JP6388931B2 - レーザー取り外し用レーザー走査システム - Google Patents

レーザー取り外し用レーザー走査システム Download PDF

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Publication number
JP6388931B2
JP6388931B2 JP2016521305A JP2016521305A JP6388931B2 JP 6388931 B2 JP6388931 B2 JP 6388931B2 JP 2016521305 A JP2016521305 A JP 2016521305A JP 2016521305 A JP2016521305 A JP 2016521305A JP 6388931 B2 JP6388931 B2 JP 6388931B2
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Japan
Prior art keywords
laser beam
substrate
light guiding
laser
guiding element
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Expired - Fee Related
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JP2016521305A
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English (en)
Japanese (ja)
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JP2016539806A5 (enExample
JP2016539806A (ja
Inventor
デイビッド チャールズ ミルン
デイビッド チャールズ ミルン
フィリップ トーマス ラムズビー
フィリップ トーマス ラムズビー
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エム−ソルヴ・リミテッド
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3066—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state involving the reflection of light at a particular angle of incidence, e.g. Brewster's angle
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2016521305A 2013-10-08 2014-05-09 レーザー取り外し用レーザー走査システム Expired - Fee Related JP6388931B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1317773.8A GB2519088B (en) 2013-10-08 2013-10-08 Laser scanning system for laser release
GB1317773.8 2013-10-08
PCT/GB2014/051423 WO2015052475A1 (en) 2013-10-08 2014-05-09 Laser scanning system for laser release

Publications (3)

Publication Number Publication Date
JP2016539806A JP2016539806A (ja) 2016-12-22
JP2016539806A5 JP2016539806A5 (enExample) 2017-05-18
JP6388931B2 true JP6388931B2 (ja) 2018-09-12

Family

ID=49630355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016521305A Expired - Fee Related JP6388931B2 (ja) 2013-10-08 2014-05-09 レーザー取り外し用レーザー走査システム

Country Status (8)

Country Link
US (1) US9804384B2 (enExample)
EP (1) EP3055097B1 (enExample)
JP (1) JP6388931B2 (enExample)
KR (1) KR20160067168A (enExample)
CN (1) CN105636739B (enExample)
GB (1) GB2519088B (enExample)
TW (1) TWI614077B (enExample)
WO (1) WO2015052475A1 (enExample)

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* Cited by examiner, † Cited by third party
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WO2016014648A2 (en) * 2014-07-22 2016-01-28 Brewer Science Inc. Polyimides as laser release materials for 3-d ic applications
CN106654814A (zh) * 2017-03-09 2017-05-10 中国科学院合肥物质科学研究院 可用于晶化和剥离的两用准分子激光系统
KR102550390B1 (ko) * 2017-09-12 2023-07-03 에베 그룹 에. 탈너 게엠베하 일시적으로 접합된 기판 스택을 분리하는 방법 및 장치
KR102148013B1 (ko) * 2018-07-24 2020-08-25 (주) 큐알에스 레이어 분리장치
KR102748542B1 (ko) * 2019-10-29 2025-01-03 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. 발광 다이오드 칩 및 발광 다이오드 칩 이송 장치
CN116348223A (zh) * 2020-10-02 2023-06-27 Slm方案集团股份公司 操作辐照系统的方法、辐照系统和具有偏振控制的用于生产三维工件的设备
CN115609138A (zh) * 2021-07-13 2023-01-17 广东聚华印刷显示技术有限公司 激光剥离方法、激光设备以及激光剥离系统
DE102023205564A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Verfahren zur Erzeugung einer Temperierhohlstruktur in einem Substrat mit Hilfe eines Bearbeitungslichtstrahls

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US4694139A (en) * 1984-12-03 1987-09-15 Messer Griesheim Gmbh Guidance device for a laser beam for three-dimensional machining of workpieces
US5436867A (en) * 1993-03-08 1995-07-25 Northrop Grumman Corporation Holographic random access memory
JPH08132267A (ja) * 1994-11-02 1996-05-28 Toshiba Corp レ−ザ光走査装置
US6294407B1 (en) * 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
US6875951B2 (en) * 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
JP5057619B2 (ja) * 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4335613B2 (ja) * 2003-08-28 2009-09-30 Ｔｄｋ株式会社 ホログラフィック記録方法及び装置
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
TWI253065B (en) * 2004-06-30 2006-04-11 Lite On It Corp Angle multiplexing holographic storage device
TWI375498B (en) 2007-11-21 2012-10-21 Ind Tech Res Inst High perfromance laser-assisted transferring system and transfer component
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JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
CN101879657B (zh) 2009-05-08 2016-06-29 东莞市中镓半导体科技有限公司 固体激光剥离设备和剥离方法
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Also Published As

Publication number Publication date
GB2519088B (en) 2015-09-16
US20160246050A1 (en) 2016-08-25
GB201317773D0 (en) 2013-11-20
GB2519088A (en) 2015-04-15
US9804384B2 (en) 2017-10-31
KR20160067168A (ko) 2016-06-13
EP3055097B1 (en) 2020-01-01
TWI614077B (zh) 2018-02-11
CN105636739A (zh) 2016-06-01
JP2016539806A (ja) 2016-12-22
TW201513959A (zh) 2015-04-16
EP3055097A1 (en) 2016-08-17
CN105636739B (zh) 2017-05-24
WO2015052475A1 (en) 2015-04-16

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