KR20140058557A - 반도체 패키지 수지 조성물 및 그의 사용 방법 - Google Patents

반도체 패키지 수지 조성물 및 그의 사용 방법 Download PDF

Info

Publication number
KR20140058557A
KR20140058557A KR1020147003608A KR20147003608A KR20140058557A KR 20140058557 A KR20140058557 A KR 20140058557A KR 1020147003608 A KR1020147003608 A KR 1020147003608A KR 20147003608 A KR20147003608 A KR 20147003608A KR 20140058557 A KR20140058557 A KR 20140058557A
Authority
KR
South Korea
Prior art keywords
semiconductor package
resin composition
package resin
substrate
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020147003608A
Other languages
English (en)
Korean (ko)
Inventor
고히치로 가와테
히로코 아키야마
나오타 스기야마
브랜트 유 콜브
에릭 지 라손
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20140058557A publication Critical patent/KR20140058557A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Polymerisation Methods In General (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
KR1020147003608A 2011-07-15 2012-07-09 반도체 패키지 수지 조성물 및 그의 사용 방법 Ceased KR20140058557A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161508344P 2011-07-15 2011-07-15
US61/508,344 2011-07-15
PCT/US2012/045916 WO2013012587A2 (en) 2011-07-15 2012-07-09 Semiconductor package resin composition and usage method thereof

Publications (1)

Publication Number Publication Date
KR20140058557A true KR20140058557A (ko) 2014-05-14

Family

ID=47558664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147003608A Ceased KR20140058557A (ko) 2011-07-15 2012-07-09 반도체 패키지 수지 조성물 및 그의 사용 방법

Country Status (5)

Country Link
US (2) US9230873B2 (https=)
JP (2) JP6155261B2 (https=)
KR (1) KR20140058557A (https=)
TW (1) TWI550018B (https=)
WO (1) WO2013012587A2 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2691466B1 (en) * 2011-03-28 2017-12-27 3M Innovative Properties Company Curable composition, article, method of curing, and reaction product
JP6271164B2 (ja) * 2013-06-17 2018-01-31 日立オートモティブシステムズ株式会社 箱型車載制御装置
CN105874030B (zh) * 2014-01-02 2019-07-26 汉高知识产权控股有限责任公司 含有纳米微粒填料的膜
US9220183B1 (en) * 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
CN108463774A (zh) * 2016-01-12 2018-08-28 日立化成株式会社 感光性树脂组合物、使用其的干膜、印刷配线板、以及印刷配线板的制造方法
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
CN111758168B (zh) * 2018-02-19 2024-05-17 昕诺飞控股有限公司 具有光引擎的经密封的设备
JP7109940B2 (ja) * 2018-03-08 2022-08-01 日東電工株式会社 封止用接着シート
CN121400152A (zh) * 2023-05-04 2026-01-23 因派科技术有限合伙公司 形成具有受控热膨胀系数的非导电聚合物层的方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6228681B1 (en) 1999-03-10 2001-05-08 Fry's Metals, Inc. Flip chip having integral mask and underfill providing two-stage bump formation
US6245595B1 (en) 1999-07-22 2001-06-12 National Semiconductor Corporation Techniques for wafer level molding of underfill encapsulant
US6281046B1 (en) 2000-04-25 2001-08-28 Atmel Corporation Method of forming an integrated circuit package at a wafer level
US6573122B2 (en) 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
US6794761B2 (en) 2001-04-26 2004-09-21 Intel Corporation No-flow underfill material
US20030111519A1 (en) 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
DE60232942D1 (de) 2001-10-09 2009-08-27 Mitsubishi Chem Corp Strahlungshärtbare Beschichtungszusammensetzung
US20030162911A1 (en) 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
US7022410B2 (en) 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
KR100774798B1 (ko) 2004-05-13 2007-11-07 닛토덴코 가부시키가이샤 반도체 캡슐화용 에폭시 수지 조성물 및 이것을 이용한 반도체 장치
EP1950239B1 (en) * 2005-10-28 2017-01-04 Sumitomo Osaka Cement Co., Ltd. Transparent inorganic-oxide dispersion, resin composition containing inorganic oxide particles, composition for encapsulating luminescent element, luminescent element, hard coat, optical functional film, optical part, and process for producing resin composition containing inorganic oxide particles
JP2008180992A (ja) * 2007-01-25 2008-08-07 Hitachi Chem Co Ltd 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及び半導体パッケージ
EP2135276A2 (en) 2007-03-13 2009-12-23 Lord Corporation Die attachment method with a covex surface underfill
JP2008297373A (ja) 2007-05-29 2008-12-11 Somar Corp 液状エポキシ樹脂組成物からなるアンダーフィル材及びフリップチップ型半導体装置
JP5004351B2 (ja) 2007-11-30 2012-08-22 信越化学工業株式会社 半導体装置の製造方法
KR101041240B1 (ko) * 2009-02-27 2011-06-14 주식회사 엘지화학 내마모성 및 내오염성이 우수한 코팅 조성물 및 코팅 필름
KR101748893B1 (ko) * 2009-05-26 2017-06-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 충전 수지 제조 방법

Also Published As

Publication number Publication date
WO2013012587A2 (en) 2013-01-24
JP6155261B2 (ja) 2017-06-28
JP2017133023A (ja) 2017-08-03
TW201311806A (zh) 2013-03-16
US9230873B2 (en) 2016-01-05
US9773714B2 (en) 2017-09-26
TWI550018B (zh) 2016-09-21
US20150329740A1 (en) 2015-11-19
US20140217622A1 (en) 2014-08-07
WO2013012587A3 (en) 2013-04-18
JP2014524957A (ja) 2014-09-25

Similar Documents

Publication Publication Date Title
JP6155261B2 (ja) 半導体パッケージ樹脂組成物及びその使用方法
JP4892164B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
WO2018221681A1 (ja) 封止用液状樹脂組成物及び電子部品装置
CN110770275A (zh) 压缩成型用液状树脂组合物及电子部件装置
JP6233441B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP5664220B2 (ja) 半導体封止材料及び半導体装置
JP2024096265A (ja) 樹脂組成物及び電子部品装置
WO2012018684A1 (en) Encapsulating resin composition
JP7715983B2 (ja) アンダーフィル用液状樹脂組成物、電子部品装置、及び電子部品装置の製造方法
JP2015193851A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP6657716B2 (ja) 封止用液状組成物、封止材、及び電子部品装置
JP5523816B2 (ja) 変性樹脂組成物、その製造方法、及びそれを含む硬化性樹脂組成物
TWI868209B (zh) 壓縮成形用密封材及電子零件裝置
JP2009057575A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP2005171209A (ja) フィラー含有樹脂組成物及びその製造方法
JP5367205B2 (ja) 封止用液状エポキシ樹脂組成物
JP5708666B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP5664358B2 (ja) エポキシ樹脂組成物、半導体封止材料および半導体装置
JP2016040393A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP2015180760A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP5924443B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP2015110803A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP5929977B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP7753740B2 (ja) 熱硬化性樹脂組成物及び電子部品装置
KR101293791B1 (ko) 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000