KR20170094702A - 연성회로기판 - Google Patents

연성회로기판 Download PDF

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Publication number
KR20170094702A
KR20170094702A KR1020160015811A KR20160015811A KR20170094702A KR 20170094702 A KR20170094702 A KR 20170094702A KR 1020160015811 A KR1020160015811 A KR 1020160015811A KR 20160015811 A KR20160015811 A KR 20160015811A KR 20170094702 A KR20170094702 A KR 20170094702A
Authority
KR
South Korea
Prior art keywords
ground
signal line
dielectric layer
layer
holes
Prior art date
Application number
KR1020160015811A
Other languages
English (en)
Korean (ko)
Inventor
김병열
김상필
이다연
구황섭
김현제
정희석
Original Assignee
주식회사 기가레인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to KR1020160015811A priority Critical patent/KR20170094702A/ko
Priority to TW106201738U priority patent/TWM544175U/zh
Priority to PCT/KR2017/001367 priority patent/WO2017138744A1/ko
Priority to CN201790000472.4U priority patent/CN208210411U/zh
Publication of KR20170094702A publication Critical patent/KR20170094702A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
KR1020160015811A 2016-02-11 2016-02-11 연성회로기판 KR20170094702A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160015811A KR20170094702A (ko) 2016-02-11 2016-02-11 연성회로기판
TW106201738U TWM544175U (zh) 2016-02-11 2017-02-06 可撓性電路板
PCT/KR2017/001367 WO2017138744A1 (ko) 2016-02-11 2017-02-08 연성회로기판
CN201790000472.4U CN208210411U (zh) 2016-02-11 2017-02-08 柔性电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160015811A KR20170094702A (ko) 2016-02-11 2016-02-11 연성회로기판

Publications (1)

Publication Number Publication Date
KR20170094702A true KR20170094702A (ko) 2017-08-21

Family

ID=59563344

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160015811A KR20170094702A (ko) 2016-02-11 2016-02-11 연성회로기판

Country Status (4)

Country Link
KR (1) KR20170094702A (zh)
CN (1) CN208210411U (zh)
TW (1) TWM544175U (zh)
WO (1) WO2017138744A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021118301A1 (en) * 2019-12-11 2021-06-17 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
WO2022154294A1 (ko) * 2021-01-12 2022-07-21 삼성전자 주식회사 차폐 구조를 갖는 기판을 포함하는 전자 장치
US11848279B2 (en) 2021-01-12 2023-12-19 Samsung Electronics Co., Ltd. Electronic device including printed circuit board having shielding structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111044762A (zh) * 2020-01-19 2020-04-21 安费诺电子装配（厦门）有限公司 一种高速原电缆电气完整性测试夹具
KR102457122B1 (ko) 2020-12-03 2022-10-20 주식회사 기가레인 다중 신호 전송용 연성회로기판

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185821A (ja) * 1999-12-27 2001-07-06 Toshiba Corp 配線基板
JP2006157646A (ja) * 2004-11-30 2006-06-15 Sony Corp 配線基板
KR100958268B1 (ko) * 2008-02-15 2010-05-19 (주)기가레인 임피던스 미스매칭 없이 신호전송라인의 폭을 넓힐 수 있는인쇄회로기판
KR100987191B1 (ko) * 2008-04-18 2010-10-11 (주)기가레인 신호전송라인 주위의 본딩 시트를 제거한 인쇄회로기판
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021118301A1 (en) * 2019-12-11 2021-06-17 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
US11439009B2 (en) 2019-12-11 2022-09-06 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
WO2022154294A1 (ko) * 2021-01-12 2022-07-21 삼성전자 주식회사 차폐 구조를 갖는 기판을 포함하는 전자 장치
US11848279B2 (en) 2021-01-12 2023-12-19 Samsung Electronics Co., Ltd. Electronic device including printed circuit board having shielding structure

Also Published As

Publication number Publication date
WO2017138744A1 (ko) 2017-08-17
TWM544175U (zh) 2017-06-21
CN208210411U (zh) 2018-12-07

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