KR20140134278A - 재료 상의 얇은 코팅 - Google Patents
재료 상의 얇은 코팅 Download PDFInfo
- Publication number
- KR20140134278A KR20140134278A KR20147023432A KR20147023432A KR20140134278A KR 20140134278 A KR20140134278 A KR 20140134278A KR 20147023432 A KR20147023432 A KR 20147023432A KR 20147023432 A KR20147023432 A KR 20147023432A KR 20140134278 A KR20140134278 A KR 20140134278A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- metal
- coating
- less
- containing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/52—Two layers
- B05D7/54—No clear coat specified
- B05D7/548—No curing step for the last layer
- B05D7/5483—No curing step for any layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2012900378A AU2012900378A0 (en) | 2012-02-02 | Thin Coatings on Materials | |
| AU2012900378 | 2012-02-02 | ||
| AU2012905644A AU2012905644A0 (en) | 2012-12-21 | Thin coatings on materials | |
| AU2012905644 | 2012-12-21 | ||
| PCT/AU2013/000088 WO2013113068A1 (en) | 2012-02-02 | 2013-02-01 | Thin coatings on materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20140134278A true KR20140134278A (ko) | 2014-11-21 |
Family
ID=48904308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20147023432A Withdrawn KR20140134278A (ko) | 2012-02-02 | 2013-02-01 | 재료 상의 얇은 코팅 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140370259A1 (https=) |
| EP (1) | EP2809824A4 (https=) |
| JP (1) | JP6171189B2 (https=) |
| KR (1) | KR20140134278A (https=) |
| CN (1) | CN105164311A (https=) |
| AU (1) | AU2013214694B2 (https=) |
| BR (1) | BR112014019005A8 (https=) |
| WO (1) | WO2013113068A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210109640A (ko) * | 2019-01-23 | 2021-09-06 | 램 리써치 코포레이션 | 다운스트림 플라즈마를 위한 듀얼 이온 필터를 포함하는 기판 프로세싱 시스템 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013163695A1 (en) * | 2012-05-04 | 2013-11-07 | Nano-Nouvelle Pty Ltd | Battery electrode materials |
| EP3259048B1 (en) * | 2015-02-18 | 2018-10-31 | Unilever N.V. | Microporous membrane having metallic coating |
| US10550010B2 (en) | 2015-12-11 | 2020-02-04 | Uchicago Argonne, Llc | Oleophilic foams for oil spill mitigation |
| WO2018009882A1 (en) | 2016-07-08 | 2018-01-11 | Uchicago Argonne, Llc | Functionalized foams |
| US11896935B2 (en) | 2017-08-17 | 2024-02-13 | Uchicago Argonne, Llc | Filtration membranes |
| US12012559B2 (en) | 2018-05-11 | 2024-06-18 | Uchicago Argonne, Llc | Janus membranes via atomic layer deposition |
| US11590456B2 (en) * | 2018-05-31 | 2023-02-28 | Uchicago Argonne, Llc | Systems and methods for oleophobic composite membranes |
| US11351478B2 (en) | 2018-09-06 | 2022-06-07 | Uchicago Argonne, Llc | Oil skimmer with oleophilic coating |
| US11548798B2 (en) | 2019-04-23 | 2023-01-10 | Uchicago Argonne, Llc | Compressible foam electrode |
| CN112928255B (zh) * | 2021-01-25 | 2022-05-06 | 合肥工业大学 | 一种锂硫电池复合正极材料及其制备方法与应用 |
| CN116282284B (zh) * | 2023-03-13 | 2025-05-30 | 中国农业机械化科学研究院集团有限公司 | 一种野外污水快速净化装置及其净水板及制造方法 |
| CN119754024B (zh) * | 2024-12-27 | 2026-02-24 | 郑州大学 | 一种红外隐身织物的制备方法及由其制备得到的红外隐身织物和应用 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
| US4321285A (en) * | 1974-10-04 | 1982-03-23 | Surface Technology, Inc. | Electroless plating |
| US3993799A (en) * | 1974-10-04 | 1976-11-23 | Surface Technology, Inc. | Electroless plating process employing non-noble metal hydrous oxide catalyst |
| ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
| US4346128A (en) * | 1980-03-31 | 1982-08-24 | The Boeing Company | Tank process for plating aluminum substrates including porous aluminum castings |
| US4720400A (en) * | 1983-03-18 | 1988-01-19 | W. L. Gore & Associates, Inc. | Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| US4557957A (en) * | 1983-03-18 | 1985-12-10 | W. L. Gore & Associates, Inc. | Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| JPS62163261A (ja) * | 1986-01-10 | 1987-07-20 | Kuraray Co Ltd | 高導電性電極の製法 |
| JPH07320742A (ja) * | 1994-05-20 | 1995-12-08 | Sumitomo Electric Ind Ltd | アルカリ蓄電池用電極およびその製造方法 |
| JP3198066B2 (ja) * | 1997-02-21 | 2001-08-13 | 荏原ユージライト株式会社 | 微多孔性銅皮膜およびこれを得るための無電解銅めっき液 |
| US6344272B1 (en) * | 1997-03-12 | 2002-02-05 | Wm. Marsh Rice University | Metal nanoshells |
| DE59805523D1 (de) * | 1997-06-14 | 2002-10-17 | Mat Adsorption Technologies Gm | Membranmodul mit einseitig eingebetteten hohlfasermembranen |
| JP2001271171A (ja) * | 2000-03-27 | 2001-10-02 | Daishin Kagaku Kk | 無電解めっき処理法、および前処理剤 |
| WO2002004704A2 (en) * | 2000-07-11 | 2002-01-17 | Applied Materials, Inc. | Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| WO2003025243A2 (en) * | 2001-09-14 | 2003-03-27 | Asm International N.V. | Metal nitride deposition by ald using gettering reactant |
| US6989897B2 (en) * | 2002-06-12 | 2006-01-24 | Intel Corporation | Metal coated nanocrystalline silicon as an active surface enhanced Raman spectroscopy (SERS) substrate |
| KR20040026733A (ko) * | 2002-09-25 | 2004-04-01 | 주식회사 피앤아이 | 표면개질된 모재와의 접착력이 향상된 후막 형성 방법 및그의 장치 |
| US20040215030A1 (en) * | 2003-04-22 | 2004-10-28 | Norman John Anthony Thomas | Precursors for metal containing films |
| JP2005347177A (ja) * | 2004-06-04 | 2005-12-15 | Sanoh Industrial Co Ltd | アルカリ電池 |
| US7306729B2 (en) * | 2005-07-18 | 2007-12-11 | Gore Enterprise Holdings, Inc. | Porous PTFE materials and articles produced therefrom |
| US8399989B2 (en) * | 2005-07-29 | 2013-03-19 | Megica Corporation | Metal pad or metal bump over pad exposed by passivation layer |
| KR20120127400A (ko) * | 2009-11-11 | 2012-11-21 | 나노-누벨레 피티와이 엘티디 | 다공성 물질 |
-
2013
- 2013-02-01 US US14/375,931 patent/US20140370259A1/en not_active Abandoned
- 2013-02-01 WO PCT/AU2013/000088 patent/WO2013113068A1/en not_active Ceased
- 2013-02-01 CN CN201380016625.0A patent/CN105164311A/zh active Pending
- 2013-02-01 KR KR20147023432A patent/KR20140134278A/ko not_active Withdrawn
- 2013-02-01 JP JP2014555041A patent/JP6171189B2/ja not_active Expired - Fee Related
- 2013-02-01 BR BR112014019005A patent/BR112014019005A8/pt not_active IP Right Cessation
- 2013-02-01 AU AU2013214694A patent/AU2013214694B2/en not_active Ceased
- 2013-02-01 EP EP13743972.5A patent/EP2809824A4/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210109640A (ko) * | 2019-01-23 | 2021-09-06 | 램 리써치 코포레이션 | 다운스트림 플라즈마를 위한 듀얼 이온 필터를 포함하는 기판 프로세싱 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014019005A2 (https=) | 2017-06-20 |
| AU2013214694B2 (en) | 2017-09-21 |
| BR112014019005A8 (pt) | 2017-07-11 |
| US20140370259A1 (en) | 2014-12-18 |
| EP2809824A4 (en) | 2015-11-18 |
| JP6171189B2 (ja) | 2017-08-02 |
| JP2015505582A (ja) | 2015-02-23 |
| EP2809824A1 (en) | 2014-12-10 |
| WO2013113068A1 (en) | 2013-08-08 |
| AU2013214694A1 (en) | 2014-08-28 |
| CN105164311A (zh) | 2015-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20140821 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20180126 Comment text: Request for Examination of Application |
|
| PC1202 | Submission of document of withdrawal before decision of registration |
Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment) Patent event code: PC12021R01D Patent event date: 20180510 |
|
| WITB | Written withdrawal of application |