KR20170093949A - 회전 척으로부터 손실 웨이퍼의 검출 - Google Patents

회전 척으로부터 손실 웨이퍼의 검출 Download PDF

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Publication number
KR20170093949A
KR20170093949A KR1020177019065A KR20177019065A KR20170093949A KR 20170093949 A KR20170093949 A KR 20170093949A KR 1020177019065 A KR1020177019065 A KR 1020177019065A KR 20177019065 A KR20177019065 A KR 20177019065A KR 20170093949 A KR20170093949 A KR 20170093949A
Authority
KR
South Korea
Prior art keywords
detection
microelectronic substrate
component
position indicator
rotating chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020177019065A
Other languages
English (en)
Korean (ko)
Inventor
알란 디. 로즈
마이클 그루엔하겐
Original Assignee
티이엘 에프에스아이, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티이엘 에프에스아이, 인코포레이티드 filed Critical 티이엘 에프에스아이, 인코포레이티드
Publication of KR20170093949A publication Critical patent/KR20170093949A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H01L21/67288—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H01L21/68728—
    • H01L21/68764—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020177019065A 2014-12-10 2014-12-10 회전 척으로부터 손실 웨이퍼의 검출 Withdrawn KR20170093949A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/069557 WO2016093824A1 (en) 2014-12-10 2014-12-10 Detection of lost wafer from spinning chuck

Publications (1)

Publication Number Publication Date
KR20170093949A true KR20170093949A (ko) 2017-08-16

Family

ID=56107842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177019065A Withdrawn KR20170093949A (ko) 2014-12-10 2014-12-10 회전 척으로부터 손실 웨이퍼의 검출

Country Status (4)

Country Link
JP (1) JP2018501654A (enExample)
KR (1) KR20170093949A (enExample)
CN (1) CN107112257A (enExample)
WO (1) WO2016093824A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7756571B2 (ja) * 2022-01-19 2025-10-20 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置
CN115458471B (zh) * 2022-08-31 2024-07-23 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
JP2529637Y2 (ja) * 1991-08-30 1997-03-19 大日本スクリーン製造株式会社 基板の回転保持装置
DE4237928C2 (de) * 1992-07-09 1995-01-19 Siemens Ag Mikroschalter mit einem Magnetfeld-Sensor
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
US6670807B2 (en) * 2002-01-16 2003-12-30 Applied Materials, Inc. Proximity sensor detecting loss of magnetic field complete
KR100460807B1 (ko) * 2002-07-08 2004-12-09 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법
JP5379533B2 (ja) * 2009-03-27 2013-12-25 大日本スクリーン製造株式会社 基板保持機構、およびこの基板保持機構を備える基板処理装置
JP5646528B2 (ja) * 2012-03-09 2014-12-24 東京エレクトロン株式会社 液処理装置
CN102867771B (zh) * 2012-09-18 2015-08-05 北京七星华创电子股份有限公司 具有监测半导体晶片状态功能的夹持装置和方法
US9255894B2 (en) * 2012-11-09 2016-02-09 Kla-Tencor Corporation System and method for detecting cracks in a wafer

Also Published As

Publication number Publication date
JP2018501654A (ja) 2018-01-18
WO2016093824A1 (en) 2016-06-16
CN107112257A (zh) 2017-08-29

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000