KR20160085620A - 유연 기판의 제조 방법 - Google Patents

유연 기판의 제조 방법 Download PDF

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Publication number
KR20160085620A
KR20160085620A KR1020150002849A KR20150002849A KR20160085620A KR 20160085620 A KR20160085620 A KR 20160085620A KR 1020150002849 A KR1020150002849 A KR 1020150002849A KR 20150002849 A KR20150002849 A KR 20150002849A KR 20160085620 A KR20160085620 A KR 20160085620A
Authority
KR
South Korea
Prior art keywords
layer
separation layer
peeling
flexible substrate
forming
Prior art date
Application number
KR1020150002849A
Other languages
English (en)
Korean (ko)
Inventor
안명용
박성환
유병묵
Original Assignee
동우 화인켐 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Priority to KR1020150002849A priority Critical patent/KR20160085620A/ko
Priority to TW104121904A priority patent/TW201626872A/zh
Priority to JP2015140929A priority patent/JP2016127257A/ja
Priority to CN201510423639.5A priority patent/CN105789116A/zh
Publication of KR20160085620A publication Critical patent/KR20160085620A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/288—Removal of non-metallic coatings, e.g. for repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
KR1020150002849A 2015-01-08 2015-01-08 유연 기판의 제조 방법 KR20160085620A (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020150002849A KR20160085620A (ko) 2015-01-08 2015-01-08 유연 기판의 제조 방법
TW104121904A TW201626872A (zh) 2015-01-08 2015-07-06 可撓基板製備方法
JP2015140929A JP2016127257A (ja) 2015-01-08 2015-07-15 柔軟基板の製造方法
CN201510423639.5A CN105789116A (zh) 2015-01-08 2015-07-17 柔软基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150002849A KR20160085620A (ko) 2015-01-08 2015-01-08 유연 기판의 제조 방법

Publications (1)

Publication Number Publication Date
KR20160085620A true KR20160085620A (ko) 2016-07-18

Family

ID=56359793

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150002849A KR20160085620A (ko) 2015-01-08 2015-01-08 유연 기판의 제조 방법

Country Status (4)

Country Link
JP (1) JP2016127257A (ja)
KR (1) KR20160085620A (ja)
CN (1) CN105789116A (ja)
TW (1) TW201626872A (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101757430B1 (ko) * 2016-09-27 2017-07-12 동우 화인켐 주식회사 플렉서블 기능성 필름과 그 제조방법
CN110754140A (zh) * 2017-06-23 2020-02-04 富士胶片株式会社 配线基板的制造方法及导电性墨液
JP6896579B2 (ja) * 2017-09-27 2021-06-30 株式会社東芝 構造体、配線基板、配線基板用基材及び銅張積層板
JP7232594B2 (ja) * 2018-05-25 2023-03-03 三菱製紙株式会社 導電性部材の製造方法
JP7232595B2 (ja) * 2018-05-25 2023-03-03 三菱製紙株式会社 導電性材料の製造方法
CN111341715B (zh) * 2018-12-19 2022-11-08 瀚宇彩晶股份有限公司 电子装置及其制作方法
CN111244229B (zh) * 2020-02-11 2021-07-06 信利半导体有限公司 一种可挠曲的透明薄膜太阳能电池制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191865B1 (ko) 2011-04-20 2012-10-16 한국기계연구원 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101191865B1 (ko) 2011-04-20 2012-10-16 한국기계연구원 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판

Also Published As

Publication number Publication date
JP2016127257A (ja) 2016-07-11
TW201626872A (zh) 2016-07-16
CN105789116A (zh) 2016-07-20

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