KR20160067940A - 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 - Google Patents

페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 Download PDF

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Publication number
KR20160067940A
KR20160067940A KR1020167011943A KR20167011943A KR20160067940A KR 20160067940 A KR20160067940 A KR 20160067940A KR 1020167011943 A KR1020167011943 A KR 1020167011943A KR 20167011943 A KR20167011943 A KR 20167011943A KR 20160067940 A KR20160067940 A KR 20160067940A
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South Korea
Prior art keywords
ferrite
layer
gold
wafer
etching
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Ceased
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KR1020167011943A
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English (en)
Korean (ko)
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존 브린 밀스
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코닌클리케 필립스 엔.브이.
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Publication of KR20160067940A publication Critical patent/KR20160067940A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/18—Phase-shifters
    • H01P1/19—Phase-shifters using a ferromagnetic device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
    • H10P14/69398—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides the material having a perovskite structure, e.g. BaTiO3

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Chemically Coating (AREA)
  • Coating By Spraying Or Casting (AREA)
KR1020167011943A 2013-10-07 2014-10-01 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법 Ceased KR20160067940A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13187538 2013-10-07
EP13187538.7 2013-10-07
PCT/EP2014/071079 WO2015052059A1 (en) 2013-10-07 2014-10-01 Precision batch production method for manufacturing ferrite rods

Publications (1)

Publication Number Publication Date
KR20160067940A true KR20160067940A (ko) 2016-06-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167011943A Ceased KR20160067940A (ko) 2013-10-07 2014-10-01 페라이트 막대들을 제조하기 위한 정밀 배치 생성 방법

Country Status (7)

Country Link
US (1) US9825347B2 (enExample)
EP (1) EP3055871A1 (enExample)
JP (1) JP6293875B2 (enExample)
KR (1) KR20160067940A (enExample)
CN (1) CN105814655B (enExample)
SG (1) SG11201602499TA (enExample)
WO (1) WO2015052059A1 (enExample)

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WO2017177171A1 (en) 2016-04-08 2017-10-12 3D Glass Solutions, Inc. Methods of fabricating photosensitive substrates suitable for optical coupler
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KR102614826B1 (ko) 2017-12-15 2023-12-19 3디 글래스 솔루션즈 인코포레이티드 결합 전송 라인 공진 rf 필터
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KR102601781B1 (ko) 2019-04-18 2023-11-14 3디 글래스 솔루션즈 인코포레이티드 고효율 다이 다이싱 및 릴리스
US10727216B1 (en) 2019-05-10 2020-07-28 Sandisk Technologies Llc Method for removing a bulk substrate from a bonded assembly of wafers
CN110202880B (zh) * 2019-06-03 2020-05-22 西安交通大学 一种柔性微波器件及其制备方法
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Also Published As

Publication number Publication date
WO2015052059A1 (en) 2015-04-16
US20160254579A1 (en) 2016-09-01
CN105814655A (zh) 2016-07-27
SG11201602499TA (en) 2016-04-28
JP6293875B2 (ja) 2018-04-25
JP2016535930A (ja) 2016-11-17
US9825347B2 (en) 2017-11-21
CN105814655B (zh) 2018-08-07
EP3055871A1 (en) 2016-08-17

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