KR20160149245A - 가접착용 적층체, 가접착용 적층체의 제조 방법 및 디바이스 웨이퍼 부착 적층체 - Google Patents

가접착용 적층체, 가접착용 적층체의 제조 방법 및 디바이스 웨이퍼 부착 적층체 Download PDF

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KR20160149245A
KR20160149245A KR1020167032859A KR20167032859A KR20160149245A KR 20160149245 A KR20160149245 A KR 20160149245A KR 1020167032859 A KR1020167032859 A KR 1020167032859A KR 20167032859 A KR20167032859 A KR 20167032859A KR 20160149245 A KR20160149245 A KR 20160149245A
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South Korea
Prior art keywords
group
elastomer
film
device wafer
laminate
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KR1020167032859A
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English (en)
Korean (ko)
Inventor
유 이와이
이치로 코야마
미츠루 사와노
요시타카 카모치
아츠시 나카무라
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후지필름 가부시키가이샤
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Publication of KR20160149245A publication Critical patent/KR20160149245A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J7/0228—
    • C09J7/025—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
KR1020167032859A 2014-06-13 2015-06-09 가접착용 적층체, 가접착용 적층체의 제조 방법 및 디바이스 웨이퍼 부착 적층체 KR20160149245A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014122523 2014-06-13
JPJP-P-2014-122523 2014-06-13
PCT/JP2015/066595 WO2015190478A1 (ja) 2014-06-13 2015-06-09 仮接着用積層体、仮接着用積層体の製造方法およびデバイスウエハ付き積層体

Publications (1)

Publication Number Publication Date
KR20160149245A true KR20160149245A (ko) 2016-12-27

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ID=54833568

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167032859A KR20160149245A (ko) 2014-06-13 2015-06-09 가접착용 적층체, 가접착용 적층체의 제조 방법 및 디바이스 웨이퍼 부착 적층체

Country Status (4)

Country Link
JP (1) JP6321163B2 (ja)
KR (1) KR20160149245A (ja)
TW (1) TW201601918A (ja)
WO (1) WO2015190478A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101930721B1 (ko) * 2015-02-20 2018-12-19 후지필름 가부시키가이샤 가접착용 적층체, 적층체 및 키트
JP6624992B2 (ja) * 2016-03-24 2019-12-25 三菱電機株式会社 半導体装置の製造方法
JP6738672B2 (ja) * 2016-07-04 2020-08-12 倉敷紡績株式会社 離型フィルムおよび半導体パッケージの製造方法
WO2020045338A1 (ja) * 2018-08-30 2020-03-05 三井化学東セロ株式会社 離型フィルム
CN110289383B (zh) * 2019-06-18 2021-12-03 深圳昌茂粘胶新材料有限公司 一种锂电池动力电池耐高温微孔薄膜材料及其制备方法
WO2023182138A1 (ja) * 2022-03-24 2023-09-28 日産化学株式会社 ポリエーテル変性シロキサンを含有する接着剤

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045939A (ja) 2005-08-10 2007-02-22 Jsr Corp 粘着フィルムの粘着力低減方法
JP2009528688A (ja) 2006-03-01 2009-08-06 ヤーコプ＋リヒター イーペー−フェルヴェルツングスゲゼルシャフト ミット ベシュレンクテル ハフツング ウエハ、ウエハ−キャリヤ構造体の特に薄い背面を処理する方法及び前記タイプのウエハ−キャリヤ構造体を製造する方法
JP2010506406A (ja) 2006-10-06 2010-02-25 ブルーワー サイエンス アイ エヌ シー． スライディング手法を用いるウェーハの仮接合のための、高温およびスピンオン接合用組成物
JP2011052142A (ja) 2009-09-03 2011-03-17 Jsr Corp 接着剤組成物、それを用いた基材の加工または移動方法および半導体素子
JP2011119427A (ja) 2009-12-03 2011-06-16 Shin-Etsu Chemical Co Ltd 積層型半導体集積装置の製造方法
JP2011225814A (ja) 2010-04-02 2011-11-10 Jsr Corp 仮固定用組成物、仮固定材、基材の処理方法、および半導体素子
US20110318938A1 (en) 2009-06-15 2011-12-29 Sumitomo Bakelite Co., Ltd. Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
US20120034437A1 (en) 2010-08-06 2012-02-09 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
WO2013119976A1 (en) 2012-02-08 2013-08-15 Brewer Science Inc. Fluorinated silane coating compositions for thin wafer bonding and handling
JP2013241568A (ja) 2012-04-27 2013-12-05 Jsr Corp 基材の処理方法、仮固定用組成物および半導体装置
JP2014029999A (ja) 2012-06-29 2014-02-13 Hitachi Chemical Co Ltd 仮固定用フィルム、仮固定用フィルムシート及び半導体装置の製造方法
JP2014034632A (ja) 2012-08-08 2014-02-24 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム並びに接着方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000071327A (ja) * 1998-08-31 2000-03-07 Canon Inc 管状フィルムおよび管状フィルムの製造方法
JP5962395B2 (ja) * 2011-09-28 2016-08-03 Jsr株式会社 基材の仮固定方法、半導体装置および仮固定用組成物
JP5661669B2 (ja) * 2011-09-30 2015-01-28 東京応化工業株式会社 接着剤組成物、接着フィルムおよび基板の処理方法
JP6014455B2 (ja) * 2012-10-19 2016-10-25 富士フイルム株式会社 半導体装置の製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007045939A (ja) 2005-08-10 2007-02-22 Jsr Corp 粘着フィルムの粘着力低減方法
JP2009528688A (ja) 2006-03-01 2009-08-06 ヤーコプ＋リヒター イーペー−フェルヴェルツングスゲゼルシャフト ミット ベシュレンクテル ハフツング ウエハ、ウエハ−キャリヤ構造体の特に薄い背面を処理する方法及び前記タイプのウエハ−キャリヤ構造体を製造する方法
JP2010506406A (ja) 2006-10-06 2010-02-25 ブルーワー サイエンス アイ エヌ シー． スライディング手法を用いるウェーハの仮接合のための、高温およびスピンオン接合用組成物
US20110318938A1 (en) 2009-06-15 2011-12-29 Sumitomo Bakelite Co., Ltd. Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same
JP2011052142A (ja) 2009-09-03 2011-03-17 Jsr Corp 接着剤組成物、それを用いた基材の加工または移動方法および半導体素子
JP2011119427A (ja) 2009-12-03 2011-06-16 Shin-Etsu Chemical Co Ltd 積層型半導体集積装置の製造方法
JP2011225814A (ja) 2010-04-02 2011-11-10 Jsr Corp 仮固定用組成物、仮固定材、基材の処理方法、および半導体素子
US20120034437A1 (en) 2010-08-06 2012-02-09 Brewer Science Inc. Multiple bonding layers for thin-wafer handling
WO2013119976A1 (en) 2012-02-08 2013-08-15 Brewer Science Inc. Fluorinated silane coating compositions for thin wafer bonding and handling
JP2013241568A (ja) 2012-04-27 2013-12-05 Jsr Corp 基材の処理方法、仮固定用組成物および半導体装置
JP2014029999A (ja) 2012-06-29 2014-02-13 Hitachi Chemical Co Ltd 仮固定用フィルム、仮固定用フィルムシート及び半導体装置の製造方法
JP2014034632A (ja) 2012-08-08 2014-02-24 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム並びに接着方法

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WO2015190478A1 (ja) 2015-12-17
JPWO2015190478A1 (ja) 2017-05-25
TW201601918A (zh) 2016-01-16
JP6321163B2 (ja) 2018-05-09

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