KR20160056892A - 인쇄 회로 기판에서의 접착 촉진 - Google Patents

인쇄 회로 기판에서의 접착 촉진 Download PDF

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Publication number
KR20160056892A
KR20160056892A KR1020167006853A KR20167006853A KR20160056892A KR 20160056892 A KR20160056892 A KR 20160056892A KR 1020167006853 A KR1020167006853 A KR 1020167006853A KR 20167006853 A KR20167006853 A KR 20167006853A KR 20160056892 A KR20160056892 A KR 20160056892A
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KR
South Korea
Prior art keywords
substituted
unsubstituted
copper
group
composition
Prior art date
Application number
KR1020167006853A
Other languages
English (en)
Korean (ko)
Inventor
아바요미 아이 오웨이
조셉 에이. 아비스
테오도르 안토넬리스
에릭 발흐
Original Assignee
엔쏜 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엔쏜 인코포레이티드 filed Critical 엔쏜 인코포레이티드
Publication of KR20160056892A publication Critical patent/KR20160056892A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
KR1020167006853A 2013-08-16 2013-08-16 인쇄 회로 기판에서의 접착 촉진 KR20160056892A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2013/055368 WO2015023295A1 (en) 2013-08-16 2013-08-16 Adhesion promotion in printed circuit boards

Publications (1)

Publication Number Publication Date
KR20160056892A true KR20160056892A (ko) 2016-05-20

Family

ID=49036657

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167006853A KR20160056892A (ko) 2013-08-16 2013-08-16 인쇄 회로 기판에서의 접착 촉진

Country Status (5)

Country Link
EP (1) EP3033929A1 (zh)
JP (1) JP2016535453A (zh)
KR (1) KR20160056892A (zh)
CN (1) CN105453711A (zh)
WO (1) WO2015023295A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108535959B (zh) * 2018-02-28 2021-09-24 苏州城邦达益材料科技有限公司 感光胶黏剂及其制备方法和应用
CN110029348A (zh) * 2018-08-09 2019-07-19 苏州纳勒电子科技有限公司 一种用于处理铜表面的微蚀液
CN110205630A (zh) * 2018-08-09 2019-09-06 苏州纳勒电子科技有限公司 一种能用于杂质清除的微蚀液
CN110129802A (zh) * 2019-06-18 2019-08-16 博敏电子股份有限公司 一种印制板用新型抗氧化剂及其应用
CN113903502A (zh) * 2019-11-14 2022-01-07 宸盛光电有限公司 具自组装保护层的导电结构及自组装涂层组合物
US20220293509A1 (en) * 2021-03-10 2022-09-15 Intel Corporation Dielectric-to-metal adhesion promotion material
TW202402773A (zh) * 2022-03-24 2024-01-16 日商三菱瓦斯化學股份有限公司 銅表面保護用組成物、以及使用其之半導體中間體及半導體之製造方法
CN116607136B (zh) * 2023-06-01 2024-01-05 武汉创新特科技有限公司 一种用于线路板表面处理的键合剂及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
US7211204B2 (en) * 2003-12-12 2007-05-01 Electrochemicals, Inc. Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
JP4605446B2 (ja) * 2004-09-08 2011-01-05 日立化成工業株式会社 多層配線基板、半導体チップ搭載基板及び半導体パッケージ、並びにそれらの製造方法
JP4804847B2 (ja) * 2005-09-15 2011-11-02 新日鐵化学株式会社 銅張積層板の製造方法
EP2546387A1 (en) * 2008-03-21 2013-01-16 Enthone, Inc. Adhesion promotion of metal to laminate with a multi-functional compound
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
AU2014233658B2 (en) * 2013-03-16 2017-06-29 Prc-Desoto International, Inc. Alkaline cleaning compositions for metal substrates

Also Published As

Publication number Publication date
CN105453711A (zh) 2016-03-30
WO2015023295A1 (en) 2015-02-19
JP2016535453A (ja) 2016-11-10
EP3033929A1 (en) 2016-06-22

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