KR20150120869A - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR20150120869A
KR20150120869A KR1020150052900A KR20150052900A KR20150120869A KR 20150120869 A KR20150120869 A KR 20150120869A KR 1020150052900 A KR1020150052900 A KR 1020150052900A KR 20150052900 A KR20150052900 A KR 20150052900A KR 20150120869 A KR20150120869 A KR 20150120869A
Authority
KR
South Korea
Prior art keywords
polishing
polished
cleaning
wafer
substrate
Prior art date
Application number
KR1020150052900A
Other languages
English (en)
Korean (ko)
Inventor
고지 마루야마
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20150120869A publication Critical patent/KR20150120869A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020150052900A 2014-04-18 2015-04-15 기판 처리 장치 KR20150120869A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014086177A JP2015205359A (ja) 2014-04-18 2014-04-18 基板処理装置
JPJP-P-2014-086177 2014-04-18

Publications (1)

Publication Number Publication Date
KR20150120869A true KR20150120869A (ko) 2015-10-28

Family

ID=54321213

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150052900A KR20150120869A (ko) 2014-04-18 2015-04-15 기판 처리 장치

Country Status (5)

Country Link
US (1) US20150298283A1 (zh)
JP (1) JP2015205359A (zh)
KR (1) KR20150120869A (zh)
CN (1) CN105047582A (zh)
TW (1) TW201601875A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017108113A (ja) * 2015-11-27 2017-06-15 株式会社荏原製作所 基板処理装置および基板処理方法ならびに基板処理装置の制御プログラム
JP6577385B2 (ja) * 2016-02-12 2019-09-18 株式会社荏原製作所 基板保持モジュール、基板処理装置、および基板処理方法
CN206105604U (zh) * 2016-09-14 2017-04-19 天津华海清科机电科技有限公司 化学机械抛光系统
JP6884015B2 (ja) * 2017-03-22 2021-06-09 株式会社荏原製作所 基板の研磨装置および研磨方法
DE102018007463B4 (de) * 2018-09-04 2022-01-05 Schneider Gmbh & Co. Kg Vorrichtung und Verfahren zur Linsenbearbeitung sowie Bearbeitungseinrichtung für Linsen

Also Published As

Publication number Publication date
CN105047582A (zh) 2015-11-11
TW201601875A (zh) 2016-01-16
JP2015205359A (ja) 2015-11-19
US20150298283A1 (en) 2015-10-22

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