KR20160078227A - Cutting apparatus and cutting method - Google Patents

Cutting apparatus and cutting method Download PDF

Info

Publication number
KR20160078227A
KR20160078227A KR1020150153623A KR20150153623A KR20160078227A KR 20160078227 A KR20160078227 A KR 20160078227A KR 1020150153623 A KR1020150153623 A KR 1020150153623A KR 20150153623 A KR20150153623 A KR 20150153623A KR 20160078227 A KR20160078227 A KR 20160078227A
Authority
KR
South Korea
Prior art keywords
cutting
rotary blade
displacement
amount
displacement sensor
Prior art date
Application number
KR1020150153623A
Other languages
Korean (ko)
Other versions
KR101749422B1 (en
Inventor
쇼이치 가타오카
히데카즈 아즈마
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20160078227A publication Critical patent/KR20160078227A/en
Application granted granted Critical
Publication of KR101749422B1 publication Critical patent/KR101749422B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/7999—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto for disconnecting

Abstract

In the cutting apparatus according to the present invention, the displacement amount in the axial direction and the displacement amount in the radial direction of the rotary blade are measured using one displacement sensor.
In the cutting apparatus according to the present invention, the spindle 1 is provided with the flange 6 having the tapered portion 5 for holding the rotary blade 4 sandwiched therebetween. A displacement sensor 7 is provided at a position facing the tapered portion 5 of the flange 6 in the spindle body 2. [ The amount of displacement in the axial direction and the amount of displacement in the radial direction can be measured by measuring the distance from the distal end of the displacement sensor 7 to the tapered portion 5 of the flange 6. [ The displacement amount of the rotary shaft 3 expanded and contracted by the thermal expansion can be corrected and the position of the center line of the rotary blade 4 can be precisely adjusted to the position of the cutting line of the sealed substrate. The magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped by grasping the vibration of the rotary blade 4 as the amount of displacement in which the distance from the distal end of the displacement sensor 7 to the tapered portion 5 is displaced.

Description

CUTTING APPARATUS AND CUTTING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus and a cutting method for producing a plurality of individualized pieces by cutting a piece to be cut.

A substrate made of a printed board or a lead frame is virtually divided into a plurality of regions in a lattice shape and a chip type element (for example, a semiconductor chip) is mounted on each region, and then the entire substrate is resin- . The finished substrate is cut off by a cutting mechanism using a rotating blade or the like, and the product is divided into individual areas.

BACKGROUND ART Conventionally, in a cutting apparatus, a predetermined region of a sealed substrate is cut by a cutting means such as a rotary blade by using a cutting mechanism. First, the sealed substrate is placed on the cutting table and adsorbed. Next, the sealed substrate is aligned (aligned). By alignment, the position of a virtual cut line dividing a plurality of regions is set. Next, the cutting table on which the sealed substrate is sucked and the cutting mechanism are relatively moved. The cutting water is sprayed onto the cut portion of the substrate that has been completely sealed, and the seal-completed substrate is cut along the cut line set on the seal-completed substrate by the cutting mechanism. By cutting the encapsulated substrate, the individualized product is produced.

In the cutting mechanism, the rotary blade and the motor are connected via a rotary shaft. The rotating blade is rotated at a high speed by the motor to cut the sealed substrate. When cutting of the sealed substrate is repeated using the cutting mechanism, the rotating shaft rotates at a high speed to generate heat. By heat generation, the rotary shaft expands thermally and extends in the direction along the rotary shaft (axial direction). When the rotary shaft is extended in the axial direction, the rotary blade attached to the tip of the rotary shaft is also displaced in the axial direction. Therefore, the position of the rotary blade in the cutting mechanism and the position of the cutting line of the sealed substrate deviate from each other. There is a fear that if the position of the rotary blade is deviated from the position of the cutting line, the finished substrate is broken, the product may be damaged or deteriorated.

Depending on the structure of the sealed substrate and the condition for cutting the sealed substrate, the cutting load at the time of cutting may be increased. When the cutting load at the time of cutting becomes large, the vibration of the rotary blade becomes large. If the vibration of the rotating blade is large, the rotating blade may be damaged, thereby deteriorating the quality of the product. Further, the wear amount of the rotary blade is increased, and the service life of the rotary blade is reduced. Therefore, in the cutting mechanism, it is important to grasp the magnitude of the amplitude of the vibration during expansion and contraction of the rotary shaft at the time of cutting, and feedback with the optimum cutting conditions.

The present invention relates to a dicing apparatus capable of simply positioning a cutting position. The dicing apparatus includes a cutter for cutting a semiconductor wafer, a microscope for confirming a cutting position of the semiconductor wafer, And a cutting position control means for controlling the cutting position by the cutter on the basis of the distance between the measuring means and the microscope and the distance measured by the measuring means " (See, for example, paragraphs [0008] of Patent Document 1, Figs. 1 and 2).

Patent Document 1: JP-A-6-310596

However, the dicing apparatus disclosed in Patent Document 1 has the following problem. As shown in Fig. 1 of Patent Document 1, the reference line 18 is exposed in the field of view of the microscope 13. Fig. The distance D 1 between the reference line 18 and the tip of the optical displacement sensor 14 is known in advance. The optical displacement sensor 14 is disposed at a position opposite to the blade 11 and measures the distance D 2 from the tip of the optical displacement sensor 14 to the blade 11 and outputs an analog voltage corresponding to the distance D 2 . The NC apparatus 16 performs numerical control of the entire dicing apparatus such as the spindle motor 12 in addition to the table drive apparatus 17.

In such an apparatus, since the optical displacement sensor 14 is used, it is easily affected by water, dirt, and the like attached to the blade 11. Therefore, there is a possibility that an error occurs in the measurement of the distance D 2 from the optical displacement sensor 14 to the blade 11. Further, since the means for measuring the vibration in the radial direction (radial direction) of the blade 11 being cut is not provided, it can not be judged whether or not the cutting is performed efficiently.

The present invention solves the above-mentioned problems, and it is an object of the present invention to provide a cutting apparatus which is provided with a measuring unit facing a predetermined area of a fixing member (for example, a flange) for fixing a rotary blade, And it is an object of the present invention to provide a cutting apparatus and a cutting method which can measure a displacement amount of a cutting position and grasp the cutting efficiency.

In order to solve the above problems, a cutting apparatus according to the present invention comprises:

A table on which the object to be cut is placed; a cutting mechanism for cutting the object to be cut; and a moving mechanism for relatively moving the table and the cutting mechanism, wherein the object to be cut is cut along the cutting line As a cutting apparatus to be used at the time of cutting,

A rotating shaft provided in the cutting mechanism,

A rotary blade attached to a distal end of the rotary shaft,

Two fixing members respectively provided on both side surfaces of the rotary blade for fixing the rotary blade therebetween,

And measurement means provided in the cutting mechanism with a predetermined region of the fixing member facing the predetermined region,

The displacement amount of the rotary blade displaced is measured by detecting the displacement of the fixing member in the predetermined region by the measuring means,

The amount of displacement includes a first amount of displacement caused by the displacement of the rotary blade along the axial direction of the rotary shaft and a second amount of displacement caused by the displacement of the rotary blade along the radial direction of the rotary shaft do.

In the cutting apparatus according to the present invention, the relative positional relationship between the rotary blade and the workpiece is corrected based on the first amount of displacement, whereby the position of the rotary blade and the position of the cutting line are matched.

In the cutting apparatus according to the present invention, the characteristic relating to the vibration of the rotary blade is measured based on the second displacement amount.

Further, in the cutting apparatus according to the present invention, the predetermined region has a tapered portion formed so that the thickness on the center side and the thickness on the peripheral side are different from each other.

Further, in the cutting apparatus according to the present invention, the predetermined region includes an end portion formed perpendicular to the surface of the rotary blade at the outer peripheral portion of the fixing member.

In the cutting apparatus according to the present invention, the predetermined region is made of a material having conductivity.

Further, in the cutting apparatus according to the present invention, the measuring means includes an eddy current type displacement sensor.

Further, in the cutting apparatus according to the present invention, the object to be cut is a sealed substrate.

Further, in the cutting apparatus according to the present invention, there is an aspect in which the to-be-cut object is a substrate in which a functional element corresponding to each of a plurality of regions is formed.

Means for Solving the Problems In order to solve the above problems,

A step of disposing a blank to be cut on a table, a step of relatively moving the cutting tool having a rotary blade and the table, and a step of relatively moving the cutting mechanism and the table, A cutting method comprising cutting along a cutting line,

A step of rotating the rotary blade fixed to the tip of a rotary shaft provided in the cutting mechanism by two fixing members provided on both side surfaces of the rotary blade,

A step of opposing the measuring means provided in the cutting mechanism to a predetermined region of the fixing member,

And measuring the amount of displacement of the rotary blade by detecting the displacement of the fixing member in the predetermined area,

Wherein the step of measuring the amount of displacement comprises:

Measuring a first amount of displacement due to displacement of the rotary blade along an axial direction of the rotary shaft;

And measuring a second displacement amount caused by the displacement of the rotary blade along the radial direction of the rotary shaft.

The cutting method according to the present invention includes a step of adjusting the position of the rotary blade and the position of the cutting line by correcting the relative positional relationship between the rotary blade and the workpiece to be cut based on the first amount of displacement .

The cutting method according to the present invention includes a step of measuring a characteristic relating to the amplitude of vibration of the rotary blades based on the second amount of displacement.

Further, in the cutting method according to the present invention, the predetermined region has a tapered portion formed so that the thickness on the center side and the thickness on the peripheral side are different from each other.

Further, in the cutting method according to the present invention, the predetermined region includes an end portion formed perpendicularly to the surface of the rotary blade at the outer peripheral portion of the fixing member.

Further, in the cutting method according to the present invention, the predetermined region is made of a conductive material.

Further, in the cutting method according to the present invention, the measuring means includes an eddy current type displacement sensor.

Further, in the cutting method according to the present invention, the object to be cut is a sealed substrate.

Further, in the cutting method according to the present invention, there is an aspect in which the object to be cut is a substrate in which a functional element corresponding to each of a plurality of regions is formed.

According to the present invention, there is provided a cutting apparatus comprising a table on which a workpiece is placed, a cutting mechanism for cutting the workpiece, and a moving mechanism for relatively moving the table and the cutting mechanism. The cutting mechanism is provided with two fixing members for fixing the rotary blade on both sides of the rotary blade and the rotary blade attached to the tip of the rotary shaft. The measuring device is provided on the cutting mechanism so as to face a predetermined area of the fixing member. The first displacement amount at which the rotary blade is displaced along the axial direction and the second displacement amount at which the rotary blade is displaced along the radial direction can be measured by detecting the displacement in the predetermined region of the fixing member. Therefore, it is possible to measure both the amount of displacement in the axial direction and the amount of displacement in the radial direction by using one measurement means.

Figs. 1 (a) to 1 (c) are schematic views respectively showing a configuration of a spindle and displacement of a rotary blade in Embodiment 1 of the cutting apparatus according to the present invention, wherein (a) (b) is a schematic view showing a state in which the rotary blade is displaced in the axial direction, and (c) is a schematic diagram showing a state in which the rotary blade is displaced in the radial direction.
Fig. 2 (a) to Fig. 2 (c) are schematic views each showing a state in which the rotary blade shown in Fig. 1 moves up and down, (C) is a schematic view showing a state in which the rotary blade has moved to the lowermost part.
3 is a schematic view showing a configuration of an eddy current type displacement sensor used in the present embodiment.
4 is a correlation diagram showing the relationship between the distance measured by the eddy current type displacement sensor and the output voltage versus time.
5A and 5B are schematic views each showing a mounting position of a displacement sensor according to a second embodiment of the cutting apparatus according to the present invention, wherein (a) shows the case where the displacement sensor is attached in the horizontal direction ( b) is a schematic view showing the case where the displacement sensor is attached in the vertical direction.
Fig. 6 is a plan view showing the outline of a cutting apparatus in Embodiment 3 of the cutting apparatus according to the present invention. Fig.

As shown in Fig. 1, in the cutting apparatus, a rotary shaft 3, a rotary blade 4 attached to the tip end of the rotary shaft 3, and a rotary blade 4 are provided on the spindle 1, A flange (fixing member) 6 having a tapered portion 5 for fitting and fixing is provided. A displacement sensor 7 is provided at a position facing the tapered portion 5 of the flange 6 in the spindle body portion 2. [ An eddy-current displacement sensor is used as the displacement sensor (7). The axial displacement amount and the radial displacement amount can be measured by measuring the distance from the distal end of the displacement sensor 7 to the tapered portion 5 of the flange 6. [ The displacement amount of the rotary shaft 3 expanded and contracted by the thermal expansion can be corrected and the position of the center line of the rotary blade 4 can be precisely adjusted to the position of the cutting line of the sealed substrate. The magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped by grasping the vibration of the rotary blade 4 as the amount of displacement in which the distance from the distal end of the displacement sensor 7 to the tapered portion 5 is displaced.

(Example 1)

Embodiment 1 of a cutting apparatus according to the present invention will be described with reference to Figs. 1 to 4. Fig. Any drawings in this application document are schematically illustrated by being omitted or exaggerated appropriately for the sake of clarity. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

1 (a), a spindle 1 serving as a cutting mechanism has a rotating shaft 3 connected to a spindle main body 2 and a spindle motor (not shown) And a rotary blade (4). The rotary blade 4 is fixed to the rotary shaft 3 by inserting both surfaces (both sides of the rotary blade 4) into two flanges 6 having tapered portions 5, for example. The flange 6 has a toroidal shape (toroidal shape). The tapered portion 5 of the flange 6 has an angle of 30 to 50 degrees with respect to the rotary blade 4. [ In particular, it is preferable to have an angle of 40 degrees. The flange 6 is formed of a conductive material (e.g., metal) such as stainless steel or chrome steel. The tapered portion 5 may be provided on one of the flanges 6 of the two flanges 6. It is preferable that the tapered portion 5 is provided on the flange 6 near the spindle body portion 2. [ 1, the thickness of the center side of the tapered portion 5 is formed larger than the thickness of the peripheral side. Conversely, the thickness of the center side of the tapered portion 5 may be smaller than the thickness of the peripheral side.

The spindle 1 is provided with a displacement sensor 7 at the tip of the spindle body 2 as means for measuring the distance from the tip of the spindle body 2 to the rotary blade 4. [ The displacement sensor 7 is provided at a position opposite to the tapered portion 5 of the flange 6. The displacement sensor 7 measures the distance from the distal end of the displacement sensor 7 to the tapered portion 5 of the flange 6. As the displacement sensor 7, for example, it is preferable to use an eddy current type displacement sensor for measuring a displacement distance by detecting an eddy current.

The distance from the tip end of the displacement sensor 7 to the tapered portion 5 of the flange 6 is measured in a noncontact manner by using an eddy current type displacement sensor as the displacement sensor 7 in the spindle 1. [ The distance from the tip end of the displacement sensor 7 to the tapered portion 5 of the flange 6 is d0 and the distance from the tip of the spindle body portion 2 to the tapered portion 5 is d0, And the distance to the center line in the thickness direction of the blade 4 is L0. In the initial state, in the relationship of L0 = d0 + alpha, the value of alpha is determined by the size of the displacement sensor 7, the position and angle of the tapered portion 5 in the flange 6, Thickness and the like. The value of? represents a fixed value that is hardly influenced by heat. Therefore, even if the rotary shaft 3 is expanded in the axial direction by thermal expansion after the start of cutting of the sealed substrate, the distance from the tip end of the displacement sensor 7 to the tapered portion 5 of the flange 6 is measured , The distance from the spindle body portion 2 to the center line of the rotary blade 4 can be obtained.

The sealed substrate is cut by a rotating blade 4 that rotates at a high speed by driving a spindle motor (not shown). As shown in Fig. 1 (b), when cutting of the sealed substrate continues, the rotating shaft 3 rotating at a high speed generates heat, and is gradually expanded in the axial direction (+ X direction in the drawing) . The rotary blade 3 is displaced in the + X direction by an amount corresponding to the elongation of the rotary shaft 3 since the rotary shaft 3 is elongated in the + X direction. When the measurement distance from the tip end of the displacement sensor 7 to the tapered portion 5 is dX at some point since the start of cutting of the seal finished substrate, the distance from the tip of the spindle body portion 2 to the rotary blade 4, The distance LX to the center line of the center line becomes LX = dX + alpha. As the rotary shaft 3 thermally expands, the rotary shaft 3 is elongated in the X direction by (dX-d0). Therefore, when the sealed substrate is cut, the position of the rotary blade 4 is corrected by the amount of the inserted dx-d0 of the rotary shaft 3, and the position of the cutting edge of the rotary blade 4 It is possible to cut the sealed substrate with the position precisely adjusted.

As shown in Fig. 1 (c), the rotary blade 4 may be displaced in the radial direction by receiving a cutting load during cutting the substrate. By receiving the displacement in the radial direction, the rotary blade 4 vibrates in the vertical direction (Z direction) in the drawing. If the cutting load is large, the vibration of the rotary blade 4 becomes large, and the load on the product also becomes large, and the quality deteriorates. In addition, when the vibration of the rotary blade 4 is increased, breakage may occur in the rotary blade 4, thereby deteriorating the quality of the product. Therefore, when cutting the sealed substrate, it is important to set cutting conditions such that the cutting load is reduced and the amplitude of the vibration of the rotary blade 4 becomes smaller.

The position of the tapered portion 5 measured by the displacement sensor 7 (the position in the Z direction in the figure) is displaced by the oscillation of the rotary blade 4 in the vertical direction (Z direction). Therefore, the displacement in the radial direction of the rotary blade 4 can be measured as the amount of displacement in which the distance from the distal end of the displacement sensor 7 to the tapered portion 5 is displaced. That is, the magnitude of the amplitude of the vibration of the rotary blade 4 can be obtained as the amount of displacement of the distance from the distal end portion of the displacement sensor 7 to the tapered portion 5. The displacement sensor 7 measures the distance to the tapered portion 5 of the periodically displaced flange 6 so that the state of the vibration of the rotary blade 4 can be grasped. In the present embodiment, by providing the tapered portion 5 on the flange 6, it is possible to measure both axial displacement and radial displacement by one displacement sensor 7. [

With reference to Fig. 2, a state in which the rotary blade 4 moves up and down by vibration will be described. 2 (a), in the initial state, the distance from the tip end of the displacement sensor 7 to the tapered portion 5 of the flange 6 is d0. When the sealed substrate is cut, the sealed substrate is cut by rotating the rotating blade 4 at a high speed usually from 20,000 rpm to 40,000 rpm. In this case, the period of rotation of the rotary blade 4 is 3 msec to 1.5 msec, and the cycle of the oscillation of the rotary blade 4 is the same. Therefore, since the period of the vibration of the rotary blade 4 is short, the extension of the rotary shaft 3 in the axial direction can be neglected over a short period of time. In other words, the distance L0 from the tip end of the spindle body portion 2 to the center line of the rotary blade 4 is constant when the rotary blade 4 is moved in the Z direction for a short time by the vibration.

2B, the distance from the tip of the displacement sensor 7 to the tapered portion 5 of the flange 6 is smaller than the distance between the tip of the rotation sensor 4 and the tapered portion 5, d1. The position where the thickness of the tapered portion 5 becomes the largest is measured. Therefore, when the rotary blade 4 moves to the top of the figure, d1 becomes the minimum value. Further, the rotary blade 4 and the rotary shaft 3 move integrally and move in the Z direction. In the drawing, for the sake of convenience, only the rotary shaft 3 of the portion to which the rotary blade 4 is fixed moves in the Z direction.

The distance from the tip of the displacement sensor 7 to the tapered portion 5 becomes d2 when the rotary blade 4 is vibrated and moved to the lowermost portion of the drawing as shown in Fig. The position where the thickness of the tapered portion 5 is the thinnest is measured. Therefore, when the rotary blade 4 moves to the lowermost portion of the drawing, d2 becomes the maximum value.

As the rotary blade 4 moves in the Z direction by the vibration, the distance to the tapered portion 5 measured by the displacement sensor 7 becomes d2 at the furthest point and d1 at the nearest point. Therefore, as the tapered portion 5 of the flange 6 moves in the Z direction, the distance measured by the displacement sensor 7 is in the range of (d2-d1). The distance that the taper portion 5 of the flange 6 moves indirectly (apparently) in the X direction becomes (d2-d1). Therefore, corresponding to the period of oscillation of the rotary blade 4, the displacement sensor 7 periodically measures the distance from d1 to d2 as the distance to the tapered portion 5. [ The difference in distance from the tip of the displacement sensor 7 to the tapered portion 5 is proportional to the amplitude of the rotary blade 4. [ Therefore, the displacement sensor 7 can measure the distance from the distal end of the displacement sensor 7 to the tapered portion 5, thereby grasping the state in which the rotary blade 4 vibrates.

The configuration and operation of the eddy current type displacement sensor used as the displacement sensor 7 will be described with reference to Fig. The eddy current type displacement sensor 7 includes a sensor portion 9 having a sensor coil 8 at the tip end thereof, a converter (driver) 10 composed of an electronic circuit for oscillation or detection, And a coaxial cable 11 connecting the transducer 10 with each other. The converter 10 is composed of an oscillation circuit, a resonance circuit, a detection circuit, an amplification circuit, and an output circuit (linearization circuit).

A method of measuring the distance from the tip end of the displacement sensor 7 to the tapered portion 5 of the flange 6 by using the eddy current type displacement sensor 7 will be described. First, a high-frequency signal is supplied to the sensor coil 8 of the sensor unit 9 from the oscillation circuit in the transducer 10. Thus, the high-frequency magnetic field 12 is generated from the sensor coil 8. If a target made of a metal (equivalent to the tapered portion 5 of the flange 6 in the first embodiment) comes close to the magnetic field 12, an eddy current 13 is generated on the surface of the target. The magnitude of the eddy current 13 changes according to the distance between the sensor coil 8 and the target. The impedance of the sensor coil 8 including the target seen from the converter 10 side changes in accordance with the change of the eddy current 13. Therefore, a change in the distance between the sensor section 9 and the target (taper section 5) can be grasped as a change in the impedance of the sensor coil 8. [

The change in the impedance of the sensor coil 8 is taken out as a change in the output voltage in the resonance circuit in the converter 10. [ This voltage change is converted into a DC voltage corresponding to the distance by the detection circuit. The signal is amplified by an amplifying circuit, linearized by an output circuit (linearizing circuit), and outputted as a voltage proportional to the distance. The output characteristic 14 is obtained as a linear output proportional to the distance, with the distance measured on the abscissa and the output voltage on the ordinate. The distance to the target can be obtained by reading the output voltage of the target by using the eddy current type displacement sensor 7. [ Thus, the distance from the tip end of the eddy current type displacement sensor 7 to the tapered portion 5 of the flange 6 can be obtained. Since the eddy current type displacement sensor 7 obtains the distance from the change of the impedance to the target, it is less likely to be influenced by water, dirt or the like as compared with the optical displacement sensor.

A method of determining the magnitude of the amplitude of the vibration of the rotary blade 4 using the eddy current type displacement sensor 7 will be described with reference to Fig. As shown in Fig. 4 (a), the output characteristic of the eddy current type displacement sensor 7 outputs a voltage proportional to the distance. The distance from the tip end of the eddy current type displacement sensor 7 to the tapered portion 5 of the flange 6 is d0 in the initial state and the rotating blade 4 vibrates as shown in Fig. , And the distance (d1 to d2) (see Fig. 2). Therefore, the output voltage V1 of the output characteristic shown in Fig. 4A is shifted from V1 to V2, and the tapered portion 5 of the flange 6 from the tip end of the eddy current type displacement sensor 7, Can be expressed as the displacement of the distance (from d1 to d2) in Fig. 4 (b). As shown in Fig. 4 (c), the displacement of the output voltage (from V1 to V2) can be expressed as the displacement (amplitude) of the voltage waveform with respect to time. Therefore, the amplitude 15, which is a change in the voltage waveform, can be grasped as the magnitude of the amplitude of the vibration of the rotary blade 4. [ The smaller the amplitude 15 (= V2-V1) of the voltage waveform, the smaller the amplitude of the vibration. In other words, the smaller the amount of displacement (= d2-d1) of the distance to the tapered portion 5 measured by the eddy current type displacement sensor 7, the smaller the vibration of the rotary blade 4 is.

(= D2-d1) of the distance from the amplitude 15 (= V2-V1) of the voltage waveform to the taper portion 5 measured by the eddy current type displacement sensor 7, The magnitude of the amplitude of the vibration can be grasped. When the amplitude 15 of the voltage waveform or the amount of displacement of the distance to the tapered portion 5 measured by the eddy current type displacement sensor 7 is small, the cutting load is small and the cutting efficiency is good. Therefore, by detecting the magnitude of the amplitude of the vibration of the rotary blade 4, it is possible to set the cutting condition so as to reduce the vibration of the cutting blade 4. Thereby, the cutting load can be reduced and the cutting efficiency and cutting quality can be improved. Further, when actually measuring the vibration of the rotary blade 4, the influence of the eccentricity or the like of the flange 6 is removed, and the change of the amplitude of the vibration and the center of the vibration is obtained.

According to the present embodiment, in the cutting apparatus, the rotary shaft 3 and the rotary blade 4 attached to the tip end portion of the rotary shaft 3 are provided on the spindle 1. Two flanges 6 each having a tapered portion 5 for fitting the rotating blade 4 therebetween are provided. In the spindle body portion 2, a displacement sensor 7 is provided at a position facing the tapered portion 5 of the flange 6. The displacement sensor 7 measures the distance from the distal end of the displacement sensor 7 to the tapered portion 5 of the flange 6 using an eddy current displacement sensor. Thus, the displacement of the rotary blade 4 in the axial direction (the distance from the front end of the spindle body portion 2 to the center line in the thickness direction of the rotary blade 4) can be obtained. Therefore, the displacement amount of the rotary shaft 3 expanded and contracted by the thermal expansion can be corrected, and the position of the center line of the rotary blade 4 can be precisely aligned at the position of the cutting line of the sealed substrate. It is possible to prevent the position of the center line of the rotary blade 4 from being cut off in a state deviated from the cutting line of the finished substrate, thereby improving the yield and improving the quality.

According to the present embodiment, the tapered portion 5 is provided in the flange 6 for fixing the rotary blade 4 sandwiched from both sides thereof. The rotary blade 4 is displaced in the radial direction by receiving the cutting load during the cutting of the sealed substrate, and vibrates in the Z direction in Fig. The vibration of the rotary blade 4 can be grasped as the amount of displacement in which the distance from the distal end of the displacement sensor 7 to the tapered portion 5 of the flange 6 is displaced by providing the tapered portion 5 on the flange 6 . The cycle of the vibration of the rotary blade 4 can be grasped as the cycle of the amount of displacement in which the distance from the distal end of the displacement sensor 7 to the tapered portion 5 is displaced. The magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped as the magnitude of the displacement amount of the distance from the distal end portion of the displacement sensor 7 to the tapered portion 5. [ Therefore, by measuring the distance from the tip of the displacement sensor 7 to the tapered portion 5 of the flange 6 using the displacement sensor 7, the magnitude of the amplitude of the vibration of the rotary blade 4, It is possible to grasp a change in the state of the rotary blade 4 such as a change in the center. By grasping the magnitude of the amplitude of the vibration of the rotary blade 4, the cutting condition can be set so that the amplitude of the vibration of the cutting blade 4 becomes small. Therefore, the cutting load can be reduced and the cutting efficiency and cutting quality can be improved.

According to the present embodiment, by providing the tapered portion 5 on the flange 6, it is possible to measure both the amount of displacement in the axial direction and the amount of displacement in the radial direction by using one displacement sensor 7. [ Therefore, the cost of the cutting apparatus can be suppressed, the cutting state can be grasped, and effective cutting can be performed. Therefore, it is possible to contribute to the improvement of the yield, the improvement of the quality, and the improvement of the productivity.

In the present embodiment, the displacement sensor 10 is provided at a position facing the tapered portion 5 of the flange 6 near the spindle body portion 2 in the spindle body portion 2 . The displacement sensor 10 may be provided at a position opposite to the tapered portion 5 of the flange 6 farther from the spindle body portion 2 by using a mounting plate of a suitable shape.

(Example 2)

Embodiment 2 of the cutting apparatus according to the present invention will be described with reference to Fig. The difference from the first embodiment is that the shape of the flange and the position of attachment of the displacement sensor 7 are changed. The other configuration is the same as that of the first embodiment, and a description thereof will be omitted. As shown in Fig. 5, the rotary blade 4 is fixed to the rotary shaft 3 by sandwiching both sides of the two disk-shaped flanges 16. The flange 16 is formed in a disk shape, and its outer peripheral end has a shape perpendicular to the surface of the rotary blade 4. [ A flange 16a closer to the spindle body 2 and a flange 16b opposite to the spindle body 2 are set. The above-described " shape perpendicular to the plane " may be a shape that is inclined in a range in which the displacement sensor of a later-described displacement sensor can detect displacement, in addition to being strictly perpendicular.

As shown in Fig. 5 (a), the outer peripheral end 16c (the left end of the uppermost position in the figure) of the flange 16a closer to the spindle main body 2 faces the (+ The displacement sensor 7 is provided at the tip end portion of the spindle body portion 2 so as to face the X direction, i.e., the horizontal direction. As the displacement sensor 7, an eddy current type displacement sensor is used. 5 (a), the center portion of the displacement sensor 7 is attached so as to face the outer peripheral end 16c of the flange 16a. The position where the displacement sensor 7 is attached may be any position as long as it is directed toward the outer peripheral end of the flange 16a. For example, in FIG. 5A, the displacement sensor 7 may be attached to the outer peripheral end 16d at the lowest position of the flange 16a.

Fig. 5B is a modification of Fig. 5A, in which the attachment position of the displacement sensor 7 is changed. For example, the displacement sensor 7 is provided so as to face the vertical direction (-Z direction) by using an attachment plate 17 having an alphabet "L" shape. A portion 17a corresponding to the vertical bar of the attachment plate 17 is attached to the end face of the spindle body portion 2 (right end in the figure), and a displacement sensor 7 in the vertical direction. The displacement sensor 7 made of an eddy current type displacement sensor is attached so as to face the outer peripheral end 16e of the flange 16a (upper left in the figure). The position to which the displacement sensor 7 is attached may be any position as long as it faces the outer peripheral end of the flange 16a or the flange 16b. For example, in Fig. 5B, the displacement sensor 7 may be attached toward the outer peripheral end 16f at the uppermost position of the flange 16b.

5 (a) and 5 (b), the displacement sensor 7 is attached to the spindle body portion 2 so as to face the horizontal direction or the vertical direction. A displacement sensor 7 is provided toward the outer peripheral end of the flange 16a or the flange 16b. As the rotary shaft 3 is displaced in the axial direction or the radial direction, the distance from the displacement sensor 7 to the flange outer peripheral end or the area near the flange outer peripheral end end changes. By these changes, the displacement sensor 7 measures the change of the eddy current. Thus, the displacement in the axial direction and the displacement in the radial direction can be measured using the displacement sensor 7.

According to the present embodiment, in the cutting apparatus, the rotary blade 4 is fixed to the rotary shaft 3 by sandwiching the rotary blade 4 from both sides by the flanges 16a, 16b formed in a disk shape. In the spindle body portion 2, a displacement sensor 7 made of an eddy current type displacement sensor is provided so as to face the outer peripheral end of the flange 16a or the flange 16b. The displacement sensor 7 is used to measure a distance from the displacement sensor 7 to the flange outer peripheral end or an area change near the flange outer peripheral end. As a result, the displacement of the rotary blade 4 in the axial direction or the magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped.

The amount of displacement of the rotary shaft 3 expanded or contracted by thermal expansion is corrected by measuring the displacement of the rotary shaft 3 in the axial direction so that the position of the center line of the rotary blade 4 is accurately aligned with the position of the cutting line of the sealed substrate Can be cut. Therefore, it is possible to prevent the position of the center line of the rotary blade 4 from being cut off from the cutting line of the sealed substrate, thereby improving the yield and improving the quality.

The cycle of the vibration of the rotary blade 4 can be grasped as the cycle of the change amount in which the area near the flange outer peripheral end end changes. The magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped as the magnitude of the amount of change in the area detected by the displacement sensor 7. [ Therefore, by using the displacement sensor 7, the magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped. By grasping the magnitude of the amplitude of the vibration of the rotary blade 4, the cutting condition can be set so that the amplitude of the vibration of the cutting blade 4 becomes small. Therefore, the cutting load can be reduced and the cutting efficiency and cutting quality can be improved.

(Example 3)

Embodiment 3 of the cutting apparatus according to the present invention will be described with reference to Fig. As shown in Fig. 6, the cutting device 18 is a device for cutting pieces to be cut into a plurality of products. The cutting apparatus 18 includes a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements. Each component (each unit A to C) is detachable and exchangeable with respect to each other.

The substrate supply unit (A) is provided with a substrate supply mechanism (19). The sealed substrate 20 including a chip type element such as a semiconductor chip corresponding to the material to be cut is taken out from the substrate supply mechanism 19 and is transported to the substrate cutting unit B by a transport mechanism Lt; / RTI > The substrate supply unit A is provided with a control unit CTL for setting and controlling the operation and cutting conditions of the cutting device 18. [

The cutting device 18 shown in Fig. 6 is a cutting device of a single cut table type. Therefore, the substrate cutting unit B is provided with one cutting table 21. The cutting table 21 is movable in the Y direction in the drawing by the moving mechanism 22 and is rotatable in the? Direction by the rotating mechanism 23. [ On the cutting table 21, a sealed substrate 20 is arranged and adsorbed.

The substrate cutting unit B is provided with a spindle 1 as a cutting mechanism. The cutting apparatus 18 is a single-spindle cutting apparatus in which one spindle 1 is provided. The spindle 1 is independently movable in the X and Z directions. The spindle 1 is provided with a rotary blade 4 fitted to two flanges 6 having, for example, a tapered portion 5 (see Fig. 1). An eddy current type displacement sensor is provided on the spindle 1 as a displacement sensor 7 opposite to the tapered portion 5 of the flange 6. [ The sealed substrate 20 is cut by moving the cutting table 22 and the spindle 1 relatively. The rotary blade 4 rotates in a plane including the Y direction and the Z direction to cut the sealed substrate 20.

An inspection table (24) is provided in the inspection unit (C). In the inspection table 24, an assembly made up of a plurality of individual products P cut from the encapsulated substrate 20, that is, a cut completion substrate 25 is disposed. The plurality of products P are inspected by a camera (not shown) for inspection, and are selected as good products and defective products. The good product is received in the tray 26.

In the present embodiment, the cutting device 18 having a single spindle configuration has been described as a single cut table system. The spindle 1 of the present invention can also be applied to a single-cut table system, a twin-spindle cutting apparatus, a twin cut table system, a twin spindle cutting apparatus, and the like. Further, an eddy-current type displacement sensor was used as the displacement sensor 7. The present invention is not limited to this, and other non-contact type displacement sensors may be used.

In each of the embodiments, a washer-type rotary blade having a donut shape (toroidal shape) is used as the rotary blade 4. The present invention is not limited to this, and a hub-type rotary blade having a blade tip portion mounted on the base may be used. As the fixing member, a combination of a flange and a nut or the like can be used instead of the combination of two flanges. As the fixing member, a member having a planar shape other than the toroidal shape may be used.

In the description so far, the case where the encapsulated substrate 20 including chip-type elements is cut is shown. However, the present invention is not limited to this, and the present invention can be applied to the case where the next object to be cut is cut as a piece to be cut other than the sealed substrate 20 to be separated. First, it is a case that semiconductor wafers made of silicon, compound semiconductor, and functional devices such as circuit elements and MEMS (Micro Electro Mechanical Systems) are made and put in the semiconductor wafer. Second, we manufacture products such as chip resistors, chip capacitors, chip type sensors, and surface acoustic wave devices by disassembling ceramics substrates and glass substrates into which functional devices such as resistors, capacitors, sensors, and surface acoustic wave devices are formed . In both of these cases, a semiconductor wafer, a ceramics substrate, or the like corresponds to a substrate in which functional elements corresponding to a plurality of regions are formed. Third, there is a case where an optical component such as a lens, an optical module, and a light guide plate is manufactured by disengaging the resin molded article. Fourth, there is a case in which a resin molded article is divided into a general molded product. Fifth, there is a case where a glass plate used as a cover of various electronic apparatuses is manufactured. In the various cases including the above five cases, the contents described above can be applied.

The present invention is not limited to the above-described embodiments, and can be arbitrarily and suitably combined, modified, or selected as necessary within the scope of the present invention.

1: spindle (cutting mechanism) 2: spindle body
3: rotating shaft 4: rotating blade
5: tapered portion (predetermined region) 6: flange (fixing member)
7: Displacement sensor (measuring means) 8: Sensor coil
9: sensor part 10: converter
11: coaxial cable 12: high frequency magnetic field
13: Eddy current 14: Output characteristics
15: Amplitude of the voltage waveform 16a, 16b: Flange (fixing member)
16c, 16d, 16e, 16f: outer circumferential end (predetermined region)
17: Attachment plate 17a: Portion corresponding to vertical bar
17b: a portion corresponding to a cross bar 18: a cutting device
19: substrate feed mechanism 20: sealed substrate (cut material)
21: cutting table (table) 22: moving mechanism
23: rotation mechanism 24: inspection table
25: cut-off substrate 26: tray
d0, dX, d1, d2: Measuring distance from the tip of the displacement sensor to the tapered part
L0, LX: Distance from the front end of the spindle body to the center line in the thickness direction of the rotary blade
α: fixed value V1, V2, V3: output voltage
A: substrate supply unit B: substrate cutting unit
C: Inspection unit CTL:
P: Products

Claims (18)

A table on which the object to be cut is placed; a cutting mechanism for cutting the object to be cut; and a moving mechanism for relatively moving the table and the cutting mechanism, wherein the object to be cut is cut along the cutting line As a cutting apparatus to be used at the time of cutting,
A rotating shaft provided in the cutting mechanism,
A rotary blade attached to a distal end of the rotary shaft,
Two fixing members respectively provided on both side surfaces of the rotary blade for fixing the rotary blade therebetween,
And a measuring unit provided in the cutting mechanism so as to face a predetermined region of the fixing member
And,
The displacement amount of the rotary blade displaced is measured by detecting the displacement of the fixed member in the predetermined region by the measuring means,
The amount of displacement,
A first displacement amount caused by the displacement of the rotary blade along the axial direction of the rotary shaft,
And a second displacement amount caused by the displacement of the rotary blade along the radial direction of the rotary shaft. The cutting apparatus according to claim 1, wherein the relative positional relationship between the rotary blade and the workpiece is corrected based on the first amount of displacement so that the position of the rotary blade is aligned with the position of the cutting line. The cutting apparatus according to claim 1, characterized in that a characteristic relating to the vibration of the rotary blade is measured based on the second amount of displacement. The cutting apparatus according to claim 1, wherein the predetermined region has a tapered portion formed so that the thickness on the center side and the thickness on the peripheral side are different from each other. 2. The cutting apparatus according to claim 1, wherein the predetermined region includes an end portion perpendicular to the surface of the rotary blade at an outer peripheral portion of the fixing member. The cutting apparatus according to claim 1, wherein the predetermined region is made of a conductive material. 7. The cutting apparatus according to claim 6, wherein the measuring means includes an eddy current type displacement sensor. The cutting apparatus according to any one of claims 1 to 7, wherein the workpiece is a sealed substrate. The cutting apparatus according to any one of claims 1 to 7, wherein the object to be cut is a substrate in which a functional element corresponding to each of a plurality of regions is formed. A step of disposing a blank to be cut on a table, a step of relatively moving the cutting tool having a rotary blade and the table, and a step of relatively moving the cutting mechanism and the table, A cutting method comprising cutting along a cutting line,
A step of rotating the rotary blade fixed to the tip of the rotary shaft provided on the cutting mechanism by two fixing members provided on both side surfaces of the rotary blade;
A step of opposing measurement means provided in the cutting mechanism to a predetermined region of the fixing member,
A step of measuring the amount of displacement of the rotary blade by detecting the displacement of the fixing member in the predetermined region by the measuring means
Wherein the step of measuring the amount of displacement comprises:
Measuring a first amount of displacement due to displacement of the rotary blade along an axial direction of the rotary shaft;
And measuring a second displacement amount caused by the displacement of the rotary blade along the radial direction of the rotary shaft. The cutting method according to claim 10, further comprising a step of matching the position of the rotary blade with the position of the cutting line by correcting a relative positional relationship between the rotary blade and the workpiece to be cut based on the first amount of displacement . The cutting method according to claim 10, comprising a step of measuring a characteristic relating to the amplitude of vibration of the rotary blade based on the second amount of displacement. The cutting method according to claim 10, wherein the predetermined region has a tapered portion formed so that a thickness on the center side and a thickness on the peripheral side are different from each other. 11. The cutting method according to claim 10, wherein the predetermined region includes an end portion perpendicular to the surface of the rotary blade at an outer peripheral portion of the fixing member. The cutting method according to claim 10, wherein the predetermined region is made of a conductive material. The cutting method according to claim 15, wherein the measuring means includes an eddy current type displacement sensor. The cutting method according to any one of claims 10 to 16, wherein the workpiece is a sealed substrate. The cutting method according to any one of claims 10 to 16, wherein the object to be cut is a substrate in which a functional element corresponding to each of a plurality of regions is formed.
KR1020150153623A 2014-12-24 2015-11-03 Cutting apparatus and cutting method KR101749422B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014259909A JP6235453B2 (en) 2014-12-24 2014-12-24 Cutting apparatus and cutting method
JPJP-P-2014-259909 2014-12-24

Publications (2)

Publication Number Publication Date
KR20160078227A true KR20160078227A (en) 2016-07-04
KR101749422B1 KR101749422B1 (en) 2017-06-20

Family

ID=56295989

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150153623A KR101749422B1 (en) 2014-12-24 2015-11-03 Cutting apparatus and cutting method

Country Status (4)

Country Link
JP (1) JP6235453B2 (en)
KR (1) KR101749422B1 (en)
CN (1) CN105742245B (en)
TW (1) TWI602641B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6846657B2 (en) * 2017-01-20 2021-03-24 株式会社ディスコ Cutting equipment
JP7051205B2 (en) * 2017-12-27 2022-04-11 株式会社ディスコ Cutting equipment
TWI690385B (en) * 2019-06-28 2020-04-11 鼎朋企業股份有限公司 Grinding machine tool with random eccentric orbit motion speed detection
KR102279726B1 (en) * 2019-09-26 2021-07-20 한국광기술원 Wafer Lens Array Dicing Apparatus Including Dicing Blade for Cutting Wafer Lens Array and Method Using the Same
JP7394712B2 (en) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 Cutting device and method for manufacturing cut products

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310596A (en) 1993-04-23 1994-11-04 Seiko Seiki Co Ltd Dicing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049464B2 (en) * 1993-11-26 2000-06-05 セイコー精機株式会社 Dicing equipment
SG118084A1 (en) * 2001-08-24 2006-01-27 Micron Technology Inc Method and apparatus for cutting semiconductor wafers
JP2003203885A (en) * 2002-01-08 2003-07-18 Disco Abrasive Syst Ltd Process machine
JP4559094B2 (en) * 2004-02-16 2010-10-06 株式会社ディスコ Cutting blade mounting device, cutting device
ITMI20041269A1 (en) * 2004-06-24 2004-09-24 Paper Converting Machine Co CUTTING BLADE CONTROL SYSTEM PARTICULARLY FOR CUTTING MACHINES FOR LOG CUTTING OF SHEET MATERIAL
JP4549818B2 (en) * 2004-11-10 2010-09-22 株式会社ディスコ Amplitude measurement method
JP4311686B2 (en) * 2006-09-27 2009-08-12 日立ビアメカニクス株式会社 Method for processing printed circuit boards
JP2009206362A (en) * 2008-02-28 2009-09-10 Disco Abrasive Syst Ltd Method of cutting plate-like material
JP5248250B2 (en) * 2008-09-26 2013-07-31 株式会社ディスコ Cutting device and method for adjusting rotational balance of cutting blade
CN202278449U (en) * 2011-08-16 2012-06-20 北京工业大学 Device for testing displacement of machine tool combining part relative to tool nose point
JP5643729B2 (en) * 2011-09-02 2014-12-17 Ｔｏｗａ株式会社 Spindle locking device in air spindle unit
CN102554780A (en) * 2012-02-17 2012-07-11 上海理工大学 Measuring device for grinding radial run-out of metal-bonded grinding wheels

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06310596A (en) 1993-04-23 1994-11-04 Seiko Seiki Co Ltd Dicing apparatus

Also Published As

Publication number Publication date
CN105742245A (en) 2016-07-06
JP2016122673A (en) 2016-07-07
CN105742245B (en) 2018-12-07
TW201622879A (en) 2016-07-01
TWI602641B (en) 2017-10-21
KR101749422B1 (en) 2017-06-20
JP6235453B2 (en) 2017-11-22

Similar Documents

Publication Publication Date Title
KR101749422B1 (en) Cutting apparatus and cutting method
JP5912395B2 (en) Substrate upper surface detection method and scribing apparatus
US10821568B2 (en) Method and device for determining a vibration amplitude of a tool
JP4364810B2 (en) Apparatus and method for alignment of die bonding tools
JP6491044B2 (en) Manufacturing apparatus and manufacturing method
US10340170B2 (en) Method and device for grooving wafers
US8991064B2 (en) Measurement head for feeler for workpieces being machined
JP2005210128A5 (en)
KR101570003B1 (en) Cutting apparatus and cutting method for manufacturing electronic component
JP4915823B2 (en) Ultrasonic bonding equipment
JP5829211B2 (en) Method and apparatus for measuring the deformation of a disk workpiece, in particular a molded wafer
US8058780B2 (en) Circular cylinder type piezoelectric actuator and piezoelectric element and scanning probe microscope using those
JP2012134333A (en) Method for measurement
WO2017130914A1 (en) Laser machining device and laser machining method
US9557730B2 (en) Driving apparatus and article processing apparatus
JP2006156970A (en) Resonator for ultrasonic jointing
JP4529759B2 (en) Electronic component mounting apparatus and electronic component mounting method
JP6159325B2 (en) Maintaining the measurement gap in the rheometer
JP2017042856A (en) Positioning device
JP6418030B2 (en) Calf depth measuring device
JP6709337B2 (en) Tool position setting device and tool position setting method using the same
WO2024018937A1 (en) Joining method and joining apparatus
KR101900137B1 (en) Tape cutting device
JP6190707B2 (en) Reference member for sensor calibration and sensor calibration method
JPH05264214A (en) Method and device for measuring surface configuration

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right