CN202517372U - Grinding fluid dynamic pressure measuring device for plane grinding area - Google Patents
Grinding fluid dynamic pressure measuring device for plane grinding area Download PDFInfo
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- CN202517372U CN202517372U CN2012201436527U CN201220143652U CN202517372U CN 202517372 U CN202517372 U CN 202517372U CN 2012201436527 U CN2012201436527 U CN 2012201436527U CN 201220143652 U CN201220143652 U CN 201220143652U CN 202517372 U CN202517372 U CN 202517372U
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- grinding
- fluid dynamic
- dynamic pressure
- pressure sensor
- grinding fluid
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Abstract
The utility model relates to a grinding fluid dynamic pressure measuring device for a plane grinding area. The grinding fluid dynamic pressure measuring device comprises a silicon diffusion pressure sensor, a sensor amplifier, an A/D (Analog-to-Digital) collecting card and a computer, wherein the silicon diffusion pressure sensor is mounted on a bracket; a sensing head of the silicon diffusion pressure sensor is vertical to a workpiece circular hole; and through signal output wires the silicon diffusion pressure sensor is connected with the computer by the sensor amplifier and the A/D collecting card. According to the utility model, the desired grinding fluid dynamic pressure in the grinding area during grinding different workpiece materials can be measured in real time. Through experiments, the grinding fluid dynamic pressure of the ground workpiece material is measured and grinding process parameters and grinding fluid nozzle position are optimized, so that important significances are obtained in improving the grinding efficiency and the grinding quality.
Description
Technical field
The utility model relates to a kind of device for pressure measurement, especially a kind of device that is used for the grinding fluid dynamic pressure measurement of flat surface grinding district.
Background technology
In recent years, Grinding Technology forward high accuracy, reach the high-rate grinding direction at a high speed and develop, the use of grinding fluid has been proposed requirements at the higher level for guaranteeing grinding quality.That grinding fluid has is lubricated, the grinding fluid of cooling, effect, particularly grinding area such as clear is supplied with fully very big with the crudy influence to Grinding Process.Under the effect of flat surface grinding emery wheel; The part grinding fluid is launched into the wedge gap between revolving wheel and workpiece and produces bigger grinding fluid dynamic pressure; Whether fully the supply that grinding fluid dynamic pressure size has not only reflected grinding fluid has also reflected the grinding quality quality simultaneously.Therefore, how effectively to measure grinding area grinding fluid dynamic pressure size, significance is arranged improving grinding efficiency and grinding quality.
Summary of the invention
The utility model is that a kind of flat surface grinding district grinding fluid dynamic pressure measurement mechanism will be provided, and this device uses high-precision diffusion silicon pressure sensor ability accurate and effective measurement plane grinding area grinding fluid dynamic pressure, can effectively improve grinding efficiency and grinding quality.
For realizing above-mentioned purpose, the technical scheme of the utility model is: a kind of flat surface grinding district grinding fluid dynamic pressure measurement mechanism comprises silicon diffusion pressure sensor; Sensor amplifier; The A/D capture card, computer is characterized in: silicon diffusion pressure sensor is rack-mount; And silicon diffusion pressure transducer probe assembly is perpendicular to the workpiece circular hole, and silicon diffusion pressure sensor is connected with computer with the A/D capture card through sensor amplifier through output line.
The range of silicon diffusion pressure sensor is 0-40pa, and linear precision is ± 0.25%FS; A/D capture card (7) sample frequency is
=1kHz; And the data of gathering are carried out low-pass filtering treatment through Chebyshev II type digital filter, its cut-off frequency
should satisfy following formula:
In the formula:
Cut-off frequency (H for wave filter
z),
Be grinding wheel diameter (mm).
Silicon diffusion pressure sensor is made up of crystal orientation silicon chip and four resistance, wherein injects four resistance in the silicon chip of crystal orientation, connects into Wheatstone bridge.
The beneficial effect of the utility model is: desired grinding area grinding fluid dynamic pressure value when the utility model can be measured the grinding of different workpieces material in real time.Through experiment measuring grinding work piece material grinding fluid dynamic pressure value, optimize grinding technique parameter and grinding fluid nozzle location, significant to improving grinding efficiency and grinding quality.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the diffusion silicon pressure sensor fundamental diagram;
Fig. 3 is a grinding fluid pressure measurements sketch map.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described.
As shown in Figure 1, the flat surface grinding district grinding fluid dynamic pressure measurement mechanism of the utility model comprises silicon diffusion pressure sensor 1, supply lines 2, D.C. regulated power supply 3; Output line 4, support 5, sensor amplifier 6, A/D capture card 7; Computer 8, platen 9, grinding work piece 10, grinding fluid 11; Grinding fluid nozzle 12, abrasive grinding wheel 13, workpiece circular hole 14, support circular hole 15.
Silicon diffusion pressure sensor 1 is installed on the support 5, and silicon diffusion pressure sensor 1 gauge head is perpendicular to workpiece circular hole 14, and silicon diffusion pressure sensor 1 is connected with computer 8 with A/D capture card 7 through sensor amplifier 6 through output line 4.
As shown in Figure 1, before grinding, choose institute's grinding work piece 10, its workpiece 10 sizes: the wide W of being, length are L and highly are H.For effectively gathering the grinding area grinding fluid dynamic pressure signal in the Grinding Process, the range of selecting high precision silicon diffusion pressure sensor 1 for use is 0-40pa, and linear precision is ± 0.25%FS; Utilize bolt that silicon diffusion pressure sensor 1 is installed on the support 5, guarantee silicon diffusion pressure sensor 1 gauge head, and support is fixed on the platen 9 perpendicular to workpiece circular hole 14.Utilize D.C. regulated power supply 3 and supply lines 2 to be 1 power supply of silicon diffusion pressure sensor.Utilize output line 4 silicon diffusion pressure sensor 1 to be connected to sensor amplifier 6, be connected to A/D capture card 7, be connected to computer 8 at last through support circular hole 15.The sample frequency of setting silicon diffusion pressure sensor signal A/D capture card 7 is
=1kHz.At last, start lathe and carry out the grinding experiment measuring.
This patent uses Chebyshev II type digital filter that the data of gathering are carried out low-pass filtering treatment.Handle to record grinding fluid dynamic pressure signal through computer 8, as shown in Figure 3, be the curve map over time of grinding area grinding fluid pressure in the experiment grinding.In actual grinding measuring process,, need regulate grinding process parameters V repeatedly to the desired grinding fluid dynamic pressure of use workpiece material value △ P
s, V
wWith grinding fluid nozzle 12 positions, satisfying grinding efficiency and the grinding quality that improves workpiece material under the grinding area grinding fluid dynamic pressure △ P prerequisite.
As shown in Figure 2; Diffusion silicon pressure sensor 1 operation principle is to utilize single crystal silicon semiconductor to be stressed to make the piezoresistive effect that time spent resistivity changes; Through semiconductor planar technology; The certain position of silicon chip injects four resistance in certain crystal orientation, connects into Wheatstone bridge, silicon chip is processed into the diaphragm of periphery fixed.When diaphragm upper and lower faces pressure does not wait, since the relation of piezoresistive effect and position, crystal orientation, R in four resistance
1, R
4Reduce R
2, R
3Increase, during a diagonal galvanization of electric bridge I, make a diagonal just export the voltage signal △ U that is directly proportional with the pressure size.
Start lathe, it is V that lathe emery wheel 13 rotating speeds are set
s(m/s), platen 9 feed speeds are V
w(mm/min) and the grinding degree of depth be a
p=0 (mm) starts grinding fluid nozzle 12 and carries out grinding test.A/D capture card 7 through said apparatus writes down the dynamic pressure signal that silicon diffusion pressure sensors 1 record grinding fluid 11 with computer 8.In order to remove the influence of high-frequency interferencing signal such as electromagnetic environment to experimental measurements, this patent uses Chebyshev II type digital filter that the data of gathering are carried out low-pass filtering treatment.The cut-off frequency of this low pass filter
should satisfy following formula:
In the formula:
Cut-off frequency (H for wave filter
z),
Be grinding wheel diameter (mm).
Handle to record grinding area grinding fluid dynamic pressure signal through computer 8, shown in figure (3), be the curve map over time of grinding area grinding fluid pressure in the experiment grinding, the maximum of grinding area grinding fluid pressure is P.
The grinding area grinding fluid dynamic pressure value of table 1 different workpieces material
| Workpiece material | Grinding area grinding fluid dynamic pressure value △ P (Pa) |
| |
△ |
| Material | |
| 2 | △P2 |
| Material 3 | △ |
| Material | |
| 4 | △ |
| Material | |
| 5 | △P5 |
| |
△P6 |
Because desired grinding area grinding fluid dynamic pressure value is different during the grinding of different workpieces material, and is as shown in table 1 below.In actual grinding measuring process,, need regulate grinding process parameters V repeatedly to the desired grinding fluid dynamic pressure of use workpiece material value △ P
s, V
wWith grinding fluid nozzle 12 positions, satisfying grinding efficiency and the grinding quality that improves workpiece material under the grinding area grinding fluid dynamic pressure △ P prerequisite.
Claims (4)
1. flat surface grinding district grinding fluid dynamic pressure measurement mechanism; Comprise silicon diffusion pressure sensor (1); Sensor amplifier (6); A/D capture card (7), computer (8) is characterized in that: said silicon diffusion pressure sensor (1) is installed on the support (5); And silicon diffusion pressure sensor (1) gauge head is perpendicular to workpiece circular hole (14), and silicon diffusion pressure sensor (1) is connected with computer (8) with A/D capture card (7) through sensor amplifier (6) through output line (4).
2. flat surface grinding according to claim 1 district grinding fluid dynamic pressure measurement mechanism is characterized in that: the range of said silicon diffusion pressure sensor (1) is 0-40pa, and linear precision is ± 0.25%FS;
3. flat surface grinding according to claim 1 district grinding fluid dynamic pressure measurement mechanism; It is characterized in that: said A/D capture card (7) sample frequency is
=1kHz; And the data of gathering are carried out low-pass filtering treatment through Chebyshev II type digital filter, its cut-off frequency
should satisfy following formula:
In the formula:
Cut-off frequency (H for wave filter
z),
Be grinding wheel diameter (mm).
4. flat surface grinding according to claim 1 district grinding fluid dynamic pressure measurement mechanism is characterized in that: said silicon diffusion pressure sensor (1) is made up of crystal orientation silicon chip and four resistance, wherein injects four resistance in the silicon chip of crystal orientation, connects into Wheatstone bridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201436527U CN202517372U (en) | 2012-04-09 | 2012-04-09 | Grinding fluid dynamic pressure measuring device for plane grinding area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201436527U CN202517372U (en) | 2012-04-09 | 2012-04-09 | Grinding fluid dynamic pressure measuring device for plane grinding area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202517372U true CN202517372U (en) | 2012-11-07 |
Family
ID=47100340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201436527U Expired - Fee Related CN202517372U (en) | 2012-04-09 | 2012-04-09 | Grinding fluid dynamic pressure measuring device for plane grinding area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202517372U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620881A (en) * | 2012-04-09 | 2012-08-01 | 上海理工大学 | Grinding fluid dynamic pressure measurement device for plane grinding region |
| CN106476151A (en) * | 2015-09-02 | 2017-03-08 | 天津职业技术师范大学 | A kind of multi-line cutting machine cutting area mortar pressure gauge |
| CN107433521A (en) * | 2017-08-07 | 2017-12-05 | 贵州大学 | The Testing Platform of high speed and precision roll bistrique |
| CN110744431A (en) * | 2019-11-18 | 2020-02-04 | 浙江工业大学 | Pressure detection system for linear hydraulic pressure polishing device |
| CN110744431B (en) * | 2019-11-18 | 2024-05-03 | 浙江工业大学 | Pressure detection system for linear hydrodynamic polishing device |
-
2012
- 2012-04-09 CN CN2012201436527U patent/CN202517372U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102620881A (en) * | 2012-04-09 | 2012-08-01 | 上海理工大学 | Grinding fluid dynamic pressure measurement device for plane grinding region |
| CN106476151A (en) * | 2015-09-02 | 2017-03-08 | 天津职业技术师范大学 | A kind of multi-line cutting machine cutting area mortar pressure gauge |
| CN106476151B (en) * | 2015-09-02 | 2018-09-21 | 天津职业技术师范大学 | A kind of multi-line cutting machine cutting area mortar device for pressure measurement |
| CN107433521A (en) * | 2017-08-07 | 2017-12-05 | 贵州大学 | The Testing Platform of high speed and precision roll bistrique |
| CN110744431A (en) * | 2019-11-18 | 2020-02-04 | 浙江工业大学 | Pressure detection system for linear hydraulic pressure polishing device |
| CN110744431B (en) * | 2019-11-18 | 2024-05-03 | 浙江工业大学 | Pressure detection system for linear hydrodynamic polishing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20130409 |