JP2016539806A5 - - Google Patents

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Publication number
JP2016539806A5
JP2016539806A5 JP2016521305A JP2016521305A JP2016539806A5 JP 2016539806 A5 JP2016539806 A5 JP 2016539806A5 JP 2016521305 A JP2016521305 A JP 2016521305A JP 2016521305 A JP2016521305 A JP 2016521305A JP 2016539806 A5 JP2016539806 A5 JP 2016539806A5
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JP
Japan
Prior art keywords
laser beam
substrate
light guiding
guiding element
incident direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2016521305A
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English (en)
Japanese (ja)
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JP6388931B2 (ja
JP2016539806A (ja
Filing date
Publication date
Priority claimed from GB1317773.8A external-priority patent/GB2519088B/en
Application filed filed Critical
Publication of JP2016539806A publication Critical patent/JP2016539806A/ja
Publication of JP2016539806A5 publication Critical patent/JP2016539806A5/ja
Application granted granted Critical
Publication of JP6388931B2 publication Critical patent/JP6388931B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016521305A 2013-10-08 2014-05-09 レーザー取り外し用レーザー走査システム Expired - Fee Related JP6388931B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1317773.8A GB2519088B (en) 2013-10-08 2013-10-08 Laser scanning system for laser release
GB1317773.8 2013-10-08
PCT/GB2014/051423 WO2015052475A1 (en) 2013-10-08 2014-05-09 Laser scanning system for laser release

Publications (3)

Publication Number Publication Date
JP2016539806A JP2016539806A (ja) 2016-12-22
JP2016539806A5 true JP2016539806A5 (enExample) 2017-05-18
JP6388931B2 JP6388931B2 (ja) 2018-09-12

Family

ID=49630355

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016521305A Expired - Fee Related JP6388931B2 (ja) 2013-10-08 2014-05-09 レーザー取り外し用レーザー走査システム

Country Status (8)

Country Link
US (1) US9804384B2 (enExample)
EP (1) EP3055097B1 (enExample)
JP (1) JP6388931B2 (enExample)
KR (1) KR20160067168A (enExample)
CN (1) CN105636739B (enExample)
GB (1) GB2519088B (enExample)
TW (1) TWI614077B (enExample)
WO (1) WO2015052475A1 (enExample)

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WO2016014648A2 (en) * 2014-07-22 2016-01-28 Brewer Science Inc. Polyimides as laser release materials for 3-d ic applications
CN106654814A (zh) * 2017-03-09 2017-05-10 中国科学院合肥物质科学研究院 可用于晶化和剥离的两用准分子激光系统
KR102550390B1 (ko) * 2017-09-12 2023-07-03 에베 그룹 에. 탈너 게엠베하 일시적으로 접합된 기판 스택을 분리하는 방법 및 장치
KR102148013B1 (ko) * 2018-07-24 2020-08-25 (주) 큐알에스 레이어 분리장치
KR102748542B1 (ko) * 2019-10-29 2025-01-03 청두 비스타 옵토일렉트로닉스 씨오., 엘티디. 발광 다이오드 칩 및 발광 다이오드 칩 이송 장치
CN116348223A (zh) * 2020-10-02 2023-06-27 Slm方案集团股份公司 操作辐照系统的方法、辐照系统和具有偏振控制的用于生产三维工件的设备
CN115609138A (zh) * 2021-07-13 2023-01-17 广东聚华印刷显示技术有限公司 激光剥离方法、激光设备以及激光剥离系统
DE102023205564A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Verfahren zur Erzeugung einer Temperierhohlstruktur in einem Substrat mit Hilfe eines Bearbeitungslichtstrahls

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US4694139A (en) * 1984-12-03 1987-09-15 Messer Griesheim Gmbh Guidance device for a laser beam for three-dimensional machining of workpieces
US5436867A (en) * 1993-03-08 1995-07-25 Northrop Grumman Corporation Holographic random access memory
JPH08132267A (ja) * 1994-11-02 1996-05-28 Toshiba Corp レ−ザ光走査装置
US6294407B1 (en) * 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
US6875951B2 (en) * 2000-08-29 2005-04-05 Mitsubishi Denki Kabushiki Kaisha Laser machining device
JP5057619B2 (ja) * 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4335613B2 (ja) * 2003-08-28 2009-09-30 Ｔｄｋ株式会社 ホログラフィック記録方法及び装置
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
TWI253065B (en) * 2004-06-30 2006-04-11 Lite On It Corp Angle multiplexing holographic storage device
TWI375498B (en) 2007-11-21 2012-10-21 Ind Tech Res Inst High perfromance laser-assisted transferring system and transfer component
US8027074B2 (en) * 2007-12-07 2011-09-27 Konica Minolta Opto, Inc. Scan optical system, light scan device, and image formation device
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
CN101879657B (zh) 2009-05-08 2016-06-29 东莞市中镓半导体科技有限公司 固体激光剥离设备和剥离方法
US8871609B2 (en) * 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
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