KR20160067168A - 레이저 릴리즈를 위한 레이저 스캐닝 시스템 - Google Patents

레이저 릴리즈를 위한 레이저 스캐닝 시스템 Download PDF

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Publication number
KR20160067168A
KR20160067168A KR1020167011861A KR20167011861A KR20160067168A KR 20160067168 A KR20160067168 A KR 20160067168A KR 1020167011861 A KR1020167011861 A KR 1020167011861A KR 20167011861 A KR20167011861 A KR 20167011861A KR 20160067168 A KR20160067168 A KR 20160067168A
Authority
KR
South Korea
Prior art keywords
laser beam
substrate
laser
incidence
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1020167011861A
Other languages
English (en)
Korean (ko)
Inventor
데이비드 찰스 밀른
필립 토마스 럼스비
Original Assignee
엠-솔브 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠-솔브 리미티드 filed Critical 엠-솔브 리미티드
Publication of KR20160067168A publication Critical patent/KR20160067168A/ko
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3066—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state involving the reflection of light at a particular angle of incidence, e.g. Brewster's angle
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020167011861A 2013-10-08 2014-05-09 레이저 릴리즈를 위한 레이저 스캐닝 시스템 Abandoned KR20160067168A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1317773.8A GB2519088B (en) 2013-10-08 2013-10-08 Laser scanning system for laser release
GB1317773.8 2013-10-08
PCT/GB2014/051423 WO2015052475A1 (en) 2013-10-08 2014-05-09 Laser scanning system for laser release

Publications (1)

Publication Number Publication Date
KR20160067168A true KR20160067168A (ko) 2016-06-13

Family

ID=49630355

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167011861A Abandoned KR20160067168A (ko) 2013-10-08 2014-05-09 레이저 릴리즈를 위한 레이저 스캐닝 시스템

Country Status (8)

Country Link
US (1) US9804384B2 (enExample)
EP (1) EP3055097B1 (enExample)
JP (1) JP6388931B2 (enExample)
KR (1) KR20160067168A (enExample)
CN (1) CN105636739B (enExample)
GB (1) GB2519088B (enExample)
TW (1) TWI614077B (enExample)
WO (1) WO2015052475A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200011097A (ko) * 2018-07-24 2020-02-03 (주) 큐알에스 레이어 분리장치
KR20220047664A (ko) * 2019-10-29 2022-04-18 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. 발광 다이오드 칩 및 발광 다이오드 칩 이송 장치

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WO2016014648A2 (en) * 2014-07-22 2016-01-28 Brewer Science Inc. Polyimides as laser release materials for 3-d ic applications
CN106654814A (zh) * 2017-03-09 2017-05-10 中国科学院合肥物质科学研究院 可用于晶化和剥离的两用准分子激光系统
KR102550390B1 (ko) * 2017-09-12 2023-07-03 에베 그룹 에. 탈너 게엠베하 일시적으로 접합된 기판 스택을 분리하는 방법 및 장치
CN116348223A (zh) * 2020-10-02 2023-06-27 Slm方案集团股份公司 操作辐照系统的方法、辐照系统和具有偏振控制的用于生产三维工件的设备
CN115609138A (zh) * 2021-07-13 2023-01-17 广东聚华印刷显示技术有限公司 激光剥离方法、激光设备以及激光剥离系统
DE102023205564A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Verfahren zur Erzeugung einer Temperierhohlstruktur in einem Substrat mit Hilfe eines Bearbeitungslichtstrahls

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US4694139A (en) * 1984-12-03 1987-09-15 Messer Griesheim Gmbh Guidance device for a laser beam for three-dimensional machining of workpieces
US5436867A (en) * 1993-03-08 1995-07-25 Northrop Grumman Corporation Holographic random access memory
JPH08132267A (ja) * 1994-11-02 1996-05-28 Toshiba Corp レ−ザ光走査装置
US6294407B1 (en) * 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
US6875951B2 (en) * 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
JP5057619B2 (ja) * 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4335613B2 (ja) * 2003-08-28 2009-09-30 Ｔｄｋ株式会社 ホログラフィック記録方法及び装置
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
TWI253065B (en) * 2004-06-30 2006-04-11 Lite On It Corp Angle multiplexing holographic storage device
TWI375498B (en) 2007-11-21 2012-10-21 Ind Tech Res Inst High perfromance laser-assisted transferring system and transfer component
US8027074B2 (en) * 2007-12-07 2011-09-27 Konica Minolta Opto, Inc. Scan optical system, light scan device, and image formation device
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
CN101879657B (zh) 2009-05-08 2016-06-29 东莞市中镓半导体科技有限公司 固体激光剥离设备和剥离方法
US8871609B2 (en) * 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
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JP5856824B2 (ja) * 2011-11-28 2016-02-10 オリンパス株式会社 光走査装置および走査型顕微鏡装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200011097A (ko) * 2018-07-24 2020-02-03 (주) 큐알에스 레이어 분리장치
KR20220047664A (ko) * 2019-10-29 2022-04-18 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. 발광 다이오드 칩 및 발광 다이오드 칩 이송 장치

Also Published As

Publication number Publication date
JP6388931B2 (ja) 2018-09-12
GB2519088B (en) 2015-09-16
US20160246050A1 (en) 2016-08-25
GB201317773D0 (en) 2013-11-20
GB2519088A (en) 2015-04-15
US9804384B2 (en) 2017-10-31
EP3055097B1 (en) 2020-01-01
TWI614077B (zh) 2018-02-11
CN105636739A (zh) 2016-06-01
JP2016539806A (ja) 2016-12-22
TW201513959A (zh) 2015-04-16
EP3055097A1 (en) 2016-08-17
CN105636739B (zh) 2017-05-24
WO2015052475A1 (en) 2015-04-16

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Patent event code: PA01051R01D

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