CN106476151B - A kind of multi-line cutting machine cutting area mortar device for pressure measurement - Google Patents
A kind of multi-line cutting machine cutting area mortar device for pressure measurement Download PDFInfo
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- CN106476151B CN106476151B CN201510551455.7A CN201510551455A CN106476151B CN 106476151 B CN106476151 B CN 106476151B CN 201510551455 A CN201510551455 A CN 201510551455A CN 106476151 B CN106476151 B CN 106476151B
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- cutting area
- pressure
- mortar
- sensing transmitter
- pressure sensing
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Abstract
The invention discloses a kind of multi-line cutting machine cutting area mortar device for pressure measurement.In multi-wire saw process, the mortar film that cutting area is formed is a key factor for influencing chipping qualities and efficiency.Because cutting area is narrow, it is difficult to detect cutting area mortar and form the pressure of film layer to which the reasonable selection to technological parameter brings difficulty, influence chipping qualities and efficiency.The cutting area device for pressure measurement includes pressure sensing transmitter, intermediate mass, side crystal block, pressure-display device, gasket, and the acquisition port of narrow cutting area and pressure sensing transmitter is formed the unicom region of a mortar to realize the measurement of pressure by the conduction hole of intermediate mass.The present invention realizes the measurement of cutting area mortar pressure, can determine quantifier elimination cutting parameter and cutting area mortar pressure dependence, and to improving chipping qualities, processing efficiency has larger practical significance.
Description
Technical field
The present invention relates to a kind of multi-line cutting machine cutting area mortar device for pressure measurement, for measuring free abrasive multi-wire cutting
The cutting mortar for cutting narrow cutting area in process forms the pressure of film, belongs to semiconductor hard brittle material slice processing neck
Domain.
Background technology
IC chip, solar battery sheet and light emitting diode etc. are required for cutting the very high crystalline material of hardness
Flakiness shape, and the requirement of dimensional accuracy and surface figure accuracy is very high.Because crystalline material has the spy that hardness is high, brittleness is big
Point, slice processing difficulty are big.Multi-wire cutting technology be it is fast-developing in recent years get up a kind of advanced slice of hard brittle material add
Work technology is widely used in monocrystalline silicon, polysilicon and sapphire slice processing.It is to pass through winding that multi-line cutting machine, which is sliced principle,
Steel wire on guide wheel forms the gauze of parallel spacing, and when guide wheel high-speed rotation drives gauze high-speed motion, online online square sand
It starches jet pipe and sprays mortar, while being fixed with the saw working bench of crystal ingot and making feed motion towards gauze, the steel wire of movement is by sand
Slurry is brought into cutting area and is ground processing to crystal ingot, and crystal ingot is gradually cut into hundreds of thousands of thin slices simultaneously.Multi-wire cutting
Cutting mill is high with its high efficiency, material deterioration inside is few, is widely used in crystalline material slice processing in high precision.
In multi-wire saw process, cutting area is 0.15-0.4 millimeters or so of narrow slit, and mortar is cut in cutting area
Thin film is formed between steel wire and workpiece, the pressure of film directly influences the efficiency and quality of cutting.Because of cutting area
Narrow, traditional sensor is difficult to detect the pressure condition of cutting area.Some research workers are by simulation software to pressure
It is analyzed.But there are no experimental provisions qualitatively to measure for the actual value of pressure.How multi-wire saw is measured
The pressure of cutting area mortar becomes a problem in the process.This problem, first, the exploration of cutting mechanism is constrained, second is that practical
Parameter adjustment lacks theoretical guidance during cutting processing, keeps cutting technique unstable.
Invention content
The present invention is directed to the problem of narrow mortar pressure of cutting area is difficult to effectively measure in multi-wire saw process, provides
A kind of multi-line cutting machine cutting area mortar device for pressure measurement.
It is as follows to achieve the object of the present invention technical solution:
A kind of multi-line cutting machine cutting area mortar device for pressure measurement, is structurally characterized in that, including pressure sensing transmitter;
The pressure sensing transmitter is threadedly secured on intermediate mass;The intermediate mass is fixed on by glue on the crystal block of side;It is described
Side crystal block is fixed on by glue on cushion block;The cushion block is fixed on by glue on iron bar;The iron bar is fixed on crystal holder by glue
On;The crystal holder is fixed on saw working bench.
Conduction hole is arranged on the intermediate mass, diameter is between 0.2-0.4 millimeters.
Gasket is housed between the intermediate mass and pressure sensing transmitter.
The liquid acquisition mouth of the conduction hole unicom cutting area and pressure sensing transmitter front end makes cutting area mortar enter
To the sensing device further of pressure sensing transmitter.
The pressure sensing transmitter is connected by electric wire with pressure-display device.
The line space P of the conduction hole is equal to the spacing that steel wire on guide wheel forms gauze, and column pitch is equal to 0.5-0.8
Millimeter;Conduction hole distribution is within the scope of the liquid acquisition mouth diameter d of pressure sensing transmitter front end;Conduction hole is every when mounted
Row center line faces the steel wire on guide wheel.
Above the gauze that steel wire is formed on the guide wheel, there is mortar spray pipe to spray mortar on the steel wire of movement.
A kind of multi-line cutting machine cutting area mortar device for pressure measurement provided by the invention is drained by being processed on intermediate mass
The mortar of cutting area is introduced into the acquisition port of pressure sensing transmitter by hole, according to pascal's principle, cuts mortar in narrow slit
The pressure transmission of film is to the pressure-sensing device in pressure sensing transmitter, to realize that the pressure to cutting area mortar is surveyed
Amount.The size of cutting area mortar pressure and the distribution along cutting area, directly influence the quality of slice.By to cutting area sand
The measurement for starching pressure, can obtain the relationship between cutting area pressure and cutting parameter, so as to be better understood by cutting area
Material Removal Mechanism simultaneously provides theories integration for adjustment cutting parameter, to ensure the quality and processing efficiency of slice.
Description of the drawings
Fig. 1 is apparatus of the present invention main sectional view;
Fig. 2 is apparatus of the present invention main sectional view cutting area enlarged drawing;
Fig. 3 is the left sectional view of apparatus of the present invention;
Fig. 4 is the left sectional view cutting area enlarged drawing of apparatus of the present invention;
Fig. 5 is intermediate mass front view;
Fig. 6 is intermediate mass upward view.
In figure:
1- guide wheels;2- steel wires;3- mortars;4-- mortar spray pipes;5- pressure-display devices;6- electric wires;The sides 7- crystal block;In 8-
Between block;9- gaskets;10- pressure sensing transmitters;11- cushion blocks;12- glue;13- iron bars;14- crystal holders;15- cutting machines work
Platform;16- conduction holes.
Specific implementation mode
With reference to the accompanying drawings and examples, the present invention is described in detail.It is emphasized that following embodiment is only used
In illustrating the application, but scope of the present application is not defined.This embodiment for the section Example of the application and it is not all
Embodiment, all other embodiment that those of ordinary skill in the art are obtained without creative efforts, all
Belong to the range of the application protection.Fig. 1 is apparatus of the present invention main sectional view,
Fig. 2 is apparatus of the present invention main sectional view cutting area enlarged drawing, and Fig. 3 is the left sectional view of apparatus of the present invention, and Fig. 4 is this hair
The bright left sectional view cutting area enlarged drawing of device, Fig. 5 are intermediate mass front views, and Fig. 6 is intermediate mass upward view.
A kind of multi-line cutting machine cutting area mortar device for pressure measurement, including pressure sensing transmitter 10;The pressure passes
Sense transmitter 10 is threadedly secured on intermediate mass 8;The intermediate mass 8 is fixed on by glue 12 on side crystal block 7;The side is brilliant
Block 7 is fixed on by glue 12 on cushion block 11;The cushion block 11 is fixed on by glue 12 on iron bar 13;The iron bar 13 is solid by glue
It is scheduled in crystal holder 14;The crystal holder 14 is fixed on saw working bench 15.
Conduction hole 16 is arranged on intermediate mass 8 as described in Fig. 5, Fig. 6, diameter is between 0.2-0.4 millimeters.
As shown in Figures 1 and 2, gasket 9, gasket 9 are housed between the intermediate mass 8 and pressure sensing transmitter 10
Effect be to prevent from entering the mortar 3 of the acquisition port of pressure sensing transmitter 10 from intermediate mass 8 and pressure sensing transmitter 10
Junction overflow, keep the result of measurement inaccurate.
As shown in Figures 3 and 4, the liquid acquisition of the conduction hole 16 unicom cutting area and 10 front end of pressure sensing transmitter
Mouthful, so that cutting area mortar 3 is entered the sensing device further of pressure sensing transmitter 10, to measure the pressure of mortar.
As shown in Figure 1, the pressure sensing transmitter 10 is connected by electric wire 6 with pressure-display device 5, pressure is shown
It shows to come.
As shown in Fig. 3, Fig. 4 and Fig. 6, the line space P of the conduction hole 16 is equal to steel wire 2 on guide wheel 1 and is formed between gauze
Away from P, column pitch is equal to 0.5-0.8 millimeters.
As shown in Figure 1, Figure 2 and shown in Fig. 6,16 distribution of conduction hole is adopted in 10 front end liquid of pressure sensing transmitter
Collect within the scope of mouth diameter d.
As shown in Figure 1, often row centerline hole faces the steel wire 2 on guide wheel 1 to the conduction hole 16 when mounted.
Below by taking certain type multi-line cutting machine as an example, in conjunction with apparatus of the present invention, specific step is introduced:
1)Get out workpiece:Intermediate mass is processed according to pressure sensing transmitter 10,1 slot pitch P of guide wheel, 16 diameter of conduction hole
8 and side crystal block 7, ensure the verticality of 12 bonding plane of glue and machined surface;
2)Mounting device:Gasket 9 is placed on to the threaded hole bottom of intermediate mass 8, pressure sensing transmitter 10 passes through it
On be threadedly secured on intermediate mass 8, while gasket 9 being compressed, between the glue 12 of intermediate mass 8 is fixed on side crystal block 7, and is glued
Cushion block 11 is tied, iron bar 13 is bonded, pressure-display device 5 is connected with electric wire 6, is fixed in crystal holder 14, in bonding process,
Ensure the verticality of the row center line and 14 center line of crystal holder of conduction hole 16;
3)Cutting area pressure data acquires:Crystal holder 14 is fixed on saw working bench 15, pays attention to ensureing conduction hole 16
Row center line face the cutting steel wire 2 on guide wheel 1, set cutting parameter, the rotation of guide wheel 1 drives steel wire 2 to move, mortar
Jet pipe 4 sprays mortar 3 to gauze, and saw working bench 15 is fed down, with the variation of cutting condition, pressure-display device 5
Show the pressure of the mortar 3 of cutting area.
A kind of multi-line cutting machine cutting area mortar device for pressure measurement of the present invention, the pressure sensing transmitter may be used
Danfoss MBS1900 pressure transmitters or BP801 spread silicon piezoresistance type pressure transmitter, measurement range 0-1Mpa.Above
Embodiments of the present invention are described in detail in conjunction with attached drawing, but present invention is not limited to the embodiments described above, this field
Those of ordinary skill understand said program content after can also not depart from present inventive concept under the premise of make various changes
Change.
Claims (7)
1. a kind of multi-line cutting machine cutting area mortar device for pressure measurement, characterized in that including pressure sensing transmitter(10);Institute
State pressure sensing transmitter(10)It is threadedly secured to intermediate mass(8)On;The intermediate mass(8)On be arranged with conduction hole
(16), the conduction hole(16)Unicom cutting area and pressure sensing transmitter(10)The liquid acquisition mouth of front end, makes cutting area sand
Slurry(3)Enter pressure sensing transmitter(10)Sensing device further;The intermediate mass(8)Pass through glue(12)It is fixed on side crystal block
(7)On;The side crystal block(7)Pass through glue(12)It is fixed on cushion block(11)On;The cushion block(11)Pass through glue(12)It is fixed on iron
Item(13)On;The iron bar(13)It is fixed on crystal holder by glue(14)On;The crystal holder(14)Fixed to saw working bench
(15)On.
2. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 1, it is characterised in that described
Conduction hole(16)Diameter between 0.2-0.4 millimeters.
3. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 1, it is characterised in that described
Intermediate mass(8)With pressure sensing transmitter(10)Between be equipped with gasket(9).
4. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 1, it is characterised in that described
Pressure sensing transmitter(10)Pass through electric wire(6)With pressure-display device(5)It is connected.
5. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 2, it is characterised in that described
Conduction hole(16)Line space P be equal to guide wheel(1)Upper steel wire(2)The spacing of gauze is formed, column pitch is equal to 0.5-0.8 millis
Rice.
6. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 2, it is characterised in that described
Conduction hole(16)Distribution is in pressure sensing transmitter(10)Within the scope of the liquid acquisition mouth diameter d of front end.
7. a kind of multi-line cutting machine cutting area mortar device for pressure measurement according to claim 2, it is characterised in that described
Conduction hole(16)Often row centerline hole faces guide wheel when mounted(1)On steel wire(2).
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CN201510551455.7A CN106476151B (en) | 2015-09-02 | 2015-09-02 | A kind of multi-line cutting machine cutting area mortar device for pressure measurement |
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CN201510551455.7A CN106476151B (en) | 2015-09-02 | 2015-09-02 | A kind of multi-line cutting machine cutting area mortar device for pressure measurement |
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CN106476151A CN106476151A (en) | 2017-03-08 |
CN106476151B true CN106476151B (en) | 2018-09-21 |
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Citations (7)
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RU2149093C1 (en) * | 1999-03-29 | 2000-05-20 | Орловский государственный технический университет | Method of controlling glazing of grinding wheel peripheral surface |
CN201960673U (en) * | 2010-12-06 | 2011-09-07 | 浙江芯能光伏科技有限公司 | Loading mechanism of crystal silicon wafer multi-wire cutting machine |
CN201970408U (en) * | 2010-11-25 | 2011-09-14 | 浙江昱辉阳光能源有限公司 | Cutting clamp for crystal silicon block |
CN202517372U (en) * | 2012-04-09 | 2012-11-07 | 上海理工大学 | Grinding fluid dynamic pressure measuring device for plane grinding area |
CN203210171U (en) * | 2013-04-16 | 2013-09-25 | 河南富耐克超硬材料股份有限公司 | Double-surface lapping machine |
CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
CN203401616U (en) * | 2013-07-16 | 2014-01-22 | 江西旭阳雷迪高科技股份有限公司 | Device for reducing broken edges of crystal silicon wafer |
-
2015
- 2015-09-02 CN CN201510551455.7A patent/CN106476151B/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2149093C1 (en) * | 1999-03-29 | 2000-05-20 | Орловский государственный технический университет | Method of controlling glazing of grinding wheel peripheral surface |
CN201970408U (en) * | 2010-11-25 | 2011-09-14 | 浙江昱辉阳光能源有限公司 | Cutting clamp for crystal silicon block |
CN201960673U (en) * | 2010-12-06 | 2011-09-07 | 浙江芯能光伏科技有限公司 | Loading mechanism of crystal silicon wafer multi-wire cutting machine |
CN202517372U (en) * | 2012-04-09 | 2012-11-07 | 上海理工大学 | Grinding fluid dynamic pressure measuring device for plane grinding area |
CN203210171U (en) * | 2013-04-16 | 2013-09-25 | 河南富耐克超硬材料股份有限公司 | Double-surface lapping machine |
CN203401616U (en) * | 2013-07-16 | 2014-01-22 | 江西旭阳雷迪高科技股份有限公司 | Device for reducing broken edges of crystal silicon wafer |
CN103341919A (en) * | 2013-07-29 | 2013-10-09 | 山东大海新能源发展有限公司 | Pretreatment process capable of increasing slicing rate of polycrystalline silicon rod |
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