CN105164311A - 材料上的薄涂层 - Google Patents
材料上的薄涂层 Download PDFInfo
- Publication number
- CN105164311A CN105164311A CN201380016625.0A CN201380016625A CN105164311A CN 105164311 A CN105164311 A CN 105164311A CN 201380016625 A CN201380016625 A CN 201380016625A CN 105164311 A CN105164311 A CN 105164311A
- Authority
- CN
- China
- Prior art keywords
- metal
- coating
- substrate
- less
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 359
- 239000000463 material Substances 0.000 title claims abstract description 267
- 239000011248 coating agent Substances 0.000 claims abstract description 307
- 239000000758 substrate Substances 0.000 claims abstract description 224
- 229910052751 metal Inorganic materials 0.000 claims abstract description 141
- 239000002184 metal Substances 0.000 claims abstract description 141
- 238000000034 method Methods 0.000 claims abstract description 123
- 239000010970 precious metal Substances 0.000 claims abstract description 31
- 230000008021 deposition Effects 0.000 claims description 92
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 85
- 239000010949 copper Substances 0.000 claims description 80
- 229910052802 copper Inorganic materials 0.000 claims description 74
- 239000012528 membrane Substances 0.000 claims description 74
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 68
- 238000006722 reduction reaction Methods 0.000 claims description 52
- 230000002829 reductive effect Effects 0.000 claims description 44
- 229910052759 nickel Inorganic materials 0.000 claims description 42
- 239000013078 crystal Substances 0.000 claims description 38
- 239000011148 porous material Substances 0.000 claims description 33
- 239000003638 chemical reducing agent Substances 0.000 claims description 29
- 238000001914 filtration Methods 0.000 claims description 29
- 230000009467 reduction Effects 0.000 claims description 25
- -1 polypropylene Polymers 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 239000001301 oxygen Substances 0.000 claims description 15
- 150000004692 metal hydroxides Chemical class 0.000 claims description 12
- 229910000000 metal hydroxide Inorganic materials 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 229920002678 cellulose Polymers 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 9
- 230000035515 penetration Effects 0.000 claims description 9
- 239000000020 Nitrocellulose Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 229920001220 nitrocellulos Polymers 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 8
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 8
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 claims description 7
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 claims description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 6
- 229920001778 nylon Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 150000001408 amides Chemical class 0.000 claims description 5
- 239000001913 cellulose Substances 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 229910021518 metal oxyhydroxide Inorganic materials 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920000307 polymer substrate Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 abstract description 101
- 230000008569 process Effects 0.000 abstract description 15
- 239000010410 layer Substances 0.000 description 179
- 239000010408 film Substances 0.000 description 95
- 239000000243 solution Substances 0.000 description 68
- 150000001875 compounds Chemical class 0.000 description 57
- 229920002301 cellulose acetate Polymers 0.000 description 36
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 32
- 238000007747 plating Methods 0.000 description 29
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 24
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 239000011787 zinc oxide Substances 0.000 description 16
- 238000001878 scanning electron micrograph Methods 0.000 description 13
- 150000002816 nickel compounds Chemical class 0.000 description 12
- 150000002941 palladium compounds Chemical class 0.000 description 12
- 238000010899 nucleation Methods 0.000 description 11
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 11
- 239000002243 precursor Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 9
- 150000004706 metal oxides Chemical class 0.000 description 9
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 239000008367 deionised water Substances 0.000 description 8
- 229910021641 deionized water Inorganic materials 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000004304 visual acuity Effects 0.000 description 8
- 230000003197 catalytic effect Effects 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- 229910000085 borane Inorganic materials 0.000 description 6
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical group CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229910021645 metal ion Inorganic materials 0.000 description 6
- 229910052763 palladium Inorganic materials 0.000 description 6
- 239000012279 sodium borohydride Substances 0.000 description 6
- 229910000033 sodium borohydride Inorganic materials 0.000 description 6
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 5
- 239000011149 active material Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 150000001879 copper Chemical class 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 4
- 239000005750 Copper hydroxide Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910001956 copper hydroxide Inorganic materials 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910001092 metal group alloy Inorganic materials 0.000 description 4
- BFDHFSHZJLFAMC-UHFFFAOYSA-L nickel(ii) hydroxide Chemical compound [OH-].[OH-].[Ni+2] BFDHFSHZJLFAMC-UHFFFAOYSA-L 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 4
- 229960004418 trolamine Drugs 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000010953 base metal Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 241000370738 Chlorion Species 0.000 description 2
- 229910017518 Cu Zn Inorganic materials 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000006555 catalytic reaction Methods 0.000 description 2
- 229910000428 cobalt oxide Inorganic materials 0.000 description 2
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000001027 hydrothermal synthesis Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- YPJKMVATUPSWOH-UHFFFAOYSA-N nitrooxidanyl Chemical compound [O][N+]([O-])=O YPJKMVATUPSWOH-UHFFFAOYSA-N 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000007146 photocatalysis Methods 0.000 description 2
- 230000001699 photocatalysis Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 239000002094 self assembled monolayer Substances 0.000 description 2
- 239000013545 self-assembled monolayer Substances 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001432 tin ion Inorganic materials 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005749 Copper compound Substances 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 235000010210 aluminium Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000231 atomic layer deposition Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000000224 chemical solution deposition Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 150000001880 copper compounds Chemical class 0.000 description 1
- LTYZGLKKXZXSEC-UHFFFAOYSA-N copper dihydride Chemical compound [CuH2] LTYZGLKKXZXSEC-UHFFFAOYSA-N 0.000 description 1
- 229910000050 copper hydride Inorganic materials 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 229960004643 cupric oxide Drugs 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- NXJCBFBQEVOTOW-UHFFFAOYSA-L palladium(2+);dihydroxide Chemical compound O[Pd]O NXJCBFBQEVOTOW-UHFFFAOYSA-L 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- UKHWJBVVWVYFEY-UHFFFAOYSA-M silver;hydroxide Chemical compound [OH-].[Ag+] UKHWJBVVWVYFEY-UHFFFAOYSA-M 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/50—Multilayers
- B05D7/52—Two layers
- B05D7/54—No clear coat specified
- B05D7/548—No curing step for the last layer
- B05D7/5483—No curing step for any layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
- Y10T428/24975—No layer or component greater than 5 mils thick
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249987—With nonvoid component of specified composition
- Y10T428/24999—Inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2012900378A AU2012900378A0 (en) | 2012-02-02 | Thin Coatings on Materials | |
| AU2012900378 | 2012-02-02 | ||
| AU2012905644A AU2012905644A0 (en) | 2012-12-21 | Thin coatings on materials | |
| AU2012905644 | 2012-12-21 | ||
| PCT/AU2013/000088 WO2013113068A1 (en) | 2012-02-02 | 2013-02-01 | Thin coatings on materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105164311A true CN105164311A (zh) | 2015-12-16 |
Family
ID=48904308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380016625.0A Pending CN105164311A (zh) | 2012-02-02 | 2013-02-01 | 材料上的薄涂层 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20140370259A1 (https=) |
| EP (1) | EP2809824A4 (https=) |
| JP (1) | JP6171189B2 (https=) |
| KR (1) | KR20140134278A (https=) |
| CN (1) | CN105164311A (https=) |
| AU (1) | AU2013214694B2 (https=) |
| BR (1) | BR112014019005A8 (https=) |
| WO (1) | WO2013113068A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112928255A (zh) * | 2021-01-25 | 2021-06-08 | 合肥工业大学 | 一种锂硫电池复合正极材料及其制备方法与应用 |
| WO2024187859A1 (zh) * | 2023-03-13 | 2024-09-19 | 中国农业机械化科学研究院集团有限公司 | 一种野外污水快速净化装置及其净水板及制造方法 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013163695A1 (en) * | 2012-05-04 | 2013-11-07 | Nano-Nouvelle Pty Ltd | Battery electrode materials |
| EP3259048B1 (en) * | 2015-02-18 | 2018-10-31 | Unilever N.V. | Microporous membrane having metallic coating |
| US10550010B2 (en) | 2015-12-11 | 2020-02-04 | Uchicago Argonne, Llc | Oleophilic foams for oil spill mitigation |
| WO2018009882A1 (en) | 2016-07-08 | 2018-01-11 | Uchicago Argonne, Llc | Functionalized foams |
| US11896935B2 (en) | 2017-08-17 | 2024-02-13 | Uchicago Argonne, Llc | Filtration membranes |
| US12012559B2 (en) | 2018-05-11 | 2024-06-18 | Uchicago Argonne, Llc | Janus membranes via atomic layer deposition |
| US11590456B2 (en) * | 2018-05-31 | 2023-02-28 | Uchicago Argonne, Llc | Systems and methods for oleophobic composite membranes |
| US11351478B2 (en) | 2018-09-06 | 2022-06-07 | Uchicago Argonne, Llc | Oil skimmer with oleophilic coating |
| WO2020154244A1 (en) * | 2019-01-23 | 2020-07-30 | Lam Research Corporation | Substrate processing system including dual ion filter for downstream plasma |
| US11548798B2 (en) | 2019-04-23 | 2023-01-10 | Uchicago Argonne, Llc | Compressible foam electrode |
| CN119754024B (zh) * | 2024-12-27 | 2026-02-24 | 郑州大学 | 一种红外隐身织物的制备方法及由其制备得到的红外隐身织物和应用 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1315589A (zh) * | 2000-03-27 | 2001-10-03 | 大伸化学株式会社 | 无电解镀处理方法及前处理剂 |
| US20040058088A1 (en) * | 2002-09-25 | 2004-03-25 | Young-Whoan Beag | Processing method for forming thick film having improved adhesion to surface-modified substrate and apparatus thereof |
| US20040135997A1 (en) * | 2002-06-12 | 2004-07-15 | Selena Chan | Metal coated nanocrystalline silicon as an active surface enhanced raman spectroscopy (SERS) substrate |
| WO2011057341A1 (en) * | 2009-11-11 | 2011-05-19 | Nano-Nouvelle Pty Ltd | Porous materials |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3962494A (en) * | 1971-07-29 | 1976-06-08 | Photocircuits Division Of Kollmorgan Corporation | Sensitized substrates for chemical metallization |
| US4321285A (en) * | 1974-10-04 | 1982-03-23 | Surface Technology, Inc. | Electroless plating |
| US3993799A (en) * | 1974-10-04 | 1976-11-23 | Surface Technology, Inc. | Electroless plating process employing non-noble metal hydrous oxide catalyst |
| ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
| US4346128A (en) * | 1980-03-31 | 1982-08-24 | The Boeing Company | Tank process for plating aluminum substrates including porous aluminum castings |
| US4720400A (en) * | 1983-03-18 | 1988-01-19 | W. L. Gore & Associates, Inc. | Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| US4557957A (en) * | 1983-03-18 | 1985-12-10 | W. L. Gore & Associates, Inc. | Microporous metal-plated polytetrafluoroethylene articles and method of manufacture |
| JPS62163261A (ja) * | 1986-01-10 | 1987-07-20 | Kuraray Co Ltd | 高導電性電極の製法 |
| JPH07320742A (ja) * | 1994-05-20 | 1995-12-08 | Sumitomo Electric Ind Ltd | アルカリ蓄電池用電極およびその製造方法 |
| JP3198066B2 (ja) * | 1997-02-21 | 2001-08-13 | 荏原ユージライト株式会社 | 微多孔性銅皮膜およびこれを得るための無電解銅めっき液 |
| US6344272B1 (en) * | 1997-03-12 | 2002-02-05 | Wm. Marsh Rice University | Metal nanoshells |
| DE59805523D1 (de) * | 1997-06-14 | 2002-10-17 | Mat Adsorption Technologies Gm | Membranmodul mit einseitig eingebetteten hohlfasermembranen |
| WO2002004704A2 (en) * | 2000-07-11 | 2002-01-17 | Applied Materials, Inc. | Method and apparatus for patching electrochemically deposited layers using electroless deposited materials |
| WO2003025243A2 (en) * | 2001-09-14 | 2003-03-27 | Asm International N.V. | Metal nitride deposition by ald using gettering reactant |
| US20040215030A1 (en) * | 2003-04-22 | 2004-10-28 | Norman John Anthony Thomas | Precursors for metal containing films |
| JP2005347177A (ja) * | 2004-06-04 | 2005-12-15 | Sanoh Industrial Co Ltd | アルカリ電池 |
| US7306729B2 (en) * | 2005-07-18 | 2007-12-11 | Gore Enterprise Holdings, Inc. | Porous PTFE materials and articles produced therefrom |
| US8399989B2 (en) * | 2005-07-29 | 2013-03-19 | Megica Corporation | Metal pad or metal bump over pad exposed by passivation layer |
-
2013
- 2013-02-01 US US14/375,931 patent/US20140370259A1/en not_active Abandoned
- 2013-02-01 WO PCT/AU2013/000088 patent/WO2013113068A1/en not_active Ceased
- 2013-02-01 CN CN201380016625.0A patent/CN105164311A/zh active Pending
- 2013-02-01 KR KR20147023432A patent/KR20140134278A/ko not_active Withdrawn
- 2013-02-01 JP JP2014555041A patent/JP6171189B2/ja not_active Expired - Fee Related
- 2013-02-01 BR BR112014019005A patent/BR112014019005A8/pt not_active IP Right Cessation
- 2013-02-01 AU AU2013214694A patent/AU2013214694B2/en not_active Ceased
- 2013-02-01 EP EP13743972.5A patent/EP2809824A4/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1315589A (zh) * | 2000-03-27 | 2001-10-03 | 大伸化学株式会社 | 无电解镀处理方法及前处理剂 |
| US20040135997A1 (en) * | 2002-06-12 | 2004-07-15 | Selena Chan | Metal coated nanocrystalline silicon as an active surface enhanced raman spectroscopy (SERS) substrate |
| US20040058088A1 (en) * | 2002-09-25 | 2004-03-25 | Young-Whoan Beag | Processing method for forming thick film having improved adhesion to surface-modified substrate and apparatus thereof |
| WO2011057341A1 (en) * | 2009-11-11 | 2011-05-19 | Nano-Nouvelle Pty Ltd | Porous materials |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112928255A (zh) * | 2021-01-25 | 2021-06-08 | 合肥工业大学 | 一种锂硫电池复合正极材料及其制备方法与应用 |
| CN112928255B (zh) * | 2021-01-25 | 2022-05-06 | 合肥工业大学 | 一种锂硫电池复合正极材料及其制备方法与应用 |
| WO2024187859A1 (zh) * | 2023-03-13 | 2024-09-19 | 中国农业机械化科学研究院集团有限公司 | 一种野外污水快速净化装置及其净水板及制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014019005A2 (https=) | 2017-06-20 |
| AU2013214694B2 (en) | 2017-09-21 |
| BR112014019005A8 (pt) | 2017-07-11 |
| US20140370259A1 (en) | 2014-12-18 |
| EP2809824A4 (en) | 2015-11-18 |
| JP6171189B2 (ja) | 2017-08-02 |
| JP2015505582A (ja) | 2015-02-23 |
| EP2809824A1 (en) | 2014-12-10 |
| KR20140134278A (ko) | 2014-11-21 |
| WO2013113068A1 (en) | 2013-08-08 |
| AU2013214694A1 (en) | 2014-08-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105164311A (zh) | 材料上的薄涂层 | |
| US20200157684A1 (en) | Electroless copper plating polydopamine nanoparticles | |
| KR102427122B1 (ko) | 구리 및 구리 합금 회로의 광학 반사율을 감소시키는 방법 및 터치 스크린 디바이스 | |
| TWI602948B (zh) | For electroless plating solution and before electroless plating method | |
| CN1286557C (zh) | 多孔载体负载NiB非晶态合金的催化剂及其制备方法 | |
| Mkhohlakali et al. | Electrosynthesis and characterization of PdIr using electrochemical atomic layer deposition for ethanol oxidation in alkaline electrolyte | |
| Vaškelis et al. | Gold nanoparticles obtained by Au (III) reduction with Sn (II): preparation and electrocatalytic properties in oxidation of reducing agents | |
| CN104685098B (zh) | 担载用于镀覆处理的催化剂颗粒的基板的处理方法 | |
| Luo et al. | Synthesis of carbon-based Ag-Pd bimetallic nanocomposite and the application in electroless copper deposition | |
| JP2011086786A (ja) | 光透過性電磁波シールド材の製造方法、及び光透過性電磁波シールド材 | |
| Chiu et al. | Fabrication and photocatalytic performance of Au/ZnO layered structure on silk textile for flexible device applications | |
| CN101798683B (zh) | 纳米金属溶液、纳米金属复合颗粒及金属膜层的制作方法 | |
| Fujiwara et al. | Ag nanoparticle catalyst for electroless Cu deposition and promotion of its adsorption onto epoxy substrate | |
| US20160145746A1 (en) | Palladium plate coated material and method of producing palladium plate coated material | |
| US20200040459A1 (en) | Plated object and method of forming the same | |
| KR20140020286A (ko) | 피복 섬유상 구리 미립자, 및 그 피복 섬유상 구리 미립자를 포함하는 도전성 코팅제 및 도전성 필름 | |
| JP2011086785A (ja) | 光透過性電磁波シールド材の製造方法、及び光透過性電磁波シールド材 | |
| Chao et al. | Activity of small silver nanocubes as activators for electroless copper deposition | |
| US20250137139A1 (en) | Metal compound thin film, method of forming the same and thin flim catalyst for water electrolysis | |
| KR20250142679A (ko) | 금속 촉매 및 이의 제조 방법 | |
| Chiu et al. | Electrodeposition of High-Functional Metal Oxide on Noble Metal for MEMS Devices | |
| CN121006726A (zh) | 一种图案化金属/纸基复合材料及其制备方法和应用 | |
| CN118510942A (zh) | 用于制造半导体器件的镍合金或钴合金金属化的方法 | |
| Gurung et al. | Atomic Layer Electroless Deposition on Nanoporous Metals. |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151216 |
|
| WD01 | Invention patent application deemed withdrawn after publication |