KR20170094702A - Flexible printed circuit board - Google Patents

Flexible printed circuit board Download PDF

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Publication number
KR20170094702A
KR20170094702A KR1020160015811A KR20160015811A KR20170094702A KR 20170094702 A KR20170094702 A KR 20170094702A KR 1020160015811 A KR1020160015811 A KR 1020160015811A KR 20160015811 A KR20160015811 A KR 20160015811A KR 20170094702 A KR20170094702 A KR 20170094702A
Authority
KR
South Korea
Prior art keywords
ground
signal line
dielectric layer
layer
holes
Prior art date
Application number
KR1020160015811A
Other languages
Korean (ko)
Inventor
김병열
김상필
이다연
구황섭
김현제
정희석
Original Assignee
주식회사 기가레인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to KR1020160015811A priority Critical patent/KR20170094702A/en
Priority to TW106201738U priority patent/TWM544175U/en
Priority to PCT/KR2017/001367 priority patent/WO2017138744A1/en
Priority to CN201790000472.4U priority patent/CN208210411U/en
Publication of KR20170094702A publication Critical patent/KR20170094702A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)

Abstract

Disclosed is a flexible circuit board. The flexible circuit board of the present invention includes: a first dielectric layer having signal lines formed on one surface thereof; and a first ground layer formed on the other surface of the first dielectric layer and having a plurality of circular ground holes spaced from each other by a predetermined distance along the signal line. Accordingly, the present invention can improve a shielding ratio.

Description

[0001] The present invention relates to a flexible printed circuit board

The present invention relates to a flexible circuit board.

Conventionally, a radio frequency (RF) signal line is provided in a wireless terminal device such as a mobile phone. Conventionally, the RF signal line is installed in the form of a coaxial cable. When mounted in the form of a coaxial cable, In general, a flexible circuit board is used.

Since the optimum impedance of the signal transmission end of the flexible circuit board is about 33 Ω and the optimal impedance of the signal receiving end is about 75 Ω, the characteristic impedance of the flexible circuit board is generally designed to be about 50 Ω.

When an external signal due to peripheral components flows, the above-mentioned characteristic impedance deviates from the reference value of 50?, Which adversely affects the signal transmission efficiency. When other parts such as a main board, a sub board, The characteristic impedance is out of 50? Because the signal is inputted from the outside.

Therefore, the flexible circuit board may be mounted at a properly spaced position from the other components, or the thickness of the dielectric may be adjusted in order to prevent the impedance change from occurring.

On the other hand, in the flexible circuit board, it is advantageous to increase the area of the signal line in order to minimize the signal loss and to increase the amount of signal transmission. As a result, the impedance is increased and a hole having a polygonal shape is formed on the ground, The impedance is matched.

In recent years, there is an increasing demand for a flexible circuit board having a long length. In order to solve this problem, the area of the signal line must be widened. However, if the area of the signal line is widened, If a plurality of ground holes are formed in a polygonal shape to narrow the ground area, there is a problem that the shielding rate is lowered and the impedance is distorted in the section bent in comparison with the straight line section.

Further, the via holes must be formed between the ground holes and the ground holes at the same period, but it is difficult to form the via holes at the same intervals in the bent portions.

US 2014-0003007 (2014.01.02)

An object of the present invention is to provide a flexible circuit board in which the shielding ratio is improved, the impedance is not changed even in the bent portion, and the via holes are formed at the same period.

To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described herein, there is provided a flexible circuit board comprising: a first dielectric layer having signal lines formed on one surface thereof; And a first ground layer formed on the other surface of the first dielectric layer and having a plurality of circular ground holes spaced apart from each other by a predetermined distance along the signal line.

Further comprising a pair of via holes passing through the first ground layer and the first dielectric layer and spaced apart from each other by a predetermined distance with the ground hole interposed therebetween, and a gap B between the pair of via holes, The width A of the line and the diameter D of the ground hole may satisfy the following expression.

A? D? B-0.2mm

The distance d between the ground holes adjacent to each other can satisfy the following expression.

0.05mm? D? 5mm

The first dielectric layer, the signal line, and the first ground layer may be formed along the straight line portion and the bent portion.

A second dielectric layer having one surface thereof facing the one surface of the first dielectric layer; A pair of side grounds stacked on one surface of the first dielectric layer with the signal line therebetween; And a second ground layer stacked on the other surface of the second dielectric layer.

The second ground layer may be formed in a plate shape.

The second ground layer may have a continuous network of ground holes along the signal line.

The second ground layer may have a plurality of square-shaped ground holes spaced apart from each other along the signal line.

The second ground layer may be formed as a pair of plate members spaced apart from each other by a predetermined distance about a portion corresponding to the signal line.

In the second ground layer, a plurality of circular ground holes may be formed along the signal line at predetermined intervals.

According to the present invention, since a plurality of ground bridges are formed to enlarge the ground area, not only the shielding ratio is improved but also the impedance is not changed even in a bent section and the via holes are not arranged at the same period, There is one advantage.

1 is a sectional view of a flexible circuit board of the present invention,
2 is a plan view of the flexible circuit board of the present invention,
3 (a) to 3 (e) are views showing various embodiments of a second ground layer, which is a part of the present invention.

The objects, particular advantages and novel features of the present invention will become more apparent from the following detailed description and examples taken in conjunction with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the flexible circuit board of the present invention includes a first dielectric layer 10 and a first ground layer 40.

A signal line L is formed on one surface of the first dielectric layer 10 and a first ground layer 40 formed on the other surface of the first dielectric layer 10 with a plurality of circular ground holes H spaced apart along the signal line L Are stacked.

When a plurality of circular ground holes (H) are formed, a plurality of ground bridges (G) connecting adjacent ground holes (H) are formed to increase the ground area as a whole, have.

In the case of a flexible circuit board including a straight portion T and a bent portion C, when a plurality of ground holes having a polygonal shape are formed in the rectilinear portion T, a plurality of ground holes are formed for a predetermined period , While it is difficult to repeat formation with the same period in the section of the flexure C, and the impedance is distorted.

In the present invention, a plurality of ground holes (H) having the same period can be repeatedly formed in the first ground layer (40) by repeatedly forming a circular ground hole (H) .

Also, since a plurality of ground bridges G are formed, it is not necessary to arrange the via holes V at the same period, and there is an advantage that a bent section can be easily formed.

The flexible circuit board of the present invention includes a first ground layer 40 and a first dielectric layer 10 and a pair of first and second dielectric layers 10 and 20 spaced apart from each other in the width direction of the flexible circuit board And may include a via hole (V).

The distance B between the pair of via holes V and the width A of the signal line L formed between the pair of via holes V and the diameter D of the circular ground hole H, It is preferable that the following expression is satisfied.

A? D? B-0.2mm

The diameter D of the circular ground hole H can be formed to be 0.1 mm at the minimum machining. When the diameter D of the circular ground hole H is smaller than the width A of the signal line L , Impedance change is small due to small change in impedance. Therefore, it is preferable that the diameter D of the circular ground hole H is adjusted to be equal to or larger than the width A of the signal line L. [

The gap B between the pair of via holes V formed at a predetermined distance in the width direction of the flexible circuit board is 0.1 mm apart from the via hole V with the signal line L therebetween It is preferable to arrange the circular ground hole H between the pair of via holes V. [

The impedance increases when the diameter D of the circular ground hole H is increased and the impedance decreases when the diameter D of the circular ground hole H is made smaller. Therefore, impedance matching is performed while adjusting the diameter of the circular ground hole H within the above- shall.

When the diameter D of the circular ground hole H increases within the above range, the thickness of the first dielectric layer 10 can be reduced, which is advantageous for application to ultra-thin radio terminals, It is possible to widen the width A of the signal line A, thereby reducing the signal loss.

On the other hand, the interval d between the circular ground holes H adjacent to each other preferably satisfies the following expression.

0.05mm? D? 5mm

The distance d between the circular ground holes H can also be defined by the ground bridge G so that impedance can be matched while adjusting the interval d between the circular ground holes H .

It is preferable that the interval d between the circular ground holes H is adjusted while adjusting the minimum width of the signal line L from 0.05 mm to 5 mm where the impedance change is small.

When the distance d between the circular ground holes H is made small, the impedance increases. When it is increased, the impedance decreases.

The thickness of the first dielectric layer 10 can be made thinner when the interval d between the circular ground holes H is made small so that it is advantageous to apply to the ultrathin radio terminal and the width of the signal line L A) can be widened so that there is an advantage that the signal loss can be reduced.

Meanwhile, the flexible circuit board of the present invention may include a straight portion T and a bent portion C.

In the case of a wireless terminal or a notebook computer to which a flexible circuit board is applied, various components are present inside the flexure portion C, the flexible portion C formed by bending and extending in the straight portion T so as to avoid interference with such components, .

The first dielectric layer 10, the signal line L and the first ground layer 40 described above are formed along the straight line portion T and the bent portion C.

The circular ground holes H formed in the first ground layer 40 are spaced apart from the linear portions T as well as the bent portions C by a predetermined distance. By adjusting it constantly, it is efficient for impedance matching.

The flexible circuit board of the present invention includes a second dielectric layer 20 facing one surface of a first dielectric layer 10 and a pair of side surfaces 11a and 11b formed on one surface of the first dielectric layer 10 with a signal line L therebetween. And a second ground layer 50 stacked on the other surface of the ground 30 and the second dielectric layer 20.

The first dielectric layer 10 and the second dielectric layer 20 may be melted and bonded to each other by a high-temperature press, or may be bonded via the bonding sheet 60.

In addition, the second dielectric layer 20 may further include a pair of side grounds 30 and a pair of side grounds (not shown) corresponding to the pair of side grounds 30.

Meanwhile, as shown in FIG. 3A, the second ground layer 50 may be formed in a plate shape. When the second ground layer 50 is formed in a plate shape, the width A of the signal line L is narrow and the signal loss is relatively increased, but the shielding ratio can be increased.

As shown in FIG. 3 (b), a ground hole H having a net shape may be formed continuously along the signal line L in the second ground layer 50, As shown in the figure, the second ground layer 50 may be formed with a plurality of square-shaped ground holes H spaced by a predetermined distance along the signal line L.

3 (d), the second ground layer 50 may be formed as a pair of plate members spaced apart from each other by a predetermined distance about a portion corresponding to the signal line L, As shown in FIG. 3 (e), the second ground layer 50 may be formed with a plurality of circular ground holes H spaced apart from one another along the signal line L by a predetermined distance. In this case, the width A of the signal line L can be widened as compared with the other embodiments, which is advantageous in that the signal loss can be reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the scope of the invention as defined by the appended claims. It will be apparent that modifications and improvements can be made by those skilled in the art.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: first dielectric layer 20: second dielectric layer
30: a pair of side grounds 40: a first ground layer
50: second ground layer 60: bonding sheet
L: signal line H: ground hole
V: via hole G: ground bridge
T: straight line portion C:

Claims (10)

A first dielectric layer having signal lines formed on one surface thereof; And
And a first ground layer formed on the other surface of the first dielectric layer and having a plurality of circular ground holes spaced apart from each other by a predetermined distance along the signal line.
The method according to claim 1,
The first ground layer and the first dielectric layer,
Further comprising a pair of via holes spaced apart from each other with the ground hole interposed therebetween,
Wherein the distance (B) between the pair of via holes, the width (A) of the signal line, and the diameter (D) of the ground hole satisfy the following expression.
A? D? B-0.2mm
The method of claim 2,
(D) of the ground holes adjacent to each other satisfies the following formula:
0.05mm? D? 5mm
The method according to claim 1,
A straight portion and a bent portion extending from the straight portion,
Wherein the first dielectric layer, the signal line, and the first ground layer are formed along the straight portion and the bent portion.
The method according to any one of claims 1 to 4,
A second dielectric layer having one surface thereof facing the one surface of the first dielectric layer;
A pair of side grounds stacked on one surface of the first dielectric layer with the signal line therebetween;
And a second ground layer laminated on the other surface of the second dielectric layer.
The method of claim 5,
Wherein the second ground layer is formed in a plate shape.
The method of claim 5,
Wherein the second ground layer is formed by continuously forming a network-shaped ground hole along the signal line.
The method of claim 5,
Wherein the second ground layer has a plurality of square-shaped ground holes spaced apart from each other by a predetermined distance along the signal line.
The method of claim 5,
Wherein the second ground layer is formed in a shape of a pair of plate members spaced apart from each other by a distance corresponding to a portion corresponding to the signal line.
The method of claim 5,
Wherein a plurality of circular ground holes are formed in the second ground layer at predetermined intervals along the signal lines.
KR1020160015811A 2016-02-11 2016-02-11 Flexible printed circuit board KR20170094702A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020160015811A KR20170094702A (en) 2016-02-11 2016-02-11 Flexible printed circuit board
TW106201738U TWM544175U (en) 2016-02-11 2017-02-06 Flexible printed circuit board
PCT/KR2017/001367 WO2017138744A1 (en) 2016-02-11 2017-02-08 Flexible circuit board
CN201790000472.4U CN208210411U (en) 2016-02-11 2017-02-08 Flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020160015811A KR20170094702A (en) 2016-02-11 2016-02-11 Flexible printed circuit board

Publications (1)

Publication Number Publication Date
KR20170094702A true KR20170094702A (en) 2017-08-21

Family

ID=59563344

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160015811A KR20170094702A (en) 2016-02-11 2016-02-11 Flexible printed circuit board

Country Status (4)

Country Link
KR (1) KR20170094702A (en)
CN (1) CN208210411U (en)
TW (1) TWM544175U (en)
WO (1) WO2017138744A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021118301A1 (en) * 2019-12-11 2021-06-17 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
WO2022154294A1 (en) * 2021-01-12 2022-07-21 삼성전자 주식회사 Electronic device including substrates having shielding structure
US11848279B2 (en) 2021-01-12 2023-12-19 Samsung Electronics Co., Ltd. Electronic device including printed circuit board having shielding structure

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111044762A (en) * 2020-01-19 2020-04-21 安费诺电子装配（厦门）有限公司 High-speed former cable electrical integrity test fixture
KR102457122B1 (en) 2020-12-03 2022-10-20 주식회사 기가레인 Flexible circuit board for multiple signal transmission

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185821A (en) * 1999-12-27 2001-07-06 Toshiba Corp Wiring board
JP2006157646A (en) * 2004-11-30 2006-06-15 Sony Corp Wiring board
KR100958268B1 (en) * 2008-02-15 2010-05-19 (주)기가레인 printed circuit board capable of widening the width of signal transmission line without impedance miss matching
KR100987191B1 (en) * 2008-04-18 2010-10-11 (주)기가레인 printed circuit board removing bonding sheet around signal transmission line
KR101416159B1 (en) * 2013-09-06 2014-07-14 주식회사 기가레인 Printed curcuit board comprising contact pad

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021118301A1 (en) * 2019-12-11 2021-06-17 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
US11439009B2 (en) 2019-12-11 2022-09-06 Samsung Electronics Co., Ltd. Printed circuit board and electronic device including the same
WO2022154294A1 (en) * 2021-01-12 2022-07-21 삼성전자 주식회사 Electronic device including substrates having shielding structure
US11848279B2 (en) 2021-01-12 2023-12-19 Samsung Electronics Co., Ltd. Electronic device including printed circuit board having shielding structure

Also Published As

Publication number Publication date
TWM544175U (en) 2017-06-21
CN208210411U (en) 2018-12-07
WO2017138744A1 (en) 2017-08-17

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