JP6155261B2 - 半導体パッケージ樹脂組成物及びその使用方法 - Google Patents

半導体パッケージ樹脂組成物及びその使用方法 Download PDF

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Publication number
JP6155261B2
JP6155261B2 JP2014520234A JP2014520234A JP6155261B2 JP 6155261 B2 JP6155261 B2 JP 6155261B2 JP 2014520234 A JP2014520234 A JP 2014520234A JP 2014520234 A JP2014520234 A JP 2014520234A JP 6155261 B2 JP6155261 B2 JP 6155261B2
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semiconductor package
resin composition
package resin
electronic component
substrate
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JP2014520234A
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Japanese (ja)
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JP2014524957A (ja
JP2014524957A5 (https=
Inventor
川手　恒一郎
恒一郎 川手
紘子 秋山
紘子 秋山
直大 杉山
直大 杉山
ブラント ユー． コーブ，
ブラント ユー． コーブ，
エリック ジー． ラーソン，
エリック ジー． ラーソン，
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Wire Bonding (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
JP2014520234A 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法 Expired - Fee Related JP6155261B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161508344P 2011-07-15 2011-07-15
US61/508,344 2011-07-15
PCT/US2012/045916 WO2013012587A2 (en) 2011-07-15 2012-07-09 Semiconductor package resin composition and usage method thereof

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017043422A Division JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Publications (3)

Publication Number Publication Date
JP2014524957A JP2014524957A (ja) 2014-09-25
JP2014524957A5 JP2014524957A5 (https=) 2015-08-27
JP6155261B2 true JP6155261B2 (ja) 2017-06-28

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014520234A Expired - Fee Related JP6155261B2 (ja) 2011-07-15 2012-07-09 半導体パッケージ樹脂組成物及びその使用方法
JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Family Applications After (1)

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JP2017043422A Pending JP2017133023A (ja) 2011-07-15 2017-03-08 半導体パッケージ樹脂組成物及びその使用方法

Country Status (5)

Country Link
US (2) US9230873B2 (https=)
JP (2) JP6155261B2 (https=)
KR (1) KR20140058557A (https=)
TW (1) TWI550018B (https=)
WO (1) WO2013012587A2 (https=)

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EP2691466B1 (en) * 2011-03-28 2017-12-27 3M Innovative Properties Company Curable composition, article, method of curing, and reaction product
JP6271164B2 (ja) * 2013-06-17 2018-01-31 日立オートモティブシステムズ株式会社 箱型車載制御装置
JP6679488B2 (ja) 2014-01-02 2020-04-15 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング ナノ粒子フィラーを含むフィルム
US9220183B1 (en) * 2014-07-16 2015-12-22 International Business Machines Corporation Devices employing semiconductor die having hydrophobic coatings, and related cooling methods
JP6872313B2 (ja) * 2015-10-13 2021-05-19 リンテック株式会社 半導体装置および複合シート
US20190031790A1 (en) * 2016-01-12 2019-01-31 Hitachi Chemical Company, Ltd. Photosensitive resin composition, dry film using same, printed wiring board, and method for manufacturing printed wiring board
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7218378B2 (ja) * 2018-02-19 2023-02-06 シグニファイ ホールディング ビー ヴィ ライトエンジンを備える封止デバイス
JP7109940B2 (ja) * 2018-03-08 2022-08-01 日東電工株式会社 封止用接着シート
KR20260012727A (ko) * 2023-05-04 2026-01-27 인팩 테크놀로지스 - 리미티드 파트너십 제어된 열팽창 계수를 갖는 비전도성 폴리머 층을 형성하는 방법

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US6228681B1 (en) 1999-03-10 2001-05-08 Fry's Metals, Inc. Flip chip having integral mask and underfill providing two-stage bump formation
US6245595B1 (en) 1999-07-22 2001-06-12 National Semiconductor Corporation Techniques for wafer level molding of underfill encapsulant
US6281046B1 (en) 2000-04-25 2001-08-28 Atmel Corporation Method of forming an integrated circuit package at a wafer level
US6573122B2 (en) 2001-03-28 2003-06-03 International Rectifier Corporation Wafer level insulation underfill for die attach
US6794761B2 (en) 2001-04-26 2004-09-21 Intel Corporation No-flow underfill material
US20030111519A1 (en) 2001-09-04 2003-06-19 3M Innovative Properties Company Fluxing compositions
DE60232942D1 (de) 2001-10-09 2009-08-27 Mitsubishi Chem Corp Strahlungshärtbare Beschichtungszusammensetzung
US20030162911A1 (en) 2002-01-31 2003-08-28 Yue Xiao No flow underfill composition
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Also Published As

Publication number Publication date
US9230873B2 (en) 2016-01-05
KR20140058557A (ko) 2014-05-14
US9773714B2 (en) 2017-09-26
JP2017133023A (ja) 2017-08-03
JP2014524957A (ja) 2014-09-25
US20140217622A1 (en) 2014-08-07
US20150329740A1 (en) 2015-11-19
TWI550018B (zh) 2016-09-21
WO2013012587A2 (en) 2013-01-24
TW201311806A (zh) 2013-03-16
WO2013012587A3 (en) 2013-04-18

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