TW201637075A - Vacuum laminating device for film - Google Patents

Abstract

To provide a vacuum laminating device for film, which can proceed lamination in high vacuum, for example, below 0.5kPa degree of vacuum. It has the following feature: To change the length of pasted lamination film (21) according to the length of the put-in substrate (14a), measure the length of substrate (14a) before lamination. According to the measured length of substrate (14a), a film length adjustment mechanism (23) changes the kept length of lamination film (21) between the half-cut position and the knife edge part (24) disposed near a lamination roller (26). Peel the lamination film (21) laminated before the protection film (27) which changes the kept length of lamination film (21) by the film length adjustment mechanism (23). Proceed half-cut at the length position of pasted lamination film (21). The lamination film (21) is conveyed to a knife edge part (24) at a continuous state of protection film (27) by film conveying means (20, 29).

Description

Film vacuum laminating device

The present invention relates to a vacuum lamination apparatus for a film, and more particularly to a laminated vacuum apparatus for laminating a laminated film such as a photosensitive dry film for pattern formation on a surface of a printed substrate in a vacuum.

In the case where the printed circuit board (hereinafter referred to simply as "substrate") is continuously innovated around a mobile phone or the like, in particular, the size and weight of the substrate are important.

In the miniaturization of the substrate, the pattern of the substrate is miniaturized and the multilayer of the substrate is progressing, and the substrate is made thinner in terms of weight reduction.

Here, the pattern formation is mainly referred to as a photolithography engineer, and a laminated film such as a photosensitive dry film is laminated on a copper clad laminate, and then exposed, developed, etched, or plated to form a pattern.

A photosensitive dry film or the like is mainly composed of a laminated film having a three-layer structure, and a resist layer having a photosensitive/thermosetting property is applied onto a base film made of a polyester film or the like, and a polyethylene layer is laminated thereon. It is formed of three layers of a protective film formed of a film or the like.

Hereinafter, the photosensitive dry film or the like is referred to as a laminated film (in the present specification, it may be simply referred to as "film").

In the lamination process for pattern forming of a printed circuit board, the protective film of the laminated film is peeled off, and the resist film is heated/pressurized from the base film as a laminating roll of a thermocompression bonding roll, and the laminated film is thermocompression bonded thereto. Copper clad laminate.

In the main use of the vacuum lamination apparatus, there are a substrate which requires high reliability, a vacuum lamination in which a laminated film is formed for fine pattern formation, or a concavo-convex substrate in which a wiring pattern or the like is formed on the surface of the substrate in the manufacturing process of the multilayer substrate. On the surface, a photosensitive solder resist film (insulating film) or the like is vacuum laminated.

The purpose of laminating the laminated film in a vacuum is to prevent microbubbles which are caused by poor adhesion from being mixed between the surface of the substrate and the laminated film which are adhered at the time of lamination, but in recent years, the pattern has been miniaturized. When laminated on a flat copper-clad laminate, micro-bubbles (10 μm or less in diameter) are mixed into the fine unevenness on the surface of the substrate, which causes a defect. Therefore, a vacuum lamination device is used.

Among them, the surface of a general copper-clad laminate is subjected to rough surface processing having a depth of 10 μm or less, and as a pre-treatment before lamination, the adhesion of the resist is improved. The main rough surface processing method is carried out by chemical polishing using an acid or the like.

Since the resist containing the adhesive component intrudes into the concave portion of the rough surface, the adhesion to the substrate is increased. This is called the quasi-effect.

Due to the rough surface processing, the lamination in the atmosphere is caused by uneven pressurization The insufficient cracking of the resist in the rough concave portion or the insufficient melting of the resist due to uneven heating may cause fine bubbles to remain in the rough concave portion. The lamination in a vacuum greatly improves the embedding property of the resist because the rough recess does not block the atmosphere in which the resist invades.

In the method of laminating under vacuum, it is necessary to separate the atmosphere from the vacuum chamber, and a vacuum lamination device including an inlet chamber, a vacuum chamber, and an outlet chamber has been proposed (see Patent Document 1).

Further, in another vacuum lamination method, it has been proposed to introduce a laminated film into a decompression chamber from the outside of the decompression chamber (atmosphere), and the substrate is carried in/out by crimping without sealing the vacuum chamber. A roll (made of rubber) can vacuum laminate the substrate in a clean state (see Patent Document 2).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] JP-A-4-39038

[Patent Document 2] JP-A-2001-38806

When vacuum lamination is carried out, the presence or absence of fine bubbles is an important issue in terms of quality evaluation.

In order to solve the problem of the presence or absence of microbubbles in the right and left, the evaluation test is used to explain the fact that the degree of vacuum at the time of lamination is large. In one example, the line in the pattern The line (conductor width) and the space (gap between the conductors) are not more than 25 μm, and preferably have a degree of vacuum of 1.3 kPa or less.

In addition, in the future, the line and space for mass production are 10 μm or less, and those requiring a high vacuum of 0.5 kPa or less are considered.

Therefore, a laminating apparatus under high vacuum which does not exist in the past is required, but in the current situation, there is no problem in the market that a vacuum laminating apparatus which is excellent in productivity under high vacuum is not found in the market.

For example, the vacuum lamination method disclosed in Patent Document 1 has the same structure as the conventional atmosphere laminating apparatus, and is configured by providing an adsorption holding mechanism for transporting and holding the laminated film. In the adsorption and retention of the laminated film, it was found from the test results that the laminated film had a width of 500 mm and an adsorption differential pressure of about 12 kPa was required. Therefore, since the vacuum chamber provided with the laminating apparatus has a configuration in which the degree of vacuum is about 12 kPa or less and the adsorption of the laminated film cannot be performed, it is considered that the vacuum degree cannot be matched.

Further, in Patent Document 2, the base film of the laminated film is introduced from the outside (atmosphere side) of the decompression chamber, and is hermetically sealed by vacuum sealing, but the thickness of the base film is leaked on both sides of the base film. structure.

Therefore, it is not a structure that is completely vacuum-sealed, and it is difficult to maintain a vacuum degree of 0.5 kPa or less without using a large-capacity vacuum pump that exceeds the leak amount.

Further, each time the substrate is carried in/out and the laminated film is introduced, the large-capacity decompression chamber must be opened to the atmosphere and hollowed out, and the processing speed of the predicted line is greatly reduced.

In addition, in the problem of laminating in a vacuum, when a substrate heated by a preheating device in the air is put into a vacuum chamber, the atmosphere around the substrate disappears due to hollowing, so the surface temperature of the substrate is lowered. . Especially in thin-plate substrates with a large demand, the substrate temperature due to heat release is significantly reduced. The lowering temperature varies depending on the thickness of the substrate, etc., but the test results of the substrate having a substrate thickness of 0.2 mm cause a decrease in the substrate temperature of about 10 °C.

As described above, when the laminated film is laminated in a vacuum, the temperature of the substrate before lamination is lowered, and the melting of the resist is insufficient, so that the adhesion of the resist is lowered.

According to the countermeasure, the substrate temperature can be measured at the entrance of the vacuum chamber, the lamination speed can be lowered, and the resist heating time can be lengthened, but the productivity is lowered.

Among them, the general recommended condition for laminated film manufacturers is to recommend a substrate heating temperature of 50 to 60 ° C for the pre-lamination substrate temperature, and a lamination speed of about 3 m/min.

The substrate preliminary heating device provided before the laminating device used in the atmosphere is generally formed by a cartridge heater or hot air circulation, and the gas ambient temperature in the furnace is set to a constant heating mode, and the heating furnace is measured. The gas ambient temperature inside is controlled by feedback. However, since there is no atmosphere in the vacuum, there is a problem that the temperature of the gas in the heating furnace cannot be measured.

The present invention has been made in view of the problems of the above-mentioned conventional film laminating apparatus to provide, for example, a vacuum of 0.5 kPa or less. The vacuum lamination apparatus for laminating a film in a vacuum is the first object.

Further, the present invention is also a second object of providing a vacuum laminating apparatus for a film which can solve the problem that the temperature of the substrate is lowered and the resistance of the resist is lowered during lamination.

In order to achieve the above-described first object, the vacuum lamination device for a film of the present invention is a vacuum lamination device in which a film is transferred by a transfer means and a film is peeled off from the film and adhered to the film of the substrate while being transported by a transfer means. In order to change the length of the adhered film in accordance with the length of the substrate to be loaded, the length of the substrate is measured before lamination, and between the half-cut position and the edge portion provided near the stacking roller, according to the measured substrate a film length adjusting mechanism that changes the length of the film to maintain the length of the film before the film is held by the film length adjusting mechanism, and the film is half-cut at the length of the film to be adhered, and is transported by the film. According to the method, the film is conveyed to the knife edge portion in a state in which the protective film is continuous, thereby providing a vacuum lamination device which can be laminated, for example, in a high vacuum having a degree of vacuum of 0.5 kPa or less.

Further, in order to achieve the second object, that is, the substrate placed in the vacuum chamber in the atmosphere is evacuated to remove the atmosphere around the substrate, whereby the substrate temperature is lowered, and the substrate temperature is lowered, and during lamination, In order to solve this problem, a substrate heating mechanism for heating a substrate in a pre-lamination process in a vacuum chamber is provided in the vacuum chamber, whereby the substrate before lamination is heated under optimum conditions.

Further, when the substrate preheating device is subjected to temperature control, there is no atmosphere in the vacuum, and therefore the gas ambient temperature in the heating furnace cannot be measured. For this problem, the temperature of the substrate is measured at the outlet of the substrate heating mechanism, and the measurement is performed. The temperature reached is fed back to the temperature control unit of the substrate heating mechanism to automatically control the heating temperature of the substrate.

In the vacuum lamination process for forming a thin pattern of a substrate, the vacuum lamination device for a thin film of the present invention has an effect of improving productivity by improving the quality of the product and the lamination processing speed.

More specifically,

1. Improve productivity by reducing low and low stack processing speed

(1) Since lamination is performed at a high degree of vacuum (0.5 kPa or less), it is possible to prevent the incorporation of fine bubbles which are a cause of defects.

(2) The substrate heating mechanism provided in the vacuum chamber can prevent the temperature of the substrate before lamination from being lowered and the substrate temperature from being constant, whereby the lamination quality for reducing the adhesion of the resist can be stabilized. In addition, in order to prevent the substrate temperature from being lowered, the lamination speed can be increased, and productivity can be improved.

(3) The substrate temperature is measured at the exit of the substrate heating mechanism, and the temperature measurement result is fed back to the substrate heating mechanism, whereby the substrate temperature can be stabilized and the stacking quality can be improved.

2. Other effects

(1) When a laminated film is laminated in a vacuum, the floating foreign matter generated by the device driving unit or the like can be removed from the vacuum chamber by hollow drawing, and mixed. The floating foreign matter between the laminated film and the substrate disappears, and the product defect can be reduced.

(2) Since the water is deposited in a vacuum, the moisture contained in the atmosphere also disappears. Therefore, the moisture mixed between the laminated film and the substrate disappears, the adhesion of the resist increases, and the wiring pattern is mainly used. The oxidation preventing effect of the copper surface of the material.

1‧‧‧ entrance room

2‧‧‧vacuum room

3‧‧‧Exports room

4‧‧‧Substrate loading gate valve

5‧‧‧Substrate inlet gate valve

6‧‧‧Substrate exit gate valve

7‧‧‧Substrate removal gate valve

8‧‧‧Vacuum pump

9‧‧‧Vacuum manifold

10a, 10b, 10c‧‧‧ vacuum zone gate valve

11a, 11b‧‧‧ vacuum bypass valve

12a, 12b, 12c‧‧‧ atmosphere open valve

13a, 13b, 13c‧‧‧ vacuum gauge

14a, 14b, 14c, 14d, 14e‧‧‧ substrates

15‧‧‧ entrance room conveyor belt

16‧‧‧Substrate heating mechanism conveyor belt

17a, 17b‧‧‧ substrate heating mechanism

18a, 18b‧‧‧ substrate temperature detector

19‧‧‧Substrate input conveyor belt

20‧‧‧film roll-out unit (film transfer means)

21‧‧‧Laminated film

22‧‧‧ Half-cut unit

23‧‧‧Film lead-out adjustment unit (film length adjustment mechanism)

24‧‧‧Knife Department

25‧‧‧Laminated film front end

26‧‧‧Laminating rolls

27‧‧‧Protective film

28‧‧‧Protective film feed roller

29‧‧‧Protective film winding unit (film transport means)

30‧‧‧Laminated laminated film

31‧‧‧The substrate is carried out of the conveyor belt

32‧‧‧Export room moved out of the conveyor belt

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an explanatory view showing an embodiment of a vacuum lamination apparatus for a film of the present invention.

Hereinafter, embodiments of the vacuum lamination apparatus for a film of the present invention will be described with reference to the drawings.

Fig. 1 is a view showing an embodiment of a vacuum lamination apparatus for a film of the present invention, showing a state in which a laminated film is vacuum-laminated on both surfaces of a substrate, and a state in which the laminate is instantaneously displayed in the vacuum chamber 2 is shown.

This vacuum laminating apparatus for a film is composed of an inlet chamber 1 in which a substrate is supplied from the atmosphere, a vacuum chamber 2 in which a substrate is preheated in a vacuum to be stacked, and an outlet chamber 3 in which the substrate is carried out to the atmosphere by the vacuum chamber 2; These control devices (not shown) are controlled. However, since the film laminated portion in the vacuum chamber 2 is vertically symmetrical, the symbols on the lower side are omitted.

In FIG. 1, the substrate 14a is carried in by the transport conveyor belt or the like of the left-hand project, and is located in the entrance belt of the entrance chamber 1. 15 Move into the substrate.

Since the vacuum state is formed, the substrate is moved into the gate valve 4, and the vacuum pump 8 performs the hollow drawing to form the inlet chamber 1 in a vacuum state.

The inlet chamber 1 opens the substrate inlet gate valve 5 at substantially the same degree of vacuum as the vacuum chamber 2, and carries the substrate into the substrate heating mechanism conveyor belt portion 16 of the vacuum chamber 2.

The substrate 14b heated by the upper and lower substrate heating mechanisms 17a and 17b provided in the substrate heating mechanism belt portion 16 is moved by a conveyor belt, and the substrate temperature detectors 18a and 18b measure the front and back surface temperatures of the substrate, and feedback control is performed. , the data is sent to the temperature regulator of the substrate heating mechanism.

In the substrate insertion conveyor portion 19, a film width of the laminated film 21 is blended by a substrate alignment device (not shown), and the substrate width direction is aligned.

Further, the substrate length of the substrate 14c to be loaded is measured by the substrate position detector (not shown) and the substrate feed amount of the substrate into the conveyor belt portion 19.

In addition, since the laminated film is adhered to the specified substrate adhesion position at the end of the substrate 14c, the control unit (not shown) controls the substrate to be placed at the stop position of the conveyor unit 19.

In the laminated portion of the vacuum chamber 2, the film unwinding unit (film transfer means) 20 pulls the laminated film 21 from the protective film feed roller 28 to protect the feed of the film 27, and the laminated film 21 is half cut. The position is conveyed to the position of the front end 25 of the laminated film.

At this time, the half-cutting unit 22 is half-cut at a position corresponding to the bonding length of the substrate 14c to be loaded. Therefore, the film-forming film (film length adjusting mechanism) 23 is moved by using a driving device (not shown).

The protective film 27 of the semi-cut residual laminated film 21 is cut to cut the base film and the resist. Instead of cutting the entire thickness of the laminated film 21 as described above, the cutting of the protective film 27, which is the opposite side of the remaining half-cut unit 22, is referred to as half-cutting.

In the knife edge portion 24, the protective film 27 is folded back at an acute angle, and in the state where the protective film 27 is peeled off, the laminated film leading end 25 on which the resist surface is exposed is taken out from the tip end of the blade.

The substrate 14c and the laminated film leading end 25, which are positioned at the laminating position, are stacked up and down by a laminating roller 26, sandwiched by a clamping mechanism (not shown), and laminated while being thermocompression-bonded by a rotation driving mechanism (not shown). At this time, the laminated film 21 is taken out by the rotational driving of the laminating roller 26.

Further, the film unwinding unit 20 optimizes the holding tension of the laminated film 21 at the time of lamination by generating a braking torque by winding a film around the shaft with a torque motor or the like.

Further, the protective film 27 is wound by the protective film feed roller 28 to take out the protective film 27, and is wound and recovered by a protective film winding unit (film transfer means) 29. This protective film feed speed controls the rotation of the protective film feed roller 28 by a servo motor or the like so as to be synchronized with the lamination speed of the laminating rolls 26.

The substrate carrying-out belt unit 31 carries out the conveyance speed of the substrate at the same speed as the stacking speed, and receives the substrate 14d to which the laminated film 30 is adhered to the front and back of the substrate.

At this time, since the substrate 14d is received in the outlet chamber 3, the atmosphere opening valve 12e is closed in the stacking, and the vacuum chamber opening valve 10e is opened to perform the hollow drawing, and the vacuum degree of the vacuum chamber 2 and the outlet chamber 3 is substantially the same pressure, and the vacuum is closed. Zone gate valve 10e.

The degree of vacuum of the outlet chamber 3 is monitored by the vacuum gauge 13c, and the substrate exit gate valve 6 is opened at substantially the same degree of vacuum as the vacuum chamber 2, and the substrate carry-out belt portion 31 and the outlet chamber carry-out belt portion 32 of the outlet chamber 3 are rotated in synchronization. The substrate 14e is carried into the outlet chamber 3.

Next, the substrate exit gate valve 6 is closed, the atmosphere opening valve 12c is opened, the outlet chamber 3 is formed in an atmospheric state, the substrate carry-out gate valve 7 is opened, and the substrate 14e to which the laminated film 30 is adhered is carried out to the secondary engineering device.

Hereinafter, the operation method of the vacuum lamination apparatus of the film and the like will be described in detail.

In order to prepare the operation, in order to form the vacuum chamber 2 and the outlet chamber 3 into a vacuum, the vacuum zone gate valve 10b, the vacuum zone gate valve 10c, and the vacuum bypass valve 11b are opened, and the vacuum manifold 9 belonging to the constant vacuum state is hollowed out. Pull. Since the vacuum bypass valve 11b is opened, since the substrate exit gate valve 6 is opened and closed, the degree of vacuum of the vacuum chamber 2 and the outlet chamber 3 is substantially the same.

The vacuum degree is set by the signal output of the vacuum gauge 13b and the vacuum gauge 13c, and the vacuum zone gate valves 10b and 10c are closed, if the degree of vacuum is When a small leak or the like rises to the atmosphere side, the signals are outputted by the vacuum gauges 13b and 13c in the same manner, and the vacuum section gate valves 10b and 10c are opened to start the hollow drawing, and the degree of vacuum can be kept substantially constant. Further, in another method, a small atmosphere is placed in the vacuum chamber 2 and the outlet chamber 3 by a leak valve or the like (not shown), and the leak valve or the like is opened and closed to control the vacuum discharge with the vacuum pump 8. A method of maintaining the degree of vacuum by equalizing the amount of gas.

The substrate 14a to which the previous project is placed is a signal of a substrate detector (not shown), and it is confirmed that the substrate is carried in, and the conveyance of the inlet chamber conveyor portion 15 is stopped. At the same time, the substrate loading gate valve 4 and the atmosphere opening valve 12a are closed, and the vacuum zone blocking valve 10a is opened to perform the hollow drawing.

The vacuum degree of the inlet chamber 1 is sensed by the vacuum gauge 13a, and the vacuum bypass valve 11a is opened only by the atmospheric side vacuum degree so that the inlet chamber 1 and the vacuum chamber 2 become substantially the same degree of vacuum as compared with the set vacuum degree. . When the vacuum chamber 2 in the vacuum state is suddenly connected to the inlet chamber 1 in the atmospheric state, the vacuum degree of the vacuum chamber 2 is largely changed to prevent the situation.

Further, when a differential pressure occurs in the vacuum chambers before and after the substrate inlet gate valve 5, a pushing force is generated on the opening surface that is closed by the valve, and the opening operation of the gate valve cannot be performed.

The vacuum zone gate valve is commercialized by a manufacturer (trade name "Gate Valve" or the like), and it is preferable that the differential pressure at the time of opening operation is small, and the manufacturer recommends that the differential pressure is about 3.9 kPa or less.

If the degree of vacuum of the inlet chamber 1 reaches the set value, the substrate inlet gate valve 5 is opened, and the substrate 14a is operated at the synchronous speed. 15 and the substrate heating mechanism conveyor belt portion 16, and the substrate is carried into the vacuum chamber 2.

Further, the substrate position detector (not shown) of the substrate heating mechanism conveyance belt 16 stops the substrate 14b in the substrate heating mechanisms 17a and 17b.

At the substrate heating position, the substrate is heated by the substrate heating mechanisms 17a, 17b. The method of heating the substrate in a vacuum does not have a heat transfer atmosphere. Therefore, in order to use a far-infrared heater or the like using radiant heat, as shown in the substrate heating mechanisms 17a and 17b of FIG. 1, the maximum substrate size is exceeded. Area, equipped with far infrared heaters, etc. The far-infrared heater or the like is buried in a thermocouple, and is connected to a temperature regulator to perform temperature control.

Further, in order to uniformize the temperature distribution of the substrate, the heater region is preferably divided into three upstream and midstream/downstream directions in the flow direction of the substrate, and three segments at both ends and the center of the substrate in the wide direction, and the total is 9 The divided regions are divided for temperature control.

The surface temperatures of the substrates 14b heated by the substrate heating mechanisms 17a and 17b are measured by the substrate temperature detectors 18a and 18b, and the temperature is controlled by the temperature controller.

For example, the substrate heating time is fixed by the line speed, and the temperature measurement value of the sample substrate for the prior confirmation is used to determine the set value of the temperature regulator, and the feedback is deviated from the measured value of the substrate temperature actually flowing. The temperature control of the far infrared ray heater or the like is performed.

In terms of measuring the temperature of the substrate in the vacuum chamber 2, A non-contact temperature detector is preferred in view of damage or adhesion of foreign matter to the substrate.

In the case of the non-contact type temperature detecting method, an airtight box for a temperature detector is provided in the vacuum chamber 2, and an observation window is passed over the glass to emit a thermometer (measured by the object being irradiated as blackbody radiation) The amount of infrared rays is converted into temperature) and measured.

Fig. 1 shows the state at the start of lamination.

The upper and lower rolls of the laminating rolls 26 are placed on the substrate 14c at a position where the film front end 25 is laminated by using an air cylinder (not shown), and the laminating rolls 26 are sandwiched, and the laminating rolls 26 are rotationally driven while being nipped. The rotary drive source starts a laminating operation using a servo motor, a speed control motor, or the like (not shown).

The laminated film 30 is adhered by the laminating roller 26, and the lamination film is attached to the stacking end position at the position of the lamination end by the length of the lamination film set by the length of the substrate 14c, thereby completing the laminating operation.

At this time, the conveyance speed of the substrate carry-out conveyor portion 31 is synchronized with the stacking speed.

The outlet chamber 3 is in a vacuum state, and the substrate exit gate valve 6 is lowered to be in an open state. Therefore, the substrate 14d to which the laminated film 30 is adhered is continuously conveyed to the substrate 14e of the outlet chamber 3 at the synchronous speed by the outlet chamber carry-out conveyor portion 32. position.

The substrate exit gate valve 6 is closed by the conveyance completion signal of the substrate position detector (not shown) of the substrate 14e, and the atmosphere opening valve 12c is opened to form the outlet chamber 3 in an atmospheric state. Confirm with vacuum gauge 13c The outlet chamber 3 is in an atmospheric state, the substrate carrying-out gate valve 7 is opened, and the substrate 14e to which the laminated film 30 is adhered is carried out out of the conveyor belt portion 32 using the outlet chamber, and is carried out to the secondary engineering device.

The vacuum chamber 2 is in a normal vacuum state during operation, and stops the operation of the laminated film remaining amount sensing signal of the film unwinding unit 20, and closes the vacuum zone blocking valves 10a, 10b, and 10c, and opens the vacuum bypass valves 11a and 11b. The atmosphere opening valves 12a, 12b, and 12c are opened to be in an atmospheric state, and a threshold (not shown) of the vacuum chamber 2 is opened to exchange the laminated film.

The vacuum lamination apparatus of the laminated film of the present invention is described above based on the examples, but the present invention is not limited to the configuration described in the above embodiments, and the configuration can be appropriately changed without departing from the scope of the invention.

[Industrial availability]

Since the vacuum lamination device for a film of the present invention laminates a laminated film under high vacuum, it is possible to use a fine pattern by preventing the incorporation of fine bubbles.

In addition, in the final work of wiring pattern formation, in order to protect the surface of the wiring, there is a process of laminating a photosensitive solder resist film (insulating film). Since the pattern has been formed, the surface of the substrate has irregularities in the height of the wiring pattern. The lamination in the atmosphere is a problem in which air bubbles remain between the substrate and the resist. Although the vacuum pressing device is used in the present, the processing speed is increased by opening the vacuum chamber every time the substrate is loaded. Slow subject. There is a use as an alternative to the vacuum pressing device.

1‧‧‧ entrance room

2‧‧‧vacuum room

3‧‧‧Exports room

4‧‧‧Substrate loading gate valve

5‧‧‧Substrate inlet gate valve

6‧‧‧Substrate exit gate valve

7‧‧‧Substrate removal gate valve

8‧‧‧Vacuum pump

9‧‧‧Vacuum manifold

10a, 10b, 10c‧‧‧ vacuum zone gate valve

11a, 11b‧‧‧ vacuum bypass valve

12a, 12b, 12c‧‧‧ atmosphere open valve

13a, 13b, 13c‧‧‧ vacuum gauge

14a, 14b, 14c, 14d, 14e‧‧‧ substrates

15‧‧‧ entrance room conveyor belt

16‧‧‧Substrate heating mechanism conveyor belt

17a, 17b‧‧‧ substrate heating mechanism

18a, 18b‧‧‧ substrate temperature detector

19‧‧‧Substrate input conveyor belt

20‧‧‧film roll-out unit (film transfer means)

21‧‧‧Laminated film

22‧‧‧ Half-cut unit

23‧‧‧Film lead-out adjustment unit (film length adjustment mechanism)

24‧‧‧Knife Department

25‧‧‧Laminated film front end

26‧‧‧Laminating rolls

27‧‧‧Protective film

28‧‧‧Protective film feed roller

29‧‧‧Protective film winding unit (film transport means)

30‧‧‧Laminated laminated film

31‧‧‧The substrate is carried out of the conveyor belt

32‧‧‧Export room moved out of the conveyor belt

Claims (4)

A vacuum laminating apparatus for a film, which is a vacuum laminating apparatus for transferring a film to a film by peeling a protective film from a film while being transported by a transfer means in a vacuum chamber, and is characterized in that: The length of the substrate to be loaded changes the length of the adhered film, and the length of the substrate is measured before lamination, and the film is changed between the half-cut position and the edge portion provided near the stacking roll in accordance with the measured length of the substrate. The film length adjusting mechanism for holding the length, the film before peeling off the protective film which changes the holding length of the film by the film length adjusting mechanism, and half-cutting at the length of the adhered film, and the film is transported by the film transfer means It is conveyed to the knife edge portion in a state in which the protective film is continuous. A vacuum laminating apparatus for a film according to the first aspect of the invention, wherein the vacuum chamber is formed in an airtight state having a degree of vacuum of 0.5 kPa or less, and the film is laminated. A vacuum laminating apparatus for a film according to the first or second aspect of the invention, wherein the vacuum chamber is provided with a substrate heating mechanism for heating the substrate before the stacking process. The vacuum lamination device for a film according to the third aspect of the invention, wherein the temperature of the substrate is measured at an outlet of the substrate heating mechanism, and the measured temperature is fed back to the temperature control portion of the substrate heating mechanism to automatically control the heating temperature of the substrate. .