KR20160104541A - Vacuum laminating device for film - Google Patents

Abstract

The present invention provides a film vacuum laminating device capable of performing lamination in a vacuum state having a vacuum degree of 0.5 kPa or less. The length of a fed substrate (14a) is measured before lamination so as to change the length of a lamination film (21) attached according to the length of the substrate (14a). A film length adjusting tool (23) for changing a maintaining and supporting length of the lamination film (21) is disposed between a half-cut position and a knife edge unit (24) installed near to a lamination roll (26) according to the measured length of the substrate (14a). The lamination film (21) before peeling a projection film (27) having a changed maintaining and supporting length of the lamination film (21) is half-cut in a length position of the attached lamination film (21) by means of the film length adjusting tool (23). The lamination film (21) is returned to the knife edge unit (24) by film returning means (20, 29) while being continued by the protection film (27).

Description

FIELD OF THE INVENTION [0001] The present invention relates to a vacuum lamination apparatus for a film,

The present invention relates to a vacuum laminating apparatus for a film, and more particularly to a laminate vacuum apparatus for attaching a laminated film such as a photosensitive dry film for forming a pattern on a surface of a printed substrate in vacuum.

BACKGROUND ART [0002] Printed substrates (in the present specification, sometimes simply referred to as " substrates ") are under the circumstances where technological innovation is progressing centering on mobile phones and the like. Particularly, miniaturization and lightening of substrates have become important issues.

With respect to miniaturization of the substrate, the pattern formed on the substrate is made finer and the substrate is made more multilayered, and in terms of weight reduction, the substrate is made thinner.

Here, the formation of the pattern is mainly called a photolithography process. The pattern is formed by laminating a laminated film such as a photosensitive dry film on a copper-clad laminate, then performing exposure, development, etching or plating to form a pattern will be.

Sensitive dry film or the like is constituted mainly of a laminated film having a three-layer structure, in which a resist film having a photosensitive and thermosetting property is applied on a base film made of a polyester film or the like, and a protective film made of a polyethylene film or the like is laminated thereon Three layers are formed.

Hereinafter, this photosensitive dry film or the like is referred to as a laminated film (sometimes referred to simply as " film " in this specification).

In the pattern-forming laminate process for manufacturing a printed circuit board, the protective film of the laminated film is peeled off, the resist layer is heated and pressed on the base film by a lamination roll which is a thermocompression roll, and the laminated film is thermally bonded to the copper clad laminate.

As a main use of a vacuum laminator, a vacuum laminating a laminated film for forming a substrate requiring high reliability and a vacuum laminate for forming a fine pattern, or a photosensitive solder resist film (insulating film) on a surface of a concave- Film) may be vacuum laminated.

The purpose of laminating the laminated film in a vacuum is to avoid mixing minute bubbles which cause poor adhesion between the laminated film surface and the substrate surface to be laminated at the time of lamination. However, in recent years, with the miniaturization of patterns, When the laminate is laminated, microbubbles (10 mu m or less in diameter) are mixed into fine irregularities on the surface of the substrate, which causes defects, so that a vacuum laminator is used.

The surface of a conventional copper-plated laminated board is subjected to rough surface processing to a depth of 10 탆 or less as a pretreatment before laminating in order to improve adhesion of the resist. The main rough machining method is carried out by chemical polishing with acid chemicals.

The resist containing the adhesive component penetrates into the concave portion of the roughened surface portion, thereby improving the adhesion with the substrate. This is called an anchor effect.

Due to this rough surface processing, micro-bubbles remain in the concaved portion due to insufficient pressing of the resist into the concave portion due to pressure unevenness, insufficient melting of the resist due to uneven heating, and the like. Since the laminate in a vacuum has no atmosphere that interferes with the penetration of the resist into the recessed concaves, the filling property of the resist is greatly improved.

In the method of laminating under vacuum, it is necessary to divide the atmosphere and the vacuum chamber, and it has been proposed to use a vacuum laminator composed of an inlet chamber, a vacuum chamber and an outlet chamber (see Patent Document 1).

As another vacuum laminating method, a laminated film is introduced from the outside (in the air) of the decompression chamber into the decompression chamber, and the substrate is carried in and out without using a press roll (made of rubber) for sealing the vacuum chamber, It has been proposed that vacuum laminating can be performed in a clean state (see Patent Document 2).

Japanese Patent Application Laid-Open No. 4-39038 Japanese Patent Laid-Open No. 2001-38806

When vacuum laminating is performed, the presence or absence of microbubbles is an important issue in quality evaluation.

As a factor that determines the presence or absence of microbubbles, the degree of vacuum at the time of laminating is a factor that has been clarified in an evaluation test. As an example, it is said that the degree of vacuum of 1.3 kPa or less is preferable when the line (conductor width) of the pattern and the space (gap between conductors) are 25 mu m or less.

Further, it is considered that a high degree of vacuum of 0.5 kPa or less is required when the line and space are to be mass-produced in the future, at a level of 10 μm or less.

As a result, there is a problem that a vacuum laminate apparatus with high productivity in high vacuum is not available in the market in the present situation although a conventional laminate apparatus under high vacuum is required.

For example, the vacuum laminating method disclosed in Patent Document 1 has the same structure as that of the conventional atmospheric laminating apparatus, and comprises a suction holding mechanism for carrying and holding the laminated film. It has been found that the adsorption holding of the laminated film necessitates an adsorption differential pressure of about 12 kPa at a laminated film width of 500 mm according to the test results. Therefore, it is considered that the vacuum chamber in which the laminate device is installed can not support a high degree of vacuum because it can not hold and hold the laminated film at a vacuum degree of about 12 kPa or less.

In Patent Document 2, the base film of the laminated film is introduced from the outside (atmospheric side) of the decompression chamber and airtight by the vacuum seal. However, a structure in which the thickness of the base film is leaked from both sides of the base film to be.

Therefore, it is considered that it is difficult to maintain a degree of vacuum of 0.5 kPa or less in vacuum degree unless a vacuum pump of a large capacity exceeding the leakage amount is used, not a structure which is completely sealed by vacuum.

Further, every time the substrate carrying-in / out and the laminated film are introduced, the large-capacity decompression chamber must be opened to the atmosphere and evacuated, and the processing speed of the line is expected to be largely lowered.

Further, as a problem of a vacuum laminate, when a substrate heated in a preliminary heating apparatus in the atmosphere is introduced into a vacuum chamber, the atmosphere surrounding the vacuum furnace substrate disappears, thereby lowering the surface temperature of the substrate. Particularly, in a thin plate substrate in which there is a large demand, the temperature of the substrate is significantly lowered by heat radiation. The lowering temperature depends on the thickness of the substrate and the like, but the test result on the substrate having a substrate thickness of 0.2 mm causes a temperature decrease of about 10 캜.

From the above, there is a problem that when the laminated film is laminated in a vacuum, the adhesion of the resist is lowered due to the insufficient melting of the resist due to the lowering of the substrate temperature before lamination.

As a countermeasure, the substrate temperature can be measured at the entrance of the vacuum chamber, the lamination speed can be lowered and the resist heating time can be lengthened, but the productivity is lowered.

As a general recommended condition of the laminated film maker, the preheating temperature of the substrate is preferably 50 to 60 DEG C at the substrate temperature before lamination, and the lamination speed is preferably about 3 m / min.

The substrate preliminary heating apparatus to be installed in front of the laminating apparatus used in the atmosphere generally employs a heating method of constantizing the atmospheric temperature in the furnace by a cartridge heater or hot air circulation to measure the atmospheric temperature in the heating furnace and perform feedback control However, since there is no atmosphere in a vacuum, there is a problem that the temperature of the atmosphere in the heating furnace can not be measured.

It is a first object of the present invention to provide a vacuum laminating apparatus for a laminatable film in a high vacuum such as a vacuum degree of 0.5 kPa or less in view of the problems of the conventional film laminating apparatus.

It is a second object of the present invention to provide a vacuum laminating apparatus for a film which can solve the problem that the adhesion of the resist at the time of laminating is lowered due to the lowering of the substrate temperature.

In order to achieve the first object, in the vacuum laminating apparatus for a film of the present invention, a film is peeled from a film while a substrate is being conveyed by a conveying means in a vacuum chamber, and a vacuum In order to change the length of the film to be adhered in accordance with the length of the substrate to be laminated, the length of the substrate is measured before lamination, and between the half cut position and the knife edge portion provided near the lamination roll, And a film length adjusting mechanism for changing the holding length of the film in accordance with the length of the film. The film before peeling the protective film whose holding length of the film is changed by the film length adjusting mechanism, And the film is transported by the film transport means from the state of continuing with the protective film to the edge of the knife By causing a song, for example to provide a laminate available vacuum laminating apparatus in a high vacuum degree of vacuum less than 0.5kPa and the like.

In order to attain the second object, that is, in the case of a substrate which has been charged into a vacuum chamber in the atmosphere, the atmosphere around the substrate is removed by vacuuming, whereby the substrate temperature is lowered and the adhesion of the resist at the time of laminating A substrate heating mechanism for heating the substrate in the entire process of the lamination process is provided in the vacuum chamber to heat the substrate before the lamination under the optimum conditions.

In order to solve the problem that the atmospheric temperature in the heating furnace can not be measured because there is no atmosphere in a vacuum during the temperature control of the substrate preliminary heating apparatus described above, the temperature of the substrate is measured at the outlet of the substrate heating mechanism, The temperature is fed back to the temperature control unit of the substrate heating mechanism to automatically control the heating temperature of the substrate.

The vacuum laminating apparatus of the film of the present invention has the effect of improving productivity by improving the quality of the product and the speed of the lamination process in the vacuum laminating process for forming fine patterns on the substrate.

More specifically,

1. Improved productivity by improving defectiveness and speed of lamination process

(1) Since the laminate is laminated at a high degree of vacuum (0.5 kPa or less), it is possible to prevent the incorporation of microbubbles, which are defective factors.

(2) The substrate heating mechanism provided in the vacuum chamber can stabilize the laminate quality against the decrease in adhesion of the resist by preventing the substrate temperature before lamination and making the substrate temperature uniform. Further, by preventing the decrease of the substrate temperature, the lamination speed can be improved, and the productivity can be improved.

(3) The substrate temperature is measured at the outlet of the substrate heating mechanism, and the result of the temperature measurement is fed back to the substrate heating mechanism, thereby stabilizing the substrate temperature and improving the quality of the laminate.

2. Other effects

(1) In the case of laminating a laminated film in a vacuum, the floating foreign matter generated from a device driving unit or the like can be removed from the vacuum chamber by evacuating, and there is no floating foreign matter mixed in between the laminated film and the substrate, .

(2) Since moisture is not contained in the atmosphere due to lamination in a vacuum, moisture mixed into the laminated film and the substrate disappears, thereby improving adhesion of the resist and preventing oxidation of the copper surface, which is a main material of the wiring pattern.

1 is an explanatory diagram showing an embodiment of a vacuum laminating apparatus for a film of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of a vacuum laminating apparatus for a film of the present invention will be described with reference to the drawings.

Fig. 1 shows an embodiment of a vacuum laminating apparatus for a film of the present invention. Fig. 1 shows a mode in which a laminated film is vacuum laminated on both sides of a substrate. In the vacuum chamber 2, a state just before lamination is shown.

This film vacuum laminating apparatus comprises an inlet chamber 1 for introducing a substrate from the atmosphere, a vacuum chamber 2 for preliminarily heating and laminating the substrate in vacuum, and an outlet chamber 2 for discharging the substrate from the vacuum chamber 2 to the atmosphere. (3), and a control device not shown for controlling them. Since the film laminate portion in the vacuum chamber 2 is symmetrical in the vertical direction, the lower symbols are omitted.

In Fig. 1, the substrate 14a is conveyed from the left side to the positively defined conveying conveyor or the like, and the substrate is conveyed to the inlet chamber conveyor portion 15 in the inlet chamber 1. Fig.

The substrate transfer gate valve 4 is closed and the vacuum chamber 8 is evacuated to bring the inlet chamber 1 into a vacuum state.

The inlet chamber 1 opens the substrate inlet gate valve 5 with substantially the same degree of vacuum as the vacuum chamber 2 and brings the substrate into the substrate heating mechanism conveyor section 16 of the vacuum chamber 2. [

The substrate 14b heated by the substrate heating mechanisms 17a and 17b provided above and below the substrate heating mechanism conveyor portion 16 is moved to the substrate temperature detectors 18a and 18b by the conveyor movement, And feeds the data to the temperature controller of the substrate heating mechanism for feedback control.

In the substrate feeding conveyor section 19, the substrate width direction is aligned with the film width of the laminated film 21 by a substrate aligning device or the like (not shown).

The substrate length of the inserted substrate 14c is measured by the substrate position detector not shown and the roller feed amount of the substrate feeding conveyor 19.

The stopping of the laminate start position of the front end portion of the substrate 14c controls the stop position of the substrate loading conveyor portion 19 by a control device not shown in order to attach the laminated film to the specified substrate attachment position.

In the laminated portion of the vacuum chamber 2, the laminated film 21 is pulled out from the film unwinding unit (film carrying means) 20 by the protective film feed roll 28, The position where the half cut is cut in the film 21 is conveyed to the position of the laminated film front end portion 25.

At this time, the half-cut unit 22 is driven by a driving device (not shown) of the film pull-out adjustment unit (film length adjustment mechanism) 23 in order to half cut at a position corresponding to the attachment length of the inserted substrate 14c Use it to move.

The half cut cuts the base film and the resist while leaving the protective film 27 of the laminated film 21. Cutting without leaving the protective film 27 opposite to the half cut unit 22 without cutting all the thicknesses of the laminated film 21 is called a half cut.

In the knife edge portion 24, the protective film 27 is folded back at an acute angle so that the laminated film front end portion 25, from which the resist surface is exposed, is pulled out from the knife edge leading end portion in a state in which the protective film 27 is peeled off .

The substrate 14c positioned at the laminate position and the laminated film front end portion 25 are clamped by a clamping mechanism (not shown) above and below the lamination roll 26 and laminated while thermocompression is performed by a rotation driving mechanism I do. At this time, the laminated film (21) is pulled out by the rotation drive of the lamination roll (26).

Further, the film unwinding unit 20 generates a break torque on the film take-up shaft by a torque motor or the like to optimize the holding tension of the laminated film 21 at the time of lamination.

The protective film 27 is wound by a protective film winding unit (film carrying means) 29 by taking out the protective film 27 by the protective film transfer roll 28. The transfer speed of the protective film controls the rotation of the protective film feed roll 28 by a servomotor or the like so as to synchronize with the lamination speed of the lamination roll 26.

The substrate carry-out conveyor 31 receives the substrate 14d having the laminated film 30 adhered to the front and back sides of the substrate at the substrate carry-out conveyor speed synchronized with the laminating speed.

At this time, in the outlet chamber 3, in order to receive the substrate 14d, the atmospheric release valve 12c is closed in the laminate, the vacuum partitioning valve 10c is opened to evacuate the vacuum chamber 2, The vacuum partitioning valve 10c is closed with the same degree of vacuum as that of the vacuum partitioning valve 3.

The vacuum level of the outlet chamber 3 is monitored by the vacuum gauge 13c and the substrate outlet gate valve 6 is opened at a degree of vacuum substantially equal to that of the vacuum chamber 2 so that the substrate outlet conveyor portion 31 and the outlet chamber 3 are opened, The outlet chamber conveying portion 32 of the outlet chamber 3 is synchronously rotated to bring the substrate 14e into the outlet chamber 3.

Subsequently, the substrate outlet gate valve 6 is closed, the atmospheric release valve 12c is opened, the outlet chamber 3 is put in a standby state, the substrate outlet gate valve 7 is opened, To the next processing apparatus.

Hereinafter, the details of the operation method of the vacuum laminator of this film will be described.

The vacuum compartment valve 10b and the vacuum compartment valve 10c and the vacuum bypass valve 11b are opened to prepare the vacuum chamber 2 and the outlet chamber 3 for the preparation of operation, Vacuuming is performed from the manifold (9). Opening of the vacuum bypass valve 11b sets the vacuum degree of the vacuum chamber 2 and the outlet chamber 3 to substantially the same pressure in order to open and close the substrate outlet gate valve 6. [

The vacuum degree is set by closing the vacuum partitioning valves 10b and 10c by the signal output of the vacuum gauge 13b and the vacuum gauge 13c and when the degree of vacuum rises to the atmospheric side by minute leakage or the like, , It is possible to start the evacuation by opening the vacuum partitioning valves 10b and 10c and to maintain the degree of vacuum substantially constant. As another method, a minute air is introduced into the vacuum chamber 2 and the outlet chamber 3 by a leakage valve or the like (not shown) so as to control the opening and closing of the leakage valve, There is a method of maintaining the degree of vacuum in balance.

The board 14a put in from the previous process confirms board loading by a signal of a board detector (not shown), and stops the conveyance of the entrance room conveyor unit 15. At the same time, the substrate transfer gate valve 4 and the atmospheric release valve 12a are closed, and the vacuum partitioning valve 10a is opened to evacuate.

The vacuum degree of the inlet chamber 1 is detected by a vacuum gauge 13a and the vacuum bypass valve 11a is opened with a degree of vacuum on the atmosphere side slightly lower than the set degree of vacuum so that the inlet chamber 1 and the vacuum chamber 2 are almost the same Set the vacuum degree. This is because, when the vacuum chamber 2 in vacuum and the inlet chamber 1 in the standby state are suddenly connected by opening the vacuum bypass valve 11a, the degree of vacuum of the vacuum chamber 2 is largely changed, to be.

Further, when a differential pressure is generated in the front and rear vacuum chambers of the substrate inlet gate valve 5, a pressing force is generated on the opening face of the valve, and the opening operation of the gate valve can not be performed.

This vacuum partitioning valve is commercially available from a maker (trade name: "gate valve"), and it is recommended that the differential pressure at the time of opening operation is small, and the manufacturer recommends a differential pressure of about 3.9 kPa or less.

When the degree of vacuum of the inlet chamber 1 reaches the set value, the substrate inlet gate valve 5 is opened and the substrate 14a is driven to the inlet chamber conveyor portion 15 and the substrate heating mechanism conveyor portion 16 at the synchronous speed , And the substrate is carried into the vacuum chamber (2).

Further, the substrate 14b is stopped in the substrate heating mechanisms 17a and 17b by a substrate position detector (not shown) of the substrate heating mechanism conveyor unit 16. [

At this substrate heating position, the substrate is heated by the substrate heating mechanisms 17a and 17b. As a method of heating a substrate in a vacuum, there is no atmosphere for transferring heat, so a far-infrared heater using radiant heat or the like is used. As shown in the substrate heating mechanisms 17a and 17b of FIG. 1, And a far infrared heater or the like is disposed. The far infrared ray heater or the like has a thermocouple embedded therein and is connected to a temperature controller for temperature control.

In order to equalize the temperature distribution of the substrate, the heater zone is divided into three parts, that is, upstream, middle, and downstream in the substrate flow direction, and divided into three at both ends and the center in the width direction. .

The surface temperature of the substrate 14b heated by the substrate heating mechanisms 17a and 17b is measured by the substrate temperature detectors 18a and 18b and the temperature is controlled by the temperature controller based on the measured data.

For example, the substrate heating time is fixed by the line speed, the set value of the temperature controller is determined with reference to the temperature measurement value of the sample substrate for confirmation, and the deviation from the measured value of the actually flowing substrate temperature is fed back Infrared heater or the like.

As a method for measuring the substrate temperature in the vacuum chamber 2, a noncontact type temperature detector is preferable in view of scratches on the substrate or attachment of foreign matter.

As an example of the noncontact type temperature detection method, an airtight box for a temperature detector is provided in a vacuum chamber 2, and a radiation thermometer (measuring the amount of infrared ray radiated from an object called a blackbody radiation and measuring temperature ). ≪ / RTI >

Fig. 1 shows a state at the time of starting lamination.

The lamination roll 26 is clamped with the substrate 14c therebetween at the position of the laminated film front end portion 25 by using an air cylinder or the like not shown in the upper and lower rolls of the lamination roll 26, And drives the lamination roll 26 to rotate. A servo motor or a speed control motor, not shown, is used as the rotation driving source to start the lamination operation.

The laminated film 30 is attached to the lamination roll 26 and the clamping of the lamination roll 26 is released at the position of the lamination end portion by the length of the laminated film set with respect to the length of the substrate 14c, .

At this time, the conveying speed of the substrate carry-out conveyor 31 is synchronized with the laminating speed.

The substrate 14d to which the laminated film 30 is adhered is conveyed to the outlet chamber delivery conveyor portion 32 at a synchronous speed because the outlet chamber 3 is already in a vacuum state and the substrate outlet gate valve 6 is descending to be in the open state, To the position of the substrate 14e of the outlet chamber 3, as shown in Fig.

The substrate exit gate valve 6 is closed and the atmospheric release valve 12c is opened by the transport completion signal of the substrate position detector not shown on the substrate 14e to put the outlet chamber 3 in the standby state . It is confirmed that the outlet chamber 3 is in the standby state in the vacuum system 13c and the substrate discharge gate valve 7 is opened to transfer the substrate 14e on which the laminated film 30 is mounted to the outlet chamber delivery conveyor portion 32, To the next processing apparatus.

The vacuum chamber 2 is always in a vacuum state during operation and is stopped by the laminated film remaining amount detection signal of the film unwinding unit 20 to close the vacuum partitioning valves 10a, 10b and 10c, After the valves 11a and 11b are opened, the atmospheric release valves 12a, 12b, and 12c are opened to put them in a standby state, and doors not shown in the vacuum chamber 2 are opened to replace the laminated films .

As described above, the vacuum lamination apparatus of the laminated film of the present invention has been described based on the embodiments. However, the present invention is not limited to the configurations described in the above embodiments, Can be changed.

The vacuum laminator of the film of the present invention can be used for fine pattern formation by preventing the incorporation of minute bubbles in order to laminate the laminated film under high vacuum.

There is a step of laminating a photosensitive solder resist film (insulating film) in order to protect the surface of the wiring in the final step of forming the wiring pattern. However, since pattern formation has already been completed, There is a problem that air bubbles remain between the substrate and the resist in the atmospheric laminates, and the vacuum press apparatus is presently available. However, since the vacuum chamber is open to the atmosphere every time the substrate is inserted, there is a problem that the processing speed is slow. There is an application as an alternative to this vacuum press apparatus.

1: entrance room
2: Vacuum room
3: Outlet room
4: Substrate transfer gate valve
5: Substrate inlet gate valve
6: Substrate exit gate valve
7: Substrate removal gate valve
8: Vacuum pump
9: Vacuum manifold
10a, 10b, 10c: vacuum compartment valve
11a, 11b: Vacuum bypass valve
12a, 12b, 12c: atmospheric release valve
13a, 13b and 13c:
14a, 14b, 14c, 14d, 14e:
15: entrance room conveyor part
16: substrate heating mechanism conveyor part
17a and 17b: a substrate heating mechanism
18a, 18b: substrate temperature detector
19: Substrate feeding conveyor section
20: Film unwinding unit (film transport means)
21: laminated film
22: Half-cut unit
23: Film take-out adjusting unit (film length adjusting mechanism)
24: knife edge portion
25: laminated film tip
26: lamination roll
27: Protective film
28: Protective Film Transfer Roll
29: protective film winding unit (film carrying means)
30: laminated finish laminated film
31: Substrate carry-out conveyor part
32: Exit chamber conveying part

Claims (4)

In a vacuum laminating apparatus for a film to be peeled off from a film and to be attached to the substrate while the substrate is being conveyed by the conveying means in the vacuum chamber, the length of the film to be adhered is changed A film length adjusting mechanism for measuring the length of the substrate before lamination and changing the holding length of the film in accordance with the length of the substrate measured between the half cut position and the knife edge portion provided near the lamination roll, The film before peeling the protective film from which the holding length of the film is changed by the film length adjusting mechanism is half cut at the position of the film to be attached and the film is conveyed by the film conveying means in the state of being continuous by the protective film, To the edge of the knife. ≪ RTI ID = 0.0 > 8. < / RTI > The vacuum laminating apparatus for a film according to claim 1, wherein the inside of the vacuum chamber is made to have an airtight state with a degree of vacuum of 0.5 kPa or less and the film is laminated. The film vacuum laminating apparatus according to any one of claims 1 to 3, further comprising a substrate heating mechanism for heating the substrate in the vacuum chamber in all the steps of the laminating process. The film heating apparatus according to claim 3, characterized in that the temperature of the substrate is measured at the outlet of the substrate heating mechanism, and the measured temperature is fed back to the temperature control section of the substrate heating mechanism to automatically control the heating temperature of the substrate Laminating device.

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