CN102554780A - Measuring device for grinding radial run-out of metal-bonded grinding wheels - Google Patents
Measuring device for grinding radial run-out of metal-bonded grinding wheels Download PDFInfo
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- CN102554780A CN102554780A CN2012100354647A CN201210035464A CN102554780A CN 102554780 A CN102554780 A CN 102554780A CN 2012100354647 A CN2012100354647 A CN 2012100354647A CN 201210035464 A CN201210035464 A CN 201210035464A CN 102554780 A CN102554780 A CN 102554780A
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- grinding
- eddy current
- current sensor
- wheel
- measuring device
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Abstract
The invention relates to a measuring device for grinding radial run-out of metal-bonded grinding wheels. An eddy current sensor is mounted on a cover of a grinding wheel, is perpendicular to the surface of the grinding wheel and is connected with a computer by a sensor amplifier and an A/D (analog/digital) acquisition card. A gap is reserved between the eddy current sensor and the surface of the grinding wheel, and the size of the gap is within a measuring range of the eddy current sensor. Sampling frequency of the A/D acquisition card is 25kHz. The measuring device can measure the quantity of radial run-out of the metal-bonded grinding wheels in different types in real time. By means of measuring and optimizing grinding machining technological parameters in real time, the quantity of the radial run-out of the grinding wheels meets machining requirements of different workpiece materials, and the measuring device plays an important role in terms of improving grinding efficiency and grinding quality.
Description
Technical field
The present invention relates to the precision machined measurement mechanism of a kind of machinery, especially a kind of measurement mechanism of wheel grinding circular runout.
Background technology
In recent years; Along with high-speed grinding and superfine grinding technology rapid development; Emery wheel is had higher requirement; The emery wheel of pottery and resinoid bond can not meet the needs of production, and metal bonded wheel is used widely because of conspicuousnesses such as its bond strength height, good moldability, long service life aborning.Because the restriction of grinding wheel spindle rigidity, there is certain radial beat eccentricity in the emery wheel in the grinding, and particularly the circular runout meeting of the metal bonded wheel in the ultraprecise processing badly influences the crudy of workpiece.Therefore, how efficient real time is measured radial beat eccentricity in the metal bonded wheel grinding, to improving grinding efficiency and grinding quality significance is arranged.
Summary of the invention
The present invention is the measurement mechanism that a kind of metal bonded wheel grinding circular runout will be provided, and is used to realize the real-time measurement of Grinding Process medium plain emery wheel circular runout, effectively improves grinding efficiency and grinding quality.
For realizing above-mentioned purpose; Technical scheme of the present invention is: a kind of measurement mechanism of metal bonded wheel grinding circular runout; Comprise the vortex flow displacement transducer; Be characterized in: eddy current sensor is installed on the emery wheel case, and perpendicular to wheel face, eddy current sensor is connected with computer with the A/D capture card through sensor amplifier.
Leave the gap between eddy current sensor and the wheel face, the distance in gap is within the range ability of eddy current sensor.The sample frequency of A/D capture card is
=25kHz.
The invention has the beneficial effects as follows:
It is a kind of non-contacting linearisation metering outfit that the present invention adopts the vortex flow displacement transducer, can staticly measure tested metallic conductor apart from the detecting head surface distance with dynamically noncontact, high linearity, high-resolution ground.Eddy current sensor can be measured under harsh conditions, can in high-speed rotating machine and reciprocating machine performance analysis to measure, to non-contacting high accuracy vibration, displacement signal, can collect the multiple parameter of rotor oscillation state continuously exactly.
The present invention can measure the radial beat eccentricity of the metal bonded wheel of different model in real time.Through real-time measurement with optimize the grinding technique parameter, make the emery wheel radial beat eccentricity satisfy the processing request of different workpieces material, significant to improving grinding efficiency and grinding quality.
Therefore, the present invention uses high accuracy high frequency sound eddy current sensor to measure the radial beat eccentricity in the metal bonded wheel grinding process in real time, has obtained good effect.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is an emery wheel radial pulsation measurement sketch map as a result.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described.
As shown in Figure 1, the measurement mechanism of metal bonded wheel grinding circular runout of the present invention comprises vortex flow displacement transducer 6, sensor amplifier 7, A/D capture card 8 and computer 9.
Eddy current sensor 6 is installed on the emery wheel case 5; And perpendicular to wheel face 4, eddy current sensor 6 is connected with computer 9 with A/D capture card 8 through sensor amplifier 7.
Leave the gap between eddy current sensor 6 and the wheel face 4, the distance in gap is within the range ability of eddy current sensor 6.The sample frequency of A/D capture card 8 is
=25kHz.
Before grinding, for effectively gathering the emery wheel circular runout displacement signal in the Grinding Process, select high accuracy high frequency sound vortex flow displacement transducer 6 for use, high frequency sound eddy current sensor 6 is installed on the emery wheel case 5; Guarantee eddy current sensor 6 perpendicular to wheel face 4, and regulate the distance between eddy current sensor 6 and the wheel face 4, make its distance within the range ability of eddy current sensor 6.Eddy current sensor 6 is connected to sensor amplifier 7, is connected to A/D capture card 8, be connected to computer 9 at last.The sample frequency of setting eddy current sensor signal A/D capture card 8 is
=25kHz.
Start lathe, it is V that emery wheel 3 rotating speeds are set
s(m/s), workpiece 2 feed speeds on the platen 1 are V
w(mm/min) and the wheel grinding working depth be a
p(mm), the A/D capture card 8 through said apparatus writes down emery wheel circular runout displacement signals with computer 9.In order to remove the influence of high-frequency interferencing signal such as electromagnetic environment to experimental measurements, the present invention uses Chebyshev II type digital filter that the data of gathering are carried out low-pass filtering treatment.The cut-off frequency of this low pass filter
should satisfy following formula:
In the formula:
Cut-off frequency (H for wave filter
z),
Be grinding wheel diameter (mm).
Utilize the MATLAB software processes to calculate metal bonded wheel circular runout displacement signal, as shown in Figure 2, the measurement result of the circular runout displacement that rotates a circle for the experiment abrasive grinding wheel.This emery wheel circular runout displacement signal effecting reaction the situation of circular runout in the wheel grinding process; Go out emery wheel run-out error T weekly through computed in software
Max, according to the maximum threshold values M of the run-out error of grinding work piece Mass Calculation emery wheel; In actual grinding process, through regulating each technological parameter V
s, V
wAnd a
p, make it satisfy T
Max<improve working (machining) efficiency under the M prerequisite.
Claims (3)
1. the measurement mechanism of a metal bonded wheel grinding circular runout comprises vortex flow displacement transducer (6), it is characterized in that: said eddy current sensor (6) is installed on the emery wheel case (5), and perpendicular to wheel face (4); Said eddy current sensor (6) is connected with computer (9) with A/D capture card (8) through sensor amplifier (7).
2. the measurement mechanism of metal bonded wheel grinding circular runout according to claim 1; It is characterized in that: leave the gap between said eddy current sensor (6) and the wheel face (4), the distance in gap is within the range ability of eddy current sensor (6).
3. the measurement mechanism of metal bonded wheel grinding circular runout according to claim 1 and 2 is characterized in that: the sample frequency of said A/D capture card (8) is
=25kHz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100354647A CN102554780A (en) | 2012-02-17 | 2012-02-17 | Measuring device for grinding radial run-out of metal-bonded grinding wheels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100354647A CN102554780A (en) | 2012-02-17 | 2012-02-17 | Measuring device for grinding radial run-out of metal-bonded grinding wheels |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102554780A true CN102554780A (en) | 2012-07-11 |
Family
ID=46402082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100354647A Pending CN102554780A (en) | 2012-02-17 | 2012-02-17 | Measuring device for grinding radial run-out of metal-bonded grinding wheels |
Country Status (1)
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|---|---|
| CN (1) | CN102554780A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104990503A (en) * | 2015-07-16 | 2015-10-21 | 郑州磨料磨具磨削研究所有限公司 | Grinding wheel external circle run-out detection method based on laser displacement sensor |
| CN105345663A (en) * | 2015-11-25 | 2016-02-24 | 厦门理工学院 | Grinding wheel device capable of monitoring grinding working conditions in real time |
| TWI602641B (en) * | 2014-12-24 | 2017-10-21 | Towa Corp | Cutting device and cutting method |
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| JP2011245592A (en) * | 2010-05-27 | 2011-12-08 | Jtekt Corp | Grinding method and grinding machine |
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| JPS6219374A (en) * | 1985-07-17 | 1987-01-28 | Washino Kikai Kk | Grinding device |
| JPH0866851A (en) * | 1994-08-29 | 1996-03-12 | Noritake Co Ltd | Dressing device for grinding wheel |
| JP2001062718A (en) * | 1999-08-20 | 2001-03-13 | Super Silicon Kenkyusho:Kk | Double head grinding device and grinding wheel position correcting method |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI602641B (en) * | 2014-12-24 | 2017-10-21 | Towa Corp | Cutting device and cutting method |
| CN104990503A (en) * | 2015-07-16 | 2015-10-21 | 郑州磨料磨具磨削研究所有限公司 | Grinding wheel external circle run-out detection method based on laser displacement sensor |
| CN104990503B (en) * | 2015-07-16 | 2018-04-20 | 郑州磨料磨具磨削研究所有限公司 | A kind of grinding wheel cylindrical glitch detection method based on laser displacement sensor |
| CN105345663A (en) * | 2015-11-25 | 2016-02-24 | 厦门理工学院 | Grinding wheel device capable of monitoring grinding working conditions in real time |
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Application publication date: 20120711 |