JP2018501654A - スピンチャックからのウェハ脱落の検出 - Google Patents

スピンチャックからのウェハ脱落の検出 Download PDF

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Publication number
JP2018501654A
JP2018501654A JP2017531335A JP2017531335A JP2018501654A JP 2018501654 A JP2018501654 A JP 2018501654A JP 2017531335 A JP2017531335 A JP 2017531335A JP 2017531335 A JP2017531335 A JP 2017531335A JP 2018501654 A JP2018501654 A JP 2018501654A
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Japan
Prior art keywords
microelectronic substrate
detection
component
detection component
signal
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Ceased
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JP2017531335A
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English (en)
Japanese (ja)
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JP2018501654A5 (enExample
Inventor
ディー． ローズ，アラン
ディー． ローズ，アラン
グルーエンハーゲン，マイケル
Original Assignee
ティーイーエル エフエスアイ，インコーポレイティド
ティーイーエル エフエスアイ，インコーポレイティド
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Publication date
Application filed by ティーイーエル エフエスアイ，インコーポレイティド, ティーイーエル エフエスアイ，インコーポレイティド filed Critical ティーイーエル エフエスアイ，インコーポレイティド
Publication of JP2018501654A publication Critical patent/JP2018501654A/ja
Publication of JP2018501654A5 publication Critical patent/JP2018501654A5/ja
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017531335A 2014-12-10 2014-12-10 スピンチャックからのウェハ脱落の検出 Ceased JP2018501654A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/069557 WO2016093824A1 (en) 2014-12-10 2014-12-10 Detection of lost wafer from spinning chuck

Publications (2)

Publication Number Publication Date
JP2018501654A true JP2018501654A (ja) 2018-01-18
JP2018501654A5 JP2018501654A5 (enExample) 2019-09-26

Family

ID=56107842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017531335A Ceased JP2018501654A (ja) 2014-12-10 2014-12-10 スピンチャックからのウェハ脱落の検出

Country Status (4)

Country Link
JP (1) JP2018501654A (enExample)
KR (1) KR20170093949A (enExample)
CN (1) CN107112257A (enExample)
WO (1) WO2016093824A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023105587A (ja) * 2022-01-19 2023-07-31 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458471B (zh) * 2022-08-31 2024-07-23 北京北方华创微电子装备有限公司 卡盘装置及监测晶圆状态的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529637Y2 (ja) * 1991-08-30 1997-03-19 大日本スクリーン製造株式会社 基板の回転保持装置
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
JP2010232523A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板保持機構、およびこの基板保持機構を備える基板処理装置
JP2013187490A (ja) * 2012-03-09 2013-09-19 Tokyo Electron Ltd 液処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3538883A (en) * 1967-12-12 1970-11-10 Alco Standard Corp Vacuum chuck with safety device
DE4237928C2 (de) * 1992-07-09 1995-01-19 Siemens Ag Mikroschalter mit einem Magnetfeld-Sensor
US6670807B2 (en) * 2002-01-16 2003-12-30 Applied Materials, Inc. Proximity sensor detecting loss of magnetic field complete
KR100460807B1 (ko) * 2002-07-08 2004-12-09 삼성전자주식회사 반도체소자 제조설비의 웨이퍼 외관 검사장치와 이를이용하는 세정설비 및 그 검사방법
CN102867771B (zh) * 2012-09-18 2015-08-05 北京七星华创电子股份有限公司 具有监测半导体晶片状态功能的夹持装置和方法
US9255894B2 (en) * 2012-11-09 2016-02-09 Kla-Tencor Corporation System and method for detecting cracks in a wafer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2529637Y2 (ja) * 1991-08-30 1997-03-19 大日本スクリーン製造株式会社 基板の回転保持装置
US6459382B1 (en) * 2001-04-26 2002-10-01 Applied Materials, Inc. Over clamp sensor
JP2010232523A (ja) * 2009-03-27 2010-10-14 Dainippon Screen Mfg Co Ltd 基板保持機構、およびこの基板保持機構を備える基板処理装置
JP2013187490A (ja) * 2012-03-09 2013-09-19 Tokyo Electron Ltd 液処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023105587A (ja) * 2022-01-19 2023-07-31 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置
JP7756571B2 (ja) 2022-01-19 2025-10-20 株式会社荏原製作所 プッシャ、搬送装置、および基板処理装置

Also Published As

Publication number Publication date
KR20170093949A (ko) 2017-08-16
WO2016093824A1 (en) 2016-06-16
CN107112257A (zh) 2017-08-29

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