CN105814655B - 用于制造铁氧体棒的精确批量生产方法 - Google Patents
用于制造铁氧体棒的精确批量生产方法 Download PDFInfo
- Publication number
- CN105814655B CN105814655B CN201480066647.2A CN201480066647A CN105814655B CN 105814655 B CN105814655 B CN 105814655B CN 201480066647 A CN201480066647 A CN 201480066647A CN 105814655 B CN105814655 B CN 105814655B
- Authority
- CN
- China
- Prior art keywords
- ferrite
- layer
- semiconductor substrate
- resist coating
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/18—Phase-shifters
- H01P1/19—Phase-shifters using a ferromagnetic device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02197—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides the material having a perovskite structure, e.g. BaTiO3
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Chemically Coating (AREA)
- Coating By Spraying Or Casting (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13187538 | 2013-10-07 | ||
| EP13187538.7 | 2013-10-07 | ||
| PCT/EP2014/071079 WO2015052059A1 (en) | 2013-10-07 | 2014-10-01 | Precision batch production method for manufacturing ferrite rods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105814655A CN105814655A (zh) | 2016-07-27 |
| CN105814655B true CN105814655B (zh) | 2018-08-07 |
Family
ID=49303841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480066647.2A Expired - Fee Related CN105814655B (zh) | 2013-10-07 | 2014-10-01 | 用于制造铁氧体棒的精确批量生产方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9825347B2 (enExample) |
| EP (1) | EP3055871A1 (enExample) |
| JP (1) | JP6293875B2 (enExample) |
| KR (1) | KR20160067940A (enExample) |
| CN (1) | CN105814655B (enExample) |
| SG (1) | SG11201602499TA (enExample) |
| WO (1) | WO2015052059A1 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3140838B1 (en) | 2014-05-05 | 2021-08-25 | 3D Glass Solutions, Inc. | Inductive device in a photo-definable glass structure |
| KR20200010598A (ko) | 2016-02-25 | 2020-01-30 | 3디 글래스 솔루션즈 인코포레이티드 | 3d 커패시터 및 커패시터 어레이 제작용 광활성 기재 |
| US12165809B2 (en) | 2016-02-25 | 2024-12-10 | 3D Glass Solutions, Inc. | 3D capacitor and capacitor array fabricating photoactive substrates |
| US11161773B2 (en) | 2016-04-08 | 2021-11-02 | 3D Glass Solutions, Inc. | Methods of fabricating photosensitive substrates suitable for optical coupler |
| US9912028B2 (en) * | 2016-04-18 | 2018-03-06 | Eagantu Ltd. | Wide band radio frequency circulator |
| CA3058793C (en) * | 2017-04-28 | 2021-12-28 | 3D Glass Solutions, Inc. | Rf circulator |
| KR102386799B1 (ko) | 2017-07-07 | 2022-04-18 | 3디 글래스 솔루션즈 인코포레이티드 | 패키지 광활성 유리 기판들에서 rf 시스템을 위한 2d 및 3d 집중 소자 디바이스들 |
| US10854946B2 (en) | 2017-12-15 | 2020-12-01 | 3D Glass Solutions, Inc. | Coupled transmission line resonate RF filter |
| EP3735743A4 (en) | 2018-01-04 | 2021-03-03 | 3D Glass Solutions, Inc. | IMPEDANCE-ADJUSTING CONDUCTIVE STRUCTURE FOR HF CIRCUITS WITH HIGH EFFICIENCY |
| WO2019199470A1 (en) | 2018-04-10 | 2019-10-17 | 3D Glass Solutions, Inc. | Rf integrated power condition capacitor |
| CA3071138C (en) | 2018-05-29 | 2021-05-25 | 3D Glass Solutions, Inc. | Low insertion loss rf transmission line |
| KR102322938B1 (ko) | 2018-09-17 | 2021-11-09 | 3디 글래스 솔루션즈 인코포레이티드 | 접지면을 갖는 고효율 컴팩트형 슬롯 안테나 |
| US11996600B2 (en) | 2018-11-14 | 2024-05-28 | Optisys, Inc. | Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles |
| KR102577948B1 (ko) * | 2018-11-14 | 2023-09-14 | 옵티시스 인코포레이티드 | 불규칙 육각형 단면을 가지는 중공의 금속 도파관 및 이를 제조하는 방법 |
| US11233304B2 (en) | 2018-11-19 | 2022-01-25 | Optisys, LLC | Irregular hexagon cross-sectioned hollow metal waveguide filters |
| US11270843B2 (en) | 2018-12-28 | 2022-03-08 | 3D Glass Solutions, Inc. | Annular capacitor RF, microwave and MM wave systems |
| CA3107810C (en) | 2018-12-28 | 2024-05-14 | 3D Glass Solutions, Inc. | Heterogenous integration for rf, microwave and mm wave systems in photoactive glass substrates |
| US11962057B2 (en) | 2019-04-05 | 2024-04-16 | 3D Glass Solutions, Inc. | Glass based empty substrate integrated waveguide devices |
| KR102473256B1 (ko) | 2019-04-18 | 2022-12-05 | 3디 글래스 솔루션즈 인코포레이티드 | 고효율 다이 다이싱 및 릴리스 |
| US10727216B1 (en) | 2019-05-10 | 2020-07-28 | Sandisk Technologies Llc | Method for removing a bulk substrate from a bonded assembly of wafers |
| CN110202880B (zh) * | 2019-06-03 | 2020-05-22 | 西安交通大学 | 一种柔性微波器件及其制备方法 |
| US11908617B2 (en) | 2020-04-17 | 2024-02-20 | 3D Glass Solutions, Inc. | Broadband induction |
| US11501905B2 (en) * | 2020-08-31 | 2022-11-15 | Boston Applied Technologies, Inc. | Composition and method of making a monolithic heterostructure of multiferroic thin films |
| KR20230088822A (ko) | 2020-10-19 | 2023-06-20 | 옵티시스 인코포레이티드 | 광대역 도파관 - 이중 동축 천이 구조 |
| WO2022094325A1 (en) | 2020-10-29 | 2022-05-05 | Optisys, Inc. | Integrated balanced radiating elements |
| CN112103602B (zh) * | 2020-11-05 | 2021-03-16 | 中国电子科技集团公司第九研究所 | 一种宽带高频法拉第隔离器 |
| CN112909458B (zh) * | 2021-02-08 | 2021-09-10 | 湖南国科雷电子科技有限公司 | 一种w波段e面波导滤波器 |
| WO2022241483A2 (en) | 2021-05-14 | 2022-11-17 | Optisys, Inc. | Planar monolithic combiner and multiplexer for antenna arrays |
| CN116345099A (zh) * | 2023-01-13 | 2023-06-27 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种硅基腔体环行器/隔离器及其加工方法 |
| CN120824531A (zh) * | 2025-06-27 | 2025-10-21 | 河北美泰电子科技有限公司 | 一种晶圆级异质集成的mems环行器及其制备方法 |
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| JPS5238163A (en) * | 1975-09-20 | 1977-03-24 | Omron Tateisi Electronics Co | Passive element |
| JPS5246787A (en) * | 1975-10-11 | 1977-04-13 | Hitachi Ltd | Coil for integrated circuit and process for production of same |
| JPH02166801A (ja) * | 1988-12-20 | 1990-06-27 | Mitsubishi Electric Corp | ファラデー旋回子用フェライト |
| JPH02188001A (ja) * | 1989-01-17 | 1990-07-24 | Uniden Corp | 円偏波対直線偏波変換器 |
| JPH06164222A (ja) | 1992-11-25 | 1994-06-10 | Murata Mfg Co Ltd | マイクロ波用磁性体及びその製造方法 |
| US5772820A (en) | 1995-08-07 | 1998-06-30 | Northrop Grumman Corporation | Process for fabricating a microwave power device |
| US5828271A (en) | 1997-03-06 | 1998-10-27 | Northrop Grumman Corporation | Planar ferrite toroid microwave phase shifter |
| US5876539A (en) | 1997-06-17 | 1999-03-02 | Northrop Grumman Corporaiton | Fabrication of ferrite toroids |
| US6060433A (en) | 1998-01-26 | 2000-05-09 | Nz Applied Technologies Corporation | Method of making a microwave device having a polycrystalline ferrite substrate |
| US6171886B1 (en) * | 1998-06-30 | 2001-01-09 | Eastman Kodak Company | Method of making integrated hybrid silicon-based micro-actuator devices |
| US6249039B1 (en) * | 1998-09-10 | 2001-06-19 | Bourns, Inc. | Integrated inductive components and method of fabricating such components |
| US6498549B1 (en) | 1998-12-07 | 2002-12-24 | Corning Applied Technologies Corporation | Dual-tuning microwave devices using ferroelectric/ferrite layers |
| US6600601B1 (en) | 1999-04-12 | 2003-07-29 | Shin-Etsu Chemical Co., Ltd. | Polarization-independent optical isolator and production method thereof |
| US6645677B1 (en) | 2000-09-18 | 2003-11-11 | Micronic Laser Systems Ab | Dual layer reticle blank and manufacturing process |
| US6673181B1 (en) * | 2001-10-29 | 2004-01-06 | Northrop Grumman Corporation | Method of manufacturing ferromagnetic toroids used in ferrite phase shifters |
| JP2003264405A (ja) | 2002-03-08 | 2003-09-19 | Opnext Japan Inc | 高周波伝送線路およびそれを用いた電子部品並びに電子装置 |
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| EP1746430A1 (en) * | 2005-07-22 | 2007-01-24 | Liaisons Electroniques-Mecaniques Lem S.A. | Orthogonal fluxgate magnetic field sensor |
| US7480435B2 (en) * | 2005-12-30 | 2009-01-20 | Intel Corporation | Embedded waveguide printed circuit board structure |
| TW200905703A (en) * | 2007-07-27 | 2009-02-01 | Delta Electronics Inc | Magnetic device and manufacturing method thereof |
| US20110123783A1 (en) | 2009-11-23 | 2011-05-26 | David Sherrer | Multilayer build processses and devices thereof |
| JP5815353B2 (ja) * | 2011-09-28 | 2015-11-17 | 株式会社フジクラ | コイル配線素子およびコイル配線素子の製造方法 |
| US9293245B2 (en) * | 2013-08-05 | 2016-03-22 | Qualcomm Mems Technologies, Inc. | Integration of a coil and a discontinuous magnetic core |
-
2014
- 2014-10-01 SG SG11201602499TA patent/SG11201602499TA/en unknown
- 2014-10-01 EP EP14780474.4A patent/EP3055871A1/en not_active Withdrawn
- 2014-10-01 JP JP2016517478A patent/JP6293875B2/ja not_active Expired - Fee Related
- 2014-10-01 WO PCT/EP2014/071079 patent/WO2015052059A1/en not_active Ceased
- 2014-10-01 US US15/027,286 patent/US9825347B2/en not_active Expired - Fee Related
- 2014-10-01 KR KR1020167011943A patent/KR20160067940A/ko not_active Ceased
- 2014-10-01 CN CN201480066647.2A patent/CN105814655B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP3055871A1 (en) | 2016-08-17 |
| WO2015052059A1 (en) | 2015-04-16 |
| CN105814655A (zh) | 2016-07-27 |
| US9825347B2 (en) | 2017-11-21 |
| KR20160067940A (ko) | 2016-06-14 |
| SG11201602499TA (en) | 2016-04-28 |
| JP6293875B2 (ja) | 2018-04-25 |
| JP2016535930A (ja) | 2016-11-17 |
| US20160254579A1 (en) | 2016-09-01 |
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Legal Events
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180807 Termination date: 20201001 |
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| CF01 | Termination of patent right due to non-payment of annual fee |