KR20160038746A - Vacuum deposition apparatus - Google Patents

Vacuum deposition apparatus Download PDF

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KR20160038746A
KR20160038746A KR1020150131559A KR20150131559A KR20160038746A KR 20160038746 A KR20160038746 A KR 20160038746A KR 1020150131559 A KR1020150131559 A KR 1020150131559A KR 20150131559 A KR20150131559 A KR 20150131559A KR 20160038746 A KR20160038746 A KR 20160038746A
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film
organic material
film thickness
organic
quartz
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KR1020150131559A
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KR101968798B1 (en
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히로유키 다무라
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캐논 톡키 가부시키가이샤
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    • H01L51/56
    • H01L21/203
    • H01L51/001
    • H01L2251/56

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Abstract

(PROBLEMS) By using a quartz oscillator in which an evaporated organic material evaporated from other evaporation sources in advance is formed in a predetermined film thickness in a crystal oscillation type film deposition system of one evaporation source, an organic material base There is provided an excellent vacuum deposition apparatus provided with a crystal oscillation type film deposition apparatus capable of forming a plurality of crystal oscillators with a film in advance and suppressing the rise of the equivalent series resistance of the crystal oscillator and lengthening the life span that.
A plurality of crystal oscillators (4) of a crystal oscillation type film thickness controller for controlling the film thickness and the deposition rate of one evaporation source are controlled in advance by controlling the film thickness and the deposition rate in the evaporation process by other evaporation sources in the remainder And a quartz oscillator to which an organic material base film is attached, in which an organic material base film of the organic material is formed on the plurality of quartz crystal vibrators.

Description

[0001] VACUUM DEPOSITION APPARATUS [0002]

The present invention relates to a vacuum evaporation apparatus for forming a thin film on a substrate in a vacuum tank maintaining a reduced pressure atmosphere and a vacuum deposition apparatus provided with a crystal oscillation type film thickness gauge for controlling the film thickness or deposition rate To a vacuum deposition apparatus.

BACKGROUND ART In a vacuum vapor deposition apparatus in which a thin film is formed on a substrate by a vacuum deposition method, a film thickness is used to control a film thickness and a deposition rate (film thickness rate). There are various kinds of these film thicknesses depending on the measurement method, but the quartz crystal method is widely used.

The quartz quartz crystal filter using the quartz oscillator method uses the fact that the resonance vibration changes due to the change in mass when an evaporation material is attached to the surface of the quartz crystal. For example, by measuring the change in resonance frequency (oscillation frequency) The film thickness and the film thickness are measured and fed back to the heating control device of the evaporation source to control the film thickness of the deposited thin film on the substrate uniformly and to control the film thickness.

When the thin film is deposited thick on the electrode film of the quartz vibrator at the time of measuring the film thickness (monitoring of the film thickness) by such a quartz vibrating film subscale, the resonance vibration becomes unstable or the equivalent series resistance (crystal impedance) The current flowing through the quartz crystal oscillator is lowered, and the phenomenon that resonance vibration can not be measured occurs. Therefore, when it is deposited in such a thick state that the resonance vibration can not be measured, it is determined that the life of the quartz crystal is the life of the quartz crystal, and the quartz crystal is replaced with a new quartz crystal.

Specifically, for example, the crystal holder holding a plurality of crystal oscillators is rotated so that the exchange of the crystal oscillator can be continuously performed in the vacuum tank.

In order to lengthen the life of the quartz crystal, in order to prevent cracks or peeling of the film from occurring even if the thin film is deposited thickly, according to Patent Document 1 (Japanese Patent Application Laid-Open No. 2000-101387) The soft metal film is formed on the electrode film on the film surface in advance to relax the internal stress of the film to prevent peeling and cracking of the film.

According to Patent Document 2 (Japanese Patent Laid-Open Publication No. 2014-70238), a vacuum chamber has at least two evaporation sources and a corresponding film thickness sensor, and a material which is difficult to adhere to the surface of the quartz crystal from one evaporation source evaporates And a material evaporating from the other evaporation source is introduced in advance into the film thickness sensor for monitoring the film thickness of the quartz crystal so that a base film is formed on the surface of the quartz crystal with a material having good adhesiveness before deposition of a material difficult to adhere, So that accurate evaporation rate can be detected.

Patent Document 1: Japanese Patent Application Laid-Open No. 2000-101387 Patent Document 2: JP-A-2014-70238

However, the method of forming the metal film in advance on the quartz crystal vibrator described in Patent Document 1 is a method of preventing peeling of the film forming material to eliminate instability of the resonance vibration and lengthening the life of the quartz crystal, The equivalent series resistance of the quartz oscillator rises and the current flowing through the quartz crystal oscillator is lowered so that the resonant oscillation can not be measured even though the formed film is not peeled off and therefore the life of the quartz crystal can not be lengthened.

A method of previously forming a base film by introducing a material evaporating from the other evaporation source into a film-forming sensor of a hardly attachable material provided on one of the evaporation sources known in Patent Document 2, A sufficient deposition rate can not be ensured because the material of the other evaporation source is introduced through the precoat introduction pipe to the film rearrangement sensor disposed on the rear surface sensor, It is easy to get rid of. Incorporation of a material that is liable to adhere from the other evaporation source does not monitor the film thickness, and therefore, a base film having an accurate film thickness can not be formed.

That is, even if it is possible to prevent peeling or cracking of the evaporation film, in the case of depositing an organic material having a small specific gravity as the evaporation material, as the film thickness of the evaporation film becomes larger as the organic material is deposited on the electrode, The problem that the oscillation frequency can not be measured can be sufficiently solved because the equivalent series resistance rises as the film thickness of the evaporation film increases even if the oscillation itself is maintained, since it can not follow the thickness sliding vibration none. In particular, in the metal film of the base film, the increase of the equivalent series resistance due to the film interface with the organic material can not be suppressed, and the lifetime of the crystal oscillation film film can not be shortened or lengthened.

Particularly, the evaporation material for producing the organic EL device is an organic material having a low specific gravity and is inferior in adhesion with the electrode film (for example, Au or Ag) on the surface of the quartz crystal, and can not follow the thickness slip vibration of the quartz crystal Even if the metal base film is formed, this organic material is simply placed on the electrode film. Therefore, when the film thickness of the vapor deposition film increases, the equivalent series resistance value rises.

Further, in the method of introducing the organic material not monitoring the film thickness through the introduction tube to the surface of the quartz crystal, it is not possible to form a plurality of quartz crystal vibrators with the base film formed uniformly in a sufficient amount, It can not cope with the operation of

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to solve the above problems and provide a method of controlling the thickness and deposition rate of a crystal oscillator, (The other of the rest) evaporation source is evaporated to form an organic material base film of a predetermined film thickness in advance, and a plurality of quartz crystal vibrators having a base film of a predetermined film thickness, Deposition of the organic material evaporated from the (one) evaporation source while controlling the film thickness and the deposition rate by using a crystal oscillation type film thickness regulator suppresses an increase in the equivalent series resistance of the quartz crystal, In addition, as described above, the organic material base film can be uniformly formed to have a constant film thickness, and further, And has an object to provide an innovative vacuum deposition apparatus that can be pre-formed and efficiently without the need for a film-forming step.

The gist of the present invention will be described with reference to the accompanying drawings.

A vacuum evaporation apparatus for depositing an organic material evaporated from at least two evaporation sources (2) in a vacuum chamber (1) on a surface of a substrate (3) to form a thin film, characterized in that each evaporation source (M) for controlling the film thickness or the deposition rate of the surface of the substrate (3) is provided in the vacuum chamber (1), and the crystal oscillation type film thickness meter (M) Wherein the one crystal oscillation type film thickness meter M provided in the one evaporation source 2 is provided with a plurality of quartz oscillators 4 in which the organic material evaporated from the other evaporation sources 2 in advance, The film is deposited on the plurality of quartz vibrators 4 provided in the crystal oscillating film M in such a manner that the crystal oscillator 4 is exchanged with the next quartz oscillator 4, To monitor the film thickness in the deposition process And a plurality of quartz oscillators 4 to which an organic material base film 6 is adhered and in which an organic material base film 6 of a constant film thickness is formed in advance and other evaporation sources 2 (4) provided with the organic material base film (6) after completion of the deposition process by the evaporation source (2) in the vapor deposition process by the one evaporation source (2) And a film thickness monitoring is carried out.

The vacuum chamber 1 is constituted by a plurality of organic vapor deposition chambers 12 and the respective evaporation sources 2 and the crystal oscillation film deposition system M are arranged in the respective organic vapor deposition chambers 12, The plurality of quartz vibrators 4 of the crystal oscillation type film thickness meter M disposed in the one organic vapor deposition chamber 12 is evaporated from the evaporation source 2 of the other organic vapor deposition chamber 12 The organic material base film 6 is formed on each of the plurality of quartz crystal vibrators 4 in such a manner that the organic material is replaced with the next quartz vibrator 4 when a constant film thickness is formed, The monitoring of the film thickness in the deposition process by the evaporation source 2 of the one organic vapor deposition chamber 12 is performed by the crystal oscillation type film deposition apparatus M having the quartz oscillator 4 with the deposition source 6 attached thereto, To the vacuum evaporation apparatus according to the first aspect of the present invention.

The vacuum evaporation apparatus according to claim 1, wherein the organic material base film (6) formed on each of the quartz crystal vibrators (4) has a film thickness of at least 2 mu m or more.

The vacuum evaporation apparatus according to claim 2, wherein the organic material base film (6) formed on each of the quartz crystal vibrators (4) has a film thickness of at least 2 mu m or more.

The electrode film (5) formed on the front and back surfaces of the quartz crystal vibrator (4) is formed of a plurality of metals mainly composed of Al or Al. To a deposition apparatus.

Further, it is preferable to provide a moving mechanism (13) for moving the crystal oscillation type film thickness meter (M) while controlling the film thickness or deposition rate of the organic material evaporated from another evaporation source (2) After the evaporation process by the other evaporation source 2 among the remaining ones is completed, the crystal oscillation type film thickness meter M is transferred to the moving mechanism 13 And the vaporized organic material evaporated from the one evaporation source 2 is formed on the quartz crystal vibrator 4 to which the organic material base film 6 is adhered so that the one evaporation source 2 is controlled Is configured to control the film thickness or the deposition rate of the surface of the substrate (3) and to monitor the film thickness in the deposition process by the one evaporation source (2). The apparatus according to any one of claims 1 to 4, Vacuum deposition chamber Relate to.

Further, it is preferable to provide a moving mechanism (13) for moving the crystal oscillation type film thickness meter (M) while controlling the film thickness or deposition rate of the organic material evaporated from another evaporation source (2) After the evaporation process by the other evaporation source 2 among the remaining ones is completed, the crystal oscillation type film thickness meter M is transferred to the moving mechanism 13 And the vaporized organic material evaporated from the one evaporation source 2 is formed on the quartz crystal vibrator 4 to which the organic material base film 6 is adhered so that the one evaporation source 2 is controlled And controlling the film thickness or the deposition rate of the surface of the substrate (3) and monitoring the film thickness in the deposition process by the one evaporation source (2). .

The vacuum deposition apparatus according to any one of claims 1 to 4, wherein the organic material is an organic material for producing an organic EL device.

The vacuum deposition apparatus according to claim 5, wherein the organic material is an organic material for producing an organic EL device.

The vacuum deposition apparatus according to claim 6, wherein the organic material is an organic material for manufacturing an organic EL device.

The vacuum deposition apparatus according to claim 7, wherein the organic material is an organic material for producing an organic EL device.

Since the present invention is constituted as described above, the film thickness and the deposition rate are controlled by a crystal oscillation type film thickness meter, and by monitoring the film thickness, the surface of a plurality of crystal oscillators of the crystal oscillation type film thickness meter A plurality of quartz oscillators having a plurality of quartz crystals having a predetermined film thickness of a predetermined film thickness formed in a sufficient amount and having a predetermined film thickness; Deposition of the organic material evaporated from the (one) evaporation source while controlling the film thickness or the deposition rate is suppressed by using a film deposition system, the rise of the equivalent series resistance of the quartz crystal can be suppressed and the life span can be improved, As described above, the organic material base film can be uniformly formed to have a constant film thickness, and further, It is an epoch-making vacuum vapor deposition apparatus that can be formed in advance efficiently without requiring a deposition step.

In other words, while controlling the film thickness (monitoring the film thickness) in the same manner as the film thickness of the substrate in the crystal oscillation film system, the organic material evaporated from the evaporation source (other than the rest) (A new deposition process for forming a base film) is not provided separately from the deposition process, and the deposition of the organic material having a uniform film thickness (constant film thickness) And thus an increase in the equivalent series resistance of the quartz oscillator can be suppressed and thus the life span of the crystal oscillator can be increased.

That is, the organic material is controlled to have a predetermined thickness on the electrode film of the quartz vibrator by the film thickness and the deposition rate limit in other deposition processes in advance, and is deposited together with the substrate to form an organic material base film The adhesion between the electrode film and the base film of the organic material is good and the adhesion between the base film of the organic material and the deposition material (organic material) is good as compared with the case where the deposition material (organic material) is directly deposited on the electrode film And the affinity with the evaporation material is also better than that in the case of using the metal film as the base film, so that the film interface becomes ambiguous as compared with the metal film, and even if the film thickness of the evaporation film by the evaporation material increases, The lifetime can be prolonged and monitoring for a long period of time can be carried out. In addition, this organic material base film forming process can also be carried out with the necessary increase Because the process and is not need to be equipped separately, productivity is also extremely high vacuum deposition apparatus.

More specifically, when the organic material base film is formed on the electrode film of the quartz vibrator in advance, the adhesion between the electrode film and the evaporation material is deteriorated, the evaporation film can not follow the resonance vibration of the quartz vibrator, The increase of the equivalent series resistance of the quartz oscillator when depositing the evaporation material which has the energy loss for oscillation and in which the equivalent series resistance of the quartz oscillator is raised is suppressed so that the lifetime is increased And is capable of being monitored for a long time, is a vacuum vapor deposition apparatus equipped with a crystal oscillation type film deposition apparatus.

Further, among the plurality of evaporation sources in the vacuum chamber, the quartz crystal oscillator of the crystal oscillation type film thickness controller for controlling the film thickness or vapor deposition rate of the organic material evaporated from one evaporation source, It is possible to perform monitoring of the film thickness by switching to a separate quartz oscillator which is provided plural times when a certain film thickness is formed without depositing the different organic materials vaporized from the lower limit of the resonance frequency, , The crystal oscillator monitoring the film thickness is sequentially switched to sequentially form an organic material base film having a predetermined film thickness on each crystal oscillator so that the organic film base film deposited with a precisely constant film thickness A plurality of quartz oscillators are formed, (Used for a quartz oscillator of a crystal oscillation type membrane sub-system for one evaporation source), it is possible to suppress the rise of the equivalent series resistance and to provide an excellent Thereby forming a vacuum evaporation apparatus.

In other words, since the monitoring of the film thickness and the formation of the base film at the time of (next) monitoring of the film thickness are performed simultaneously (as can be compatible), as described above, A plurality of quartz oscillators to which the organic material base film is attached can be provided, so that the vacuum vapor deposition apparatus is excellent in practicality.

Further, in the invention described in claim 2, by having a plurality of organic vapor deposition chambers, a vacuum vapor deposition apparatus having excellent practicality is obtained.

In the invention described in claims 3 and 4, a vacuum evaporation apparatus capable of further suppressing the rise of the equivalent series resistance of the quartz vibrator by forming the organic material base film at least 2 mu m or more.

In addition, in the invention described in claim 5, the adhesion with the evaporation material is further improved, the evaporation film can not follow the resonance vibration of the quartz vibrator, the equivalent series resistance of the quartz oscillator increases, and the current flowing through the quartz oscillator is lowered So that it is possible to suppress the resonance vibration from being unable to be measured.

In addition, in the invention described in claims 6 and 7, it is possible to move automatically by having a moving mechanism for moving the crystal oscillation type film thickness meter, and further, for example, in the same evaporation chamber of a vacuum chamber, A crystal oscillation type film deposition apparatus having a quartz crystal element in which an organic material base film is formed can be used as a film thickness control monitor from another evaporation source in the same deposition chamber.

Further, in the invention according to claims 8 to 11, it is suitable for the production of an organic EL device and becomes a quartz crystal film which is more useful.

Fig. 1 is a schematic configuration diagram of a vacuum vapor deposition apparatus using a crystal oscillation type film deposition apparatus according to the present embodiment.
2 is an explanatory diagram of a crystal holder which is a part of a crystal oscillation type film thickness gauge according to the present embodiment.
3 is an explanatory diagram of a cover which is a part of a crystal oscillation type film thickness gauge according to the present embodiment.
4 is a schematic configuration explanatory view showing an example of a cluster system of an organic EL device manufacturing apparatus.
5 is a schematic explanatory diagram of the quartz crystal resonator of this embodiment.
6 is a graph showing the equivalent time series resistance value stabilization time to the film thickness of the organic material base film by the organic material deposition of this embodiment.
Fig. 7 is a schematic structural explanatory plan view showing a moving mechanism of the crystal oscillation type film deposition apparatus in the vacuum evaporation apparatus of this embodiment.
Fig. 8 is a side view schematically showing the moving mechanism of the crystal oscillation type film deposition apparatus in the vacuum evaporation apparatus of this embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

The vacuum vapor deposition apparatus of the present invention has at least two evaporation sources 2 in a vacuum chamber 1 and a crystal oscillation type film thickness meter M for controlling respective film thicknesses and deposition rates is provided in the evaporation source 2 And a plurality of quartz oscillators 4 are provided in the quartz crystal membrane remover M and a plurality of quartz crystal oscillators 4 provided in at least one quartz oscillation type film thickness meter M, The film thickness of the evaporation source 2 and the deposition rate of the other evaporation sources 2 in the remaining portion are changed in such a manner that the organic material evaporated from the other evaporation sources 2 in the remainder is replaced with the next quartz oscillator 4 when a constant film thickness is formed The organic material base film 6 is formed by depositing the organic material on the plurality of quartz crystal vibrators 4 while controlling the crystal oscillator 4 and the crystal oscillating film 4 is controlled by a crystal oscillation film for controlling the film thickness of the one evaporation source 2 and the deposition rate Or may be used for the subsequent system (M) The crystal oscillation type film thickness meter M provided with the quartz vibrator 4 with the base film 6 is used so that the evaporation material is deposited directly on the electrode film 5 of the quartz crystal vibrator 4 The adhesion between the electrode film 5 and the organic material base film 6 is good and the adhesion between the organic material base film 6 and the vapor deposition material is good and the affinity with the vapor deposition material is also high, It is possible to suppress the rise of the equivalent series resistance of the quartz crystal vibrator 4 and to prolong the life of the quartz crystal resonator 4 even if the film thickness of the vapor deposition film by the evaporation material increases because the film interface becomes more obtuse than the metal film And long-term monitoring becomes possible without having an organic-material-based film forming process other than the deposition process.

For example, even when an organic material having a small specific gravity for producing an organic EL device is deposited, adhesion with the electrode film 5 (for example, Au or Ag) on the surface of the quartz crystal vibrator 4 becomes good, , The increase in the equivalent series resistance of the quartz vibrator 4 is suppressed, the life can be lengthened, and monitoring for a long time is possible.

Therefore, the organic material for forming the organic film base film 6 on the electrode film 5 can be formed, for example, in the same vacuum chamber 1 as the organic material whose rise in the equivalent series resistance of the quartz vibrator 4 should be suppressed Evaporation from the evaporation source 2 in which co-deposition is carried out in the organic deposition chamber 12 or evaporation from the evaporation source 2 in which co-deposition is performed in the other evaporation chamber 12 in the plurality of organic deposition chambers 12 in the vacuum evaporation apparatus, The equivalent series resistance does not rise well, and the organic material base film 6 is formed by vapor deposition by the deposition process. For example, the adhesion of the quartz crystal 4 to the electrode is better than that of the organic material in which the equivalent series resistance of the quartz vibrator 4 rises well, and the followability of the thickness oscillation vibration of the quartz crystal vibrator 4 is enhanced. By making the film surface better than that of the base film, the rise of the equivalent series resistance can be suppressed even if the film interface becomes obscured and the vapor deposition film increases in thickness, so that the oscillation frequency can be stably and accurately measured, Is selected from the organic materials evaporated in the plurality of organic vapor deposition chambers 12 in the vacuum vapor deposition apparatus and is made of an organic material composed of an organic material containing at least one carbon atom.

In addition, when the base film is a metal film made of a metal material rather than an organic material, the film interface with the evaporation material occurs even if the adhesion with the electrode film 5 is increased, so that the equivalent series resistance increases and the lifetime is short .

When the quartz vibrator 4 on which the organic material has been deposited in advance on the electrode film 5 of the quartz crystal vibrator 4 is used, before the organic material base film 6 is formed and actually deposited, The organic material may deteriorate due to the influence of water or the like in the atmosphere, and the function may be lost as a base film.

For example, in the vacuum vapor deposition apparatus, the quartz oscillator 4 used for monitoring the film thickness of the organic material evaporated from the evaporation source 2 (other than the rest) is connected to the quartz crystal vibrator 4 to which the organic material base film 6 is attached (1) evaporation source (2), the deterioration of the organic material which is the base film can be suppressed to the minimum.

The vacuum vapor deposition apparatus for manufacturing the organic EL device has a plurality of organic vapor deposition chambers 12, and even if the organic vapor deposition chamber 12 does not use an organic material as a base film, 2), the optimum organic material can be selected as the base film in consideration of the deposition rate and the thin film characteristics.

Further, by setting the film thickness of the organic material base film 6 to at least 2 mu m or more, the rise of the equivalent series resistance of the quartz vibrator 4 can be further suppressed.

The electrode film 5 formed on the front surface and the back surface of the quartz crystal vibrator 4 can be made of a metal having a low reactivity such as Au or Ag by using a plurality of metals mainly composed of Al or Al, The vapor deposition film can not follow the resonance vibration of the quartz crystal vibrator 4 and the equivalent series resistance of the quartz crystal resonator 4 rises and the quartz crystal resonator 4 is prevented from being damaged. It is possible to suppress the occurrence of the inability to measure the resonance vibration in the end.

Further, in the structure in which the crystal oscillator type film thickness meter M has a larger number of evaporation sources 2 in the organic vapor deposition chamber 12 and a moving mechanism 13 for moving the whole, for example, By monitoring the film thickness of the evaporated organic material while monitoring the film thickness of the organic material evaporated from the evaporation source 2 and moving after forming the organic material based film 6 to monitor the film thickness of the evaporated organic material from the other evaporation source 2, It is possible to use for a long time without stopping evaporation.

Example

A specific embodiment of the present invention will be described with reference to the drawings.

This embodiment is characterized in that a vacuum deposition (vacuum deposition) process is carried out with a quartz crystal growth meter M for controlling the film thickness at the time of forming a thin film by depositing an organic material evaporated from the evaporation source 2 in the vacuum chamber 1 To which the present invention is applied.

This embodiment is characterized in that at least two evaporation sources 2 are provided in the vacuum chamber 1 and a crystal oscillation type film thickness meter M for monitoring the film thickness in each vapor deposition process by each evaporation source 2 is Each of the evaporation sources 2 is provided with a plurality of quartz oscillators 4 in each crystal oscillation type membrane submergence M.

Among them, the crystal oscillation type film thickness meter M (one crystal oscillation type film thickness meter M of one evaporation source 2) of the evaporation source 2 for vapor-depositing the evaporation material (organic material) A quartz crystal vibrator 4 to which an organic material base film 6 formed as a base film for evaporation from an evaporation source 2 which is different from the other evaporation source 2 is used.

The production of the quartz crystal vibrator 4 to which the organic material base film 6 is adhered according to the present embodiment is carried out in the same manner as the production of the quartz crystal vibrator 4 of the quartz crystal growth apparatus M in the deposition process by the separate evaporation source 2 A uniform organic material base film 6 of a predetermined film thickness is formed on the plurality of quartz crystal vibrators 4 simultaneously with the monitoring of the film thickness in the deposition step and in the present embodiment, The quartz crystal vibrator 4 with the organic material base film 6 attached thereto is detached from the quartz oscillation film deposition system M and the quartz oscillation film M is transferred to the single crystal oscillation film deposition system M of the one evaporation source 2 As shown in FIG.

That is, in this embodiment, the crystal oscillation type film deposition system M is provided for each deposition step (for each evaporation source 2), and the crystal oscillation type film deposition system M does not move, And the crystal vibrating element 4 is replaced (moved and mounted) after the organic material base film 6 is formed while monitoring the film thickness in the crystal vibrating body 4.

On the other hand, a quartz crystal growth meter M having a quartz crystal vibrator 4 with an organic material base film 6 attached thereto at the same time as the film thickness monitoring is mounted on the quartz substrate 1, The crystal oscillator 4 to which the other organic material base film 6 is attached is moved while the one crystal oscillation type film thickness meter M is retracted without connecting the wires again as in the embodiment described later, Oscillation-type membrane submergence system M having a plurality of crystal oscillation-type membrane submergence systems M may be replaced by the same.

Either way, according to the present invention, by forming the organic material base film (6) having a constant film thickness simultaneously with the monitoring of the film thickness in the deposition process by the other evaporation source (2) among the others, It is possible to efficiently form a plurality of quartz oscillators 4 to which the organic material base film 6 of a certain thickness is adhered, The quartz crystal vibrator 4 having the quartz crystal resonator 4 as a quartz crystal vibrator 4 provided in a quartz crystal deposition system M in a vapor deposition process for depositing an evaporation material in which one of (separate) And a crystal oscillation type film thickness meter M provided with a quartz crystal vibrator 4 to which the organic material base film 6 is attached is used as the vacuum vapor deposition apparatus.

Fig. 1 shows a schematic configuration of a vacuum evaporation apparatus which can be continuously used for a long time on a large substrate using the crystal oscillation type film deposition apparatus M of the present embodiment. In this embodiment, Two linear evaporation sources 2 and two evaporation sources 2 are provided at positions that do not interfere with the scattering process of vaporizing and evaporating evaporated materials from the evaporation sources 2 reaching the substrate surface to form a thin film, A crystal oscillation type film thickness meter M is provided.

The crystal oscillator type film thickness meter M of the present embodiment is configured such that the evaporation material injected from the evaporation source 2 is deposited on the surface (electrode film 5) of the crystal oscillator 4 vibrating at a constant frequency by the oscillator 7, The film thickness display section 11 calculates the deposition rate and the film thickness from the resonance frequency variation amount and feeds back the value to the heating control section 8 so that the heater of the evaporation source 2 The power is controlled so that the deposition rate becomes constant.

A chopper which is a shielding member having an opening portion and a non-opening portion so as to suppress the amount of deposition of the evaporation material emitted from the evaporation source 2 on the surface of the quartz crystal vibrator 4 and to use the quartz crystal vibrator 4 for a long time And a chopper (not shown) is arranged to rotate at a constant speed.

The crystal oscillation type film thickness meter M as a monitor for controlling the film thickness in this embodiment includes a crystal holder 14 capable of storing a plurality of crystal oscillators 4 shown in Fig. 2, The cover 15 provided with the opening 10 at one position of the crystal holder 4 is provided on the evaporation source 2 side of the crystal holder 14 and the crystal holder 14 is rotated The quartz vibrator 4 disposed at the position of the opening 10 can be switched and used, and the deposition rate can be continuously monitored over a long period of time.

Fig. 4 also shows a configuration of a vacuum deposition apparatus having a plurality of organic vapor deposition chambers 12 for manufacturing organic EL devices. And the organic EL device is fabricated by stacking a plurality of organic layers. Therefore, the vacuum evaporation apparatus is provided with a plurality of layers for each layer And selecting the most suitable organic material as the organic material base film 6 in consideration of the deposition rate and the thin film characteristics among the organic materials evaporated from the evaporation source 2 used therein , And the crystal oscillation type film thickness meter M can be used both as a film thickness monitor and in formation of a base film by switching the quartz vibrator 4 to a constant film thickness and operating it.

The organic material (B) selected as the organic material base film (6) does not rise in the equivalent series resistance of the quartz crystal vibrator (4) when it is deposited alone as described above. Concretely, the adhesion to the electrode film 5 is better than that of the organic material (A) as the evaporation material, and the followability to the thickness slip vibration of the quartz crystal vibrator 4 is increased, and the affinity with the organic material (A) By making the sintered metal film better than the case of using the sintered metal film as the base film, the rise of the equivalent series resistance can be suppressed even if the film interface becomes ambiguous and the vapor deposition film increases in thickness, so that the oscillation frequency can be stably and accurately measured, Choose something that can last a long time. Therefore, the organic material B forming the organic material base film 6 is composed of an organic material containing at least one carbon atom different from the evaporation material A (organic material (A)) as described above Organic materials.

In addition, when the base film is a metal film made of a metal material rather than an organic material, an interface with the evaporation material A (organic material A) occurs even if the adhesion with the electrode film 5 is increased, Series resistance increases and life is short.

That is, the organic material (B) for forming the organic material base film 6 is an organic material having good affinity with the evaporation material (A) (organic material (A)) to be deposited thereon, The organic material (B) having higher adhesion with the electrode film (5) than the organic material (A) is selected from the organic materials whose film thickness is monitored in the vacuum vapor deposition apparatus.

The electrode film formed on the front surface and the back surface of the quartz crystal vibrator 4 is made of an alloy containing Al as a main component so that compared with the case where the electrode film 5 is formed of a metal having low reactivity such as Au or Ag, The adhesion with the evaporation material is further improved and the rise of the equivalent series resistance of the quartz vibrator 4 can be suppressed.

5 is a schematic configuration of the quartz vibrator 4 of the present embodiment. As described above, the electrode film 5 made of Al or Al-based alloy is formed on the top and bottom surfaces of the quartz crystal.

Al is easily oxidized and an oxide film covered with oxygen is formed on the surface of the electrode film 5. The adhesion between the organic molecules of the organic material in which the highly reactive oxygen molecules are deposited and the electrode film 5 is improved, So that it can follow the resonance vibration of the vibrator 4.

6 shows an example in which an organic material is deposited as a preliminary film to be deposited in advance on the electrode film 5 of the quartz vibrator 4 to form an organic material base film 6, FIG. 5 is a graph showing a time during which the equivalent series resistance does not rise and is stable when the organic material used in the deposition process is deposited. FIG.

The equivalent time series resistance value when the film thickness of the organic material base film 6 is 0.16 占 퐉 is 1 and the equivalent time when the film thickness of the organic material base film 6 is 0.78 占 퐉, 1.57 占 퐉 and 3.13 占 퐉 And the ratio of the stabilization time of the series resistance value.

As the film thickness of the organic material base film 6 becomes thicker with the film thicknesses of 0.78 mu m, 1.57 mu m, and 3.13 mu m, as compared with when the film thickness of the organic material base film 6 is 0.16 mu m, Time ratio is getting longer as 1.3, 2.2, and 6.8.

Therefore, the increase in the equivalent series resistance can be suppressed as the organic material base film 6 is thickly deposited. However, since the deposition amount of the evaporation material to be formed thereon is reduced by thick deposition of the base film, The film thickness is preferably at least 2 mu m or more and the thickness of the base film and the number of the formed quartz vibrators 4 are determined in consideration of the number of the quartz crystal vibrators 4 stored in the crystal holder 14 and the deposition time do.

Fig. 7 is a schematic structural explanatory plan view showing a case in which the moving mechanism 13 for moving the crystal oscillation type film thickness meter M as a whole is provided. There are two evaporation sources 2 in the organic vapor deposition chamber 12 and three crystal oscillation type film thickness meters M are provided one more than the number of the evaporation sources 2. [ The crystal oscillator 4 having the organic material base film 6 attached thereto is placed in advance in the quartz crystal growth meter M in which the equivalent series resistance rises during deposition and the remaining two crystal oscillators 4 are placed . When the organic material is evaporated for a long time, the number of the quartz crystal vibrators 4 used for monitoring the film thickness becomes short, and it becomes necessary to replace them.

At that time, the entire three crystal oscillation type membrane submergers M are moved in the short direction of the evaporation source 2, so that the crystal oscillation type membrane submergence meter M for monitoring the film thickness is changed, and then the film thickness monitoring can be continued .

Specifically, the crystal oscillation type film thickness meter M, which had been monitoring the film thickness with the quartz crystal vibrator 4 to which the organic material base film 6 was attached, was moved backward (not used after this backward movement) , The crystal oscillation type film thickness meter M which has been compatible with the monitoring of the film thickness and the formation of the base film was moved and used instead (this was used as a film deposition system of an evaporation material in which the equivalent series resistance was raised) Next to the film deposition system of the organic material, a film deposition system which has been used without using it is used.

Therefore, evaporation of the organic material emitted from the evaporation source 2 is stopped, the inside of the vacuum chamber 1 is vented to the atmospheric pressure after cooling, and the quartz oscillator 4 of the crystal oscillation type film thickness meter M is not exchanged , The film thickness monitoring can be continued for a long time.

Fig. 8 shows the moving mechanism 13 of the crystal oscillation type film thickness meter M in the vacuum vapor deposition apparatus. The flexible piping of the crystal oscillation type film thickness meter M is connected to an atmospheric pressure space (atmospheric pressure BOX) in the vacuum tank 1 and is connected to a standby arm having a joint portion for communicating the atmospheric pressure space outside the vacuum tank 1 So that the waiting BOX can be moved. It is possible to move the electric wiring, the coaxial cable, the water-cooled pipe, etc. from the atmospheric pressure space outside the vacuum chamber 1 while introducing the electric wiring, the coaxial cable, and the water-cooled pipe into the crystal oscillation type film thickness meter M in the vacuum chamber 1.

Further, the present invention is not limited to the present embodiment, but a specific configuration of each constituent requirement can be appropriately designed.

1: vacuum chamber, 2: evaporation source, 3: substrate, 4: quartz oscillator, 5: electrode film, 6: organic base film, 12: organic vapor deposition chamber, 13:

Claims (11)

A vacuum evaporation apparatus for depositing an organic material as an evaporation material evaporated from at least two evaporation sources in a vacuum chamber to form a thin film on a substrate surface, characterized in that each evaporation source is controlled to control the film thickness or evaporation rate of the substrate surface Wherein at least two crystal oscillation type membrane submerging apparatuses are provided in the vacuum chamber, and the crystal oscillation type membrane submergence system includes a plurality of quartz oscillators, Is deposited on the plurality of quartz crystal vibrators provided in the crystal oscillating film system in such a manner that an organic material vaporized from other evaporation sources in advance is replaced with a next quartz oscillator when a constant film thickness is formed, In addition to monitoring the film thickness in the deposition process by different evaporation sources, And a plurality of quartz oscillators to which an organic material base film is adhered and in which a base film is formed in advance, and after the deposition process by another evaporation source among the remaining evaporation sources, Wherein the film thickness monitoring in the vapor deposition process by the one evaporation source is performed by a film deposition system. The method according to claim 1,
Wherein the vacuum chamber is constituted by a plurality of organic vapor deposition chambers and the respective evaporation sources and the crystal oscillation film system are disposed in the respective organic vapor deposition chambers and the plurality of crystals The vibrator is formed by forming the organic material base film on each of the plurality of quartz crystal vibrators in such a manner that an organic material evaporated from the evaporation source of another organic vapor deposition chamber in advance is replaced with a next quartz vibrator when a constant film thickness is formed, And monitoring the film thickness in the deposition process by the evaporation source of the one organic vapor deposition chamber with a quartz crystal deposition apparatus having a quartz crystal vibrator with the organic base film attached thereto. .
The method according to claim 1,
Wherein the organic material base film formed on each of the quartz crystal vibrators has a film thickness of at least 2 mu m or more.
3. The method of claim 2,
Wherein the organic material base film formed on each of the quartz crystal vibrators has a film thickness of at least 2 mu m or more.
5. The method according to any one of claims 1 to 4,
Wherein the electrode film formed on the front surface and the back surface of the quartz oscillator is formed of a plurality of metals containing Al or Al as a main component.
The method according to any one of claims 1 to 4, further comprising a moving mechanism for moving the crystal oscillation type film deposition apparatus, wherein, while controlling the film thickness or deposition rate of the evaporated organic material from another evaporation source in the remainder, Wherein the organic film is deposited on each of the quartz oscillators to form the organic material base film, and after completion of the deposition process by another evaporation source among the remainder, the crystal oscillation film deposition system is moved by the moving mechanism, The organic material is formed on the quartz crystal substrate to which the organic material base film is attached so that the one evaporation source is controlled to control the film thickness or the deposition rate of the substrate surface and the film thickness monitor in the deposition process by the one evaporation source Is performed in the vacuum deposition apparatus. 6. The method of claim 5,
And a moving mechanism for moving the crystal oscillation type film deposition apparatus, wherein the organic material evaporated from the other evaporation sources in the remainder is deposited on each of the quartz crystal vibrators while controlling the film thickness or deposition rate to form the organic film base film And the organic film evaporated from the one evaporation source is deposited on the quartz oscillator to which the organic material base film is attached, And controlling the film thickness or the deposition rate of the surface of the substrate by controlling the one evaporation source and monitoring the film thickness in the deposition process by the one evaporation source.
5. The method according to any one of claims 1 to 4,
Wherein the organic material is an organic material for producing an organic EL device.
6. The method of claim 5,
Wherein the organic material is an organic material for producing an organic EL device.
The method according to claim 6,
Wherein the organic material is an organic material for producing an organic EL device.
8. The method of claim 7,
Wherein the organic material is an organic material for producing an organic EL device.
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