KR20150093037A - Light emitting device package module, backlight unit and lighting device - Google Patents

Abstract

The present invention relates to a light emitting device package module which can be used for a display or lighting, a backlight unit, and a lighting device. The light emitting device package module includes: a substrate; at least one light emitting device package mounted on the substrate; a lens installed on an optic path of the light emitting device package; a reflecting layer formed on the substrate to be able to reflect the light generated in the light emitting device package; and a light adsorption layer formed between the substrate and the lens to make the brightness of the light released through the lens uniform.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package module, a backlight unit, and a lighting device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device package module, a backlight unit and a lighting device, and more particularly, to a light emitting device package module, a backlight unit and a lighting device.

A light emitting diode (LED) is a kind of semiconductor device that can emit light of various colors by forming a light emitting source through the formation of a PN diode of a compound semiconductor. Such a light emitting device has a long lifetime, can be reduced in size and weight, has a strong directivity of light, and can be driven at a low voltage. In addition, these LEDs are resistant to shock and vibration, do not require preheating time and complicated driving, can be packaged after being mounted on a substrate or lead frame in various forms, so that they can be modularized for various purposes and used as a backlight unit A lighting device, and the like.

The direct-type light emitting device package widely used in the backlight unit can widely disperse light generated from the light emitting device package through the secondary lens so as to reduce the thickness of the unit and uniformly irradiate the light to the light guide plate.

However, in the conventional light emitting device package, there is no means for controlling the light reflected on the substrate, so that a part having a high luminance, that is, a whirling part is generated, and an efficient planar light source can not be realized.

The present invention provides a light emitting device package module, a backlight unit, and a lighting device, which can solve various problems including the above-described problems and which can prevent the occurrence of a hue and realize an efficient planar light source with uniform luminance. . However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a light emitting device package module including: a substrate; At least one light emitting device package mounted on the substrate; A lens installed in an optical path of the light emitting device package; A reflective layer formed on the substrate to reflect light emitted from the light emitting device package; And a light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens.

According to an aspect of the present invention, the light absorbing layer is formed on the upper surface of the reflective layer and has a linear shape formed in the longitudinal direction of the substrate, and may be disposed on both sides of the light emitting device package.

Further, according to the idea of the present invention, the light absorbing layer may have a width of 5 to 20 percent of the lens diameter.

According to an aspect of the present invention, the light absorbing layer may be formed in a footprint region of the lens.

According to an aspect of the present invention, at least three support legs are disposed around the light emitting device package, and the light absorbing layer is provided outside an inner region having a support leg of the lens as an edge Lt; / RTI >

According to an aspect of the present invention, the substrate is a bar-type substrate provided below the light guide plate of the direct-type backlight unit and having a wiring layer formed thereon, And the light absorbing layer may be a black paint layer.

According to an aspect of the present invention, the light absorbing layer includes a first direction paint layer formed in a long direction in at least a first direction, a second direction paint layer formed in a long direction in a second direction, A triangular paint layer, a semi-moon-shaped paint layer having a generally semi-moon-shaped portion in the vicinity of the light emitting device package, a ring-shaped paint layer formed in a ring shape, or a combination thereof.

According to an aspect of the present invention, the light absorbing layer may be formed on the lower surface of the lens.

According to another aspect of the present invention, there is provided a backlight unit comprising: a substrate; At least one light emitting device package mounted on the substrate; A lens installed in an optical path of the light emitting device package; A reflective layer formed on the substrate to reflect light emitted from the light emitting device package; A light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens; And a light guide plate installed in an optical path of the light emitting device package.

According to an aspect of the present invention, there is provided a lighting apparatus comprising: a substrate; At least one light emitting device package mounted on the substrate; A lens installed in an optical path of the light emitting device package; A reflective layer formed on the substrate to reflect light emitted from the light emitting device package; And a light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens.

According to some embodiments of the present invention as described above, a light absorption layer capable of partially absorbing light can be formed on a substrate or a reflection layer of a module to prevent the occurrence of a horn portion, and an efficient planar light source with uniform luminance can be economically . Of course, the scope of the present invention is not limited by these effects.

1 is an exploded perspective view of a light emitting device package module according to some embodiments of the present invention.
2 is a cross-sectional view of a light emitting device package module of FIG. 1 taken along line II-II.
3 is a plan view showing the light emitting device package module of FIG.
4 is a cross-sectional view illustrating a light emitting device package module according to some other embodiments of the present invention.
5 to 9 are plan views showing a light emitting device package module according to some embodiments of the present invention.
10 is a cross-sectional view illustrating a light emitting device package module according to still another embodiment of the present invention.
11 is a cross-sectional view illustrating a backlight unit according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, The present invention is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, region or substrate is referred to as being "on", "connected to", "laminated" or "coupled to" another element, It will be appreciated that elements may be directly "on", "connected", "laminated" or "coupled" to another element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, if the element is inverted in the figures, the elements depicted as being on the upper surface of the other elements will have a direction on the lower surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

1 is an exploded perspective view of a light emitting device package module 100 according to some embodiments of the present invention. 2 is a cross-sectional view of the light emitting device package module 100 of FIG. 1 taken along line II-II, and FIG. 3 is a plan view of the light emitting device package module 100 of FIG.

1 to 3, a light emitting device package module 100 according to some embodiments of the present invention includes a substrate 10, a light emitting device package 20, a lens 30, A reflective layer 40, and a light absorbing layer 50.

11, the substrate 10 is installed below the light guide plate 60 of the direct-type backlight unit 1000, and the wiring layer 11 is formed as shown in FIGS. 1 to 3 And may be a bar type substrate formed. The substrate 10 is not limited to the drawings, and various substrates and various types of substrates may be used.

1 to 3, the substrate 10 may be provided with a terminal T connected to the wiring layer and connected to an external connector at one end thereof. In addition, The heat dissipation layer 13 may be formed to transfer heat generated in the device package 20 to the outside to dissipate heat.

1 to 3, the substrate 10 can receive the light emitting device package 20 and is electrically connected to the light emitting device package 20, It may be made of a material having a suitable mechanical strength and an insulating property or a conductive material so as to support the electrode 20.

For example, the wiring layer 11 of the substrate 10 may be formed of a conductive material so as to connect the light emitting device package 20 to an external power source, and the substrate 10 may include an epoxy resin sheet Or may be a printed circuit board (PCB) having a multilayer structure. The substrate 10 may be a Flexible Printed Circuit Board (FPCB) made of a flexible material.

In addition, the substrate 10 may be a synthetic resin substrate such as a resin or a glass epoxy or a ceramic substrate in consideration of a thermal conductivity. In addition, the substrate 10 may be formed of an insulating material such as aluminum, copper, zinc, tin, A metal substrate such as silver can be applied, and a plate or a lead frame substrate can be applied.

The substrate 10 may be made of at least one selected from EMC (Epoxy Mold Compound), PI (polyimide), ceramic, graphene, glass synthetic fiber and combinations thereof to improve workability have.

In addition, the wiring layer 11 of the substrate 10 may be provided in various patterns. The wiring layer 11 may be formed of at least one selected from copper, aluminum, and combinations thereof, which are excellent in thermal conductivity and relatively inexpensive materials.

At this time, such a pattern forming method may be thermocompression processing, plating processing, adhesive processing, sputtering processing, other etching processing, printing processing, spray processing and the like.

Meanwhile, the light emitting device package 20 may be a light emitting device package including a light emitting device such as an LED chip.

In the light emitting device package 20, at least one or more light emitting device packages 20 may be mounted on the substrate 10.

Here, although not shown, the light emitting device may be formed of a semiconductor. For example, LEDs of blue, green, red, and yellow light emission, and LEDs of ultraviolet light emission, which are made of a nitride semiconductor, can be applied. The nitride semiconductor is represented by a general formula Al _x Ga _y In _z N (0? X? 1, 0? Y? 1, 0? Z? 1, x + y + z = 1).

The light emitting element is formed by epitaxially growing a nitride semiconductor such as InN, AlN, InGaN, AlGaN, or InGaAlN on a sapphire substrate for growth or a silicon carbide substrate by a vapor phase growth method such as MOCVD can do. Further, the light emitting element can be formed using semiconductors such as ZnO, ZnS, ZnSe, SiC, GaP, GaAlAs, and AlInGaP in addition to the nitride semiconductor. These semiconductors can be stacked in the order of an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. The light emitting layer (active layer) may be a laminated semiconductor having a multiple quantum well structure or a single quantum well structure or a laminated semiconductor having a double hetero structure. In addition, the light emitting device 20 can be selected to have an arbitrary wavelength depending on the application such as display use and illumination use.

Here, as the growth substrate, an insulating, conductive or semiconductor substrate may be used if necessary. For example, the growth substrate may be sapphire, SiC, Si, MgAl 2 O 4, MgO, LiAlO 2, LiGaO 2, GaN. A GaN substrate, which is a homogeneous substrate, is preferable for epitaxial growth of a GaN material, but a GaN substrate has a problem of high production cost due to its difficulty in manufacturing.

Sapphire and silicon carbide (SiC) substrates are mainly used as the different substrates. Sapphire substrates are more utilized than expensive silicon carbide substrates. When using a heterogeneous substrate, defects such as dislocation are increased due to the difference in lattice constant between the substrate material and the thin film material. Also, due to the difference in the thermal expansion coefficient between the substrate material and the thin film material, warping occurs at a temperature change, and warping causes a crack in the thin film. This problem may be reduced by using a buffer layer between the substrate and the GaN-based light emitting laminate.

In addition, the substrate for growth may be completely or partially removed or patterned in order to improve the optical or electrical characteristics of the LED chip before or after the growth of the LED structure.

For example, in the case of a sapphire substrate, the substrate can be separated by irradiating the laser to the interface with the semiconductor layer through the substrate, and the silicon or silicon carbide substrate can be removed by a method such as polishing / etching.

Another supporting substrate may be used for removing the growth substrate. In order to improve the light efficiency of the LED chip on the opposite side of the growth substrate, the supporting substrate may be bonded using a reflective metal, As shown in FIG.

In addition, patterning of the growth substrate improves the light extraction efficiency by forming irregularities or slopes before or after the LED structure growth on the main surface (front surface or both sides) or side surfaces of the substrate. The size of the pattern can be selected from the range of 5 nm to 500 μm and it is possible to make a structure for improving the light extraction efficiency with a rule or an irregular pattern. Various shapes such as a shape, a column, a mountain, a hemisphere, and a polygon can be adopted.

In the case of the sapphire substrate, the crystals having a hexagonal-rhombo-cubic (Hexa-Rhombo R3c) symmetry have lattice constants of 13.001 and 4.758 in the c-axis direction and the a-axis direction, respectively, and have C plane, A plane and R plane. In this case, the C-plane is relatively easy to grow the nitride film, and is stable at high temperature, and thus is mainly used as a substrate for nitride growth.

Another material of the growth substrate is a Si substrate, which is more suitable for large-scale curing and relatively low in cost, so that mass productivity can be improved.

In addition, since the silicon (Si) substrate absorbs light generated from the GaN-based semiconductor and the external quantum efficiency of the light emitting device is lowered, the substrate may be removed as necessary, and Si, Ge, SiAl, A support substrate such as a metal substrate is further formed and used.

When a GaN thin film is grown on a different substrate such as the Si substrate, the dislocation density increases due to the lattice constant mismatch between the substrate material and the thin film material, and cracks and warpage Lt; / RTI > The buffer layer may be disposed between the growth substrate and the light emitting stack for the purpose of preventing dislocation and cracking of the light emitting stack. The buffer layer also functions to reduce the scattering of the wavelength of the wafer by adjusting the degree of warping of the substrate during the growth of the active layer.

Here, the buffer layer may be made of Al _x In _y Ga _1-xy N (0? X? 1, 0? _Y? 1, x + y? 1), in particular GaN, AlN, AlGaN, InGaN or InGaNAlN. Materials such as ZrB2, HfB2, ZrN, HfN and TiN can also be used as needed. Further, a plurality of layers may be combined, or the composition may be gradually changed.

Further, although not shown, the light emitting element may be a flip chip type light emitting element having a signal transmitting medium such as a bump, a pad, or a solder. In addition, the light emitting element may have various forms such as a vertical type and a horizontal type May be applied.

The light emitting device package 20 may include various substrates, a lead frame, a reflective member, a sealing member, a fluorescent material, a filler, and the like in addition to the light emitting device described above.

In addition, the light emitting device package 20 of the present invention may include only a light emitting device in the form of an LED chip. That is, the form in which the light emitting device of the LED chip type is directly mounted on the substrate 10 can be referred to as a COB (Chip on Board).

The lens 30 is installed in the optical path of the light emitting device package 20 and may be made of translucent glass or resin such as glass, acrylic, silicone, epoxy, various plastics and various polymers. have.

3, the lens 30 includes a light emitting surface 30a corresponding to the light emitting device package 20 and a light emitting surface 30b corresponding to the light guiding plate 60. [ As shown in FIG. 3, the light-outgoing surface 30b has a cross-section so as to disperse the light to the widest possible extent. The light-outgoing surface 30b is an optical system. More specifically, for example, the light incidence surface 30a has a concave groove shape. Or the like.

As shown in FIGS. 1 to 3, the lens 30 may be formed with a support leg 31 on its lower surface so that at least three or more LEDs 30 are disposed around the light emitting device package 20 . The lens 30 is not limited to the drawings, and various lenses and various types of lenses may be used.

1 to 3, the reflective layer 40 is formed on the upper surface of the substrate 10 so as to reflect upward the light generated from the light emitting device package 20, May be a white paint layer formed on the substrate 10 such that a part of the wiring layer 11 corresponding to the device package seating surface 12 is exposed.

In addition, for example, the reflective layer 40 may be formed of a metal layer, EMC including a reflective material, white silicon containing a reflective material, a photoimageable solder resist (PSR), or a combination thereof.

More specifically, for example, the reflective layer 40 may be formed of a silicone resin composition, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin composition such as an epoxy-modified silicone resin, a polyimide resin composition, A resin such as polyimide resin composition, polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin and PBT resin can be applied.

Further, a light reflecting material such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, boron nitride, mullite, chromium, have.

The reflective layer 40 may include three support leg guide holes arranged in a triangular shape around the light emitting device package seating surface 12 so as to guide and align the support legs 31 of the lens 30. [ H) may be formed. The shape of the support leg guide hole H corresponds to the end of the support leg 31. The support leg 31 and the support leg guide hole H may be modified or modified into various shapes and types, .

1 to 3, the light absorbing layer 50 is formed between the substrate 10 and the lens 30 so as to uniformly control the brightness of light emitted through the lens 30, And may be a kind of paint layer capable of absorbing light.

1 to 3, the light absorbing layer 50 may be formed on the upper surface of the reflective layer 40, and may have a length that is longer in the longitudinal direction of the substrate 10, for example, And may be a black paint layer 51 disposed on both sides of the light emitting device package 20.

2, the light absorbing layer 50 is formed on the upper surface of the reflective layer 40 and is not limited to the upper surface of the reflective layer 40, As shown in FIG.

The black paint layer 51 may include at least an aniline black, a perylene black, a titanium black, a carbon black, and a black pigment composed of a combination thereof.

In addition, the black paint layer 51 may be formed of at least one of a water-soluble azo pigment, an insoluble azo pigment, a phthalocyanine pigment, a quinacridone pigment, an isoindolinone pigment, an isoindoline pigment, a perylene pigment, Anthraquinone pigments, anthraquinone pigments, anthrapyrimidine pigments, anthanthrone pigments, indanthrone pigments, pravantron pigments, pyranthrone pigments, diketopyrrolopyrroles, Pigments, and combinations of these pigments.

In addition, the black paint layer 51 may be formed by selecting at least one of EMC, silicone, PSR (Photoimageable Solder Resist) and a combination thereof together with the above-mentioned black pigment or organic pigment.

More specifically, for example, the black paint layer 51 may be formed of a silicone resin composition containing a pigment as described above, a modified epoxy resin composition such as a silicone-modified epoxy resin, a modified silicone resin such as an epoxy- (PPA), a polycarbonate resin, a polyphenylene sulfide (PPS), a liquid crystal polymer (LCP), an ABS resin, a phenol resin, an acrylic resin, a PBT resin, etc. And the like can be applied.

In addition, the light absorbing layer 50 may be a thin film, a film, or the like having light absorbing properties at least partially.

2, the light generated from the light emitting device package 20 may be dispersed over a wide area through the lens 30. In this case,

At this time, a part of the light incident through the light incidence surface 30a of the lens 30 passes through the lower surface of the lens 30 without passing through the light exiting surface 30b, It can be reflected by the slope 40 to be emitted upward.

That is, a part of the light that is secondarily reflected and emitted upward, in particular, the light reflected from both sides of the light emitting device package 20 in the upper surface of the reflective layer 40 may form a depression. However, The light absorbing layer 50 absorbs light capable of generating a depressed portion to prevent the occurrence of the depressed portion.

Here, the larger the area of the light absorbing layer 50 is, the less the occurrence of the hill can be reduced, but the light efficiency may be lowered by absorbing too much light.

Therefore, the light absorption layer 50 can be designed to be optimized by the diameter of the lens 40, the size of the substrate 10, and the like so that the light efficiency can be maintained while reducing the occurrence of the whitening. Experimental results have shown that when the width W of the light absorbing layer 50 is 5 to 20 percent of the diameter D of the lens 30, the optimal light efficiency can be maintained there was.

In addition, the light absorbing layer 50 may be formed below the lens 30 to maintain the light efficiency.

3, the length L of the light absorbing layer 50 is at least smaller than the diameter 30 of the lens 30, so that the footprint of the lens 30 can be reduced, And may be provided outside the inner region B formed in the region A and having the support leg 31 of the lens 30 as an edge.

Therefore, the light emitted from the light emitting device package 20 is not absorbed as much as possible, and instead of the light emitted from the light emitting device package 20, It is possible to absorb only the light of both side edges of the reflection layer 40 to obtain the optimum light efficiency.

4 is a cross-sectional view illustrating a light emitting device package module 200 according to some other embodiments of the present invention.

4, the light absorption layer 50 of the light emitting device package module 200 according to some other embodiments of the present invention is formed on the side surface of the reflective layer 40, May be a black paint layer 52 formed in a long shape in the longitudinal direction and disposed in both side directions of the light emitting device package 20. That is, the black paint layer 52 may be formed on the upper surface of the substrate 10.

The black paint layer 52 is formed on the side surface of the reflective layer 40 and the upper surface of the substrate 10 as shown in FIG. 4, and is not limited to the black paint layer 52, And may be formed on the upper surface of the reflective layer 40 as well.

2 may be formed on the reflective layer 40 after the reflective layer 40 is formed and the black paint layer 52 of FIG. 4 may be formed on the reflective layer 40 40 may be formed on the upper surface of the substrate 10.

The method of forming the black paint layers 51 and 52 may be a transfer method, a stamping method, an inkjet printing method, a stencil printing method, a squeeze printing method, A printing method, a spray method, a screen printing method, a gravure printing method, various coating methods, various coating methods, and various transfer methods can be applied.

5 to 9 are plan views illustrating light emitting device package modules 300, 400, 500, 600, and 700 according to some embodiments of the present invention.

5, the light absorbing layer 50 of the light emitting device package module 300 according to some embodiments of the present invention includes a first direction paint layer 51-1 and a second direction paint layer 51-1, And a second direction paint layer 51-2 formed to be elongated in the second direction. Therefore, it is possible to selectively prevent the occurrence of angles at various angles.

5, the first direction paint layer 51-1 and the second direction paint layer 51-2 are formed such that their longitudinal directions are at an angle of 90 degrees with respect to each other, The longitudinal direction of the substrate 51 and the longitudinal direction of the substrate 10 may coincide with each other.

6, the light absorbing layer 50 of the light emitting device package module 400 according to some embodiments of the present invention includes a first direction paint layer 51-1 and a second direction paint layer 51-1, And a second direction paint layer 51-2 formed to be elongated in the second direction. Therefore, it is possible to selectively prevent the occurrence of angles at various angles.

As shown in FIG. 6, the first direction paint layer 51-1 and the second direction paint layer 51-2 are formed such that their longitudinal directions are 90 degrees from each other, The longitudinal direction of the substrate 51 and the longitudinal direction of the substrate 10 may be crossed at an angle of 45 degrees.

7, the light absorbing layer 50 of the light emitting device package module 500 according to some embodiments of the present invention has a thick triangular paint layer (a portion near the light emitting device package 20) 51-3).

Therefore, depending on the shape of the generated portion, the portion near the light emitting device package 20 absorbs more light in the central portion near the light emitting axis by using the thick triangular paint layer 51-3, can do. The shape of the light absorbing layer 50 may vary depending on the expected shape of the formed portion.

8, the light absorbing layer 50 of the light emitting device package module 600 according to some embodiments of the present invention is formed such that a portion close to the light emitting device package 20 is thick, Moon paint layer 51-4.

Accordingly, depending on the shape of the generated portion, the portion near the light emitting device package 20 absorbs more light in the central portion near the light emitting axis by using the thick band-shaped paint layer 51-4, can do. The shape of the light absorbing layer 50 may vary depending on the expected shape of the formed portion.

9, the light absorbing layer 50 of the light emitting device package module 700 according to some embodiments of the present invention may be a ring shaped paint layer 51-5 formed in a ring shape, have.

Therefore, the ring-shaped paint layer 51-5 formed in a ring shape according to the shape of the generated portion can be used to prevent the formation of a ring-shaped portion. The shape of the light absorbing layer 50 may vary depending on the expected shape of the formed portion.

In addition, the shape and type of the light absorbing layer 50 of the present invention described above may vary widely depending on the specifications of the product, the use environment, the characteristics of the components, and the like.

10 is a cross-sectional view illustrating a light emitting device package module 800 according to still another embodiment of the present invention.

10, the light absorbing layer 50 of the light emitting device package module 800 according to another embodiment of the present invention is formed on the lower surface of the lens 30, The black paint layer 53 may be a long black paint layer.

That is, as shown in FIG. 10, the black paint layer 53 may be formed on the lower surface of the lens 30.

10 may be formed on the lower surface of the lens 30 regardless of the reflective layer 40 by a transfer method, a stamping method, an inkjet printing method, a stencil printing method a stencil printing method, a squeeze printing method, a spray method, a screen printing method, a gravure printing method, various coating methods and various transfer methods.

11 is a cross-sectional view illustrating a backlight unit 1000 according to some embodiments of the present invention.

11, a backlight unit 1000 according to some embodiments of the present invention includes a substrate 10, at least one light emitting device package 20 mounted on the substrate 10, A lens 30 mounted on an optical path of the light emitting device package 20, a reflective layer 40 formed on the substrate 10 to reflect light generated from the light emitting device package 20, (50) formed between the substrate (10) and the lens (30) so as to uniformize the luminance of light emitted through the light emitting device package (30) And a light guide plate 60 provided on the light guide plate.

1 to 3, the substrate 10, the light emitting device package 20, the lens 30, the reflective layer 40, and the light absorbing layer 50 are formed on the substrate 10, The functions and configurations of the light emitting device package module 100 may be the same as those of the light emitting device package module 100 according to some embodiments of the present invention described above. Therefore, detailed description is omitted.

In addition, the light guide plate 60 may be an optical member that can be made of a light-transmitting material to guide light generated from the light emitting device package 20.

The light guide plate 60 may be installed in a path of light generated from the light emitting device package 20 to transmit light generated from the light emitting device package 20 over a wider area.

The light guide plate 60 may be made of polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, polyester, or the like , And various light transmitting resin materials may be applied. The light guide plate 60 may be formed by various methods such as forming fine patterns, fine protrusions, diffusion films, or the like on the surface, or forming fine bubbles therein.

Although not shown, various diffusion sheets, prism sheets, filters, and the like may be additionally provided above the light guide plate 60. In addition, various display panels such as an LCD panel may be provided above the light guide plate 60. [

Although not shown, the present invention may include a lighting device including the light emitting device package module 100 described above. Here, the components of the lighting device according to some embodiments of the present invention may have the same configuration and function as those of the above-described light emitting device package module of the present invention. Therefore, detailed description is omitted.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: substrate
11: wiring layer
12: Seat face
13:
20: Light emitting device package
30: Lens
31: Support leg
H: Supporting leg guide hole
40: reflective layer
50: light absorbing layer
51, 52, 53: black paint layer
60: light guide plate
100, 200, 300, 400, 500, 600, 700, 800:
1000: Backlight unit

Claims (10)

Board;
At least one light emitting device package mounted on the substrate;
A lens installed in an optical path of the light emitting device package;
A reflective layer formed on the substrate to reflect light emitted from the light emitting device package; And
A light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens;
Emitting device package module. The method according to claim 1,
The light emitting device package module according to claim 1, wherein the light absorbing layer is formed on a top surface of the reflective layer and is formed in a longitudinal direction of the substrate, the light absorbing layer being disposed on both sides of the light emitting device package. 3. The method of claim 2,
Wherein the light absorbing layer has a width of 5 to 20 percent of the lens diameter. 4. The method according to any one of claims 1 to 3,
Wherein the light absorbing layer is formed in a footprint region of the lens. 5. The method of claim 4,
Wherein at least three support legs are disposed around the light emitting device package,
Wherein the light absorbing layer is provided outside an inner region having a support leg of the lens as an edge. The method according to claim 1,
The substrate is a bar type substrate provided under the light guide plate of the direct type backlight unit and having a wiring layer formed thereon,
Wherein the reflective layer is a white paint layer formed on the substrate so that a part of the wiring layer on which the light emitting device package is mounted is exposed,
Wherein the light absorption layer is a black paint layer. The method according to claim 1,
Wherein the light absorbing layer comprises a first direction paint layer extending in at least a first direction, a second direction paint layer extending in a second direction, a triangular paint layer thicker near the light emitting device package, A ring-shaped coating layer formed in a ring shape, and a combination thereof, wherein the semi-moon-shaped coating layer, the ring-shaped coating layer, and the ring- The method according to claim 1,
Wherein the light absorbing layer is formed on the lower surface of the lens. Board;
At least one light emitting device package mounted on the substrate;
A lens installed in an optical path of the light emitting device package;
A reflective layer formed on the substrate to reflect light emitted from the light emitting device package;
A light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens; And
A light guide plate installed in an optical path of the light emitting device package;
. ≪ / RTI > Board;
At least one light emitting device package mounted on the substrate;
A lens installed in an optical path of the light emitting device package;
A reflective layer formed on the substrate to reflect light emitted from the light emitting device package; And
A light absorbing layer formed between the substrate and the lens to control the brightness of light emitted through the lens;
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