TWI602641B - Cutting device and cutting method - Google Patents

Cutting device and cutting method Download PDF

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TWI602641B
TWI602641B TW104135969A TW104135969A TWI602641B TW I602641 B TWI602641 B TW I602641B TW 104135969 A TW104135969 A TW 104135969A TW 104135969 A TW104135969 A TW 104135969A TW I602641 B TWI602641 B TW I602641B
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displacement
cutting
cut
blade
rotating
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TW104135969A
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Chinese (zh)
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TW201622879A (en
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Shoichi Kataoka
Hidekazu Azuma
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Towa Corp
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切斷裝置及切斷方法 Cutting device and cutting method

本發明係關於切斷被切斷物來製造被單片化後的複數個製品的切斷裝置以及切斷方法。 The present invention relates to a cutting device and a cutting method for producing a plurality of products which are singulated by cutting a object to be cut.

將由印刷電路板與引線框等構成的基板虛擬性地劃分為格子狀的複數個區域,並在各個區域中安裝晶片狀的元件(例如,半導體晶片),之後對基板整體進行樹脂封裝,將之稱為封裝完畢基板。由使用了旋轉刃等的切斷機構來切斷封裝完畢基板,單片化為各個區域單位後成為製品。 A substrate composed of a printed circuit board, a lead frame, or the like is virtually divided into a plurality of regions in a lattice shape, and wafer-shaped elements (for example, semiconductor wafers) are mounted in the respective regions, and then the entire substrate is resin-sealed. It is called a packaged substrate. The packaged substrate is cut by a cutting mechanism using a rotary blade or the like, and is singulated into individual regions and becomes a product.

以往,在切斷裝置中使用切斷機構並藉由旋轉刃等切斷單元來切斷封裝完畢基板的既定區域。首先,將封裝完畢基板載置在切斷用工作台上並進行吸附。接著,對封裝完畢基板進行對準(對位)。藉由進行對準,從而設定了用於劃分複數個區域的虛擬性的切斷線的位置。接下來,使吸附有封裝完畢基板的切斷用工作台與切斷機構相對地移動。在對封裝完畢基板的切斷部位噴射切削水的同時,由切斷機構沿著設定於封裝完畢基板的切斷線來切斷封裝完畢基板。藉由切斷封裝完畢基板來製造被單片化後的製品。 Conventionally, a cutting mechanism is used in a cutting device, and a predetermined region of a packaged substrate is cut by a cutting unit such as a rotating blade. First, the packaged substrate is placed on a cutting table and adsorbed. Next, the packaged substrate is aligned (aligned). By performing the alignment, the position of the cut line for dividing the virtuality of the plurality of regions is set. Next, the cutting table on which the packaged substrate is adsorbed is moved relative to the cutting mechanism. The cutting water is sprayed on the cut portion of the packaged substrate, and the packaged substrate is cut by the cutting mechanism along the cutting line set on the packaged substrate. The singulated article is produced by cutting the packaged substrate.

在切斷機構中,旋轉刃與電機經由旋轉軸而連接。藉由電機使旋轉刃高速旋轉來切斷封裝完畢基板。在使用切斷機構來重複進行封裝完畢基板的切斷時,旋轉軸因進行高速旋轉而發熱。由於發熱,旋轉軸產生熱膨脹而在沿著旋轉軸的方向(軸向)上延伸。當旋轉軸在軸向上延伸時,安裝於旋轉軸的前端部的旋轉刃也在軸向上位移。因此,切斷機構中的旋轉刃的位置與封裝完畢基板的切斷線的位置發生錯位。如果在旋轉刃的位置從切斷線的位置處錯位的狀態下切斷封裝完畢基板,則有可能會引起製品的破損與劣化。 In the cutting mechanism, the rotary blade and the motor are connected via a rotating shaft. The packaged substrate is cut by rotating the rotary blade at a high speed by a motor. When the cutting of the packaged substrate is repeated using the cutting mechanism, the rotating shaft generates heat due to high-speed rotation. Due to heat generation, the rotating shaft thermally expands and extends in the direction (axial direction) along the rotating shaft. When the rotary shaft extends in the axial direction, the rotary blade attached to the front end portion of the rotary shaft is also displaced in the axial direction. Therefore, the position of the rotary blade in the cutting mechanism is displaced from the position of the cutting line of the packaged substrate. If the packaged substrate is cut in a state where the position of the rotary blade is displaced from the position of the cutting line, the product may be damaged or deteriorated.

根據封裝完畢基板的結構與切斷封裝完畢基板的條件,進行切斷時的切斷負荷有時會增大。當進行切斷時的切斷負荷增大時,旋轉刃的振動會增大。如果旋轉刃的振動較大,則會發生旋轉刃的破損,致使製品的品質劣化。此外,旋轉刃的磨損量會增大,旋轉刃的壽命會變短。因此,在切斷機構中,對進行切斷時的旋轉軸的伸縮與切斷過程中的振動的振幅大小進行掌握並回饋為最佳的切斷條件就變得重要。 The cutting load at the time of cutting may increase depending on the structure of the packaged substrate and the condition for cutting the packaged substrate. When the cutting load at the time of cutting is increased, the vibration of the rotary blade is increased. If the vibration of the rotary blade is large, breakage of the rotary blade occurs, resulting in deterioration of the quality of the product. In addition, the amount of wear of the rotary blade increases, and the life of the rotary blade becomes shorter. Therefore, in the cutting mechanism, it is important to grasp the magnitude of the amplitude of the vibration during the expansion and contraction of the rotating shaft at the time of cutting and to return it to the optimum cutting condition.

作為能夠簡單地進行切斷位置的定位的切割裝置,提出了一種“具備:刀具,用於切斷半導體晶圓;顯微鏡,用於對半導體晶圓的切斷位置進行確認;測定手段,相對於該顯微鏡以預先確定的位置關係來配置,非接觸性地對到刀具的距離進行測定;以及切斷位置控制單元,根據該測定手段與顯微鏡之間的距離以及藉由測定手段測定出的距離,對基於刀具的切斷位置進行控制”的切割裝置(例如,參照專利文獻1的段落[0008]、圖1、圖2)。 As a cutting device capable of easily positioning the cutting position, there has been proposed a method including: a cutter for cutting a semiconductor wafer; a microscope for confirming a cutting position of the semiconductor wafer; and a measuring means for The microscope is arranged in a predetermined positional relationship, and the distance to the tool is measured non-contactly; and the position control unit is cut, the distance between the measuring means and the microscope, and the distance measured by the measuring means, A cutting device that controls the cutting position based on the cutter (for example, refer to paragraph [0008] of Patent Document 1, FIG. 1, and FIG. 2).

[先前技術文獻] [Previous Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本特開平6-310596號公報 [Patent Document 1] Japanese Patent Laid-Open No. Hei 6-310596

但是,在專利文獻1所公開的切割裝置中存在如下問題。如專利文獻1的圖1所示,在顯微鏡13的視野內,出現基準線18。預先已知了該基準線18與光學式位移感測器14的前端的距離D1。光學式位移感測器14被配置在與刀片11相對向的位置,對從其前端到刀片11的距離D2進行測定,並輸出與該距離D2相應的類比電壓。NC裝置16對除了工作台驅動裝置17以外的心軸電機12等、切割裝置整體進行數值控制。 However, the cutting device disclosed in Patent Document 1 has the following problems. As shown in FIG. 1 of Patent Document 1, the reference line 18 appears in the field of view of the microscope 13. The distance D 1 between the reference line 18 and the front end of the optical displacement sensor 14 is known in advance. The optical displacement sensor 14 is disposed at a position opposing the blade 11, measures the distance D 2 from the front end thereof to the blade 11, and outputs an analog voltage corresponding to the distance D 2 . The NC device 16 numerically controls the entire cutting device, such as the spindle motor 12 other than the table driving device 17.

在這種裝置中,由於使用光學式位移感測器14,因此易於受到附著於刀片11的水或污垢等的影響。因此,對從光學式位移感測器14到刀片11的距離D2的測定有可能產生誤差。另外,由於不具備用於對切斷過程中的刀片11的徑向方向(徑向)的振動進行測定的單元,因此無法判斷是否高效地進行切斷。 In such a device, since the optical displacement sensor 14 is used, it is easily affected by water, dirt, or the like adhering to the blade 11. Therefore, the measurement of the distance D 2 from the optical displacement sensor 14 to the blade 11 may cause an error. Further, since the unit for measuring the vibration in the radial direction (radial direction) of the blade 11 during the cutting process is not provided, it is not possible to determine whether or not the cutting is performed efficiently.

本發明解決上述問題,目的在於提供一種切斷裝置以及切斷方法,在切斷裝置中,藉由以朝向用於固定旋轉刃的固定構件(例如,凸緣)的既定區域的方式設置測定手段,從而能夠對旋轉刃的軸向的位移量與徑向的位移量進行測定,能夠掌握切斷位置的校正與切斷效率。 The present invention has been made in view of the above problems, and an object thereof is to provide a cutting device and a cutting method in which a measuring means is provided in such a manner as to face a predetermined region of a fixing member (for example, a flange) for fixing a rotating blade. Therefore, the amount of displacement in the axial direction of the rotary blade and the amount of displacement in the radial direction can be measured, and the correction of the cutting position and the cutting efficiency can be grasped.

為了解決上述問題,本發明的切斷裝置, 具備:工作台,載置被切斷物;切斷機構,對所述被切斷物進行切斷;以及移動機構,使所述工作台與所述切斷機構相對地移動,所述切斷裝置在沿著切斷線切斷所述被切斷物來進行單片化時被使用,其特徵在於,具備:旋轉軸,設置於所述切斷機構;旋轉刃,安裝於所述旋轉軸的前端部;兩個固定構件,分別設置在所述旋轉刃的兩側的側面中,夾著所述旋轉刃以進行固定;以及測定手段,以朝向所述固定構件的既定區域的方式被設置於所述切斷機構,所述測定手段藉由對所述固定構件的所述既定區域中的位移進行檢測,從而測定出所述旋轉刃位移後的位移量,所述位移量包括:所述旋轉刃沿著所述旋轉軸的軸向位移而引起的第一位移量、以及所述旋轉刃沿著所述旋轉軸的徑向位移而引起的第二位移量。 In order to solve the above problems, the cutting device of the present invention, a workbench that mounts a to-be-cut object, a cutting mechanism that cuts the object to be cut, and a moving mechanism that moves the table relative to the cutting mechanism, the cutting The apparatus is used when the object to be cut is cut along the cutting line and is singulated, and includes: a rotating shaft provided to the cutting mechanism; and a rotating blade attached to the rotating shaft a front end portion; two fixing members respectively disposed in side surfaces of both sides of the rotary blade, sandwiching the rotary blade for fixing; and measuring means to be disposed toward a predetermined area of the fixing member In the cutting mechanism, the measuring means detects the displacement of the rotating blade after the displacement of the predetermined area of the fixing member, and the displacement amount includes: a first displacement amount caused by the axial displacement of the rotary blade along the rotation axis, and a second displacement amount caused by the radial displacement of the rotary blade along the rotation axis.

本發明的切斷裝置具有如下態樣:藉由根據所述第一位移量來校正所述旋轉刃與所述被切斷物的相對的位置關係,從而使所述旋轉刃的位置與所述切斷線的位置相吻合。 The cutting device of the present invention has a state in which the positional relationship of the rotary blade and the object are corrected by correcting a relative positional relationship between the rotary blade and the object to be cut according to the first displacement amount The position of the cutting line coincides.

另外,本發明的切斷裝置具有如下態樣:根據所述第二位移量來測定與所述旋轉刃的振動有關的特性。 Further, the cutting device of the present invention has a state in which characteristics relating to vibration of the rotary blade are measured based on the second displacement amount.

另外,本發明的切斷裝置具有如下態樣:所述既定區域具有以中心側的厚度與周邊側的厚度不同的方式形成的 錐形部。 Further, the cutting device of the present invention has a state in which the predetermined region has a thickness different from that of the peripheral side. Conical part.

另外,本發明的切斷裝置具有如下態樣:所述既定區域包括在所述固定構件的外周部相對於所述旋轉刃的面垂直地形成的端部。 Further, the cutting device of the present invention has a state in which the predetermined region includes an end portion formed perpendicularly to the surface of the rotating blade at the outer peripheral portion of the fixing member.

另外,本發明的切斷裝置具有如下態樣:所述既定區域由具有導電性的物質構成。 Further, the cutting device of the present invention has a state in which the predetermined region is composed of a material having conductivity.

另外,本發明的切斷裝置具有如下態樣:所述測定手段包括渦流式位移感測器。 Further, the cutting device of the present invention has the following aspect: the measuring means includes an eddy current displacement sensor.

另外,本發明的切斷裝置具有如下態樣:所述被切斷物為封裝完畢基板。 Further, the cutting device of the present invention has the following aspect: the object to be cut is a packaged substrate.

另外,本發明的切斷裝置具有如下態樣:所述被切斷物為製作有分別與複數個區域相對應的功能元件的基板。 Further, the cutting device of the present invention has a configuration in which the object to be cut is a substrate on which functional elements respectively corresponding to a plurality of regions are formed.

為了解決上述問題,本發明的切斷方法,包括:在工作台載置被切斷物的步驟;使具有旋轉刃的切斷機構與所述工作台相對地移動的步驟;以及藉由使所述切斷機構與所述工作台相對地移動從而使用所述切斷機構沿著切斷線來切斷所述被切斷物的步驟,其特徵在於,包括:使所述旋轉刃旋轉的步驟,所述旋轉刃在被設置於所述切斷機構的旋轉軸的前端部,藉由在所述旋轉刃的兩側的側面設置的兩個固定構件而被固定;使被設置於所述切斷機構的測定手段與所述固定構件的既定區域相對向的步驟;以及 所述測定手段藉由對所述固定構件的所述既定區域中的位移進行檢測,從而測定出所述旋轉刃位移後的位移量的步驟,測定所述位移量的步驟包括:對所述旋轉刃沿著所述旋轉軸的軸向位移而引起的第一位移量進行測定的步驟;以及對所述旋轉刃沿著所述旋轉軸的徑向位移而引起的第二位移量進行測定的步驟。 In order to solve the above problems, the cutting method of the present invention includes the steps of: placing a workpiece on a table; moving a cutting mechanism having a rotary blade relative to the table; and The step of moving the cutting mechanism relative to the table to cut the object to be cut along the cutting line using the cutting mechanism, comprising the step of rotating the rotating blade The rotating blade is fixed at a front end portion of the rotating shaft provided at the cutting mechanism by two fixing members provided on both side surfaces of the rotating blade; a step of measuring the means of the breaking mechanism opposite to a predetermined area of the fixing member; The measuring means determines a displacement amount of the rotary blade after displacement by detecting a displacement in the predetermined region of the fixing member, and the step of measuring the displacement amount includes: rotating the rotation a step of measuring a first displacement amount caused by an axial displacement of the blade along the rotation axis; and a step of measuring a second displacement amount caused by a radial displacement of the rotation blade along the rotation axis .

本發明的切斷方法具有如下態樣:包括藉由根據所述第一位移量來校正所述旋轉刃與所述被切斷物的相對的位置關係,從而使所述旋轉刃的位置與所述切斷線的位置相吻合的步驟。 The cutting method of the present invention has the following aspect: including correcting a positional relationship between the rotary blade and the object to be cut according to the first displacement amount, thereby causing a position and a position of the rotary blade The step of matching the positions of the cutting lines.

另外,本發明的切斷方法具有如下態樣:包括根據所述第二位移量來測定與所述旋轉刃的振動有關的特性的步驟。 Further, the cutting method of the present invention has a step of including a step of measuring characteristics relating to vibration of the rotary blade based on the second displacement amount.

另外,本發明的切斷方法具有如下態樣:所述既定區域具有以中心側的厚度與周邊側的厚度不同的方式形成的錐形部。 Further, the cutting method of the present invention has a tapered region in which the predetermined region has a thickness different from that of the peripheral side.

另外,本發明的切斷方法具有如下態樣:所述既定區域包括在所述固定構件的外周部相對於所述旋轉刃的面垂直地形成的端部。 Further, the cutting method of the present invention has a state in which the predetermined region includes an end portion formed perpendicularly to the surface of the rotating blade at the outer peripheral portion of the fixing member.

另外,本發明的切斷方法具有如下態樣:所述既定區域由具有導電性的物質構成。 Further, the cutting method of the present invention has a state in which the predetermined region is composed of a material having conductivity.

另外,本發明的切斷方法具有如下態樣:所述測定手段包括渦流式位移感測器。 Further, the cutting method of the present invention has the following aspect: the measuring means includes a vortex displacement sensor.

另外,本發明的切斷方法具有如下態樣:所述被切斷物為封裝完畢基板。 Further, the cutting method of the present invention has the following aspect: the object to be cut is a packaged substrate.

另外,本發明的切斷方法具有如下態樣:所述被切斷物為製作有分別與複數個區域相對應的功能元件的基板。 Further, the cutting method of the present invention has a configuration in which the object to be cut is a substrate on which functional elements respectively corresponding to a plurality of regions are formed.

根據本發明,在切斷裝置中,具備:工作台,載置被切斷物;切斷機構,對被切斷物進行切斷;以及移動機構,使工作台與切斷機構相對地移動。在切斷機構中設置有在旋轉軸的前端部安裝的旋轉刃與在旋轉刃的兩側的側面中用以固定旋轉刃的兩個固定構件。在切斷機構中,以與固定構件的既定區域相對向的方式設置測定手段。測定手段藉由對固定構件的既定區域中的位移進行檢測,從而能夠測定出旋轉刃沿著軸向位移的第一位移量、以及旋轉刃沿著徑向位移的第二位移量。因此,使用一個測定手段,就能夠測試軸向的位移量與徑向的位移量中的任一個。 According to the invention, the cutting device includes: a table on which the object to be cut is placed; a cutting mechanism that cuts the object to be cut; and a moving mechanism that moves the table and the cutting mechanism relative to each other. The cutting mechanism is provided with a rotary blade attached to the front end portion of the rotary shaft and two fixing members for fixing the rotary blade in the side surfaces on both sides of the rotary blade. In the cutting mechanism, the measuring means is provided so as to face a predetermined area of the fixing member. The measuring means can detect the displacement in the predetermined region of the fixing member, thereby measuring the first displacement amount in which the rotary blade is displaced in the axial direction and the second displacement amount in which the rotary blade is displaced in the radial direction. Therefore, by using one measuring means, it is possible to test either one of the axial displacement amount and the radial displacement amount.

1‧‧‧心軸(切斷機構) 1‧‧‧ mandrel (cutting mechanism)

2‧‧‧心軸本體部 2‧‧‧Heart main body

3‧‧‧旋轉軸 3‧‧‧Rotary axis

4‧‧‧旋轉刃 4‧‧‧Rotary blade

5‧‧‧錐形部(既定區域) 5‧‧‧Cone (established area)

6‧‧‧凸緣(固定構件) 6‧‧‧Flange (fixed member)

7‧‧‧位移感測器(測定手段) 7‧‧‧ Displacement sensor (measurement means)

8‧‧‧感測器線圈 8‧‧‧Sensor coil

9‧‧‧感測器部 9‧‧‧Sensor Department

10‧‧‧轉換器 10‧‧‧ converter

11‧‧‧同軸纜線 11‧‧‧ coaxial cable

12‧‧‧高頻磁場 12‧‧‧High frequency magnetic field

13‧‧‧渦流 13‧‧‧ eddy current

14‧‧‧輸出特性 14‧‧‧ Output characteristics

15‧‧‧電壓波形的振幅 15‧‧‧Amplitude of the voltage waveform

16a、16b‧‧‧凸緣(固定構件) 16a, 16b‧‧‧Flange (fixed member)

16c、16d、16e、16f‧‧‧外周部端(既定區域) 16c, 16d, 16e, 16f‧‧‧ peripheral end (established area)

17‧‧‧安裝板 17‧‧‧Installation board

17a‧‧‧相當於豎棒的部分 17a‧‧‧Equivalent to the vertical part

17b‧‧‧相當於橫棒的部分 17b‧‧‧ equivalent to the part of the horizontal bar

18‧‧‧切斷裝置 18‧‧‧cutting device

19‧‧‧基板供給機構 19‧‧‧Substrate supply mechanism

20‧‧‧封裝完畢基板(被切斷物) 20‧‧‧Packaged substrate (cut object)

21‧‧‧切斷用工作台(工作台) 21‧‧‧Working table for cutting off (workbench)

22‧‧‧移動機構 22‧‧‧Mobile agencies

23‧‧‧旋轉機構 23‧‧‧Rotating mechanism

24‧‧‧檢查用工作台 24‧‧‧Checking workbench

25‧‧‧切斷後基板 25‧‧‧Scissed substrate

26‧‧‧托盤 26‧‧‧Tray

d0、dX、d1、d2‧‧‧從位移感測器的前端部到錐形部的測定距離 D0, dX, d1, d2‧‧‧Determination distance from the front end to the taper of the displacement sensor

L0、LX‧‧‧從心軸本體的前端部到旋轉刃的厚度方向上的中心線的距離 L0, LX‧‧‧ Distance from the front end of the mandrel body to the centerline in the thickness direction of the rotary blade

α‧‧‧固定值 Α‧‧‧ fixed value

V1、V2、V3‧‧‧輸出電壓 V1, V2, V3‧‧‧ output voltage

A‧‧‧基板供給單元 A‧‧‧Substrate supply unit

B‧‧‧基板切斷單元 B‧‧‧Substrate cutting unit

C‧‧‧檢查單元 C‧‧‧Check unit

CTL‧‧‧控制部 CTL‧‧‧Control Department

P‧‧‧製品 P‧‧‧Products

圖1的(a)~(c)為分別表示在本發明的切斷裝置的實施例1中的心軸的結構以及旋轉刃的位移的概略圖,(a)為表示旋轉刃初始的狀態的概略圖、(b)為表示旋轉刃在軸向上位移的狀態的概略圖、(c)為表示旋轉刃在徑向上位移的狀態的概略圖。 (a) to (c) of FIG. 1 are schematic diagrams showing the configuration of the mandrel and the displacement of the rotary blade in the first embodiment of the cutting device according to the present invention, and (a) shows the initial state of the rotary blade. (b) is a schematic view showing a state in which the rotary blade is displaced in the axial direction, and (c) is a schematic view showing a state in which the rotary blade is displaced in the radial direction.

圖2的(a)~(c)為分別表示圖1所示的旋轉刃上下移動的狀態的概略圖,(a)為表示旋轉刃初始的狀態的概略圖、(b)為表示旋轉刃移動到最上部的狀態的概略圖、(c)表示旋轉刃移動到最下部的狀態的概略圖。 (a) to (c) of FIG. 2 are schematic views each showing a state in which the rotary blade shown in FIG. 1 is moved up and down, wherein (a) is a schematic view showing a state in which the rotary blade is initial, and (b) is a view showing a state in which the rotary blade is moved. (C) is a schematic view showing a state in which the rotary blade is moved to the lowermost state.

圖3是表示本實施例所用的渦流式位移感測器的結構的概略圖。 Fig. 3 is a schematic view showing the configuration of an eddy current displacement sensor used in the present embodiment.

圖4是表示藉由渦流式位移感測器測定出的距離與輸出電壓以及時間的關係的相關圖。 4 is a correlation diagram showing the relationship between the distance measured by the eddy current displacement sensor and the output voltage and time.

圖5的(a)、(b)為分別表示在本發明的切斷裝置的實施例2中的位移感測器的安裝位置的概略圖,(a)為表示位移感測器被安裝在水準方向時的概略圖、(b)為表示位移感測器被安裝在鉛直方向時的概略圖。 Figs. 5(a) and 5(b) are schematic diagrams showing the mounting position of the displacement sensor in the second embodiment of the cutting device according to the present invention, and Fig. 5(a) is a view showing that the displacement sensor is mounted at a level. The schematic view in the direction and (b) are schematic views showing when the displacement sensor is mounted in the vertical direction.

圖6為表示在本發明的切斷裝置的實施例3中的切斷裝置的概要的俯視圖。 Fig. 6 is a plan view showing an outline of a cutting device in a third embodiment of the cutting device of the present invention.

如圖1所示,在切斷裝置中,在心軸1中設置旋轉軸3、在旋轉軸3的前端部安裝的旋轉刃4、以及具有從兩側夾著旋轉刃4以進行固定的錐形部5的凸緣(固定構件)6。在心軸本體部2中,在與凸緣6的錐形部5相對向的位置設置位移感測器7。使用渦流式位移感測器來作為位移感測器7。藉由對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定,從而能夠測定出軸向的位移量與徑向的位移量。能夠對因熱膨脹而伸縮的旋轉軸3的位移量進行校正,以使旋轉刃4的中心線的位置準確吻合於封裝完畢基板的切斷線的位置來進行切斷。藉由捕捉旋轉刃4的振動用以作為從位移感測器7的前端部到錐形部5的距離發生位移的位移量, 從而能夠掌握旋轉刃4的振動的振幅的大小。 As shown in Fig. 1, in the cutting device, a rotary shaft 3, a rotary blade 4 attached to a front end portion of the rotary shaft 3, and a tapered portion having a rotary blade 4 sandwiched from both sides are provided in the spindle 1. The flange (fixing member) 6 of the portion 5. In the spindle main body portion 2, a displacement sensor 7 is provided at a position opposed to the tapered portion 5 of the flange 6. An eddy current displacement sensor is used as the displacement sensor 7. By measuring the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6, the amount of displacement in the axial direction and the amount of displacement in the radial direction can be measured. The amount of displacement of the rotating shaft 3 that expands and contracts due to thermal expansion can be corrected so that the position of the center line of the rotating blade 4 is accurately aligned with the position of the cutting line of the packaged substrate. By capturing the vibration of the rotary blade 4 as a displacement amount that is displaced from the front end portion of the displacement sensor 7 to the tapered portion 5, Thereby, the magnitude of the amplitude of the vibration of the rotary blade 4 can be grasped.

(實施例1) (Example 1)

參照圖1~圖4對本發明的切斷裝置的實施例1進行說明。對於本申請文件中的任意附圖,為了易於理解,均適當省略或誇張地示意性地描繪。對於相同的結構要素標注相同的附圖標記並適當省略說明。 The first embodiment of the cutting device of the present invention will be described with reference to Figs. 1 to 4 . For the sake of easy understanding, any of the drawings in the present application are appropriately omitted or exaggeratedly depicted. The same components are denoted by the same reference numerals, and the description is omitted as appropriate.

如圖1的(a)所示,作為切斷機構的心軸1具備:心軸本體部2、與心軸電機(未圖示)連接的旋轉軸3、以及在旋轉軸3的前端部安裝的旋轉刃4。旋轉刃4例如藉由被具有錐形部5的兩個凸緣6夾著兩面(旋轉刃4的兩側的側面)而固定於旋轉軸3。凸緣6具有環形的形狀(曲面環形)。凸緣6的錐形部5相對於旋轉刃4具有30~50度的角度。特別較佳地,具有40度的角度。凸緣6例如由不銹鋼或鉻鋼等具有導電性的材料(例如,金屬)形成。錐形部5可以被設置在兩個凸緣6之中的任一個凸緣6上。較佳地,在接近心軸本體部2的一側的凸緣6上設置錐形部5。在圖1中,錐形部5的中心側的厚度被形成為大於周邊側的厚度。相反地,錐形部5的中心側的厚度也可以小於周邊側的厚度。 As shown in FIG. 1( a ), the spindle 1 as a cutting mechanism includes a spindle main body 2 , a rotating shaft 3 connected to a spindle motor (not shown), and a front end portion of the rotating shaft 3 . Rotating edge 4. The rotary blade 4 is fixed to the rotary shaft 3 by, for example, sandwiching both surfaces (side faces on both sides of the rotary blade 4) by the two flanges 6 having the tapered portion 5. The flange 6 has an annular shape (curved surface). The tapered portion 5 of the flange 6 has an angle of 30 to 50 degrees with respect to the rotary blade 4. Particularly preferably, it has an angle of 40 degrees. The flange 6 is formed of, for example, a conductive material (for example, metal) such as stainless steel or chrome steel. The tapered portion 5 may be provided on any one of the two flanges 6. Preferably, the tapered portion 5 is provided on the flange 6 on the side close to the mandrel body portion 2. In FIG. 1, the thickness of the center side of the tapered portion 5 is formed to be larger than the thickness of the peripheral side. Conversely, the thickness of the center side of the tapered portion 5 may be smaller than the thickness of the peripheral side.

在心軸1中,作為對從心軸本體部2的前端部到旋轉刃4的距離進行測定的單元,在心軸本體部2的前端部設置有位移感測器7。位移感測器7被設置在與凸緣6的錐形部5相對向的位置。位移感測器7對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定。作為位移感測器7,例如,較佳使用藉由檢測渦流來對位移後的距離進行測定的渦流式位移感測器。 In the mandrel 1, as a means for measuring the distance from the distal end portion of the mandrel main body portion 2 to the rotary blade 4, a displacement sensor 7 is provided at the distal end portion of the mandrel main body portion 2. The displacement sensor 7 is disposed at a position opposed to the tapered portion 5 of the flange 6. The displacement sensor 7 measures the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6. As the displacement sensor 7, for example, an eddy current displacement sensor that measures the displaced distance by detecting eddy currents is preferably used.

在心軸1中,藉由使用渦流式位移感測器來作為位移感測器7,從而非接觸地對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定。例如,在開始進行封裝完畢基板的切斷之前的初始狀態下,將從位移感測器7的前端部到凸緣6的錐形部5的距離設為d0,將從心軸本體部2的前端部到旋轉刃4的厚度方向上的中心線的距離設為L0。在初始狀態下,處於L0=d0+α的關係,α的值可以根據位移感測器7的尺寸、凸緣6中的錐形部5的位置與角度、旋轉刃4的厚度等事先求出。α的值表現為幾乎不受熱的影響的固定值。因此,即使在開始進行封裝完畢基板的切斷之後旋轉軸3因熱膨脹而在軸向上延伸,藉由對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定,也能夠求出從心軸本體部2到旋轉刃4的中心線的距離。 In the mandrel 1, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 is measured in a non-contact manner by using a vortex displacement sensor as the displacement sensor 7. For example, in the initial state before the cutting of the packaged substrate is started, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 is set to d0, and the spindle main body portion 2 is The distance from the front end portion to the center line in the thickness direction of the rotary blade 4 is set to L0. In the initial state, in the relationship of L0=d0+α, the value of α can be obtained in advance according to the size of the displacement sensor 7, the position and angle of the tapered portion 5 in the flange 6, the thickness of the rotary blade 4, and the like. . The value of α appears as a fixed value that is hardly affected by heat. Therefore, even if the rotating shaft 3 extends in the axial direction due to thermal expansion after the cutting of the packaged substrate is started, by measuring the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6, The distance from the mandrel main body portion 2 to the center line of the rotary blade 4 can also be obtained.

封裝完畢基板由藉由驅動心軸電機(未圖示)而高速旋轉的旋轉刃4切斷。如圖1的(b)所示,當繼續進行封裝完畢基板的切斷時,高速旋轉中的旋轉軸3發熱,因熱膨脹而在軸向(在圖中為+X方向)上逐漸延伸。由於旋轉軸3在+X方向上延伸,因此旋轉刃4在+X方向上以旋轉軸3延伸出的程度來進行位移。在從開始進行封裝完畢基板的切斷之後的某個時點,如果將從位移感測器7的前端部到錐形部5的測定距離設為dX,則從心軸本體部2的前端部到旋轉刃4的中心線的距離LX為LX=dX+α。旋轉軸3因熱膨脹,導致旋轉軸3在X方向上以(dX-d0)來延伸。因此,在切斷封裝完畢基板時,按該旋轉軸3延伸出的程度(dX-d0)來校正旋轉刃4的位置,從而能夠使旋轉刃4的位置準確吻合於封裝完畢基板的切斷線的位置來切斷封裝完畢基板。 The packaged substrate is cut by a rotary blade 4 that is rotated at a high speed by a drive spindle motor (not shown). As shown in FIG. 1(b), when the cutting of the packaged substrate is continued, the rotating shaft 3 during high-speed rotation generates heat, and gradually expands in the axial direction (in the +X direction in the drawing) due to thermal expansion. Since the rotary shaft 3 extends in the +X direction, the rotary blade 4 is displaced by the extent that the rotary shaft 3 extends in the +X direction. At some point after the cutting of the packaged substrate is started, if the measurement distance from the front end portion of the displacement sensor 7 to the tapered portion 5 is dX, the front end portion of the spindle main body portion 2 is The distance LX of the center line of the rotary blade 4 is LX = dX + α. The rotating shaft 3 is thermally expanded, causing the rotating shaft 3 to extend in the X direction by (dX-d0). Therefore, when the packaged substrate is cut, the position of the rotary blade 4 is corrected to the extent (dX-d0) at which the rotary shaft 3 extends, so that the position of the rotary blade 4 can be accurately matched to the cut line of the packaged substrate. The position to cut off the packaged substrate.

如圖1的(c)所示,旋轉刃4因在切斷封裝完畢基板的過程中受到切斷負荷,由此會在徑向上發生位移。因接受到徑向的位移,導致旋轉刃4在圖的上下方向(Z方向)上進行振動。當切斷負荷大時,旋轉刃4的振動增大,向製品施加的負荷也會增大,導致品質劣化。進而,當旋轉刃4的振動增大時,旋轉刃4會發生破損,致使製品的品質劣化。因此,當切斷封裝完畢基板時,設定如減小切斷負荷以使旋轉刃4的振動的振幅變小這樣的切斷條件就變得重要。 As shown in FIG. 1(c), the rotary blade 4 is subjected to a cutting load during the cutting of the packaged substrate, and thus is displaced in the radial direction. Due to the radial displacement, the rotary blade 4 vibrates in the vertical direction (Z direction) of the figure. When the cutting load is large, the vibration of the rotary blade 4 increases, and the load applied to the product also increases, resulting in deterioration of quality. Further, when the vibration of the rotary blade 4 is increased, the rotary blade 4 is broken, and the quality of the product is deteriorated. Therefore, when the packaged substrate is cut, it is important to set a cutting condition such that the cutting load is reduced to reduce the amplitude of the vibration of the rotary blade 4.

因旋轉刃4在上下方向(Z方向)上振動,導致位移感測器7所測定的錐形部5的位置(在圖中為Z方向的位置)發生位移。因此,能夠測定旋轉刃4的徑向的位移用以作為從位移感測器7的前端部到錐形部5的距離位移後的位移量。即,能夠求出旋轉刃4的振動的振幅的大小以作為從位移感測器7的前端部到錐形部5的距離的位移量。藉由位移感測器7對直到週期性地進行位移的凸緣6的錐形部5的距離進行測定,從而能夠掌握旋轉刃4的振動的狀態。在本實施例中,藉由在凸緣6設置錐形部5,從而能夠藉由一個位移感測器7,來測定軸向的位移與徑向的位移中的任一個。 When the rotary blade 4 vibrates in the vertical direction (Z direction), the position of the tapered portion 5 (the position in the Z direction in the drawing) measured by the displacement sensor 7 is displaced. Therefore, the displacement in the radial direction of the rotary blade 4 can be measured as the displacement amount after the displacement from the front end portion of the displacement sensor 7 to the tapered portion 5. In other words, the magnitude of the amplitude of the vibration of the rotary blade 4 can be obtained as the displacement amount from the tip end portion of the displacement sensor 7 to the tapered portion 5. The displacement of the tapered portion 5 of the flange 6 that is periodically displaced by the displacement sensor 7 is measured, whereby the state of the vibration of the rotary blade 4 can be grasped. In the present embodiment, by providing the tapered portion 5 at the flange 6, one of the axial displacement and the radial displacement can be measured by one displacement sensor 7.

參照圖2,對旋轉刃4因振動而上下移動的狀態進行說明。如圖2的(a)所示,在初始狀態下,從位移感測器7的前端部到凸緣6的錐形部5的距離為d0。在切斷封裝完畢基板時,通常使旋轉刃4以20000~40000rpm高速旋轉,據此來切斷封裝完畢基板。如果在這種情況下,旋轉刃4的旋轉的週期變為3~1.5msec,則旋轉刃4的振動的週期也成為同等程度。因此,由於旋轉刃4的振動的週期為短時間,因此在該短時間的期 間內,可以忽略旋轉軸3向軸向的延伸。換言之,在旋轉刃4因振動而在短時間的期間內在Z方向上移動的狀態下,從心軸本體部2的前端部到旋轉刃4的中心線的距離L0是固定的。 A state in which the rotary blade 4 moves up and down due to vibration will be described with reference to Fig. 2 . As shown in (a) of FIG. 2, in the initial state, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 is d0. When the packaged substrate is cut, the rotary blade 4 is normally rotated at a high speed of 20,000 to 40,000 rpm, whereby the packaged substrate is cut. In this case, the period of the rotation of the rotary blade 4 is 3 to 1.5 msec, and the period of the vibration of the rotary blade 4 is also equal. Therefore, since the period of the vibration of the rotary blade 4 is short time, in the short period of time In the meantime, the axial extension of the rotary shaft 3 can be ignored. In other words, in a state where the rotary blade 4 moves in the Z direction due to vibration for a short period of time, the distance L0 from the front end portion of the spindle main body portion 2 to the center line of the rotary blade 4 is fixed.

如圖2的(b)所示,在旋轉刃4發生振動並移動到圖的最上部的狀態下,從位移感測器7的前端部到凸緣6的錐形部5的距離變為d1。由於對錐形部5的厚度成為最厚的位置進行測定,因此旋轉刃4在移動到圖的最上部時,d1變為最小值。此外,旋轉刃4與旋轉軸3成為一體而在Z方向上進行移動。在圖中,為了便於說明,表示為僅固定有旋轉刃4的那部分的旋轉軸3在Z方向上移動。 As shown in (b) of FIG. 2, in a state where the rotary blade 4 vibrates and moves to the uppermost portion of the figure, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 becomes d1. . Since the thickness of the tapered portion 5 is measured to be the thickest position, when the rotary blade 4 is moved to the uppermost portion of the figure, d1 becomes the minimum value. Further, the rotary blade 4 is integrated with the rotary shaft 3 to move in the Z direction. In the drawing, for convenience of explanation, the rotating shaft 3 shown as the portion where only the rotary blade 4 is fixed is moved in the Z direction.

如圖2的(c)所示,在旋轉刃4發生振動並移動到圖的最下部的狀態下,從位移感測器7的前端部到凸緣6的錐形部5的距離變為d2。由於對錐形部5的厚度成為最薄的位置進行測定,因此旋轉刃4在移動到圖的最下部時,d2變為最大值。 As shown in (c) of FIG. 2, in a state where the rotary blade 4 vibrates and moves to the lowermost portion of the figure, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 becomes d2. . Since the thickness of the tapered portion 5 is measured to be the thinnest position, when the rotary blade 4 is moved to the lowermost portion of the figure, d2 becomes the maximum value.

旋轉刃4因振動而在Z方向上移動,從而位移感測器7所測定的直到錐形部5的距離最遠處為d2,最近處為d1。因此,凸緣6的錐形部5在Z方向上移動,據此,位移感測器7所測定的距離為(d2-d1)的範圍。凸緣6的錐形部5間接性地(外觀上)在X方向上移動的距離成為(d2-d1)。因此,與旋轉刃4振動的週期相對應,位移感測器7週期性地測定從d1到d2的距離以作為直到錐形部5的距離。從位移感測器7的前端部到錐形部5的距離的差分與旋轉刃4的振幅成比例。因此,藉由位移感測器7對從位移感測器7的前端部到錐形部5的距離進行測定,從而能夠掌握旋轉刃4振動的狀態。 The rotary blade 4 is moved in the Z direction by vibration, so that the distance farthest from the tapered portion 5 measured by the displacement sensor 7 is d2, and the closest point is d1. Therefore, the tapered portion 5 of the flange 6 moves in the Z direction, whereby the distance measured by the displacement sensor 7 is in the range of (d2-d1). The distance in which the tapered portion 5 of the flange 6 indirectly (appears) moves in the X direction becomes (d2-d1). Therefore, corresponding to the period in which the rotary blade 4 vibrates, the displacement sensor 7 periodically measures the distance from d1 to d2 as the distance up to the tapered portion 5. The difference in distance from the front end portion of the displacement sensor 7 to the tapered portion 5 is proportional to the amplitude of the rotary blade 4. Therefore, the distance from the distal end portion of the displacement sensor 7 to the tapered portion 5 is measured by the displacement sensor 7, so that the state in which the rotary blade 4 vibrates can be grasped.

參照圖3,對作為位移感測器7使用的渦流式位移感測器的結構與動作進行說明。渦流式位移感測器7例如具備:在前端部具有感測器線圈8的感測器部9、由進行振盪與檢波等的電子電路構成的轉換器(驅動器)10、以及連接感測器部9與轉換器10的同軸纜線11。轉換器10由振盪電路、諧振電路、檢波電路、放大電路、輸出電路(線性化電路)等構成。 The structure and operation of the eddy current displacement sensor used as the displacement sensor 7 will be described with reference to Fig. 3 . The eddy current displacement sensor 7 includes, for example, a sensor unit 9 having a sensor coil 8 at a distal end portion, a converter (driver) 10 including an electronic circuit that performs oscillation and detection, and a connection sensor unit. 9 coaxial cable 11 to converter 10. The converter 10 is composed of an oscillation circuit, a resonance circuit, a detection circuit, an amplification circuit, an output circuit (linearization circuit), and the like.

對使用渦流式位移感測器7來對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定的方法進行說明。首先,將高頻訊號從轉換器10內的振盪電路供給到感測器部9的感測器線圈8。據此,由感測器線圈8產生高頻磁場12。在該磁場12內接近由金屬構成的靶(在實施例1中相當於凸緣6的錐形部5)時,在靶表面產生渦流13。渦流13的大小根據感測器線圈8與靶的距離而變化。根據渦流13的變化,包括從轉換器10側看到的靶在內的感測器線圈8的阻抗會發生變化。因此,能夠捕捉感測器部9與靶(錐形部5)的距離的變化以作為感測器線圈8的阻抗的變化。 A method of measuring the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 using the eddy current displacement sensor 7 will be described. First, the high frequency signal is supplied from the oscillation circuit in the converter 10 to the sensor coil 8 of the sensor portion 9. Accordingly, the high frequency magnetic field 12 is generated by the sensor coil 8. When the target made of metal (corresponding to the tapered portion 5 of the flange 6 in the first embodiment) is approached in the magnetic field 12, the eddy current 13 is generated on the surface of the target. The size of the eddy current 13 varies depending on the distance of the sensor coil 8 from the target. According to the change of the eddy current 13, the impedance of the sensor coil 8 including the target seen from the side of the converter 10 changes. Therefore, the change in the distance of the sensor portion 9 from the target (the tapered portion 5) can be captured as a change in the impedance of the sensor coil 8.

取得感測器線圈8的阻抗的變化以作為在轉換器10的諧振電路中輸出電壓的變化。將該電壓的變化藉由檢波電路轉換為與距離相對應的直流電壓。進而,藉由放大電路來放大訊號,藉由輸出電路(線性化電路)進行直線化並輸出以作為與距離成比例的電壓。輸出特性14是以橫軸為測定的距離並以縱軸為輸出電壓而獲得以作為與距離成比例的線性的輸出。藉由使用渦流式位移感測器7來讀取靶的輸出電壓,從而能夠求出直到靶的距離。據此,能夠求出從渦流式位移感測器7的前端部到凸緣6的錐形部5的距離。由於根據阻抗的變化而求出直到靶的距離,因此渦流 式位移感測器7與光學式位移感測器相比難以受到水或污垢等的影響。 The change in the impedance of the sensor coil 8 is taken as a change in the output voltage in the resonant circuit of the converter 10. The change in voltage is converted by the detector circuit into a DC voltage corresponding to the distance. Further, the signal is amplified by an amplifying circuit, linearized by an output circuit (linearizing circuit), and output as a voltage proportional to the distance. The output characteristic 14 is obtained by taking the horizontal axis as the measured distance and the vertical axis as the output voltage as a linear output proportional to the distance. The distance from the target can be obtained by reading the output voltage of the target using the eddy current displacement sensor 7. Thereby, the distance from the front end portion of the eddy current displacement sensor 7 to the tapered portion 5 of the flange 6 can be obtained. Eddy current due to the distance from the target based on the change in impedance The displacement sensor 7 is less susceptible to water, dirt, etc. than the optical displacement sensor.

參照圖4,對使用渦流式位移感測器7來掌握旋轉刃4的振動的振幅的大小的方法進行說明。如圖4的(a)所示,渦流式位移感測器7的輸出特性是輸出與距離成比例的電壓。如圖4的(b)所示,從渦流式位移感測器7的前端部到凸緣6的錐形部5的距離在初始狀態下為d0,因旋轉刃4振動,而在距離d1到d2的範圍內週期性地位移(參照圖2)。因此,圖4的(a)所示的輸出特性的輸出電壓V1能夠與從V1向V2遷移相對應地,將從渦流式位移感測器7的前端部到凸緣6的錐形部5的距離的位移表示為圖4的(b)的從距離d1向d2的位移。如圖4的(c)所示,從輸出電壓V1向V2的遷移能夠表示為相對於時間的電壓波形的位移(振幅)。因此,能夠掌握作為該電壓波形的變化的振幅15以作為旋轉刃4的振動的振幅的大小。電壓波形的振幅15(=V2-V1)越小,振動的振幅越小。換言之,渦流式位移感測器7所測定的直到錐形部5的距離的位移量(=d1-d2)越小,則旋轉刃4的振動越小。 A method of grasping the magnitude of the amplitude of the vibration of the rotary blade 4 using the eddy current displacement sensor 7 will be described with reference to Fig. 4 . As shown in (a) of FIG. 4, the output characteristic of the eddy current displacement sensor 7 is a voltage whose output is proportional to the distance. As shown in (b) of FIG. 4, the distance from the front end portion of the eddy current displacement sensor 7 to the tapered portion 5 of the flange 6 is d0 in the initial state, due to the vibration of the rotary blade 4, and at the distance d1 The range of d2 is periodically displaced (refer to Figure 2). Therefore, the output voltage V1 of the output characteristic shown in (a) of FIG. 4 can be shifted from the front end portion of the eddy current displacement sensor 7 to the tapered portion 5 of the flange 6 in correspondence with the transition from V1 to V2. The displacement of the distance is expressed as the displacement from the distance d1 to d2 of (b) of Fig. 4 . As shown in (c) of FIG. 4, the transition from the output voltage V1 to V2 can be expressed as a displacement (amplitude) of the voltage waveform with respect to time. Therefore, the amplitude 15 which is a change of the voltage waveform can be grasped as the magnitude of the amplitude of the vibration of the rotary blade 4. The smaller the amplitude 15 (=V2-V1) of the voltage waveform, the smaller the amplitude of the vibration. In other words, the smaller the displacement amount (=d1 - d2) of the distance up to the tapered portion 5 measured by the vortex displacement sensor 7, the smaller the vibration of the rotary blade 4.

藉由對電壓波形的振幅15(=V2-V1)或渦流式位移感測器7所測定的直到錐形部5的距離的位移量(=d2-d1)進行把握,從而能夠掌握旋轉刃4的振動的振幅的大小。當電壓波形的振幅15或渦流式位移感測器7所測定的直到錐形部5的距離的位移量較小時,切斷負荷減小切斷效率變好。因此,藉由掌握旋轉刃4的振動的振幅的大小,從而能夠設定切斷條件以便減小切斷刃4的振動。據此,能夠減小切斷負荷並提高切斷效率與切斷品質。此外,當實際對旋轉刃4的振動進行測定時,藉由消除凸緣6的偏心等造成的影響來求出振動的振幅與振動的中心的變化。 By grasping the amplitude 15 (=V2-V1) of the voltage waveform or the displacement amount (=d2-d1) of the distance up to the tapered portion 5 measured by the eddy current displacement sensor 7, the rotary blade 4 can be grasped. The magnitude of the amplitude of the vibration. When the amplitude 15 of the voltage waveform or the displacement amount of the distance up to the tapered portion 5 measured by the eddy current displacement sensor 7 is small, the cutting load is reduced and the cutting efficiency is improved. Therefore, by grasping the magnitude of the amplitude of the vibration of the rotary blade 4, the cutting condition can be set so as to reduce the vibration of the cutting blade 4. According to this, it is possible to reduce the cutting load and improve the cutting efficiency and the cutting quality. Further, when the vibration of the rotary blade 4 is actually measured, the influence of the amplitude of the vibration and the center of the vibration is obtained by eliminating the influence of the eccentricity or the like of the flange 6.

根據本實施例,在切斷裝置中,在心軸1中設置旋轉軸3與安裝於旋轉軸3的先端部的旋轉刃4。設置從兩側夾著旋轉刃4以進行固定的、具有錐形部5的兩個凸緣6。在心軸本體部2中,在與凸緣6的錐形部5相對向的位置設置位移感測器7。使用渦流式位移感測器來作為位移感測器7,對從位移感測器7的前端部到凸緣6的錐形部5的距離進行測定。據此,能夠求出軸向上的旋轉刃4的位移(從心軸本體部2的前端部到旋轉刃4的厚度方向上的中心線的距離)。因此,能夠對因熱膨脹而伸縮的旋轉軸3的位移量進行校正,並使旋轉刃4的中心線的位置準確吻合於封裝完畢基板的切斷線的位置來進行切斷。能夠防止在旋轉刃4的中心線的位置從封裝完畢基板的切斷線處錯位的狀態下進行切斷,從而實現成品率的提高與品質的提高。 According to the present embodiment, in the cutting device, the rotary shaft 3 and the rotary blade 4 attached to the tip end portion of the rotary shaft 3 are provided in the spindle 1. Two flanges 6 having a tapered portion 5 are provided to sandwich the rotating blade 4 from both sides. In the spindle main body portion 2, a displacement sensor 7 is provided at a position opposed to the tapered portion 5 of the flange 6. The distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 was measured using a vortex displacement sensor as the displacement sensor 7. Thereby, the displacement of the rotary blade 4 in the axial direction (the distance from the front end portion of the spindle main body portion 2 to the center line in the thickness direction of the rotary blade 4) can be obtained. Therefore, the amount of displacement of the rotating shaft 3 that expands and contracts due to thermal expansion can be corrected, and the position of the center line of the rotating blade 4 can be accurately aligned with the position of the cutting line of the packaged substrate to perform cutting. It is possible to prevent the position of the center line of the rotary blade 4 from being displaced from the cutting line of the packaged substrate, thereby improving the yield and improving the quality.

另外,根據本實施例,在從兩側夾著旋轉刃4以進行固定的凸緣6上設置錐形部5。旋轉刃4因在切斷封裝完畢基板的過程中受到切斷負荷,所以在徑向上發生位移,在圖1的Z方向上振動。藉由在凸緣6設置錐形部5,從而能夠捕捉旋轉刃4的振動以作為從位移感測器7的前端部到凸緣6的錐形部5的距離位移後的位移量。能夠捕捉旋轉刃4的振動的週期以作為從位移感測器7的前端部到錐形部5的距離位移後的位移量的週期。能夠捕捉旋轉刃4的振動的振幅的大小以作為從位移感測器7的前端部到錐形部5的距離的位移量的大小。因此,藉由使用位移感測器7來測定從位移感測器7的前端部到凸緣6的錐形部5的距離,從而能夠掌握旋轉刃4的振動的振幅的大小、振動的中心的變化等旋轉刃4的狀態的變化。藉由掌握旋轉刃4的振動的振幅的大小,從而能夠設定切斷條件以減 小切斷刃4的振動的振幅。因此,能夠減小切斷負荷並提高切斷效率與切斷品質。 Further, according to the present embodiment, the tapered portion 5 is provided on the flange 6 which is fixed by sandwiching the rotary blade 4 from both sides. Since the rotary blade 4 receives a cutting load during cutting of the packaged substrate, it is displaced in the radial direction and vibrates in the Z direction of FIG. By providing the tapered portion 5 at the flange 6, it is possible to capture the vibration of the rotary blade 4 as the displacement amount after the displacement from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6. The period of the vibration of the rotary blade 4 can be captured as a period of the displacement amount after the displacement from the front end portion of the displacement sensor 7 to the tapered portion 5. The magnitude of the amplitude of the vibration of the rotary blade 4 can be captured as the magnitude of the displacement amount from the tip end portion of the displacement sensor 7 to the tapered portion 5. Therefore, by using the displacement sensor 7, the distance from the front end portion of the displacement sensor 7 to the tapered portion 5 of the flange 6 is measured, so that the magnitude of the amplitude of the vibration of the rotary blade 4 and the center of the vibration can be grasped. A change in the state of the rotary blade 4 such as a change. By grasping the magnitude of the amplitude of the vibration of the rotary blade 4, it is possible to set the cutting condition to be reduced. The amplitude of the vibration of the small cutting edge 4. Therefore, the cutting load can be reduced and the cutting efficiency and the cutting quality can be improved.

另外,根據本實施例,藉由在凸緣6設置錐形部5,從而能夠使用一個位移感測器7來測定軸向的位移量與徑向的位移量中的任一個。因此,能夠抑制切斷裝置的費用並把握切斷狀態,能夠實施有效地切斷。因此,能夠對成品率的提高、品質的提高、生產率的提高等作出貢獻。 Further, according to the present embodiment, by providing the tapered portion 5 in the flange 6, one displacement sensor 7 can be used to measure either one of the axial displacement amount and the radial displacement amount. Therefore, it is possible to suppress the cost of the cutting device and grasp the cut state, and it is possible to perform effective cutting. Therefore, it is possible to contribute to improvement in yield, improvement in quality, improvement in productivity, and the like.

此外,在本實施例中,在心軸本體部2中,在與接近心軸本體部2的一側的凸緣6的錐形部5相對向的位置設置位移感測器10。並不限於此,還可以使用適當形狀的安裝板,在與遠離心軸本體部2的一側的凸緣6的錐形部5相對向的位置設置位移感測器10。 Further, in the present embodiment, in the spindle main body portion 2, the displacement sensor 10 is provided at a position opposed to the tapered portion 5 of the flange 6 on the side close to the mandrel main body portion 2. Without being limited thereto, the displacement sensor 10 may be provided at a position opposed to the tapered portion 5 of the flange 6 on the side away from the mandrel body portion 2 by using a mounting plate of a suitable shape.

(實施例2) (Example 2)

參照圖5,對本發明的切斷裝置的實施例2進行說明。與實施例1的不同之處在於變更了凸緣的形狀與位移感測器7的安裝位置。除此以外的結構與實施例1相同,因此省略說明。如圖5所示,旋轉刃4被兩個圓板狀的凸緣16夾著兩面而固定於旋轉軸3。凸緣16被形成為圓板狀,其外周部端面相對於旋轉刃4的面具有垂直的形狀。將接近心軸本體部2的一側的凸緣設為16a,將相反側的凸緣設為16b。上述所謂的“相對於面而垂直的形狀”除了嚴格垂直的情況以外,還可以為在後述的位移感測器能夠檢測出其外周部端的位移的範圍內傾斜的形狀。 A second embodiment of the cutting device of the present invention will be described with reference to Fig. 5 . The difference from Embodiment 1 is that the shape of the flange and the mounting position of the displacement sensor 7 are changed. The other configuration is the same as that of the first embodiment, and thus the description thereof is omitted. As shown in FIG. 5, the rotary blade 4 is fixed to the rotary shaft 3 by sandwiching both surfaces of the two disk-shaped flanges 16. The flange 16 is formed in a disk shape, and its outer peripheral end surface has a perpendicular shape with respect to the surface of the rotary blade 4. The flange on the side close to the mandrel main body portion 2 is 16a, and the flange on the opposite side is 16b. The above-mentioned "shape perpendicular to the surface" may be a shape that is inclined in a range in which the displacement sensor described later can detect the displacement of the outer peripheral end, in addition to the case where it is strictly vertical.

如圖5的(a)所示,以朝向接近心軸本體部2的一側的凸緣16a的外周部端16c(在圖中最上位置的左端)的方式(圖中的+X方向, 即,朝向水準方向)在心軸本體部2的前端部設置有位移感測器7。使用渦流式位移感測器來作為位移感測器7。在圖5的(a)中,位移感測器7的中心部以朝向凸緣16a的外周部端16c的方式被安裝。並不限於此,安裝位移感測器7的位置只要是朝向凸緣16a的外周部端的位置則可以在任意位置。例如,在圖5的(a)中,也可以朝向在凸緣16a的最下的位置處表示的外周部端16d來安裝位移感測器7。 As shown in FIG. 5( a ), the outer peripheral end 16 c (the left end of the uppermost position in the drawing) of the flange 16 a facing the side close to the spindle main body portion 2 (the +X direction in the drawing, That is, the displacement sensor 7 is provided at the front end portion of the spindle main body portion 2 toward the level direction. An eddy current displacement sensor is used as the displacement sensor 7. In (a) of FIG. 5, the center portion of the displacement sensor 7 is attached so as to face the outer peripheral end 16c of the flange 16a. The position of the displacement sensor 7 is not limited thereto, and the position of the displacement sensor 7 may be any position as long as it is toward the outer peripheral end of the flange 16a. For example, in (a) of FIG. 5, the displacement sensor 7 may be attached to the outer peripheral end 16d indicated at the lowermost position of the flange 16a.

圖5的(b)為圖5的(a)的變形例,改變了位移感測器7的安裝位置。例如,使用設為字母“L”形狀的安裝板17,以朝向鉛直方向(-Z方向)的方式設置位移感測器7。將相當於安裝板17的豎棒17a的部分,安裝在心軸本體部2的端面(圖中右端),在相當於安裝板的橫棒17b的部分,朝向鉛直方向安裝位移感測器7。由渦流式位移感測器構成的位移感測器7以朝向凸緣16a的外周部端16e(圖中最上方位置的左上)的方式被安裝。並不限於此,安裝位移感測器7的位置只要是朝向凸緣16a或凸緣16b的外周部端的位置則可以在任意位置。例如,在圖5的(b)中,也可以朝向凸緣16b的最上方的位置處表示的外周部端16f來安裝位移感測器7。 (b) of FIG. 5 is a modification of (a) of FIG. 5, and the mounting position of the displacement sensor 7 is changed. For example, the displacement sensor 7 is provided in such a manner as to face the vertical direction (-Z direction) using the mounting plate 17 set to the letter "L" shape. A portion corresponding to the vertical rod 17a of the mounting plate 17 is attached to the end surface (right end in the drawing) of the spindle main body portion 2, and the displacement sensor 7 is attached to the vertical direction at a portion corresponding to the horizontal bar 17b of the mounting plate. The displacement sensor 7 composed of the eddy current displacement sensor is mounted toward the outer peripheral end 16e of the flange 16a (the upper left position in the uppermost position in the drawing). Not limited to this, the position at which the displacement sensor 7 is mounted may be at any position as long as it is toward the outer peripheral end of the flange 16a or the flange 16b. For example, in (b) of FIG. 5, the displacement sensor 7 may be attached to the outer peripheral end 16f indicated at the uppermost position of the flange 16b.

如圖5的(a)、(b)所示,位移感測器7以朝向水準方向或鉛直方向的方式被安裝於心軸本體部2。朝向凸緣16a或凸緣16b的外周部端來設置位移感測器7。因旋轉軸3在軸向或徑向上發生位移,導致從位移感測器7到凸緣外周部端的距離或者凸緣外周部端附近的面積發生變化。因為產生這些變化,使位移感測器7對渦流的變化進行測定。據此,能夠使用位移感測器7來測定軸向的位移與徑向的位移。 As shown in (a) and (b) of FIG. 5, the displacement sensor 7 is attached to the spindle main body portion 2 so as to face the horizontal direction or the vertical direction. The displacement sensor 7 is provided toward the outer peripheral end of the flange 16a or the flange 16b. Since the rotation shaft 3 is displaced in the axial or radial direction, the distance from the displacement sensor 7 to the outer peripheral end of the flange or the area near the outer peripheral end of the flange changes. Since these changes are generated, the displacement sensor 7 measures the change of the eddy current. According to this, the displacement sensor 7 can be used to measure the axial displacement and the radial displacement.

根據本實施例,在切斷裝置中,藉由形成為圓板狀的凸緣 16a、16b從兩側夾著旋轉刃4而固定於旋轉軸3。在心軸本體部2中,將由渦流式位移感測器構成的位移感測器7朝向凸緣16a或凸緣16b的外周部端設置。使用位移感測器7,對從位移感測器7到凸緣外周部端的距離或者凸緣外周部端附近的面積變化進行測定。據此,能夠掌握旋轉刃4在軸向上的位移或旋轉刃4的振動的振幅的大小。 According to the embodiment, in the cutting device, the flange is formed into a disk shape 16a and 16b are fixed to the rotating shaft 3 with the rotating blade 4 interposed therebetween. In the spindle main body portion 2, a displacement sensor 7 composed of a vortex displacement sensor is disposed toward the outer peripheral end of the flange 16a or the flange 16b. Using the displacement sensor 7, the distance from the displacement sensor 7 to the outer peripheral end of the flange or the change in area near the outer peripheral end of the flange was measured. Thereby, the magnitude of the displacement of the rotary blade 4 in the axial direction or the amplitude of the vibration of the rotary blade 4 can be grasped.

藉由測定軸向上的旋轉軸3的位移,從而能夠對因熱膨脹造成的伸縮的旋轉軸3的位移量進行校正,並使旋轉刃4的中心線的位置準確吻合於封裝完畢基板的切斷線的位置來進行切斷。因此,能夠防止在旋轉刃4的中心線的位置從封裝完畢基板的切斷線處錯位的狀態下進行切斷,從而實現成品率的提高與品質的提高。 By measuring the displacement of the rotating shaft 3 in the axial direction, the amount of displacement of the rotating shaft 3 due to thermal expansion can be corrected, and the position of the center line of the rotating blade 4 can be accurately matched to the cutting line of the packaged substrate. The location to cut off. Therefore, it is possible to prevent the position of the center line of the rotary blade 4 from being displaced from the cutting line of the packaged substrate, thereby improving the yield and improving the quality.

能夠捕捉旋轉刃4的振動的週期以作為凸緣外周部端附近的面積發生變化的變化量的週期。能夠捕捉旋轉刃4的振動的振幅的大小以作為位移感測器7檢測出的面積的變化量的大小。因此,使用位移感測器7,能夠掌握旋轉刃4的振動的振幅的大小。藉由掌握旋轉刃4的振動的振幅的大小,從而能夠設定切斷條件以使切斷刃4的振動的振幅減小。因此,能夠減小切斷負荷並提高切斷效率與切斷品質。 The period in which the vibration of the rotary blade 4 can be caught is a period in which the amount of change in the area near the outer peripheral end of the flange changes. The magnitude of the amplitude of the vibration of the rotary blade 4 can be captured as the magnitude of the amount of change in the area detected by the displacement sensor 7. Therefore, the displacement sensor 7 can be used to grasp the magnitude of the amplitude of the vibration of the rotary blade 4. By grasping the magnitude of the amplitude of the vibration of the rotary blade 4, the cutting condition can be set such that the amplitude of the vibration of the cutting blade 4 is reduced. Therefore, the cutting load can be reduced and the cutting efficiency and the cutting quality can be improved.

(實施例3) (Example 3)

參照圖6,對本發明的切斷裝置的實施例3進行說明。如圖6所示,切斷裝置18為使被切斷物經單片化為複數個製品的裝置。切斷裝置18具備分別作為結構要素的基板供給單元A、基板切斷單元B與檢查單元C。各結構要素(各單元A~C)能夠分別相對於其他結構要素裝卸且能夠交換。 A third embodiment of the cutting device of the present invention will be described with reference to Fig. 6 . As shown in Fig. 6, the cutting device 18 is a device for singulating a cut object into a plurality of products. The cutting device 18 includes a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements. Each component (each unit A to C) can be detached from each other and can be exchanged.

在基板供給單元A中設置有基板供給機構19。相當於被切斷物的、包括半導體晶圓等的晶片狀的元件在內的封裝完畢基板20從基板供給機構19搬出,並藉由移送機構(未圖示)被移送到基板切斷單元B中。在基板供給單元A中設置有控制部CTL,該控制部CTL對切斷裝置18的動作與切斷條件等進行設定並進行控制。 A substrate supply mechanism 19 is provided in the substrate supply unit A. The packaged substrate 20 including the wafer-shaped element such as a semiconductor wafer corresponding to the object to be cut is carried out from the substrate supply mechanism 19, and transferred to the substrate cutting unit B by a transfer mechanism (not shown). in. The board supply unit A is provided with a control unit CTL that sets and controls the operation of the cutting device 18, the cutting conditions, and the like.

圖6所示的切斷裝置18為單切割工位元台方式的切斷裝置。因此,在基板切斷單元B中設置有一個切斷用工作台21。切斷用工作台21可以藉由移動機構22沿著圖中的Y方向移動,並且可以藉由旋轉機構23沿著θ方向轉動。在切斷用工作台21上載置有封裝完畢基板20並加以吸附。 The cutting device 18 shown in Fig. 6 is a single cutting station type cutting device. Therefore, one cutting table 21 is provided in the substrate cutting unit B. The cutting table 21 can be moved in the Y direction in the drawing by the moving mechanism 22, and can be rotated in the θ direction by the rotating mechanism 23. The packaged substrate 20 is placed on the cutting table 21 and adsorbed.

在基板切斷單元B中設置有心軸1作為切斷機構。切斷裝置18為設置有一個心軸1的單心軸結構的切斷裝置。心軸1可以獨立地沿著X方向與Z方向移動。在心軸1中例如設置有被具有錐形部5的兩個凸緣6夾著的旋轉刃4(參照圖1)。與凸緣6的錐形部5相對向地在心軸1中設置渦流式位移感測器以作為位移感測器7。藉由使切斷用工作台22與心軸1相對地移動來切斷封裝完畢基板20。旋轉刃4在包含Y方向與Z方向的面內進行旋轉,據此來切斷封裝完畢基板20。 A spindle 1 is provided as a cutting mechanism in the substrate cutting unit B. The cutting device 18 is a cutting device having a single mandrel structure in which the mandrel 1 is provided. The mandrel 1 can be independently moved in the X direction and the Z direction. The mandrel 1 is provided with, for example, a rotary blade 4 sandwiched by two flanges 6 having a tapered portion 5 (see FIG. 1). A vortex displacement sensor is provided in the mandrel 1 as a displacement sensor 7 opposite to the tapered portion 5 of the flange 6. The packaged substrate 20 is cut by moving the cutting table 22 and the spindle 1 so as to face each other. The rotary blade 4 rotates in a plane including the Y direction and the Z direction, thereby cutting the packaged substrate 20 therefrom.

在檢查單元C中設置有檢查用工作台24。在檢查用工作台24上載置有由切斷封裝完畢基板20並單片化而成的複數個製品P構成的集合體、即切斷後基板25。複數個製品P由檢查用照相機(未圖示)進行檢查,並篩選為合格品與次品。合格品被收容在托盤26中。 An inspection table 24 is provided in the inspection unit C. An assembly formed of a plurality of products P obtained by cutting the packaged substrate 20 and singulating the packaged substrate 20, that is, the cut substrate 25 is placed on the inspection table 24 . A plurality of products P are inspected by an inspection camera (not shown) and are selected as qualified products and defective products. The good product is housed in the tray 26.

在本實施例中,對單切割工位元台方式且單心軸結構的切斷裝置18進行了說明。不限於此,在單切割工位元台方式且雙心軸結構的切 斷裝置或雙切割工位元台方式且雙心軸結構的切斷裝置等中也能夠適用本發明的心軸1。另外,使用了渦流式位移感測器來作為位移感測器7。不限於此,還可以使用其他非接觸式的位移感測器。 In the present embodiment, the cutting device 18 of the single-cut station method and the single-axis structure has been described. Not limited to this, in the single cutting station method and the cutting of the double mandrel structure The mandrel 1 of the present invention can also be applied to a cutting device or a double-cutting station method and a cutting device having a double-axis structure. In addition, an eddy current displacement sensor is used as the displacement sensor 7. Not limited to this, other non-contact displacement sensors can also be used.

在各實施例中,作為旋轉刃4,表示了使用具有環形形狀(曲面環形)的墊圈式旋轉刃的情況。不限於此,還可以使用在底座安裝刃尖部的襯模式旋轉刃。作為固定構件,代替兩個凸緣的組合,還可以使用凸緣與螺母的組合等。作為固定構件,還可以使用具有除環形形狀以外的平面形狀的構件。 In each of the embodiments, as the rotary blade 4, a case where a washer-type rotary blade having a ring shape (curved surface) is used is shown. Not limited to this, it is also possible to use a lining mode rotary blade that mounts the tip of the base. As the fixing member, instead of the combination of the two flanges, a combination of a flange and a nut or the like can also be used. As the fixing member, a member having a planar shape other than the annular shape can also be used.

在以上的說明中,表示了切斷作為被切斷物的包括晶片狀的元件在內的封裝完畢基板20的情況。不限於此,在切斷作為除了封裝完畢基板20以外的被切斷物的下述被切斷物來進行單片化的情況下,能夠適用本發明。第一為對由矽、化合物半導體構成且製作有電路元件、微機電系統(MEMS,Micro Electro Mechanical Systems)等功能元件的半導體晶圓(semiconductor wafer)進行單片化的情況。第二為對製作有電阻、電容器、感測器、表面彈性波設備等功能元件的陶瓷基板、玻璃基板等進行單片化來製造晶片電阻、晶片電容器與晶片型感測器、表面彈性波設備等製品的情況。在這兩種情況下,半導體晶圓、陶瓷基板等相當於製作有分別與複數個區域相對應的功能元件的基板。第三為對樹脂成形品進行單片化來製造透鏡、光學模組、導光板等光學構件的情況。第四為對樹脂成形品進行單片化來製造一般的成形製品的情況。第五為製造被用作各種電子設備的蓋的玻璃板的情況。在包括上述五種情況的各種情況下,都能夠適用以上說明的內容。 In the above description, the case where the packaged substrate 20 including the wafer-shaped element as the object to be cut is cut is shown. In the case where the following object to be cut, which is a cut object other than the packaged substrate 20, is cut into pieces, the present invention can be applied. The first is a case where a semiconductor wafer composed of a compound semiconductor and a functional element such as a circuit element or a microelectromechanical system (MEMS) is formed into a single piece. The second is to manufacture a wafer resistor, a wafer capacitor and a wafer type sensor, and a surface acoustic wave device by singulating a ceramic substrate or a glass substrate on which a functional element such as a resistor, a capacitor, a sensor, or a surface acoustic wave device is fabricated. The case of products. In either case, a semiconductor wafer, a ceramic substrate, or the like corresponds to a substrate on which functional elements respectively corresponding to a plurality of regions are formed. The third is a case where a resin molded article is singulated to produce an optical member such as a lens, an optical module, or a light guide plate. The fourth is a case where a resin molded article is singulated to produce a general molded article. The fifth is the case of manufacturing a glass plate used as a cover for various electronic devices. The above description can be applied in various cases including the above five cases.

本發明並不限定於上述的各實施例,在不脫離本發明主旨的範圍內,可根據需要,任意且適當地進行組合、變更或選擇性地採用。 The present invention is not limited to the above-described embodiments, and may be combined, modified, or selectively employed as needed, without departing from the spirit and scope of the invention.

1‧‧‧心軸(切斷機構) 1‧‧‧ mandrel (cutting mechanism)

2‧‧‧心軸本體部 2‧‧‧Heart main body

3‧‧‧旋轉軸 3‧‧‧Rotary axis

4‧‧‧旋轉刃 4‧‧‧Rotary blade

5‧‧‧錐形部(既定區域) 5‧‧‧Cone (established area)

6‧‧‧凸緣(固定構件) 6‧‧‧Flange (fixed member)

7‧‧‧位移感測器(測定手段) 7‧‧‧ Displacement sensor (measurement means)

d0、dX‧‧‧從位移感測器的前端部到錐形部的測定距離 D0, dX‧‧‧Determination distance from the front end to the taper of the displacement sensor

L0、LX‧‧‧從心軸本體的前端部到旋轉刃的厚度方向上的中心線的距離 L0, LX‧‧‧ Distance from the front end of the mandrel body to the centerline in the thickness direction of the rotary blade

α‧‧‧固定值 Α‧‧‧ fixed value

Claims (18)

一種切斷裝置,具備:工作台,載置被切斷物;切斷機構,對該被切斷物進行切斷;以及移動機構,使該工作台與該切斷機構相對地移動,該切斷裝置在沿著切斷線切斷該被切斷物來進行單片化時被使用,其特徵在於,具備:旋轉軸,設置於該切斷機構;旋轉刃,安裝於該旋轉軸的前端部;兩個固定構件,分別設置在該旋轉刃的兩側的側面中,夾著該旋轉刃以進行固定;以及測定手段,以朝向該固定構件的既定區域的方式被設置於該切斷機構,該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量,該位移量包括:該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量;以及該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量;根據該第二位移量來測定與該旋轉刃的振動有關的特性。 A cutting device comprising: a table on which a workpiece is placed; a cutting mechanism that cuts the object to be cut; and a moving mechanism that moves the table relative to the cutting mechanism, the cutting The cutting device is used when the object to be cut is cut along the cutting line and is singulated, and includes a rotating shaft provided in the cutting mechanism, and a rotating blade attached to the front end of the rotating shaft. And two fixing members respectively disposed on sides of the rotating blade, sandwiching the rotating blade for fixing; and measuring means for being disposed at the cutting mechanism toward a predetermined area of the fixing member The measuring means detects the displacement in the predetermined region of the fixing member, thereby measuring the displacement amount after the displacement of the rotating blade, the displacement amount including: the axial displacement of the rotating blade along the rotating shaft a first displacement amount caused; and a second displacement amount caused by the radial displacement of the rotary blade along the rotation axis; and a characteristic related to the vibration of the rotary blade is measured according to the second displacement amount. 一種切斷裝置,具備:工作台,載置被切斷物;切斷機構,對該被切斷物進行切斷;以及移動機構,使該工作台與該切斷機構相對地移動,該切斷裝置在沿著切斷線切斷該被切斷物來進行單片化時被使用,其特徵在於,具備:旋轉軸,設置於該切斷機構;旋轉刃,安裝於該旋轉軸的前端部; 兩個固定構件,分別設置在該旋轉刃的兩側的側面中,夾著該旋轉刃以進行固定;以及測定手段,以朝向該固定構件的既定區域的方式被設置於該切斷機構,該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量,該位移量包括:該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量;以及該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量;該既定區域具有以中心側的厚度與周邊側的厚度不同的方式形成的錐形部。 A cutting device comprising: a table on which a workpiece is placed; a cutting mechanism that cuts the object to be cut; and a moving mechanism that moves the table relative to the cutting mechanism, the cutting The cutting device is used when the object to be cut is cut along the cutting line and is singulated, and includes a rotating shaft provided in the cutting mechanism, and a rotating blade attached to the front end of the rotating shaft. unit; Two fixing members respectively disposed in side surfaces of the two sides of the rotating blade, sandwiching the rotating blade for fixing; and measuring means for being disposed at the cutting mechanism toward a predetermined area of the fixing member, The measuring means detects the displacement in the predetermined area of the fixing member, thereby measuring the displacement amount after the displacement of the rotating blade, the displacement amount including: the axial displacement of the rotating blade along the rotating shaft a first displacement amount; and a second displacement amount caused by a radial displacement of the rotary blade along the rotation axis; the predetermined region having a tapered portion formed in a manner that a thickness of the center side is different from a thickness of the peripheral side. 一種切斷裝置,具備:工作台,載置被切斷物;切斷機構,對該被切斷物進行切斷;以及移動機構,使該工作台與該切斷機構相對地移動,該切斷裝置在沿著切斷線切斷該被切斷物來進行單片化時被使用,其特徵在於,具備:旋轉軸,設置於該切斷機構;旋轉刃,安裝於該旋轉軸的前端部;兩個固定構件,分別設置在該旋轉刃的兩側的側面中,夾著該旋轉刃以進行固定;以及測定手段,以朝向該固定構件的既定區域的方式被設置於該切斷機構,該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量,該位移量包括: 該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量;以及該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量;該既定區域包括在該固定構件的外周部相對於該旋轉刃的面垂直地形成的端部。 A cutting device comprising: a table on which a workpiece is placed; a cutting mechanism that cuts the object to be cut; and a moving mechanism that moves the table relative to the cutting mechanism, the cutting The cutting device is used when the object to be cut is cut along the cutting line and is singulated, and includes a rotating shaft provided in the cutting mechanism, and a rotating blade attached to the front end of the rotating shaft. And two fixing members respectively disposed on sides of the rotating blade, sandwiching the rotating blade for fixing; and measuring means for being disposed at the cutting mechanism toward a predetermined area of the fixing member The measuring means detects the displacement in the predetermined area of the fixing member, thereby measuring the displacement amount after the displacement of the rotating blade, the displacement amount comprising: a first displacement amount caused by the axial displacement of the rotary shaft along the rotation axis; and a second displacement amount caused by the radial displacement of the rotary blade along the rotation axis; the predetermined region is included in the fixing member An end portion of the outer peripheral portion that is formed perpendicularly to the surface of the rotary blade. 如申請專利範圍第1至3項中任一項之切斷裝置,其中,藉由根據該第一位移量來校正該旋轉刃與該被切斷物的相對的位置關係,從而使該旋轉刃的位置與該切斷線的位置相吻合。 The cutting device according to any one of claims 1 to 3, wherein the rotary blade is corrected by correcting a relative positional relationship between the rotary blade and the object to be cut according to the first displacement amount. The position coincides with the position of the cutting line. 如申請專利範圍第1至3項中任一項之切斷裝置,其中,該既定區域由具有導電性的物質構成。 The cutting device according to any one of claims 1 to 3, wherein the predetermined region is made of a substance having conductivity. 如申請專利範圍第5項之切斷裝置,其中,該測定手段包括渦流式位移感測器。 The cutting device of claim 5, wherein the measuring means comprises a vortex displacement sensor. 如申請專利範圍第1至3項中任一項之切斷裝置,其中,該被切斷物為封裝完畢基板。 The cutting device according to any one of claims 1 to 3, wherein the object to be cut is a packaged substrate. 如申請專利範圍第1至3項中任一項之切斷裝置,其中,該被切斷物為製作有分別與複數個區域相對應的功能元件的基板。 The cutting device according to any one of claims 1 to 3, wherein the object to be cut is a substrate on which functional elements respectively corresponding to a plurality of regions are formed. 一種切斷裝置,具備:工作台,載置被切斷物;切斷機構,對該被切斷物進行切斷;以及移動機構,使該工作台與該切斷機構相對地移動,該切斷裝置在沿著切斷線切斷該被切斷物來進行單片化時被使用,其特徵在於,具備:旋轉軸,設置於該切斷機構;旋轉刃,安裝於該旋轉軸的前端部;兩個固定構件,分別設置在該旋轉刃的兩側的側面中,夾著該旋轉刃 以進行固定;以及測定手段,以朝向該固定構件的既定區域的方式被設置於該切斷機構,該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量,該位移量包括:該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量;以及該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量;該測定手段將因該旋轉刃發熱所產生之熱膨脹而在該軸向之該旋轉刃的位移作為該第一位移量而測定,藉由根據該第一位移量來校正該旋轉刃與該被切斷物的相對的位置關係,從而使該旋轉刃的位置與該切斷線的位置相吻合。 A cutting device comprising: a table on which a workpiece is placed; a cutting mechanism that cuts the object to be cut; and a moving mechanism that moves the table relative to the cutting mechanism, the cutting The cutting device is used when the object to be cut is cut along the cutting line and is singulated, and includes a rotating shaft provided in the cutting mechanism, and a rotating blade attached to the front end of the rotating shaft. a fixing member disposed in a side surface of each side of the rotating blade, sandwiching the rotating blade And the measuring means is provided to the cutting mechanism so as to face a predetermined area of the fixing member, the measuring means detecting the rotation by detecting the displacement in the predetermined area of the fixing member a displacement amount after the blade displacement, the displacement amount comprising: a first displacement amount caused by the axial displacement of the rotary blade along the rotation axis; and a second displacement caused by the radial displacement of the rotary blade along the rotation axis a displacement amount; the measuring means measures the displacement of the rotary blade in the axial direction due to thermal expansion caused by the heat generated by the rotary blade as the first displacement amount, and corrects the rotary blade according to the first displacement amount The relative positional relationship of the object to be cut so that the position of the rotating blade coincides with the position of the cutting line. 一種切斷方法,包括:在工作台載置被切斷物的步驟;使具有旋轉刃的切斷機構與該工作台相對地移動的步驟;以及藉由使該切斷機構與該工作台相對地移動從而使用該切斷機構沿著切斷線來切斷該被切斷物的步驟,其特徵在於,包括:使該旋轉刃旋轉的步驟,該旋轉刃在被設置於該切斷機構的旋轉軸的前端部,藉由在該旋轉刃的兩側的側面設置的兩個固定構件而被固定;使被設置於該切斷機構的測定手段與該固定構件的既定區域相對向的步驟;以及該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量的步驟,測定該位移量的步驟包括: 對該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量進行測定的步驟;以及對該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量進行測定的步驟;且包括根據該第二位移量來測定與該旋轉刃的振動的振幅有關的特性的步驟。 A cutting method comprising: a step of placing a cut object on a table; a step of moving a cutting mechanism having a rotating blade relative to the table; and by causing the cutting mechanism to face the table a step of moving the ground to cut the object to be cut along the cutting line using the cutting mechanism, comprising: a step of rotating the rotating blade, the rotating blade being disposed at the cutting mechanism a front end portion of the rotating shaft is fixed by two fixing members provided on both side surfaces of the rotating blade; and a step of the measuring means provided on the cutting mechanism facing a predetermined region of the fixing member; And the measuring means detects the displacement in the predetermined region of the fixing member to determine the displacement amount after the displacement of the rotating blade, and the step of measuring the displacement amount includes: a step of measuring a first displacement amount caused by an axial displacement of the rotary blade along the rotation axis; and a step of measuring a second displacement amount caused by a radial displacement of the rotary blade along the rotation axis And including a step of measuring a characteristic related to the amplitude of the vibration of the rotary blade based on the second displacement amount. 一種切斷方法,包括:在工作台載置被切斷物的步驟;使具有旋轉刃的切斷機構與該工作台相對地移動的步驟;以及藉由使該切斷機構與該工作台相對地移動從而使用該切斷機構沿著切斷線來切斷該被切斷物的步驟,其特徵在於,包括:使該旋轉刃旋轉的步驟,該旋轉刃在被設置於該切斷機構的旋轉軸的前端部,藉由在該旋轉刃的兩側的側面設置的兩個固定構件而被固定;使被設置於該切斷機構的測定手段與該固定構件的既定區域相對向的步驟;以及該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量的步驟,測定該位移量的步驟包括:對該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量進行測定的步驟;以及對該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量進行測定的步驟;該既定區域具有以中心側的厚度與周邊側的厚度不同的方式形成的錐 形部。 A cutting method comprising: a step of placing a cut object on a table; a step of moving a cutting mechanism having a rotating blade relative to the table; and by causing the cutting mechanism to face the table a step of moving the ground to cut the object to be cut along the cutting line using the cutting mechanism, comprising: a step of rotating the rotating blade, the rotating blade being disposed at the cutting mechanism a front end portion of the rotating shaft is fixed by two fixing members provided on both side surfaces of the rotating blade; and a step of the measuring means provided on the cutting mechanism facing a predetermined region of the fixing member; And the measuring means detects the displacement in the predetermined region of the fixing member to determine the displacement amount after the displacement of the rotating blade, and the step of measuring the displacement includes: rotating the rotating blade along the rotating blade a step of measuring a first displacement amount caused by an axial displacement of the shaft; and a step of measuring a second displacement amount caused by a radial displacement of the rotary blade along the rotation axis; the predetermined region A cone with different thickness of the peripheral side of the center side is formed Shape. 一種切斷方法,包括:在工作台載置被切斷物的步驟;使具有旋轉刃的切斷機構與該工作台相對地移動的步驟;以及藉由使該切斷機構與該工作台相對地移動從而使用該切斷機構沿著切斷線來切斷該被切斷物的步驟,其特徵在於,包括:使該旋轉刃旋轉的步驟,該旋轉刃在被設置於該切斷機構的旋轉軸的前端部,藉由在該旋轉刃的兩側的側面設置的兩個固定構件而被固定;使被設置於該切斷機構的測定手段與該固定構件的既定區域相對向的步驟;以及該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量的步驟,測定該位移量的步驟包括:對該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量進行測定的步驟;以及對該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量進行測定的步驟;該既定區域包括在該固定構件的外周部相對於該旋轉刃的面垂直地形成的端部。 A cutting method comprising: a step of placing a cut object on a table; a step of moving a cutting mechanism having a rotating blade relative to the table; and by causing the cutting mechanism to face the table a step of moving the ground to cut the object to be cut along the cutting line using the cutting mechanism, comprising: a step of rotating the rotating blade, the rotating blade being disposed at the cutting mechanism a front end portion of the rotating shaft is fixed by two fixing members provided on both side surfaces of the rotating blade; and a step of the measuring means provided on the cutting mechanism facing a predetermined region of the fixing member; And the measuring means detects the displacement in the predetermined region of the fixing member to determine the displacement amount after the displacement of the rotating blade, and the step of measuring the displacement includes: rotating the rotating blade along the rotating blade a step of measuring a first displacement amount caused by an axial displacement of the shaft; and a step of measuring a second displacement amount caused by a radial displacement of the rotary blade along the rotation axis; the predetermined region The fixing member including an outer circumferential portion relative to the end face of the rotary blade is formed vertically. 如申請專利範圍第10至12項中任一項之切斷方法,其中,包括藉由根據該第一位移量來校正該旋轉刃與該被切斷物的相對的位置關係,從而使該旋轉刃的位置與該切斷線的位置相吻合的步驟。 The cutting method according to any one of claims 10 to 12, further comprising: correcting a relative positional relationship between the rotary blade and the object to be cut according to the first displacement amount, thereby causing the rotation The step of the position of the blade coincides with the position of the cutting line. 如申請專利範圍第10至12項中任一項之切斷方法,其中, 該既定區域由具有導電性的物質構成。 The cutting method according to any one of claims 10 to 12, wherein The predetermined area is composed of a substance having conductivity. 如申請專利範圍第14項之切斷方法,其中,該測定手段包括渦流式位移感測器。 The cutting method of claim 14, wherein the measuring means comprises a vortex displacement sensor. 如申請專利範圍第10至12項中任一項之切斷方法,其中,該被切斷物為封裝完畢基板。 The cutting method according to any one of claims 10 to 12, wherein the object to be cut is a packaged substrate. 如申請專利範圍第10至12項中任一項之切斷方法,其中,該被切斷物為製作有分別與複數個區域相對應的功能元件的基板。 The cutting method according to any one of claims 10 to 12, wherein the object to be cut is a substrate on which functional elements respectively corresponding to a plurality of regions are formed. 一種切斷方法,包括:在工作台載置被切斷物的步驟;使具有旋轉刃的切斷機構與該工作台相對地移動的步驟;以及藉由使該切斷機構與該工作台相對地移動從而使用該切斷機構沿著切斷線來切斷該被切斷物的步驟,其特徵在於,包括:使該旋轉刃旋轉的步驟,該旋轉刃在被設置於該切斷機構的旋轉軸的前端部,藉由在該旋轉刃的兩側的側面設置的兩個固定構件而被固定;使被設置於該切斷機構的測定手段與該固定構件的既定區域相對向的步驟;以及該測定手段藉由對該固定構件的該既定區域中的位移進行檢測,從而測定出該旋轉刃位移後的位移量的步驟,測定該位移量的步驟包括:對該旋轉刃沿著該旋轉軸的軸向位移而引起的第一位移量進行測定的步驟;以及對該旋轉刃沿著該旋轉軸的徑向位移而引起的第二位移量進行測定的步驟; 對該第一位移量進行測定的步驟,係將因該旋轉刃發熱所產生之熱膨脹而在該軸向之該旋轉刃的位移作為該第一位移量而測定;且進一步包括藉由根據該第一位移量來校正該旋轉刃與該被切斷物的相對的位置關係,從而使該旋轉刃的位置與該切斷線的位置相吻合的步驟。 A cutting method comprising: a step of placing a cut object on a table; a step of moving a cutting mechanism having a rotating blade relative to the table; and by causing the cutting mechanism to face the table a step of moving the ground to cut the object to be cut along the cutting line using the cutting mechanism, comprising: a step of rotating the rotating blade, the rotating blade being disposed at the cutting mechanism a front end portion of the rotating shaft is fixed by two fixing members provided on both side surfaces of the rotating blade; and a step of the measuring means provided on the cutting mechanism facing a predetermined region of the fixing member; And the measuring means detects the displacement in the predetermined region of the fixing member to determine the displacement amount after the displacement of the rotating blade, and the step of measuring the displacement includes: rotating the rotating blade along the rotating blade a step of measuring a first displacement amount caused by an axial displacement of the shaft; and a step of measuring a second displacement amount caused by a radial displacement of the rotary blade along the rotation axis; The step of measuring the first displacement amount is determined by the thermal expansion of the rotary blade due to thermal expansion of the rotary blade, and the displacement of the rotary blade in the axial direction is determined as the first displacement amount; and further comprising A step of correcting the relative positional relationship between the rotary blade and the object to be cut, thereby matching the position of the rotary blade with the position of the cutting line.
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