrate.
8. An apparatus according to claim 1 , wherein the plating vessel is a single wall plating vessel.
9. An apparatus according to claim 1 , wherein the Bernoulli gripper is adaptable to hold the substrate without physically contacting the substrate.
10. A plating apparatus for plating a surface of a substrate, the plating apparatus comprising:
a double wall plating vessel including an inner cup, an outer cup and a plenum defined between the inner cup and the outer cup, the inner cup having an inlet for receiving a plating solution and an outlet from which the plating solution overflows the inner cup into the plenum;
a Bernoulli gripper having a planar surface with one or more gas outlets therein, the gas outlets arranged to direct a gas to flow onto an upper surface of the substrate opposite the surface to be plated, to cause the gas to flow outwardly to a peripheral edge of the substrate creating a pressure above the substrate that is less than the pressure below the substrate to hold the substrate to the planar surface, and to flow outward around substantially the entire periphery of the substrate to substantially prevent any plating occurring on the upper surface or a peripheral edge of the substrate when the substrate is held in a predetermined position proximal to the outlet of the inner cup so that the plating solution flowing from the outlet passes over and plates the surface of the substrate; and
a plurality of outlets located and oriented to direct streams of gas into the plenum, redirecting plating solution away from the edge of the substrate.
11. An apparatus according to claim 10 , wherein the planar surface further comprises a recess in which the substrate is held, and wherein the recess comprises interior side surfaces that peripherally surround and serve to center the substrate on the planar surface.
12. An apparatus according to claim 10 , wherein the Bernoulli gripper further comprises a plurality of additional gas outlets located near the peripheral edge of the substrate to provide a flow of gas across the peripheral edge to substantially prevent any plating occurring thereon.
13. An apparatus according to claim 10 , wherein the apparatus is an electroplating apparatus and further comprises an electrical power supply having a first terminal electrically coupled to an electrode positioned within the plating solution in the inner cup and a second terminal electrically coupled to the substrate.
14. An apparatus according to claim 10 , wherein the Bernoulli gripper is adaptable to hold the substrate without physically contacting the substrate.
15. A plating apparatus for plating a surface of a substrate, the plating apparatus comprising:
a double wall plating vessel including an inner cup, an outer cup and a plenum defined between the inner cup and the outer cup, the inner cup having an inlet for receiving a plating solution and an outlet from which the plating solution overflows the inner cup into the plenum;
a Bernoulli gripper having a planar surface with one or more gas outlets therein, the gas outlets arranged to direct a gas to flow onto an upper surface of the substrate opposite the surface to be plated when the substrate is held in a predetermined position proximal to the outlet of the inner cup; and
a plurality of outlets located and oriented to direct streams of gas into the plenum.
16. An apparatus according to claim 15 , wherein the planar surface further comprises a recess in which the substrate is held, and wherein the recess comprises interior side surfaces that peripherally surround and serve to center the substrate on the planar surface.
17. An apparatus according to claim 15 , wherein the Bernoulli gripper further comprises a plurality of additional gas ports located near the peripheral edge of the substrate.
18. An apparatus according to claim 15 , wherein the apparatus is an electroplating apparatus and further comprises an electrical power supply having a first terminal electrically coupled to an electrode positioned within the plating solution in the inner cup and a second terminal electrically coupled to the substrate.
19. An apparatus according to claim 15 , wherein the Bernoulli gripper is adaptable to hold the substrate without physically contacting the substrate.
20. An apparatus according to claim 15 , further comprising:
flexible electrical conductors adapted to electrically couple to the substrate when the substrate is held in the predetermined position.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/440,878 US20120199474A1 (en) | 2007-11-26 | 2012-04-05 | Prevention of substrate edge plating in a fountain plating process |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US432307P | 2007-11-26 | 2007-11-26 | |
US12/323,157 US8172989B2 (en) | 2007-11-26 | 2008-11-25 | Prevention of substrate edge plating in a fountain plating process |
US13/440,878 US20120199474A1 (en) | 2007-11-26 | 2012-04-05 | Prevention of substrate edge plating in a fountain plating process |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/323,157 Division US8172989B2 (en) | 2007-11-26 | 2008-11-25 | Prevention of substrate edge plating in a fountain plating process |
Publications (1)
Publication Number | Publication Date |
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US20120199474A1 true US20120199474A1 (en) | 2012-08-09 |
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Family Applications (2)
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US12/323,157 Expired - Fee Related US8172989B2 (en) | 2007-11-26 | 2008-11-25 | Prevention of substrate edge plating in a fountain plating process |
US13/440,878 Abandoned US20120199474A1 (en) | 2007-11-26 | 2012-04-05 | Prevention of substrate edge plating in a fountain plating process |
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US12/323,157 Expired - Fee Related US8172989B2 (en) | 2007-11-26 | 2008-11-25 | Prevention of substrate edge plating in a fountain plating process |
Country Status (3)
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US (2) | US8172989B2 (en) |
EP (1) | EP2222896A4 (en) |
WO (1) | WO2009070765A2 (en) |
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CN104846416A (en) * | 2014-02-19 | 2015-08-19 | 信越化学工业株式会社 | Electrodepositing apparatus and preparation of rare earth permanent magnet |
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CN104584156B (en) | 2012-08-31 | 2018-04-06 | 信越化学工业株式会社 | The manufacture method of rare-earth permanent magnet |
WO2014034851A1 (en) | 2012-08-31 | 2014-03-06 | 信越化学工業株式会社 | Production method for rare earth permanent magnet |
US9328427B2 (en) * | 2012-09-28 | 2016-05-03 | Sunpower Corporation | Edgeless pulse plating and metal cleaning methods for solar cells |
JP6090589B2 (en) | 2014-02-19 | 2017-03-08 | 信越化学工業株式会社 | Rare earth permanent magnet manufacturing method |
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Also Published As
Publication number | Publication date |
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US8172989B2 (en) | 2012-05-08 |
WO2009070765A2 (en) | 2009-06-04 |
EP2222896A2 (en) | 2010-09-01 |
EP2222896A4 (en) | 2013-03-13 |
US20090134034A1 (en) | 2009-05-28 |
WO2009070765A3 (en) | 2009-08-06 |
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