KR20160119267A - 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료 - Google Patents

중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료 Download PDF

Info

Publication number
KR20160119267A
KR20160119267A KR1020167027059A KR20167027059A KR20160119267A KR 20160119267 A KR20160119267 A KR 20160119267A KR 1020167027059 A KR1020167027059 A KR 1020167027059A KR 20167027059 A KR20167027059 A KR 20167027059A KR 20160119267 A KR20160119267 A KR 20160119267A
Authority
KR
South Korea
Prior art keywords
barrier
nano
grams
present
dispersed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020167027059A
Other languages
English (en)
Korean (ko)
Inventor
안토니오 보누치
로베르토 마치
로베르토 자이안안토니오
Original Assignee
사에스 게터스 에스.페.아.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사에스 게터스 에스.페.아. filed Critical 사에스 게터스 에스.페.아.
Publication of KR20160119267A publication Critical patent/KR20160119267A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H01L51/5237—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0035—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS
    • B81B7/0038—Packages or encapsulation for maintaining a controlled atmosphere inside of the chamber containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20—Light-sensitive devices
    • H01G9/2068—Panels or arrays of photoelectrochemical cells, e.g. photovoltaic modules based on photoelectrochemical cells
    • H01G9/2077—Sealing arrangements, e.g. to prevent the leakage of the electrolyte
    • H01L51/5246—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • H01L2251/5369—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/542—Dye sensitized solar cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Organic Insulating Materials (AREA)
  • Thermistors And Varistors (AREA)
KR1020167027059A 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료 Ceased KR20160119267A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT002206A ITMI20082206A1 (it) 2008-12-12 2008-12-12 Materiale composito per la protezione di dispositivi sensibili ad h2o costituito da nanozeoliti disperse in una matrice polimerica
ITMI2008A002206 2008-12-12
PCT/EP2009/066445 WO2010066647A1 (en) 2008-12-12 2009-12-04 Composite material for the protection of h2o sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020117016025A Division KR101768726B1 (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료

Publications (1)

Publication Number Publication Date
KR20160119267A true KR20160119267A (ko) 2016-10-12

Family

ID=40668386

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167027059A Ceased KR20160119267A (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료
KR1020117016025A Active KR101768726B1 (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020117016025A Active KR101768726B1 (ko) 2008-12-12 2009-12-04 중합체 매트릭스에 분산된 표면 관능화된 나노제올라이트를 기재로 하는 ｈ2ｏ에 민감성 장치 보호용 복합 재료

Country Status (8)

Country Link
US (2) US20110293895A1 (enExample)
EP (1) EP2373729B1 (enExample)
JP (1) JP5581332B2 (enExample)
KR (2) KR20160119267A (enExample)
CN (2) CN102264820A (enExample)
IT (1) ITMI20082206A1 (enExample)
TW (1) TWI469827B (enExample)
WO (1) WO2010066647A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DK2771182T3 (da) * 2011-10-24 2019-08-19 Tera Barrier Films Pte Ltd Indkapslingsbarrierestak
DE102015106658B4 (de) * 2015-04-29 2025-12-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zu deren Herstellung
JP2020012041A (ja) * 2018-07-17 2020-01-23 パナソニックＩｐマネジメント株式会社 ガスバリア用塗料組成物及び発光装置
CN109456722A (zh) * 2018-10-22 2019-03-12 广州市垠瀚能源科技有限公司 一种耐锂离子电池电解液的双组份环氧胶粘剂的制备方法
JP7053911B2 (ja) * 2021-03-04 2022-04-12 旭化成株式会社 複合体

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704806A (en) * 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
US4637197A (en) * 1984-10-15 1987-01-20 Epoxy Technology, Inc. Method and compositions for removal of moisture
US5827908A (en) * 1994-01-26 1998-10-27 Shin-Etsu Chemical Co., Ltd. Naphthalene and or biphenyl skeleton containing epoxy resin composition
JPH10251488A (ja) * 1997-03-07 1998-09-22 Sony Corp 半導体装置用硬化性樹脂組成物
KR20040019098A (ko) * 2001-08-03 2004-03-04 디에스엠 엔.브이 표시 장치용 경화성 조성물
JP2003155355A (ja) * 2001-11-21 2003-05-27 Mitsubishi Chemicals Corp 超微粒子を含有する樹脂組成物成形体
US6936131B2 (en) * 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
FR2840913B1 (fr) * 2002-06-13 2005-02-04 Inst Francais Du Petrole Composition pour reservoir a paroi monocouche
US7691514B2 (en) * 2003-11-07 2010-04-06 The Regents Of The University Of California Polymer-zeolite nanocomposite membranes for proton-exchange-membrane fuel cells
US20060284556A1 (en) * 2003-11-12 2006-12-21 Tremel James D Electronic devices and a method for encapsulating electronic devices
ITMI20051501A1 (it) * 2005-07-29 2007-01-30 Getters Spa Sistemi getter comprendenti una fase attiva inserita in un materiale poroso distribuito in un mezzo disperdente a bassa permeabilita'
ITMI20052496A1 (it) * 2005-12-27 2007-06-28 Getters Spa Sistemi compositi assorbitori di gas e metodi per la loro produzione
JP4098339B2 (ja) * 2006-09-13 2008-06-11 ポジティブフォースインベストメンツコーポレーション プラスチック除湿用マスターバッチ及びプラスチック材料の除湿方法
KR101286745B1 (ko) * 2006-03-30 2013-07-15 헨켈 아게 운트 코. 카게아아 열경화성 에폭시-아민 배리어 밀봉제
DE102006029849A1 (de) * 2006-06-27 2008-01-03 Nanoscape Ag Beschichtetes Molekularsieb
EP1873202B1 (en) * 2006-06-29 2009-02-11 Clariant Finance (BVI) Limited Transparent zeolite-polymer hybrid material with tunable properties
CN101518151B (zh) * 2006-11-06 2015-09-16 新加坡科技研究局 纳米粒子封装阻障叠层

Also Published As

Publication number Publication date
TWI469827B (zh) 2015-01-21
US20110293895A1 (en) 2011-12-01
KR20110104023A (ko) 2011-09-21
JP2012511601A (ja) 2012-05-24
EP2373729B1 (en) 2015-04-01
US20170152416A1 (en) 2017-06-01
EP2373729A1 (en) 2011-10-12
TW201034747A (en) 2010-10-01
ITMI20082206A1 (it) 2010-06-13
US10053604B2 (en) 2018-08-21
CN102264820A (zh) 2011-11-30
KR101768726B1 (ko) 2017-08-16
JP5581332B2 (ja) 2014-08-27
CN104327305A (zh) 2015-02-04
CN104327305B (zh) 2016-04-06
WO2010066647A1 (en) 2010-06-17

Similar Documents

Publication Publication Date Title
US10053604B2 (en) Composite material for the protection of H2O sensitive devices based on surface functionalized nanozeolites dispersed in a polymeric matrix
TWI480355B (zh) 黏合膜
KR101798819B1 (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
JP5263849B2 (ja) 酸素及び／又は水分に敏感な電子デバイスをカプセル封じするための多層膜
CN107634148B (zh) 粘合膜
EP3212727B1 (de) Klebemassen mit aktivierbaren gettermaterialien
AU2006350626A1 (en) Nanoparticulate encapsulation barrier stack
WO2007111607A1 (en) Radiation-curable rubber adhesive/sealant
EP2550692B1 (en) Composition for the protection of moisture sensitive devices
CN101151343A (zh) 可辐射固化的填充干燥剂的粘合剂/密封剂
TWI558787B (zh) 黏合膜及使用彼之有機電子裝置的包封產品
TW201422742A (zh) 黏合膜與使用彼之有機電子裝置的包封產物
KR20080090473A (ko) 기체 흡착성 복합체 시스템 및 이들의 제조방법
KR20160101962A (ko) 반도체 장치의 제조 방법 및 열경화성 수지 시트
KR101554378B1 (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법
KR20210089952A (ko) 수분 흡착제, 이를 포함하는 봉지재 및 유기전자장치
KR102738272B1 (ko) 유기태양전지 봉지용 조성물 및 이를 이용한 봉지필름
Boldrighini Enhanced adhesives for the encapsulation of flexible organic photovoltaic modules
KR20210089953A (ko) 수분 흡착제, 이를 포함하는 봉지재 및 유기전자장치
KR20030063990A (ko) 유기전기발광소자용 봉지 부재의 개선된 제조방법
KR20150039164A (ko) 접착 필름 및 이를 이용한 유기전자장치의 봉지 방법

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000