KR20160104541A - 필름의 진공 라미네이트 장치 - Google Patents

필름의 진공 라미네이트 장치 Download PDF

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Publication number
KR20160104541A
KR20160104541A KR1020150171174A KR20150171174A KR20160104541A KR 20160104541 A KR20160104541 A KR 20160104541A KR 1020150171174 A KR1020150171174 A KR 1020150171174A KR 20150171174 A KR20150171174 A KR 20150171174A KR 20160104541 A KR20160104541 A KR 20160104541A
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KR
South Korea
Prior art keywords
film
substrate
vacuum
length
lamination
Prior art date
Application number
KR1020150171174A
Other languages
English (en)
Korean (ko)
Inventor
가즈오 다카하시
마코토 오오사와
히데키 야마모토
Original Assignee
가부시키가이샤 히타치 플랜트메카닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 히타치 플랜트메카닉스 filed Critical 가부시키가이샤 히타치 플랜트메카닉스
Publication of KR20160104541A publication Critical patent/KR20160104541A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020150171174A 2015-02-26 2015-12-03 필름의 진공 라미네이트 장치 KR20160104541A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015036655A JP6403159B2 (ja) 2015-02-26 2015-02-26 フィルムの真空ラミネート装置
JPJP-P-2015-036655 2015-02-26

Publications (1)

Publication Number Publication Date
KR20160104541A true KR20160104541A (ko) 2016-09-05

Family

ID=56824691

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150171174A KR20160104541A (ko) 2015-02-26 2015-12-03 필름의 진공 라미네이트 장치

Country Status (4)

Country Link
JP (1) JP6403159B2 (zh)
KR (1) KR20160104541A (zh)
CN (1) CN105922706B (zh)
TW (1) TWI676206B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6460062B2 (ja) * 2016-08-08 2019-01-30 サミー株式会社 ぱちんこ遊技機
JP6964421B2 (ja) * 2017-03-23 2021-11-10 ローム株式会社 半導体発光装置
JP6908496B2 (ja) * 2017-10-25 2021-07-28 株式会社荏原製作所 研磨装置
CN112313063B (zh) * 2018-06-18 2022-10-21 株式会社迈创科 层压机及层压机的对准调整方法
CN108682646A (zh) * 2018-07-11 2018-10-19 苏州焜原光电有限公司 InSb薄膜转移装置
JP7224706B1 (ja) 2022-11-14 2023-02-20 株式会社エヌ・シー・ティ 真空ラミネート装置
JP7471559B1 (ja) 2023-06-15 2024-04-22 株式会社エヌ・シー・ティ シート真空ラミネート装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0439038A (ja) 1990-06-04 1992-02-10 Hakutou Kk 真空ラミネータ
JP2001038806A (ja) 1999-07-29 2001-02-13 Hitachi Techno Eng Co Ltd フィルム減圧貼り合わせ装置及び方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0434016Y2 (zh) * 1988-04-15 1992-08-13
JP3368992B2 (ja) * 1994-04-26 2003-01-20 富士写真フイルム株式会社 写真フイルムの穿孔及び切断装置
JPH11268122A (ja) * 1998-03-23 1999-10-05 Yamaha Corp ラミネータ装置及びラミネート方法
JP3954401B2 (ja) * 2002-02-04 2007-08-08 株式会社エム・シー・ケー ラミネータ
JP2005322458A (ja) * 2004-05-07 2005-11-17 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造装置および製造方法
EP2437049A1 (en) * 2006-10-17 2012-04-04 Nitto Denko Corporation Method and system for laminating optical elements
JP5781412B2 (ja) * 2011-09-29 2015-09-24 日清紡メカトロニクス株式会社 ラミネート方法
JP6305884B2 (ja) * 2014-09-09 2018-04-04 株式会社日立プラントメカニクス フィルムのラミネート装置及びその動作方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0439038A (ja) 1990-06-04 1992-02-10 Hakutou Kk 真空ラミネータ
JP2001038806A (ja) 1999-07-29 2001-02-13 Hitachi Techno Eng Co Ltd フィルム減圧貼り合わせ装置及び方法

Also Published As

Publication number Publication date
TWI676206B (zh) 2019-11-01
JP2016155355A (ja) 2016-09-01
TW201637075A (zh) 2016-10-16
CN105922706B (zh) 2019-07-16
JP6403159B2 (ja) 2018-10-10
CN105922706A (zh) 2016-09-07

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